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Tiêu đề IEC 61000-4-24:2015
Trường học International Electrotechnical Commission
Chuyên ngành Electrotechnical standards
Thể loại Standards publication
Năm xuất bản 2015
Thành phố Geneva
Định dạng
Số trang 88
Dung lượng 2,55 MB

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  • 3.1 Terms and definitions (10)
  • 3.2 Abbreviated terms ................................................................................................. 1 0 (12)
  • 4.1 General ................................................................................................................. 1 0 (12)
  • 4.2 Test setup ............................................................................................................. 1 1 (13)
  • 4.3 Pulse generator .................................................................................................... 1 1 (13)
  • 4.4 Launching line ...................................................................................................... 1 1 (13)
  • 4.5 Test fixtures .......................................................................................................... 1 2 (14)
    • 4.5.1 General ......................................................................................................... 1 2 (14)
    • 4.5.2 Type A fixtures .............................................................................................. 1 2 (14)
    • 4.5.3 Type B fixtures .............................................................................................. 1 2 (14)
  • 4.6 Termination ........................................................................................................... 1 3 (15)
  • 4.7 Oscilloscope ......................................................................................................... 1 4 (16)
  • 4.8 Test procedure ...................................................................................................... 1 4 (16)
    • 4.8.1 Adjustment of the pulse generator ................................................................. 1 4 (16)
    • 4.8.2 Verification procedures .................................................................................. 1 4 (16)
    • 4.8.3 Test ............................................................................................................... 1 5 (17)
    • 4.8.4 Final examination of the DUT ......................................................................... 1 5 (17)
  • 4.9 Referring to this standard ...................................................................................... 1 5 (17)
  • 5.1 Verification setup .................................................................................................. 1 6 (18)
  • 5.2 Measurement setup .............................................................................................. 1 6 (18)
  • 5.3 Measurement instrument ....................................................................................... 1 7 (19)
    • 5.3.1 Pulse generators ........................................................................................... 1 7 (19)
    • 5.3.2 Oscilloscope .................................................................................................. 1 9 (21)
    • 5.3.3 Current sensors ............................................................................................. 1 9 (21)
    • 5.3.4 Test loads ...................................................................................................... 1 9 (21)
  • 5.4 Test modes required ............................................................................................. 1 9 (21)
  • 5.5 Measurement procedure (8)
    • 5.5.1 General (23)
    • 5.5.2 Verification of pulses (23)
    • 5.5.3 Measurement procedure (23)
  • 5.6 Evaluation of test results (24)
  • 5.7 Test report (25)
  • A.1 General (26)
  • A.2 Variation of the cable connected for the measurement of short-circuit current (26)
  • A.3 Variation of the length of the cable L2 connected for the measurement of (29)
  • A.4 Variation of load impedance and cable length for connection between load (33)
  • A.5 Variation of the cable length between load and ground (35)

Nội dung

14 Fig re 3 – Typical setup for verification of the pulse test level.. This p rt of IEC 610 0 is an international stan ard that esta ls es the req ired test proced res for protective dev

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Compatibi ité électromagnétique (CEM) –

Partie 4-24: T echniques d’essai et de mesure – Méthodes d’essai pour les

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Part 4-24: T esting and measur ement techniques – Test methods for protectiv e

Partie 4-24: T echniques d’essai et de mesure – Méthodes d’essai pour les

INT ERNAT IONAL

ELECT ROT ECHNICAL

ELECT ROT ECHNIQUE

INT ERNAT IONALE

BASIC EMC PUBLICATION

PUBLICA TION FONDAMENTA LE EN CEM

®

Warnin ! Mak e s re that you obtain d this publc tio from a a th rize distributor

Atte tio ! Ve i ez v u a s rer q e v u a ez obte u c t e publc tio via u distribute r a ré

c lo r

insid

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FOREWORD 5

INTRODUCTION 7

1 Sco e 8

2 Normative referen es 8

3 Terms, definition an a breviated terms 8

3.1 Terms an definition 8

3 2 Ab reviated terms 1

0 4 Test method for protective devices (ex lu in fi ter) for con u ted disturb n e 10 4.1 General 10 4.2 Test setup 1

4 3 Pulse generator 1

4.4 L u c in l ne 1

4.5 Test fixtures 12 4.5.1 General 12 4.5.2 Type A fixtures 12 4.5.3 Type B fixtures 12 4.6 Termination 13 4.7 Os i os o e 14 4.8 Test proced re 14 4.8.1 Adju tment of the pulse generator 14 4.8.2 Verification proced res 14 4.8.3 Test 15 4.8.4 Final examination of the DUT 1

