Iec 61076 4 116 2015

Connect ors for elect ronic equipment – Product requirement s – Part 4- 116: Print ed board connect ors – Det ai specificat ion for a high- speed two- part connect or wit h int egrat ed

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Connect ors for elect ronic equipment – Product requirement s –

Part 4- 116: Print ed board connect ors – Det ai specificat ion for a high- speed

two- part connect or wit h int egrat ed shielding funct ion

Connect eurs pour équipement s élect roniques – Ex igences de produit –

Part ie 4- 116: Connect eurs pour cart es imprimées – Spécificat ion part icul ère

pour un connect eur haut e vit esse en deux part ies avec une fonct ion de

prot ect ion int égrée

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INT ERNAT IONAL

ELECT ROT ECHNICAL

COMMIS ION

ELECT ROT ECHNIQUE

INT ERNAT IONALE

®

W arning! Mak e s re t hat y ou o tain d this publc t ion from a a thorize dist ribut or

Ate t ion! V eui ez vous a s rer qu vou a ez o t en c te publc tion via u distribute r a ré

c olour

inside

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IEC 61 076- 4- 1 1 6

Editio 1.1 2 15-1

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CONTENTS

FOREWORD 5

INTRODUCTION 8

1 Sco e 10 2 Normative referen es 10 3 Terms an def i ition 10 4 General data 1

4.1 Recommen ed method of mou tin 1

4.2 Numb r of contacts an contact cavities 1

4.3 Ratin s an c aracteristic 12 5 Tec nical data 12 5.1 Survey of styles an variants 12 5.2 Information on a plcation 12 5.2.1 Complete con ectors (p irs) 12 5.2.2 Fixed b ard con ectors 12 5.2.3 Fre b ard con ectors 12 5.2.4 Ac es ories 12 5.2.5 Shieldin an grou din 12 5.2.6 Basic typ of termination 12 5 3 Contact ar an ement 1

3 6 Dimen ional information 13 6.1 General 13 6.2 Isometric view an common fe tures 14 6.2.1 Fixed b ard an fe b ard con ector 1

4 6.2.2 Common fe tures 14 6.2.3 Referen e s stem 14 6.3 Matin information 14 6.3.1 Matin con ition 14 6.3.2 Planarity 15 6.4 Fixed b ard con ector 16 6.4.1 Dimen ion 16 6.4.2 Termination 17 6.5 Fre b ard con ector 18 6.5.1 Dimen ion 18 6.5.2 Termination 2

