Iec 61189 3 913 2016

Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion st ruct ures and assembl es – Part 3- 913: Test met hod for t hermal conduct ivity ofprint ed circu

Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion

st ruct ures and assembl es –

Part 3- 913: Test met hod for t hermal conduct ivity ofprint ed circuit boards for

high- bright ness LEDs

Mét hodes d'essai pour les mat ériaux électriques, les cart es imprimées et aut re

st ruct ures d'nt erconnex ion et ensembles –

Part ie 3- 913: Mét hodes d'essai pour la conduct ivit é t hermique des circuit s

imprimés pour les LED à fort e luminosit é

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Th te h ic l c nte t of IEC p blc tio s is k pt u d r c n ta t r eview b th IEC Ple s ma e s re th t y u h v th

late t e itio ,a c rrig n a or a ame dme t mig t h v b e p bls e

IEC Cat alo ue - webst ore.e ch/ cat alo ue

Th st an -alo e a plc t io for c n ultin th e tire

biblo ra hic l informat io o IEC Intern tio al Sta d rd ,

Te h ic l Sp cific tio s, Te h ic l R ep rts a d oth r

d c me ts A v aia le for P , Ma OS, A ndroid Ta let s a d

iPa

IEC p blc t i ns s arch - www ie ch/ se rch u

Th a v an e s arc e a le to fin IEC p blc t io s b a

variety of crit eria (efere c n mb r, t ext, t ec nic l

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Ce t re:c c@ie c

A pro os de l'IEC

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Si vou d sire n u d n er d s c mme taire s r c t t e

p blc t io o si v ou av ez d s q e t io s c nt ac t ez-n u :

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Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion

st ruct ures and assembl es –

Part 3- 913: Test met hod for t hermal conduct ivity of print ed circuit boards for

Mét hodes d'es ai pour les mat ériaux électriques, les cart es imprimées et aut res

st ruct ures d' nt erconnex ion et ensembles –

Part ie 3- 913: Mét hodes d'ess i pour la conduct ivit é t hermique des circuit s

imprimés pour les LED à fort e luminosit é

INT ERNAT IONAL

ELECT ROT ECHNICAL

ELECT ROT ECHNIQUE

INT ERNAT IONALE

®

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FOREWORD

4 1 Sco e 6

2 Normative ref eren es 6

3 Terms an def i ition 6

4 Pre con itionin

6 5 Test method 6

5.1 General 6

5.2 Thermal con u tivity 6

5.2.1 Me s rement of thermal resistan e on the plane 6

5.2.2 Me s rement of thermal resistan e acros the thic nes 8

An ex A (normative) Bo rd an p nels 13 A.1 Panel an b ard sizes 13 A.1.1 Bo rd size 13 A.1.2 Al owan e of dimen ion 13 A.1.3 Per oration an sl t 14 A.1.4 V-c t 14 A 2 Total b ard thic nes 1

5 A.3 Holes 16 A.3.1 In ertion holes an vias 16 A.3.2 Datum hole 19 A.3.3 As embly hole ( hrou h-hole without wal platin ) 19 A.4 Con u tor 19 A.4.1 Width of con u tor p t ern an its al owan e 19 A.4.2 Distan e b twe n con u tors an its al owan e 2

A.4.3 Thic nes of the in ulatin layer 21

A.5 Printed contact 21

A.5.1 Al owan e of the distan e betwe n the centers of two adjacent printed contacts 21

A.5.2 Al owan e of the terminal width of printed contacts 2

A.5.3 Shift of the center of printed contacts on the font an b c sides of a b ard 2

A.6 L n p tern 2

A.6.1 Al owan e of the distan e betwe n the centers of two lan s 2

A.6.2 Al owan e of a lan width 2

A.6.3 L nd diameter an its al owan e for BGA/CSP 2

A.7 Fid cial mark an mark for comp nent p sitionin 2

A.7.1 Typical form an size of the fid cial mark 2

A.7.2 Dimen ional al owan e of f i u ial mark an comp nent p sitionin mark 2

A.7.3 Position alowan e of the comp nent p sitionin mark 2

A.8 Interlayer con ection – Co p r platin 2

An ex B (normative) Eq i brium test 2

Biblogra h 2

Fig re 1 – Il u tration of an a p ratu f or the thermal con u tivity test 10 Fig re 2 – Surace layer sp cimen p tern for thermal con u tivity test 1