5 4.9 Refer in to this stan ard 15 5 Me s rement method for HEMP combination fi ters 16 5.1 Verification setup 16 5 2 Me s rement setup 1

6 5.3 Me s rement in trument 17 5.3.1 Pulse generators 17 5.3.2 Os i os o e 19 5.3.3 Cur ent sen ors 19 5.3.4 Test lo d 19 5.4 Test modes req ired 19 5.5 Me s rement proced re 21

5.5.1 General 21

5.5.2 Verification of pulses 21

5.5.3 Me s rement proced re 21

5.6 Evaluation of test res lts 2

5.7 Test re ort 2

An ex A (informative) In estigation for the esta l s ment of a me s rement setup 2

A.1 General 2

A.2 Variation of the ca le con ected for the me s rement of s ort circ it c r ent 2

A.3 Variation of the len th of the ca le L con ected for the me s rement of resid al c r ent 2

A.4 Variation of lo d imp dan e an ca le len th for con ection b twe n lo d

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A.5 Variation of the ca le len th b twe n lo d an grou d 3

An ex B (informative) Test method for the q antitative determination of the direct resp n e b haviours of a co xial s rge protector 3

Biblogra h 4

Fig re 1 – Test setup for testin protective devices 1

Fig re 2 – Example of a typ B test fixture (u iversal) 14 Fig re 3 – Typical setup for verification of the pulse test level 16 Fig re 4 – Example of test setup u in one or two s ielded en los res 17 Fig re 5 – Example of test setup u in a s ielded en los re 17 Fig re 6 – Double exp nential waveform 19 Fig re 7 – Example of wirin setup of a sin le l ne DUT 2

Fig re 8 – Example of wirin setup for a mutual y coupled multi-l ne DUT 2

Fig re A.1 – Setup for cal bration 2

Fig re A.2 – Pe k c r ent cal bration res lts with 9 mm 2 ca les: 1 0 0 A ± 4 % 2

Fig re A.3 – Rise time calbration res lts with 9 mm 2 ca les 2

Fig re A.4 – FWHM cal bration res lts with 9 mm 2 ca les 2

Fig re A.5 – Pe k c r ent calbration res lts with 4 mm 2 ca les: 1 0 0 A ± 8 % 2

Fig re A.6 – Rise time calbration res lts with 4 mm 2 ca les 2

Fig re A.7 – FWHM calbration res lts with 4 mm 2 ca les 2

Fig re A.8 – Me s rement setup for resid al c r ent 2

Fig re A.9 – Me s rement res lt of p ak c r ent with variation of me s rement ca le L 2

Fig re A.10 – Me s rement res lt of p ak rate of rise with variation of me s rement ca le L 2

Fig re A.1 – Me s rement res lt of ro t action with variation of me s rement ca le L 2

Fig re A.12 – Variation of the p sition of c r ent sen or 2 on the me s rement ca le L 3

Fig re A.13 – Pe k c r ent with variation of ca le L an at diferent p sition 3

Fig re A.14 – Pe k rate of rise with variation of ca le L an at dif erent p sition 31

Fig re A.15 – Ro t action with variation of ca le L an at dif erent p sition 31

Fig re A.16 – Me s rement res lt of p ak c r ent with variation of lo d imp dan e 3

Fig re A.17 – Me s rement res lt of p ak rate of rise with variation of lo d imp dan e 3

Fig re A.18 – Me s rement res lt of ro t action with variation of load imp dan e 3

Fig re A.19 – Variation of the len th of ca le L con ected b twe n lo d an grou d plane 3

Fig re A.2 – Me s rement res lt of p ak c r ent with variation of me s rement ca le L 3

Fig re A.21 – Me s rement res lt of p ak rate of rise with variation of me s rement ca le L 3

Fig re A.2 – Me s rement res lt of ro t action with variation of me s rement ca le L 3

Fig re B.1 – Test setup with a p wer divider for testin protective devices 3

Fig re B.2 – Waves pro agatin alon the bran hes 3

Fig re B.3 – Simpl fied test setup for testin protective devices 3

Ta le 1 – Overview of con u ted e rly- ime HEMP (CEP) test req irements defined in