6.6 Ac es ories 21

6.7 Mou tin inf ormation for f i ed b ard con ectors 21

6.8 Mou tin inf ormation for con ectors 2

6.9 Gau es 2

6.9.1 Sizin gau es an retention f orce gau es 2

6.9.2 Test gau e for f irst contact p int 2

7 Characteristic 2

7.1 Cl matical category 2

7.2 Electrical c aracteristic 2

7.2.1 Cre p ge an cle ran e distan es 2

7.2.2 Voltage pro f 2

7.2.3 Cur ent-car yin ca acity 2

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7.2.4 Contact resistan e 2

7.2.5 In ulation resistan e 2

7.2.6 Imp dan e 2

7.2.7 Tran mis ion c aracteristic 2

7.3 Mec anical c aracteristic 2

7.3.1 Mec anical o eration 2

7.3.2 En agin an with rawal f orces 2

7.3.3 Contact retention in in ert 2

7.3.4 Static lo d, tran verse 2

7.3.5 Gau e retention force 2

7.3.6 Vibration (sin soidal) 2

7.3.7 Shoc 2

7.3.8 Polarizin method 2

7.3.9 Ro u tnes an ef fectivenes of codin devices 2

8 Test s hed le 2

8.1 General 2

8.2 Ar an ement f or contact resistan e me s rement 2

8.3 Ar an ement f or contact disturb n e me s rement (s oc an vibration test 2

8.4 Ar an ement f or c r ent car yin me s rement 2

8.5 Ar an ement f or d namic stres tests 2

8.6 Ar an ement f or testin static lo d; tran verse 3

8.7 Ar an ement f or voltage pro f an p larization voltage 3

8.8 Ar an ement f or flamma i ty tests 31

8.9 Test b ard f or imp dan e an tran mis ion c aracteristic 31

8.10 Pre-con itionin 3

8.1 Wirin an mou tin of sp cimen 3

8.1 1 Wirin 3

8.1 2 Mou tin 3

8.12 Test proced res an me s rin method 3

8.13 Test s hed le ta les 3

8.13.1 Test group P – Prelminary 3

8.13.2 Test group A – Dy amic/cl matic 3

8.13.3 Test group B – Mec anical en uran e 3

8.13.4 Test group C – Moisture 3

8.13.5 Test group D – Electrical lo d 3

8.13.6 Test group E – Mec anical resistivity 4

8.13.7 Test group F – Chemical resistivity 4

8.13.8 Test group G – Con ection 41

8.13.9 Test group H – Sig al integrity tests 41

An ex A (informative) Vibration an s oc testin of con ectors mou ted to a mec anical stru ture for electronic eq ipment ac ordin to IEC 6 917 an IEC 6 2 7 – Test setup of as embl es with mas lo din of printed b ard 4

Bibl ogra h 5

Fig re 1 – Typical ar an ement with a two-p rt con ector 8

Fig re 2 – Typical ar an ement with a direct ed e con ector, not covered in this Stan ard 9

Fig re 3 – Fixed b ard an f re b ard con ector 14

Fig re 4 – Matin con ition : lateral off set 14

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Fig re 5 – Matin con ition : misal g ment, an ular of fset 15

Fig re 6 – Matin con ition : en sto 15

Fig re 7 – Fixed b ard con ector 16

Fig re 8 – Fre b ard con ector, p rt 1 18

Fig re 9 – Fre b ard con ector, p rt 2 19

Fig re 10 – Dimen ion of hole p tern in b c plane 21

Fig re 1 – Referen e p ints 2

Fig re 12 – Cros talk combination 2

Fig re 13 – Ar an ement f or resistan e me s rement 2

Fig re 14 – Ar an ement f or me s rement of contact disturb n e 2

Fig re 15 – Wirin ar an ement for c r ent-car yin me s rement 2

Fig re 16 – Test setup f or s oc an vibration test 3

Fig re 17 – Ap l cation of static lo d 3

Fig re 18 – Me s rement ar an ement for voltage pro f 31

Fig re 19 – Me s rement ar an ement for flamma i ty tests 31

Fig re 2 – Bre k out are of the con ector f ootprint 31

Fig re 21 – Example of a test fixture for f i ed b ard con ectors 3

Fig re 2 – Example of a test fixture for f re b ard con ectors 3

Ta le 1 – Contact ar an ement 13 Ta le 2 – Dimen ion of fixed b ard con ector 17 Ta le 3 – Dimen ion of the f re b ard con ector 2

Ta le 4 – Dimen ion of hole p tern in b c plane 2

Ta le 5 – Cl matic category 2

Ta le 6 – Rated in ulation voltages 2

Ta le 7 – Cur ent ratin p r pin at ambient of 7 °C 2

Ta le 8 – Maximal p rmis ible contact resistan e c an e 2

Ta le 9 – Minimal in ulation resistan e 2

Ta le 10 – Numb r of sp cimen f or test seq en e 2

Ta le 1 – Test group P 3

Ta le 12 – Test group A 3

Ta le 13 – Test group B 3

Ta le 14 – Test group C 3

Ta le 15 – Test group D 3

Ta le 16 – Test group E 4

Ta le 17 – Test group F 4

Ta le 18 – Test group G 41

Ta le 19 – Test group H 41

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Part 4-116: Printed board connectors –

Detai specif ication for a high-speed two-part connector

with integrated shielding f unction

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic field To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cific tio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (P S) a d Guid s (h re fter refere to a “IEC

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n-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio for Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

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2) Th formal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

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Commite s in th t s n e Whie al re s n ble eforts are ma e to e s re th t th te h ic l c nte t of IEC

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4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra s are tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

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th later

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6) Al u ers s o ld e s re th t th y h v th late t e itio of this p blc tio

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oth r d ma e of a y n ture wh ts e er, wh th r dire t or in ire t, or f or c sts (in lu in le al fe s) a d

e p n e arisin o t of th p blc tio , u e o or rela c u o , this IEC Pu lc tio or a y oth r IEC