Fig re A.1 – Bo rd ar an ement in a p nel 13

Fig re A.2 – Distan es f rom the datum p int to p r oration an sl t 14

Fig re A.3 – Distan e fom the datum p int to the V-c t 15

Fig re A.4 – Al owan e of p sition of f-set of V-c ts on f ont an b c s races 15

Fig re A.5 – PWB b ard with s mb l mark, solder resist, co p r foi an platin 16

Fig re A.6 – Position of comp nent in ertion holes 17

Fig re A.7 – Distan e b twe n the wal of a hole an the b ard ed e 18

Fig re A.8 – Wal of a hole an the minimum desig ed sp cin to the in er con u tor 19

Fig re A.9 – Width of finis ed con u tor 2

Fig re A.10 – Distan e b twe n con u tor an b ard ed e 21

Fig re A.1 – Thic nes of the in ulatin layer 21

Fig re A.12 – Distan e b twe n centers of terminals of printed contacts 2

Fig re A.13 – Terminal width of a printed contact 2

Fig re A.14 – Shift of the center of printed contacts on f ront an b c sides of a b ard 2

Fig re A.15 – L n p t ern 2

Fig re A.16 – L n width of a lan p tern 2

Fig re A.17 – L n diameter of BGA/CSP formed of a con u tor only 2

Fig re A.18 – L n diameter (d) of BGA/CSP f ormed at the o enin of solder resist 2

Fig re A.19 – Examples of fid cial mark an comp nent p sitionin mark 2

Ta le 1 – Ap l ed p wer (P) that cor esp n s to a ran e of thermal resistan e on the plane 8

Ta le 2 – Ap l ed p wer (P) that cor esp n s to a ran e of thermal resistan e acros the thic nes (K/W) 9

Ta le A.1 – Panel dimen ion 13 Ta le A.2 – Al owan e of dimen ion 14 Ta le A.3 – Al owan e of the distan es f om the datum p int to p r oration an sl t 14 Ta le A.4 – Al owan e of the distan e fom the datum p int to the center of the V-c t 15 Ta le A.5 – Total thic nes an its al owan e 16 Ta le A.6 – Al owan e of holes f or comp nent in ertion 16 Ta le A.7 – Position al owan e of comp nent in ertion holes 17 Ta le A.8 – Distan e b twe n the wal of a hole an b ard ed e 18 Ta le A.9 – Minimum cle ran e b twe n the wal of a hole an the in er layer con u tor 18 Ta le A.10 – Alowan e of con u tor width 2

Ta le A.1 – Alowan e of the distan e b twe n con u tors 2

Ta le A.12 – Alowan e of terminal width of a printed contact 2

Ta le A.13 – Alowan e of terminal width of a printed contact 2

Ta le A.14 – Alowan e of the width of a lan of a lan p t ern 2

Ta le A.15 – L n diameter an its alowan e f or BGA/CSP 2

Ta le A.16 – Alowan e of the lan diameter (d) of BGA/CSP formed at the o enin of solder resist 2

Ta le A.17 – Sha es an sizes of typical fid cial mark an comp nent p sitionin mark 2

INTERNATIONAL ELECTROTECHNICAL COMMISSION

_

Part 3-913: Test method for thermal conductivity of printed

circuit boards for high-brightness LEDs

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cific tio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (P S) a d Guid s (h re f ter ref er e to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n n

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with th Intern tio al Org niz tio f or Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

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intere te IEC Natio al Commite s

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Pu lc tio s is a c rate, IEC c n ot b h ld re p n ible for th wa in whic th y are u e or f or a y

misinterpretatio b a y e d u er

4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

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b twe n a y IEC Pu lc tio a d th c re p n in n tio al or re io al p blc tio s al b cle rly in ic te in

th later

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s rvic s c rie o t b in e e d nt c rtif i atio b die

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7) No la i ty s al ata h to IEC or its dire tors, emplo e s, s rv nts or a e ts in lu in in ivid al e p rts a d