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Ta le 2 – Overview of con u ted intermediate- ime HEMP (CIP) test req irements

defined in other sp cification 18

Ta le A.1 – Me s rement res lts for the waveform cal bration of s ort circ it c r ent 2

Ta le A.2 – Me s rement res lts for variation of the ca le len th at the me s rement

p ints 2

Ta le A.3 – Me s rement res lts for variation of the lo d imp dan e 3

Ta le A.4 – Me s rement res lts for variation of the ca le len th b twe n lo d an

grou d 3

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p te t rig ts IEC s al n t b h ld re p n ible for id ntifyin a y or al s c p te t rig ts

International Stan ard IEC 610 0-4-2 has b en pre ared by s bcommit e 7 C: Hig p wer

tran ient phenomena, of IEC tec nical commit e 7 : Electromag etic comp tibi ty

It forms Part 4-2 of IEC 610 0 It has the statu of a b sic EMC publ cation in ac ordan e

with IEC Guide 10

This secon edition can els an re laces the first edition publs ed in 19 7 This edition

con titutes a tec nical revision

This edition in lu es the fol owin sig ificant tec nical c an es with resp ct to the previou

edition:

a) A new Clau e 5: Me s rement method for HEMP combination fiters, whic contain 5.1

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5.5 Me s rement proced res, 5.6 Evaluation of test res lts, whic introd ced p rforman e

criteria of fi ter, an 5.7 Test re ort

b) A new informative An ex A: In estigation for the esta l s ment of a me s rement setup,

whic was b sed on Clau e 5

c) A new informative An ex B: Test method for the q antitative determination of the direct

resp n e b haviours of a co xial s rge protector

The text of this stan ard is b sed on the fol owin doc ments:

Ful information on the votin for the a proval of this stan ard can b foun in the re ort on

votin in icated in the a ove ta le

This publ cation has b en draf ed in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts in the IEC 610 0 series, publ s ed u der the general title Ele ctromagnetc

co mpatb il y (EMC ), can b fou d on the IEC we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date indicated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

IMPORTANT – The 'c lour inside' lo o on the c v r pa e of this publ c tion in ic te

that it c ntains c lours whic are c nsidere to be us ful for the c r e t

understa din of its c nte ts Us rs s ould th refore print this d c me t using a

c lour printer

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This stan ard is p rt of the IEC 610 0 series of stan ard , ac ordin to the folowin

stru ture:

Part 1: General

General con ideration (introd ction, fu damental prin iples)

Mitigation method an devices

Part 6: Generic stan ard

Part 9: Mis el ane u

Eac p rt is further s bdivided into several p rts, publs ed either as international stan ard ,

as tec nical sp cification or tec nical re orts, some of whic have alre d b en publs ed

as section Others wi b publs ed with the p rt n mb r fol owed by a das an a secon

n mb r identifying the s bdivision (example: IEC 610 0-6-1)

The IEC has initiated the pre aration of stan ardized method to protect civi an society from

the ef ects of hig p wer electromag etic (HPEM) en ironments Su h ef ects could disrupt

s stems for commu ication , electric p wer, information tec nolog , etc

This p rt of IEC 610 0 is an international stan ard that esta ls es the req ired test

proced res for protective devices for HEMP con u ted disturb n e, s c as gas dis harge

tub s, varistors, two-p rt SPDs an HEMP combination fi ters

The a plcation of this stan ard is, however, not de en ent on ac es to other section an

p rts of the IEC 610 0, ex e t for those sp cifical y refer ed to

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This p rt of IEC 610 0 de ls with method for testin protective devices for HEMP con u ted

disturb n e It in lu es two- erminal elements, s c as gas dis harge tub s, varistors, an

two-p rt SPDs, s c as HEMP combination fiters It covers testin of voltage bre k own an

voltage-l mitin c aracteristic but also method to me s re the resid al voltage an /or the

resid al c r ent, p ak rate of rise an ro t action for the case of very fast c an es of voltage

an c r ent as a fu ction of time

This stan ard do s not cover in ertion los me s rement method

The fol owin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le for its a pl cation For dated referen es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 610 0-2-10, Ele c tromag netc c ompatb il y (EMC) – Part 2-10 : En iro me t – De scrip tio

o f HEMP e viro me t – Co ducted disturbanc e

3 Terms, definitions and abbreviated terms

For the purp ses of this doc ment, the fol owin terms, definition an a breviated terms

a ply

3.1 Terms a d definitio s

3.1.1

fe d- hro gh d vic

two-p rt device, whic is desig ed to fe d a sig al throu h an electromag etic b r ier (s ield)

