Iec Tr 63018-2015.Pdf

IEC TR 6301 8 Edition 1 0 201 5 1 2 TECHNICAL REPORT Flexible printed circuit boards (FPCBs) – Method to decrease signal loss by using noise suppression materials IE C T R 6 3 0 1 8 2 0 1 5 1 2 (e n )[.]

IEC TR 6301 8

Edit io 1.0 2 15-12

Flex ible printed circuit boards (FPCBs) – Met hod t o decrease signal loss by

using noise suppression mat erials

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IEC TR 6301 8

Edit io 1.0 2 15-12

Flex ible print ed circuit boards (FPCBs) – Method t o decrease signal loss by

INT R NATIONAL

ELECTR OT C NICAL

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FOREWORD 3

INTRODUCTION 5

1 Sco e 6

2 Normative ref eren es 6

3 Test g idel ne 6

3.1 Ap aratu 6

3.1.1 Network analy er

6 3.1.2 Bloc diagram for sig al los me s rin 6

3.2 Test sp cimen 7

3.2.1 Stru ture 7

3.2.2 Pre aration 8

3.2.3 Test method 8

3.2.4 Calc lation 9

3.2.5 Test res lt 9

3.2.6 Analy is 12 3.3 Improvement method of sig al los f or a s ield FPCB 13 An ex A (normative) Bloc diagram of sig al los test s stem 14 Fig re 1 – Bare/s ield FPCB 5

Fig re 2 – In rement of sig al los u in NSMs 5

Fig re 3 – Sig al los test s stem 6

Fig re 4 – Sc ematic diagram for two typ of test sp cimen 7

Fig re 5 – Cros -section of s ield FPCB 8

Fig re 6 – Dif feren e of sig al los b twe n b re an s ield FPCBs 9

Fig re 7 – Sig al los value of the b re an s ield FPCB 10 Fig re 8 – Sig al los variation ac ordin to the Cu con u tive layer thic nes 1

Fig re 9 – Sig al los variation ac ordin to the Cu sig al l ne width 1

Fig re 10 – Two typ s of stru ture for FPCB 12

Fig re 1 – Electric f ield diagram for two typ s of s ield FPCB 13

Fig re A.1 – Bloc diagram of sig al los test s stem 14

Fig re A.2 – Sig al los test s stem ac ordin to the Agi ent network analy er N5 3 A 14

Ta le 1 – Comp rison of c t-of f feq en y with b re/s id FPCB 10

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In recent ye rs, sin e the u e of smart phones, an other mo i e an display devices has

in re sed sig if i antly, the s p ly of FPCBs has also b en largely exten ed Sp cifical y,

sin e the FPCB devices se k hig sp ed p rorman e, the req irements with resp ct to

electromag etic interf eren e (EMI) s p res ion in the devices has also grown in imp rtan e

Therefore, FPCBs u ed in ide smart phones employ noise s p res ion materials (NSMs) to

solve EMI pro lems, as s own in Fig re 1

Figure 1 – Bare/s ield FPCB

However, an a plcation of noise s p res ion materials (NSMs) for FPCBs re c es the l mit

con ernin the pro lem of in rementation of sig al los Therefore, FPCB an NSMs

man f acturers ne d to analy e sig al los variation of FPCBs s ielded by NSMs, as s own

in Fig re 2

Fig re 2 – Increme t of signal los u ing NSMs

As FPCBs are u ed with hig feq en y, the pro lem of sig al los b comes more signif i ant

As the u er of FPCBs has a deman for the lowest value of sig al los by u in NSMs,

s p l ers of FPCBs have to anticip te an a pro riate desig in order to ac ieve an adeq ate

sig al los value

IE C

Fre u n y (GHz)

Bare FP B

Shield FP B

IE C

FLEXIBLE PRINTED CIRCUIT BOARDS (FPCBs) – METHOD TO DECREA SE

This Tec nical Re ort sp cifies a g idel ne for improvement of sig al los by u in noise

s p res ion materials (here fter ref er ed to as NSMs) f or FPCBs

This Tec nical Re ort also in icates a me s rin method of sig al los variation of FPCBs

u in NSMs u in network analy er eq ipment In ad ition, this method only meas res the

value of the sig al los variation by u in NSMs f or FPCBs This re ort, however, neither

determines nor in icates the stru ture or material of FPCBs

The f ol owin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 3 3-1:2 0 , Noise su pres ion sh et for d igital de ic s a d e uipme t – Part 1:

Definitions and g n ral pro ert ies

3 Test guidel ne

3.1.1 Network a alyzer

A network analy er is uti zed to identify sig al los data at a sp cif i feq en y ran e of