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Pu lc tio s

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p te t rig ts IEC s al n t b h ld re p n ible f or id ntif yin a y or al s c p te t rig ts

International Stan ard IEC 61 8 -3-913 has b en pre ared by IEC tec nical commit e 91:

Electronic as embly tec nolog

The text of this stan ard is based on the f ol owin doc ments:

Ful inf ormation on the votin f or the a proval of this stan ard can b foun in the re ort on

votin in icated in the a ove ta le

A l st of al p rts in the IEC 61 8 , publ s ed u der the general title Test methods for

ele tric l mat erials, printed b ards a d oth r interc n e t io stru tures a d as emb es, can

b fou d on the IEC we site

This publ cation has b en drafted in ac ordan e with the ISO/IEC Directives, Part 2.

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cif i publ cation At this date, the publ cation wi b

• with rawn,

• re laced by a revised edition, or

IMPORTANT – The 'colour inside' logo on the cov r pa e of this publ c tion in ic te

that it contains colours whic are considere to be us f ul f or the cor e t

understa din of its conte ts Us rs s ould th ref ore print this doc me t using a

colour printer

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOA RDS AND

Part 3-913: Test method for thermal conductivity of printed

circuit boards for high-brightness LEDs

This p rt of IEC 61 8 sp cifies the test method for thermal con u tivity sp cif i to printed

circ it b ard for hig -brig tnes LEDs The test a ples to printed circ it b ard for hig

-brig tnes LEDs with s rf ace mou ted LEDs or with device emb d ed LEDs in electronic

control devices (ECDs)

The f ol owin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 19 , P rinted b ard d esig , ma ufa ture a d as embly – Terms a d d efinitions

IEC 6 3 6-2 , P rinted b ards – P art 2 : Printed circ it b ard s for high-bright nes LEDs

a) L ave a sp cimen f or 2 h in the stan ard con ition

b) L ave a sp cimen for 6 min in a thermostat c amb r at 8 °C an then le ve the

sp cimen for 2 ± 4 h in the stan ard atmospheric con ition

5 Test methods

In this stan ard, the fol owin test method are sp cified in order to clas in the printed

circ it b ard in ac ordan e with Ta le 1 in IEC 6 3 6-2

5.2 Thermal cond ctivity

5.2.1 Me s reme t of th rmal re ista c on the pla e

In this s bclau e, the me s rement of thermal resistan e on the plane (horizontal direction of

a) Ap aratu

Use the a p ratu sp cified in EIA/JEDEC STD 51-2, or eq ivalent The eq ipment s al

have a set of a sp cimen an a thermocouple in the centre of a c bic c amb r of 3 cm

side len th An a p ratu is s own in Fig re 1

b) Sp cimen

Unles otherwise sp cified, u e the sp cimen i u trated in Fig re 2 Al the dimen ion in

Fig re 2 s al b req irements This sp cimen u es a TEG c ip (5 mm × 5 mm) with a

temp rature me s rin sen or, whic is wire-b n ed to the centre of the sp cimen b ard

as a he t source The detai sp cification of the printed b ard s al b in ac ordan e with

An ex A

c) Pre-con itionin

Pre-con itionin s al b in ac ordan e with Clau e 4 An , the test sp cimen s al b

f i ed horizontal y in the c amb r of the eq ipment

d) Thermal resistan e an he t tran f er p rameter on the plane (horizontal direction of the

sp cimen) The fol owin procedure s al b resp cted:

• provide a sp cimen as embled with a he ter with a TEG c ip with a temp rature

me s rin sen or;

• sp cify the temp rature co f ficient of the sen or prior to the me s rement;

• o erate the he ter an ar an e the a pled p wer (P) b sed up n the ran e of thermal

resistan e on the plane (horizontal direction of the sp cimen) as s own in Ta le 1;

• me s re the temp rature of the TEG c ip with a temp rature me s rin sen or (T

s)

an the temp rature in ide the c amb r (T

a) af ter the temp rature of the TEG c ip

with a temp rature me s rin sen or has re c ed a sta le state;

• calc late the thermal resistan e on the plane (horizontal direction of the sp cimen)

(R

p) with the fol owin eq ation:

R

p

= (T

s– T

a) / P

• u in the thermal resistan e (R

p), calc late the thermal tran fer p rameter (he) by the

Eq i brium verification s al b in ac ordan e with An ex B

Table 1 – Appl e power (P ) that cor e pond to a ra ge of thermal

5.2.2 Me s reme t of thermal re ista c a ros th thic ne s

In this s bclau e, the me s rement of thermal resistan e acros the thic nes is ad res ed

as f ol ows

The testin a p ratu is as s own in Fig re 3 The a p ratu s al con ist of a metal

bloc (aluminium or co p r) whic can hold the sp cimen sp cified in 5.2.1 b) an a

co l n s stem to ke p the temp rature of the metal bloc con tant

The proced re s al b as folows:

• provide a sp cimen, whic is s rewed to the metal bloc , as embled with a he ter that

contain a TEG c ip with a temp rature me s rin sen or;

• sp cify the temp rature co ff i ient of the sen or prior to the me s rement;

• a ply thermal con u tive materials s c as thermal gre se b twe n the sp cimen an

the metal bloc to red ce thermal resistivity;

• in tal a thermocouple within a 10 mm distan e f rom the ed e of the specimen;

• in tal another thermocouple in the water sin ;

• fix the metal bloc to the co l n s stem;

• ke p the water temp rature con tant by the water co led s stem as s own in

an the temp rature on the metal bloc (T

b) as so n as the temp rature of the T G

c ip with a temp rature me s rin sen or has re c ed the sta le state;

The thermal con u tivity p rameter (Ke) s al b calc lated with the fol owin eq ation u in

) is the are of the TEG c ip with a temp rature me s rin sen or

Table 2 – Appl e p wer (P ) that cor espond to a ra ge of thermal

re ista c a ros the thic ne s (K/W)

Ap led p wer Ran e of thermal re istanc a ros the thick e s (R

Figure 1 – I ustration of a apparatu f or the thermal con uctivity te t

Figure 2 – Surfa e la er spe ime pat ern for th rmal con uctivity te t

2

T G

Su st rat e

Gre s

Figure 3 – Te t e uipme t for thermal re ista c to the thic n s dire tion

This s bclau e is given for referen e only The size of the b ard of the prod ct (a × b)

i u trated in Fig re A.1 s ould b selected so that the b ard can b ar an ed ef ficiently

within a p nel with a size as sp cified in Ta le A.1 These dimen ion are given f or

information only Or, a pro er p nel with a size given in Ta le A.1 s al b selected so as to

satisfy the req ired ef ficient ar an ement of the b ard

Key

Bo rd siz of th pro u t: a × b

Sp c b twe n b ard a d p n l e g s: c

1, c , c , c

Sp c b twe n b ard : e

1, e

Fig re A.1 – Board ar a geme t in a pa el

Table A.1 – Pa el dime sions

Siz of a C L

(co per clad

laminate) panel

e

1

The p roration an slts are s own in Fig re A.2 The al owan es of the distan es f om the

datum p int to the center of the c t of the p rf oration an sl t is given in Ta le A.3

Figure A.2 – Dista c s f rom the d tum p int to perforation a d sl t

Table A.3 – Al owa c of the dista c s from

the datum point to perforation a d sl t

Distanc s from the datum

The V-c t is s own in Fig re A.3 an Fig re A.4 The al owan e of the distan e fom the

ref eren e datum to the center of c t of the V (g

1

to g

4) is given in Ta le A.4 The al owan e of

the deviation of the p sition of the V-c t on the f ront an b c planes is 0,2 mm, an the

al owan e of the u c t thic nes of the b ard is the s m of the al owan e of the b ard

Figure A.3 – Dista c from the datum point to the V-c t

Figure A.4 – Al owa c of position off -s t of V-c ts on front a d ba k s rf ac s

Table A.4 – Al owa c of the dista c f rom the datum point to the c nter of the V-c t

Distanc f rom the datum p int

to the c nter of he V-cut

The al owan e of the total b ard thic nes ( ) an s mb l mark as s own in Fig re A.5 is

