Iec 61189 2 719 2016

Test met hods for electrical mat erials, printed boards and other int erconnect ion st ruct ures and assembl es – Part 2- 719: Test met hods for mat erials for int erconnect ion st ructu

Test met hods for electrical mat erials, printed boards and other int erconnect ion

st ruct ures and assembl es –

Part 2- 719: Test met hods for mat erials for int erconnect ion st ructures – Relat iv e

permit t iv it y and loss t angent (500 MHz t o 10 GHz)

Partie 2- 719: Méthodes d'essai des mat ériaux pour st ruct ures d'int erconnex ion –

Permit tiv it é relat iv e et t angent e de pert e (500 MHz à 10 GHz)

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Test methods for electrical mat erials, printed boards and ot her int erconnect ion

struct ures and assembl es –

Part 2- 719: Test met hods for mat erials for int erconnection st ructures – R elativ e

permit t iv it y and loss tangent (500 MHz to 10 GHz)

Mét hode d'es ai pour les matériaux électriques, les cart es imprimées et aut res

struct ures d'interconnex ion et ensembles –

Partie 2- 719: Mét hodes d'ess i des mat ériaux pour struct ures d'interconnex ion –

Permitt iv it é relativ e et t angent e de pert e (500 MHz à 10 GHz)

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CONTENTS

FOREWORD 4

1 Sco e 6

2 Normative ref eren es 6

3 Terms an def i ition 6

4 Test method 6

4.1 Test sp cimen 6

4.1.1 General 6

4.1.2 Size 6

4.1.3 Thic nes of dielectric 6

4.1.4 Thic nes of co p r f oi 6

4.2 Test set 7

4.3 Test fi ture 9

4.4 Test eq ipment 1

4.5 Proced re 1

4.5.1 Me s rements 1

4.5.2 Calc lation 12 5 Re ort 14 6 Ad itional inf ormation 14 6.1 Ac urac 14 6.2 Ad itional inf ormation con ernin fi tures an res lts 14 An ex A (informative) Example of test f i ture an test res lts 15 A.1 Dimen ion example of a test f i ture 15 A.2 Example of test res lts 19 Fig re 1 – One side of b ard A 7

Fig re 2 – Another side of b ard A 7

Fig re 3 – Cros section b twe n X1 an X2 of b ard A 8

Fig re 4 – Cros section b twe n Y1 an Y2 of b ard A 8

Fig re 5 – One side of b ard B 8

Fig re 6 – Another side of b ard B 9

Fig re 7 – Cros -section b twe n X1 an X2 of b ard B 9

Fig re 8 – Cros section b twe n Y1 an Y2 of b ard B 9

Fig re 9 – To view of test f i ture 10 Fig re 10 – Horizontal cros section of test fi ture with test set 10 Fig re 1 – Side view of test f i ture 10 Fig re 12 – Vertical cros -section of test f i ture with test set 1

Fig re 13 – Example of VNA raw data 12

Fig re 14 – En elo es of aw data f rom VNA me s rement 14

Fig re A.1 – Parts of test f i ture 17

Fig re A.2 – Con tru tion of p rts 18

Fig re A.3 – Part f or con ector atac ment 18

Fig re A.4 – Atac ment with con ector 19

Fig re A.5 – An example of me s red ε

r

data, PTFE CCL 19

Fig re A.6 – An example of me s red tan data, PTFE CCL 2

INTERNATIONAL ELECTROTECHNICAL COMMISSION

Part 2-719: Test methods f or materials f or interconnection structures –

Relative permit ivity and loss tangent (500 MHz to 10 GHz)

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International Stan ard IEC 61 8 -2-719 has b en pre ared by IEC tec nical commite 91:

Electronic as embly tec nolog

The text of this stan ard is b sed on the f ol owin doc ments:

Ful inf ormation on the votin for the a proval of this stan ard can b f ou d in the re ort on

votin in icated in the a ove ta le

This publ cation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts in the IEC 61 8 series, publ s ed u der the general title Te t meth ds for

electric l materials, printed b ards a d other interc n e tio stru ture a d a s mb e , can

b f ou d on the IEC we site

The commite has decided that the contents of this publcation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "htp:/we store.iec.c " in the data

related to the sp cifi publ cation At this date, the publ cation wi b

• with rawn,

• re laced by a revised edition, or

IMPORTANT – Th 'colour in ide' logo on the cov r pa e of this publ c tion indic te

that it contains colours whic are consid re to be us f ul f or the cor e t

understa ding of its conte ts Us rs s ould theref ore print this doc me t using a

colour printer

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND

Part 2-719: Test methods f or materials f or interconnection structures –

Relative permit ivity and loss tangent (500 MHz to 10 GHz)

This p rt of IEC 61 8 sp cif ies a test method of relative p rmit ivity an los tan ent of

printed b ard an as embly materials, exp cted to b determined 2 to 10 of relative

p rmitivity an 0,0 1 to 0,0 0 of los tan ent at 5 0 MHz to 10 GHz

The fol owin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le for its a pl cation For dated ref eren es, only the edition cited a pl es For

u dated ref eren es, the latest edition of the ref eren ed doc ment (in lu in an

IEC 6 19 , P rinted b ard d esign, ma ufa ture a d a s mbly – Terms a d d efinitio s

The req irements with resp ct to test sp cimen are as fol ows

a) Sp cimen s al b co p r clad laminate

4.2 Te t s t

The setup of the test s al b as f ol ows

a) The test set con ists of two b ard Bo rd A s al b a bo rd with a con u tive lne on

one side an with a co p r f oi on another side The width of con u tive l ne s al b

0,9 mm ± 0,2 mm Bo rd B s al b a b ard without co p r f oi on one side an with a

co p r foi on another side These b ard s al b s own in Fig re 1, Fig re 2, Fig re 3,