This Con ol d te v rsion is not a of f icial IEC Sta dard a d ha be n prepare f or

us r conv nie c Only the c r e t v rsion of the sta dard a d its ame dme t s)

are to be considere the of f icial doc me ts

This Consol d te v rsion of IEC 610 6-4-1 6 be rs the e ition number 1.1 It consists

of th first e ition (2012-0 ) [doc me ts 4 B/2 8 /FDIS a d 4 B/2 8 /RVD] a d its

ame dme t 1 (2 15-1 ) [doc me ts 4 B/2 5 /FDIS a d 4 B/2 6 /RVD] Th te h ic l

conte t is id ntic l to th ba e e ition a d its ame dme t

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In this Re l ne v rsion, a v rtic l l ne in the margin s ows where th te hnic l conte t

is modifie by ame dme t 1 Additions are in gre n te t, d letions are in strik through

publ c tion

International Stan ard IEC 610 6-4-1 6 has b en pre ared by s bcommite 4 B:

Con ectors, of IEC tec nical commit e 4 : Electromec anical comp nents an mec anical

stru tures for electronic eq ipment

This publcation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

A lst of al p rts of IEC 610 6, u der the general title Co n ctors for electro ic e uipme t –

Prod uct re uireme ts, can b fou d on the IEC we site

The commite has decided that the contents of the b se publ cation an its amen ment wi

"ht p:/ we store.iec.c " in the data related to the sp cific publ cation At this date, the

IMPORTANT – Th 'colour in ide' logo on the cover pa e of this publ c tion indic te

that it contain colours whic are consid re to be us f ul f or th cor e t

und rsta din of its conte ts Us rs s ould theref ore print this doc me t usin a

colour printer

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International Stan ard IEC 610 6-4-1 6 esta l s es sp cification an test req irements for a

hig -sp ed two-p rt con ector with integrated s ieldin f un tion f or u e as a printed b ard

con ector in in u trial en ironments The con ectors have a primary purp se of servin as a

platform for telecommu ication an enterprise computer network eq ipment It is exp cted

that these con ectors are goin to f i d a pl cation outside the Telecommu ication market,

e.g in the in u trial market, as factory automation, proces control, in u trial commu ication,

medical an others

The con ector typ was original y develo ed in the con ortium PCI In u trial Computer

Man f acturers Group (where s PCI is a p ripheral comp nent intercon ect, whic can b

u ed to con ect p ripheral comp nents to proces ors via u ing a bu stru ture or serialy

con ected f abric b sed tran p rts) This con ortium, refer ed to in s ort as PICMG has

defined several s stem sp cification des ribin a b c plane con ector (f i ed con ector) in

combination with an ed e b ard con ector (f e con ector) as a f un tional comp nent of a

sp cified Plu -in Unit These sp cif i ation are the Ad an edMC.0 an the MicroTCA.0 The

s stem-des ription in MicroTCA.0 contain also a test program f or the con ector Further

inf ormation of PICMG an its sp cification can b o tained on the folowin we site:

www.picmg.org

Based on the con ector typ an on PICMG-develo ments, this International Stan ard was

develo ed by exp rts of IEC SC 4 B, Con ectors In contrast to the PICMG-stan ard, the

con ector des rib d here has two con ector halves (a fixed an a f re con ector, as s own

in Fig re 1) The f i ed con ector is b sed on a 1,6 mm ± 10 % plu -in u it printed b ard

thic nes simiar to PICMG sp cif i ation In ad ition, the test program of this IEC Stan ard

diff ers f rom that defined in PICMG b sed on previou existin tests defined in IEC for

con ectors to s it the ne d f or u e in in u try The res ltin test s hed le dif fers f rom the

test-proced res as def i ed within PICMG to some degre not only in test-severity an

con ition but also in test seq en e Exp rts within IEC SC4 B work together with exp rts

f om PICMG to re c con en u with regard to simiarities an diff eren es in the relevant

testprogram The outcome is inten ed to b publ s ed in se arate doc ments

A typical ar an ement for s c a two-p rt con ector is s own in the fol owin outl ne s etc

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Not covered in this International Stan ard are direct ed e con ector contacts for printed

b ard The re son f or this is, that in diff eren e to the PICMG-sp cification this International

Stan ard is inten ed to define the con ector as a comp nent together with test-proced res

only an is not inten ed to detai fu ction whic are not directly related to the con ector

s stem Examples for s c detais are the c aracteristic of the printed circ it b ard