Fig re A.5 – PWB b ard with s mbol mark, solder re ist, copper foi a d plating

Table A.5 – Total thic ne s a d its al owa c

The f ol owin req irements a ply for in ertion holes and vias

a) Al owan e of comp nent in ertion holes

The al owan e of comp nent in ertion holes is given in Ta le A.6 The al owan e given in

this ta le is not a plca le to vias ( hrou h-hole vias, buried vias an bl n vias) The

alowan e of throu h-holes with a diameter les than 0,6 mm f or in ertion of a comp nent

an holes for pres -it of a comp nent is to b as agre d b twe n the u er an s p l er

(here f ter, refer ed to as AABUS)

Table A.6 – Al owa c of hole f or compone t ins rtion

b) Position of a hole f or comp nent in ertion

The center of a hole for comp nent in ertion s ould b at the cros p int of the grid for

p tern desig in lu in the complementary grid l nes u ed The al owan e of a comp nent

in ertion hole p sition

j

→

,the deviation f om the desig ed p sition in resp ct to the datum

p int as s own in Fig re A.6 is given in Ta le A.7

Fig re A.6 – Positions of compone t ins rtion hole

Table A.7 – Position al owa c of compone t ins rtion hole

L n er dimensio of e tan ular b ard

c) Distan e f rom the b ard ed e to the wal of a hole

Distan e f rom the b ard ed e to the wal of a hole (d) is s own in Fig re A.7 The distan e

(d) b twe n the wal s of a throu h-hole b fore platin an of a hole for comp nent

in ertion s al b larger than either 1,0 mm The distan e in the case of hole for pres -f it

s al b in ac ordan e with Ta le A.8

IE C Datumln

Figure A.7 – Dista c betwe n the wal of a hole a d the b ard e ge

Table A.8 – Dista c betwe n the wal of a hole a d board e ge

Item Distanc () betwe n a comp nent h le bef ore platin an the via wal (d)

H I PWB ≤1,0 mm a d als lo g r th n th b ard thic n s (

Sta d rd PWB ≤1,5 mm a d als lo g r th n th b ard thic n s (

d) Minimum cle ran e b twe n the wal of a hole an the in er con u tor

The minimum cle ran e betwe n the wal of a hole an the in er con u tor (k) as

i u trated in Fig re A.8 s al b 0,3 5 mm An the detai ed dimen ion are sp cif ied in

Ta le A.9 If the distan e 0,3 5 mm is g arante d in the desig of the p t ern, the

minimum se aration is g arante d

Table A.9 – Minimum cle ra c betwe n the wal of a hole a d the inner la er conductor

Item

Minimum cle ranc betwe n the h le wal

an the in er layer co d ctor

Printe b ard

Figure A.8 – Wal of a hole a d the minimum de ig e spa ing to the inner con uctor

A.3.3 As embly hole ( hrou h-hole without wal plating)

The fol owin requirements a ply

a) Al owan e of an as embly hole

The al owan e of an as embly hole s al b ± ,10 mm

b) Al owan e of the p sition of an as embly hole

The al owan e of the p sition of an as embly hole s al b in ac ordan e with Ta le A.7

c) Distan e b twe n an as embly hole an the b ard ed e

The distan e b twe n an as embly hole an the b ard ed e s al b larger than 2,0 mm

In case the distan e is les than 2,0 mm, the distan e s al b agre d b twe n u er an

s p ler

d) The distan e b twe n an as embly hole an the in er con u tor

The distan e b twe n the wal of an as embly hole an the in er con u tor s al b larger

than 1,0 mm

A 4 Conductor

A.4.1 Width of conductor pat ern a d its al owa c

The alowan e of the f ormed con u tor width (w), as i u trated in Fig re A.9, s al b in

ac ordan e with the alowan es given in Ta le A.10 The al owan e of the f i is ed con u tor

p tern sp cifical y desig ed for imp dan e control s al b AABUS

Table A.10 – Al owa ce of condu tor width

Distan e b twe n con u tor an b ard ed e is i u trated in Fig re A.10 The al owan e of

the distan e b twe n con u tors (h) s al b as given in Ta le A.1 The al owan e of the

f i is ed con u tor p t ern sp cifical y desig ed for imp dan e control s al b AABUS