Fig re 4, Fig re 5, Fig re 6, Fig re 7 an Fig re 8

laminate s al b etc ed f or the test set desig

c) Af ter etc in , the test set s al b etc ed laminate

d) The test set s al b dried 1 h in the oven with 10 °C ± 2 °C, an ke t 9 h in 2 °C

a) The test f i ture con ists of two co xial con ectors an a metal c b x made of SUS

(Stainles ste l), etc

b) Co xial con ectors s al b the typ p rmitin hig freq en y me s rement The s ita le

typ s of con ectors s ould b “SMA (Sub Miniature A), APC3.5 (Amphenol Precision

Con ector, 3,5 mm), APC7 (7 mm) or Typ -N (Nav ) or eq ivalent

c) The thic nes of the metal c b ard for the metal c b x s al b more than 0,6 mm.

Figure 12 – Vertic l cros -s ction of te t f ixture with test s t

4.4 Te t e uipme t

The test eq ipment in lu es the f ol owin

a) A vector network analy er (VNA) s al b u ed

b) Th d namic ran e of the VNA s al b more than 5 dB

c) The freq en y ran e of the VNA s al b from 10 MHz to over 10 GHz

4.5 Proc dure

4.5.1.1 Ele tric l me s reme ts

The f ol owin req irements a ply to electrical me s rements

a) Electrical me s rements s al b car ied out by u in VNA an fi ture

averagin n mb r an smo thin level On the VNA, me s rement con ition s ould b

set as f ol ows Smo thin s ould b turned of f The n mb r of the data p ints u ed

s ould b enou h to ca ture the ampl tu e of the p ak of the resonan es ac urately

Averagin may b set to improve sig al to noise

c) VNA s al b cal brated with co xial ca les in the ran e of the me s rement f req en y A

f ul two-p rt cal bration is ne ded

d) Co xial con ectors of the test f i ture s al b con ected with co xial ca les

e) The test set s al b set f acin the con u tive l ne side of b ard A an the dielectric side

of b ard B in the test f i ture b x

f) The d mmy b ard an to b ard of the test f i ture s al b set on the test set The d mmy

b ard is tig tened to the cavity with s rews by typical y 0,9 Nm, whic is also a typical

torq e to tig ten co xial ca les, so that b ard A an B are in contact with e c other

g) The resonation f i ure of S21 s al b c ec ed on the monitor of VNA The example is

s own in Fig re 13 The S21 resp n e s ould b in p cted on the display of the VNA (se

Fig re 13) to en ure that al relevant information is ca tured acros the req ired freq en y

ran e In p rtic lar, f aithf ul ca ture of the ampltu e of the p ak of the resonan es

Figure 13 – Ex mple of VNA raw data

Δ2

fc

mλ

is the wavelen th in vac um;

λ is the wavelen th of the dielectric when it is tested;

L is the l ne len th of test set in m;

∆L is the total ef f ective in re se len th of the resonator in m (negl gible)

The fol owin req irements a ply to the los tan ent

a) The maximal an minimal en elo e s al b calc lated from raw data

b) Aten ation factor (α) s al b calc lated as f ol ows:

,8

Δ1

11

ln

21

=

LLUU

2

10P

where

P is the dif f eren e of maximal en elo e an minimal en elo e in dB

An example of P data is s own in Fig re 14

c) Becau e α is the s m of the con u tive los f actor (α

c) an the dielectric los f actor (α

d),

α

d

s al b calc lated as fol ows:

cd

αα

⋅

π+

−+

−π

=

tL

tLtB

tLtB

tLtB

tLtB

WL

tLtB

ZR

2

ln1

0rs

mfR

−

⋅π

=

//

/13

r0

fCtB

WL

tBtL

ln1

/11

ln2

2

tBtLtB

tL

tBtLC

,8

r

d

cf

mπ

68,8

)(

t an

ε

αα

δ

mfc

π

−

=

(10)

P is th a tu l d ta a q ire fom V A raw d ta a s own in this f i ure

Figure 14 – Env lope of raw data from VNA me s reme t

The re ort s al in lu e:

a) the test n mb r an revision;

b) the identif i ation an des ription of the material tested;

c) the relative p rmit ivity an the average in e c f req en y;

d) the los tan ent an the average in e c freq en y;

e) the date of the test;

f) temp rature an h midity u der test (f or referen e);

g) an deviation from the test method;

h) the name of the p rson con u tin the test

6 Additional inf ormation

Relative p rmitivity: Δε/ε / = ± ,0

6.2 Ad itional inf ormation conc rning fixture a d re ults

An example of a test f i ture an test res lt is s own in An ex A

Annex A

(inf ormativ )

Example of test f ixture and test results

A.1 Dimension example of a test f ixture

Fig re A.1 s ows an example of dimen ion in detai f or e c p rt of the test f i ture

Fig re A.2 s ows the con tru tion of the test f i ture that is u in the p rts s own in

Fig re A.1

Fig re A.3 s ows the con ector at ac ments The hole sizes of the con ector at ac ments

de en on the selected con ector

Fig re A.4 s ows an at ac ment with a con ector

IEC

Di me si on i n mi lli met re

IEC 8

Di me si on i n mi lli met re

Fig re A.1 – Parts of te t fixture

IEC 4

Fig re A.2 – Constru tion of parts

IEC

e.g SG C Microwa e: 31 -3 -0 -0 0 (2,4 mm MALE (4) HOLE FLA GE RECE TA LE)

Figure A.4 – At a hme t with conne tor

A.2 Example of test results

Fig re A.5 an Fig re A.6 s ow typical me s rement res lt of 0,8 mm thic nes of PTFE CCL

3 3,13,2

At ac ment

Con ector