However, b sed on the information given in 4.5.1 of this Stan ard contact p sitionin an

mec anical ed e b ard con ector detai s can b derived Further inf ormation may b

o tained in PICMG-sp cification Ad an edMC.0 Su h direct ed e con ector contacts are

a pl ed directly to the printed b ard ed e as p rt of the printed b ard circ it (f re con ector)

an f orm the interf ace to the b c plane (f i ed con ector), as can b se n in Fig re 2

Figure 2 – Typic l ar a g me t with a dire t e ge conne tor,

not cov re in this Sta dard

The con ectors as des rib d in this Stan ard are referen ed in IEC 6 2 7-3-10 , whic

des rib s dimen ion of s brac s an plu -in u its for their u e

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CONNECTORS FOR ELECTRONIC EQUIPMENT –

Part 4-116: Printed board connectors –

Detai specif ication for a high-speed two-part connector

with integrated shielding f unction

This International Stan ard esta l s es sp cification an test req irements f or a hig -sp ed

two-p rt con ector with integrated s ieldin f un tion f or u e as a printed b ard con ector in

in u trial en ironments

The con ectors con ect a b c plane to printed b ard

The folowin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le f or its a pl cation For dated referen es, only the edition cited a pl es For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 0 0-5 1: 2 0 , I ntern t io al Electrotec nic l Vo a ulary (IEV) – P art 581:

Ele trome h nic l c mp n nts for electro ic e uipme t

IEC 6 0 8-1, Enviro me tal testin – P art 1: Ge eral a d g id an e

IEC 6 0 8-2-5 : 19 6, Enviro me tal t esting – P art 2-52: Tests – Test Kb: Salt mist, c clc

(sod ium, c loride solution)

IEC 6 0 8-2-5 : 2 0 , Enviro me tal t esting – Part 2-54: Tests – Test Ta: Sold era ility

test in of ele tro ic c mp n nts b t he wett ing b la c met hod

IEC 6 512 (al p rts), Co n ctors for electro ic e uipme t – Tests a d me sureme ts

IEC 6 3 2-5, Sold erles c n e t io s – P art 5: P res -in c n e tions – Ge eral re uireme ts,

test met hods a d pra t ic l g id an e

IEC 6 3 2-8: Sold erles c n e tio s – P art 8: Compres ion mo nt c n e tio s – Ge eral

re uireme ts, t est methods a d pra tic l g id an e

3 Terms a d def initions

For the purp ses of this doc ment, the terms an definition given in IEC 6 0 0-5 1 a ply as

wel as the fol owin

3.1

conta t for ge eral purpos

electrical contact, whic do s not have a predefined f un tion (neither f or p wer, grou d nor

sig al) The f un tion can b defined ac ordin to the a pl cation

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NOT Thro g o t this s e if i atio dime sio s are in mi imetre

4.1 Re omme d d method of mounting

This International Stan ard sp cifies fe an fixed con ectors, s ita le f or pres in

con ection to the printed b ard Other termination tec niq es, as solder or compres ion

mou t con ection are up n agre ment b twe n man facturer an u er

A complete con ector con ists of two con ector halves, a f re b ard con ector an a fixed

b ard con ector

Fre b ard con ectors are mou ted on the ed e of the printed circ it b ard an have male

contacts with an led pres -in termination , solder termination or compres ion mou t

termination

Fixed b ard con ectors are mou ted on the b c plane an have female contacts with straig t

pres -in termination

The fe b ard con ector can b omited, but then alternatively the printed b ard u ed s al

have an ed e simiar to those of the con ection zone as defined in 4.5.1 f or the fe b ard

con ector The b ard con ector then is u ed as a direct ed e con ector

4.2 Number of conta ts a d conta t c vitie

The n mb r of contacts an their p sition is fixed an is 17 The n mb r of contacts in the

PCB termination are mig t dif fer when desig ated grou d-pin are combined

Several contact p sition (in total 5 ) are reserved for grou d con ection

The contacts are placed in two dif ferent contact rows

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4.3 Ratin s a d c ara teristic

Rated voltage: contact / contact 8 V r.m.s

In ulation resistan e:

10 MΩ minimum (10 MΩ minimum at initial con ition)

Perorman e level f or this con ector is 1 One termination method (pres -in termination

ac ordin to IEC 60 5 -5) is stan ardized, others are p s ible up n agre ment b twe n

man f acturer an c stomer Compres ion mou t termination or solder con ection are s c

termination method

5.2 Inf ormation on appl c tion

5.2.1 Complete con e tors (pairs)

A complete con ector con ists of b th, a f re an a fixed con ector

5.2.2 Fix d board conne tors

The f i ed b ard con ectors are con ected to the b c plane via pres -in termination Suita le

to ls s ould b u ed These to ls s ould b u ed in ac ordan e with the man facturers

sp cification

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Dimen ion are given in mi imetres, drawin s are s own in f irst an le projection The s a e

of the con ectors may deviate f om those given in the fol owin drawin s as lon as the

sp cified dimen ion are not influen ed

The f ol owin req irements a ply to the complete con ector con istin of b th the fe an

f i ed b ard con ectors

Mis in dimen ion s al b c osen ac ordin to the common c aracteristic an inten ed

u e The interf ace dimen ion of the fe b ard (male) style s al b c osen ac ordin to the

common c aracteristic of the f i ed b ard (female) styles

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6.2 Isometric view a d common fe ture

For the ref eren e s stem se Fig re 7, Fig re 8 an Fig re 9

6.3 Matin information

Trang 19

Figure 6 – Matin con itions: e d sto

The f re an the f i ed b ard con ector have to b plu ged u ti the f e con ector hits the

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6.4 Fix d board conne tor

6.4.1 Dime sions

Figure 7 – Fix d board conne tor

Trang 21

Solderles termination s al b ac ordin to the relevant IEC 6 3 2 stan ard F r pres -in

termination this is IEC 6 3 2-5 an f or compres ion-mou t termination this is IEC 6 3 2-8

For solder termination, soldera i ty is tested ac ordin to IEC 6 0 8-2-5

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6.5 Fre board conne tor

Trang 23

*

j( )

NOT * Th s dime sio s are v n or s e ific

Figure 9 – Fre board conne tor, part 2

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Table 3 – Dime sions of th fre b ard conne tor

Solderles termination s al b ac ordin to the relevant IEC 6 3 2 stan ard F r pres -in

termination this is IEC 6 3 2-5 an f or compres ion-mou t termination this is IEC 6 3 2-8

For solder termination, soldera i ty is tested ac ordin to IEC 6 0 8-2-5

The layout of the printed-b ard termination (p sition an size of con ection etc.) is of hig

influen e on the p r orman e c aracteristic of the con ector These detai s are up n

agre ment b twe n man f acturer an c stomer This do s not set a restriction on tec nical

develo ment

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Not a pl ca le

6.7 Mounting information for f ix d board conne tors

The dimen ion of the holes of b c planes are ac ordin to Fig re 10 an Ta le 4

IEC 43 2/12

Figure 10 – Dime sions of hole pat ern in ba kpla e

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Table 4 – Dime sions of hole pat ern in ba kpla e

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NOT Ap lc tio informatio – Th p rmis ible rate v lta e d p n s o th a plc tio or s e if i d s f ety

re uireme ts Re u tio s in cre p g or cle ra c dista c s ma o c r d e to th printe b ard or wirin u e ,

a d s al d ly b ta e into a c u t

7.2.2 Volta e proof

Con ition : IEC 6 512-4-1

Stan ard atmospheric con ition

Mated an u mated con ectors

Wirin ar an ement ac ordin to 8.7

Table 6 – Rate in ulation volta e

Mated con ectors

Temp rature c rves f or e c con u tor lsted in Ta le 1 to b me s red with al other

con u tor c r ents given in Ta le 7, to ac ou t for the co-he tin eff ect to other types of

con u tor At these c r ents, a maximal temp rature rise of 3 K is p rmited

Table 7 – Cur e t ratin per pin at ambie t of 7 °C

Mated con ectors

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Table 8 – Ma imal permis ible conta t re ista c c a ge