The thic nes of an in ulatin layer (t ) is i u trated in Fig re A.1

NOT In c s th s ra e of c p er foi is ro g e e , th thic n s of th b s material is th minimum dista c

Figure A.12 – Dista c betwe n c nters of terminals of printe conta ts

A.5.2 Al owa c of the terminal width of printe conta ts

The al owan e of the terminal width of printed contacts (w) as i u trated in Fig re A.13 is

sp cified in Ta le A.12

Figure A.13 – Terminal width of a printe conta t

Table A.12 – Al owa c of terminal width of a printe conta t

A.5.3 Shif t of the c nter of printe conta ts on the front a d ba k side of a b ard

The al owan e of the s if t of the center of printed contacts on the font an b c sides of a

b ard (q) as i u trated in Fig re A.14 s al b ± ,2 mm

IE C

w Print ed c nt act

Figure A.14 – Shif t of the c nter of printe conta ts

on front a d ba k side of a board

A.6.1 Al owa c of the dista c betwe n the c nters of two la ds

The al owan e of the distan e b twe n the centers of two adjacent lan s (S

1

p ral el y located lan s (S ) as i u trated in Fig re A.15 is sp cified in Ta le A.13

Figure A.15 – La d pat ern

Table A.13 – Al owa c of terminal width of a printe conta t

Distanc betwe n c nters

The al owan e of a lan width of a lan p t ern (w) as i u trated in Fig re A.16 is sp cified in

Ta le A.14 The alowan e for a lan nar ower than 0,15 mm s al b AABUS

Figure A.16 – La d width of a la d pat ern

Table A.14 – Al owa c of the width of a la d of a la d pat ern

Dime sio s are in mi metre

A.6.3 La d diameter a d its al owa c f or BGA/CSP

The alowan e of lan diameter f or BGA/CSP is sp cified in a) an b) b low

a) The p t ern is s own in Fig re A.17 The al owan e of the lan diameter (d) of BGA/CSP

made of a con u tor only is given in Ta le A.15

Figure A.17 – La d diameter of BGA/CSP forme of a con uctor only

Table A.15 – La d diameter a d its al owa c for BGA/CSP

For ref ere c o ly

b) The p t ern is s own in Fig re A.18 The al owan e of the lan diameter (d) of BGA/CSP

f ormed at the o enin of solder resist is given in Ta le A.16

Table A.16 – Al owa c of the la d diameter (d) of BGA/CSP

A 7 Fiducial mark and mark f or component positioning

A.7.1 Typic l f orm a d size of the fiducial mark

The mark f or comp nent p sitionin in Fig re A.19 is sp cified in Ta le A.17

Fig re A.19 – Ex mple of fiducial mark a d comp ne t positionin mark

Table A.17 – Shape a d size of typic l fid cial mark

a d compon nt positioning mark

Diameter

mm

A.7.2 Dime sional al owa c of f idu ial mark a d compone t p sitionin mark

The dimen ional al owan e of a f i u ial mark an a comp nent p sitionin mark, as i u trated

in Fig re A.19, is ± ,1 mm

A.7.3 Position al owa c of th comp ne t positioning mark

The f arthest lan p tern f rom the mark (u

1, u

2), as i u trated in Fig re A.19, s al b

± ,0 mm

A 8 Interlay r connection – Copper plating

The minimum thic nes of co p r platin on the wal of via an comp nent in ertion holes is

given in Ta le A.18

Table A.18 – Minimum thic ne s of copper plating

Board thick e s, or layer thick e s

Th me s reme t s al b ma e b o tic l o s rv tio of a micro-s ctio e v rtic l cro s-s ctio L c l s ra e

d viatio is n t ta e into c n id ratio

Comp n nt p sitio in mark

Fid cial mark

Printe b ard

Annex B

(nor mative)

Equi ibrium test

The f ol owin proced re s al b a pl ed to verify the eq i brium in the en losin en ironment

a) Place the sp cimen in the c amb r an wait f or 5 min minimum

b) Me s re the temp rature sen itive p rameter (TSP) and wait f or another 5 min to

Bibl ogr aphy

EIA/JEDEC STD 51-2, Int egrated Circ it Th rmal Test Meth d, Enviro me t al Co dit ions –

N atural Co vection (st ill air)

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