FPCBs

3.1.2 Bloc dia ram for signal los me s ring

Fig re 3 in icates one of the examples of the network analy er setup

Figure 3 – Signal los te t s stem

IEC

Network a aly er

In id nt

Re e tio S1

Tra smis io S21

3.2 Te t spe ime

Test sp cimen s al b desig ed by two stru tures, i.e with an without NSMs in one FPCB

b ard The p rt without u in NSMs is cal ed b re FPCB The p rt u in NSMs is cal ed

s ield FPCB, as s own in Fig re 4 This test coup n s al also b desig ed as two typ s in

order to have an o ject of comp rison The first desig s al b comp sed of one b re FPCB

with one s ield FPCB A desig of this stru ture al ows to comp re the b re FPCB with the

s ield FPCB, as s own in Fig re 4 a The secon desig s al b comp sed of one b re

FPCB with two over s ield FPCBs This stru ture al ows to comp re the b re FPCB with the

two over s ield FPCBs, as s own in Fig re 4 b

Fig re 4 a – Te t spe imen for comparin o e bare F C with an ther shield F C

Fig re 4 b – Te t spe imen for comparin o e bare F C with two o er shield F C s

Figure 4 – Sc ematic dia ram for two type of te t spe ime

The test sp cimen s al b divided into two halves with one b ard (b re FPCB an s ield

FPCB) f or eq ita le estimation with the same Cu l ne (LW1, LW1’…) This stru ture has the

merit of u iformly me s rin at on e a b re an a s ield FPCB u der the same con ition

IE C

Bare FP B

Shield FP B LW1

> ㎝

Via h le

LW1’

IEC

Bare FP B

Shield 1 FP B LW1

>5㎝

Via h le

LW1’

Shield 2 FP B

LW1’

Shield 3 FP B

LW1’

•

•

Shield n FP B

The Cu l ne is f ormed with a l ne r distan e of direction, b cau e the variation of s ield eff ect

is very we k for the c rved l ne The width of Cu lne s al b c osen f e ly in the al owan e

range of a man f acturin proces The size an sp cin of via holes s al not b l mited

Esp cial y, via holes of fer an imp rtant role to contact the NSMs with the grou d plan of

s ield FPCB, as s own in Fig re 2 However, the size, sp cin an amou t of via holes s al

b as agre d b twe n u er an s p l er (AABUS)

The len th of test sp cimen s al b over 5 cm in order to o tain sta le values f rom

me s rin eq ipment The width an thic nes of test sp cimen s al b in ac ordan e with

the ne d of the en u er

Fig re 5 in icates one of the examples of a cros -section of a s ield FPCB, where the s ield

region s al b f ormed ju t a ove the b re FPCB The s ield region contain the s ield

in ulation layer, the s ield con u tive layer an the s ield con u tive ad esive layer Where

the s ield con u tive layer play a role in an EMI a sorb r, the s ield con u tive ad esive

layer play a role f or electric intercon ection b twe n the s ield con u tive layer with the

grou d layer, an the s ield in ulation layer play a role to protect the s ield con u tive layer

f rom direct contact with the external device

Figure 5 – Cros -s ction of s ield FPCB

However, general y the stru ture of a test coup n s al also b as agre d up n b twe n u er

an s p l er (here f ter refer ed to as AABUS) The stru ture an materials of the test

sp cimen is req ired de en in on the u er’s sample sp cification But the variation of

these test sp cimen is not imp rtant, b cau e the u er for FPCBs s al c ec only the sig al

los variation eff ect by u in NSMs

3.2.2 Preparation

The fol owin ste s are ne ded to pre are the test

a) First, pre are a 5 cm over len th for a b re FPCB Then, a ply NSMs lamination to half of

the FPCB

b) Eac en of the test sp cimen s al con ist of SMA (s bminiature A) con ectors

c) To desig ate the Cu lne width, write the n mb r (or s mb l) to the b re side en (or

s ield side end) of test sp cimen ne r the SMA con ector

3.2.3 Te t method

In order to me s re the pro er sig al los value, the f ol owin proced res s al b

resp cted

a) The sig al los values of the test sp cimen s al b me s red by comp sition of a

network analy er, a test sp cimen an a co xial ca le

IEC

Shield region

Bare FPCB

Shield in ulatio la er – 5µm

Shield c n u tiv la er – 0,1/2µm

Shield c n u tiv a h siv la er – 10µm

C/L PI – 12 µm

C/L a h siv – 2 µm

Cu – 2 µm

PI – 5 µm

Cu – 2 µm