Mated con ectors

Test Voltage 8 V d.c

Table 9 – Minimal ins lation re ista c

108

Afer

moisture

107

Imp dan e s al b me s red with a source rise time < 3 ps (2 % – 8 %) The test f i ture

an ca les s al not degrade the rise time by more than 2 ps at the relevant test p int, i.e

max 5 ps rise time enterin the PCB termination are of the con ector u der test The

imp dan e mismatc of the tran ition are b twe n f i ed b ard con ector an f e b ard

con ector (o tional card ed e) may not b con idered sin e the dimen ion of the contact

p d on the f re b ard are ge metrical y fixed (l mited ro m for o timization ) Ref eren e

p ints ( ran ition ) of the con ector as p r Fig re 1 s al b identif ied in the me s red

imp dan e prof ile

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Dif ferential (Dif f.) imp dan e: 10 Ω ± 10 Ω b twe n ref eren e p ints AB an BD

(i.e ex lu in PCB termination an contact p int

Sin le En ed (SE) imp dan e: 5 Ω ± 10 Ω b twe n ref eren e p ints AB an BD

(i.e ex lu in PCB termination an contact p int

7.2.7.2 Propa ation dela

The ven or s al sp cify the pro agation c aracteristic of the con ector f or the diff erential

p irs of the b sic an exten ed side

Parameters:

– Pro agation delay within the con ector,

– Skew within a diff erential p ir,

– Pro agation delay b twe n diff erential p irs,

– Pro agation delay b twe n contact rows

7.2.7.3 S-parameters

Freq en y ran e for me s rements s al b d.c to 2 GHz The d.c an lower MHz values

can b interp lated or me s red se arately The imp dan e profi e can b calc lated fom

the S-Parameter fi es as lon as the source rise time is eq ivalent to < 3 ps (2 % – 8 %)

S-Parameters s al b displayed up to 2 GHz Pre- an p st er or cor ection method s ould

b a pl ed to isolate the con ector p rameters f rom the me s red data, sin e the res lts

in lu in test f i ture only give an in ication a out the p rf orman e of the con ector itself The

p r orman e req irements of the test fixture are des rib d in 8.9

The S-Parameter data can also b me s red with a TDNA (Time Domain Network-Analy er)

Parameters:

– Return L s (RL)

– In ertion L s (IL)

– Ne r en Cros talk (NEXT)

– Far en Cros talk (FEXT)

For the NEXT an FEXT me s rements the fol owin combination s al b me s red (se

also Fig re 12):

– b twe n adjacent p irs (b th contact rows),

Trang 30

– 5 Ag res ors Power s m worst case NEXT (al aggres ors are RX) an FEXT (al

ag res ors are TX)

fNEXT

nn

10)(

)

10log(

10)(

10/(

7.3 Me ha ic l c ara teristic

7.3.1 Me ha ic l operation

Al contacts s al tolerate 2 0 o eration c cles without lo d without damage that would imp ir

normal o eration

7.3.2 En a in a d withdrawal forc s

Rate of en agement an with rawal: 10 mm p r secon max

The f orce ne ded to en age s al not ex e d 10 N

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The f orce ne ded to disen age s al not ex e d 6 N

7.3.3 Conta t rete tion in ins rt

Not a pl ca le

7.3.4 Static loa , tra s ers

The con ectors s al with tan a static lo d of 2 0 N f or 1 min d ration in f ul y mated

con ition without damage that would imp ir normal o eration

The f orce s al b a pl ed to the f re con ector ac ordin to Fig re 17

7.3.5 Ga ge rete tion f orc

Not a pl ca le

7.3.6 Vibration (sinusoid l)

Mated con ector, ar an ement ac ordin to 8.5

Ac eleration 5 0 m/s

2

Duration of imp ct 11 ms

Thre s oc s in two direction /axis, in thre axes (18 s oc s in total)

Req irement: no rise of resistan e a ove 10 Ω for more than 10 n

This test s hed le s ows the tests an the order in whic they s al b car ied out, as wel as

the req irements to b met

Unles otherwise sp cified, mated sets of con ectors s al b tested Care s al b taken to

ke p a p rtic lar combination of connectors together d rin the complete test seq en e;

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when u matin is, f or example, neces ary for a certain test, the same con ectors s al b

mated f or the s bseq ent tests

In the f ol owin , a mated set of con ectors is caled a sp cimen

Bef ore testin commen es, the con ectors s al have b en stored f or at le st 2 h in the non

-in erted state u der normal clmate con ition for testin ac ordin to IEC 6 0 8-1

When initial tests ac ordin to test group P have b en completed, al sp cimen are divided

up ac ordin to the test groups A to F, ex e t the sp cimen f or test group G

The n mb r of sp cimen neces ary for entire in p ction an test seq en e is def i ed in

NOT 1 As th te ts of gro p F are n t a plc ble, n s e ime s are re uire f or this te t gro p, u le s

oth rwis s e if i d b th ma ufa turer

NOT 2 Th n mb r of s e ime s for te t gro p G d p n s o th ty e of termin tio te te a d th rele a t

te t sta d rd Th s s e ime s d n t u d rg th initial te ts a c rdin to te t gro p P

At le st 10 contacts p r sp cimen s al b taken into ac ou t for me s rement of the test

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Fig re 14 – Ar a geme t f or me s reme t of conta t disturba c

The me s rement of contact resistan e s al b car ied out on the n mb r of contacts

I = 0,12 A (alhig -s e d sig al c ont a s c on ec t ed in s rie )

I = 1,9 A (al p w er c ntac t s c on ec t ed in s rie )

I = 0,3 5 A (al gro n c ont a s c n e t ed in s rie )

IEC 43 7/2

Fig re 15 – Wiring ar a geme t f or c r e t c r ying me s reme t

8.5 Ar a geme t f or dy amic stre s te ts

Con ition : IEC 6 512, tests 6c an 6d

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Printe b ard

IEC 43 8/12

Figure 16 – Te t s tup for s oc a d vibration te t

8.6 Ar a geme t f or te ting static loa ; tra s ers

Con ition : The static lo d has to b a pl ed ac ordin to Fig re 17

Fig re 17 – Appl c tion of static loa

8.7 Ar a geme t f or volta e proof a d polarization volta e

The wirin ar an ement f or voltage pro f is ac ordin to Fig re 18 The test has to b

p r ormed ac ordin to IEC 6 512-4-1, Test 4

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8.9 Te t boards f or impe a c a d tra smis ion c ara teristic

The test b ard s al al ow testin of at le st 4 neig b rin dif ferential p irs, two adjacent on

e c side plu the o p site two (see Fig re 2 )

IEC 42/12

Figure 2 – Bre k out are of th con e tor footprint

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Rise time degradation of the test b ard s al b les than 2 ps (2 % – 8 %) p r b ard.

5 Ω sin le en ed an 10 Ω dif ferential imp dan e b th with max 6 % toleran e L s es

s al b b t er than 1 dB at 1 GHz, 3 dB at 5 GHz an 6 dB at 10 GHz

IEC 43 /12

Figure 21 – Ex mple of a te t fixture for fix d board conne tors

IEC 44/2

Figure 2 – Ex mple of a te t fixture f or fre board conn ctors

The test fixture may in lu e stru tures f or pre-er or cor ection an pro er de-emb d in of

the con ector The tracelen th of the diff erent con ection on e c test f i ture s al b

matc ed mec anical y within 0,0 mm len th The tracelen th may b diff erent on dif ferent

test f i tures (se Fig res 21 an Fig re 2 for examples)

8.10 Pre-conditioning

Bef ore the tests are p rf ormed, the con ectors s al b precon itioned u der con ition

sp cified in IEC 6 0 8-1 f or a p riod of 2 h, u les otherwise sp cified by the detai prod ct

When mou tin is req ired in a test, the con ectors s al b rigidly mou ted on a metal plate,

a printed b ard or to sp cified ac es ories, whic ever is a pl ca le, u in the normal

mou tin method an f i in devices as laid down in 8.1 to 8.9

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8.12 Te t proc dure a d me s ring method

The test method sp cified an given in the relevant stan ard are the prefer ed method but

not neces ari y the only ones whic can b u ed In case of dispute, however, the sp cif ied

method s al b u ed

Unles otherwise sp cif ied, al tests s al b car ied out u der stan ard atmospheric

con ition for testin as sp cified in IEC 6 0 8-1

The sp cimen s al b divided into six groups Al con ectors in e c group s al u dergo

the tests sp cified for the relevant group

Trang 40

Table 12 – Te t group A (c nt in ed)

Tiêu đề	IEC 61076-4-116:2015 - Connectors for electronic equipment – Product requirements – Part 4-116: Printed board connectors – Detail specification for a high-speed two-part connector with integrated shielding function
Trường học	Geneva University
Chuyên ngành	Electrical and Electronics Engineering
Thể loại	Standards Document
Năm xuất bản	2015
Thành phố	Geneva

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Số trang	214
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