Note 1 to e try: Ty ic ly it is in g o ele tric l c nta t with th b r ier a d h s o e p rt o e c sid of th

b rier, th s maintainin th is latio of th b rier

3.1.2

ga dis harge tube

device with two or thre metal electrodes hermetical y se led so that gas mixture an

pres ure are u der control, an desig ed to protect a p ratu or p rson el from hig

tran ient voltages

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s alar q antities that c aracterise the fe tures of a waveform

Note 1 to e try: Norms are u e to c ara teris fe ture of a wa eform th t relateto s s e tibi ty me h nisms

test method for me s rin the performan e of a protective device

Note 1 to e try: A HEMP thre t relata le tra sie t is inje te o th in ut of th prote tiv d vic a d th

re id al tra sie t stre s is me s re o its o tp t

Note 2 to e try: This n te a ple to th Fre c la g a e o ly

3.1.8

pe k c r e t

maximum a solute value of a c r ent waveform, I(t), expres ed in u its of amp re

3.1.9

primary prote tio eleme t

first protective element se n from the u protected side of a protection me s re, divertin the

electrical comp nent s c as a fiter, gas dis harge tub , metal oxide varistor (or other), for

protection again t con u ted disturb n e, or a s ield, gas et, waveg ide tra (or other), for

protection again t radiated disturb n e, whic is u ed to lmit an con u ted or radiated

stres Su h an element or a combination of several of them th s forms p rt of the con e tual

2

|)(

|

Trang 12

SPD

s rge prote tiv de ic

device that is inten ed to l mit tran ient over-voltages an divert s rge c r ents It contain at

le st one non-l ne r comp nent that is inten ed to lmit s rge voltages an divert s rge

c r ents

Note 1 to e try: This n te a ple to th Fre c la g a e o ly

[SOURCE: IEC TR 610 0-5-6:2 0 , 3.2 , modified – a note has b en ad ed

3.1.14

two-port SPD

SPD whic is not only a s u tin device, but con ists of a se arated input p rt on the

u protected side an an output p rt on the protected side

Note 1 to e try: Ty ic ly two-p rt S Ds are “bla k b x s” with n n-ln ar s u tin d vic s to gro n a d a

p rameter that is determined from a mathematical y wel -defined o eration on a waveform or

sig al (s c as an integration of the waveform), whic yield a s alar n mb r that p rmits a

comp rison of variou waveforms or their efects

The actual b haviour of a protective device u der HEMP con ition de en s very mu h on

how it is integrated into its place of u e an other at en ant circ mstan es (e.g q al ty of

s ieldin b twe n the protected an u protected side of a protection element The fol owin

test method take this into ac ou t They are defined so that the res lts o tained are as far

as p s ible related to the q al ties of the device u der test (DUT), an the test ar an ement

do s not dif er to mu h from practical protection ar an ements

NOT Cla s 4 is inte d d to a ply for a prote tiv d vic s c a g s dis h rg tu e , v ristors a d two-p rt

Trang 13

4.2 Te t s tup

The test setup con ists of a pulse generator (G), a lau c in l ne, a test fixture for the DUT,

an a termination with a con ectin l ne an os i os o e (se Fig re 1) Variou source

imp dan es may b u ed, but the example s own in Fig re 1 u es 5 Ω Other values could

b sp cified

Figure 1 – Te t s tup for te ting prote tiv d vic s

To prevent p rasitic coupl n b twe n the pulse generator an the os i os o e, b th the

u protected an protected side of the setup s al b entirely s ielded It is recommen ed to

u e ca les with multiple braided wire s ield or sold s ield The ca le an con ectors s al

b ca a le of with tan in the hig voltage pulse without a bre k own Grou din lo ps s al

b avoided

4.3 Puls g nerator

The pulse generator s al prod ce a normal y rectan ular voltage pulse into a matc ed

termination The output voltage (into a matc ed termination) s al b adju ta le to a value 2

times hig er than the exp cted l mitin voltage of the DUT Both p larities s al b avai a le

The c aracteristic of a pulse generator are as fol ows:

– c aracteristic imp dan e: 5 Ω or an alternative value

– pulse wavefront , du/dt : at le st 1 kV/n

4.4 La nc ing l ne

The lau c in l ne con ists of a co xial ca le with a c aracteristic imp dan e of 5 Ω or the

value sp cified The ca le b twe n the pulse generator an the DUT s al b lon enou h so

that reflection from the DUT do not ar ive at the pulse generator d rin the pulse front To

ac ieve this con ition, the one-way pro agation time alon the ca le s al b gre ter than

Trang 14

ste pnes of the pulse front may b lowered an th s adju ted to the desired value, by further

exten in the lau c in l ne

4.5 Te t fixture

Test fixtures are mec anical setups with co xial con ectors on b th the u protected an the

protected terminals Their tas is to hold the DUT Two dif erent typ s of test fixtures may be

u ed They are refer ed to as typ A an typ B as des rib d b low

4.5.2 Type A fixture

Gas dis harge tub s inten ed to b u ed for protection of co xial hig - req en y a pl cation

may b tested in cor esp n in , commercial y avai a le holders The protective device is

in erted b twe n the in er an outer con u tor of the co xial setup, with a minimum of

influen e on the c aracteristic imp dan e Su h holders alow the in erent pro erties of the

device to b me s red expl citly an with go d re e ta i ty

4.5.3 Type B fixture

Typ B fixtures are u iversal an a ply in prin iple to al kin s of two- erminal or two-p rt

protective devices, whether they have a fe d- hrou h or non- e d- hrou h config ration

However, me s rements on low-voltage devices l ke protective diodes an varistors may b

stron ly influen ed by in u tive overs o t d e to hig d i/d t

NOT By e s rin th te t fixture le d le gth are a s ort a pra tic ly p s ible, th ris of in u tiv influ n e

c n b mitig te

The fixture is comp sed of thre p rts: the u protected s el, the p rtition s re n an the

protected s el (se Fig re 2)

4.5.3.2 Unprote te s el

The dimen ion an cros -section s ap may b ada ted to the size of the DUT The s el

may b c t into two p rts in the axial direction for b ter ac es to the solder p ints If not

otherwise stated, the len th of the wire from the u protected con ector (P

1

to the input

contact of the DUT (P

2) s al not b lon er than the len th of the c r ent p th in the DUT

b twe n p ints P

2

an the grou din contact of the DUT (P

3)

4.5.3.3 Partitio s re n

Fe d- hrou h protective devices s al b in erted in the p rtition s re n in the same way as

in actual a pl cation

Non- e d- hrou h devices s al b p s ed throu h a hole in the p rtition s re n as s own in

Fig re 2 ) an 2 ) The wire p s in throu h the p rtition s re n s al b in ulated A fe d

-throu h ca acitor or other fe d- hrou h element s al not b u ed A non- e d- hrou h DUT

may b placed close to the s re n but s al not tou h it, ex e t if it is to b in tal ed on to a

metal wal in actual a pl cation (as s own in Fig re 2c)

4.5.3.4 Prote te s el

The protected s el serves as tran ition to the protected con ector The protected s el s al

b made as s ort as p s ible The len th of the con ection b twe n p int P

2

an the

Trang 15

4.6 Terminatio

The termination s al b matc ed to the c aracteristic imp dan e of the test setup within the

3 dB-b n width of the os i os o e It s al b of the fe d- hrou h typ , fol owed by a hig

-imp dan e, voltage-dividin pro e of the os i os o e or b p rt of the first stage of an

aten ator in front of the os i os o e The lne b twe n the test fixture an termination s al

have the same imp dan e as the termination It s al b as s ort as p s ible Its at en ation

s al b les than 0,5 dB at the up er 3 dB c t of freq en y of the os i os o e Make s re

that the termination with tan s the test pulses without degradation

a) Ex mple of a type Bte t fixture with a two-erminal D T in n n-e d-hro gh co figuratio

Trang 16

c) Ex mple of a te t fixture with a DUT in a fe d-hro gh co figuratio

Figure 2 – Ex mple of a type B te t fixture (univ rs l)

4.7 Os i los ope

The b n width of the os i os o e an the other comp nents of the test setup s al b wide

enou h that the overal toleran e of the p ak values of u an du/d t d e to b n width

l mitation an other s stem er ors is not hig er than ± 0 %

4.8 Te t proc d re

4.8.1 Adjustme t of the puls ge erator

The lau c in lne is first con ected directly to the l ne le din to the termination (se

Fig re 1)

The pulse generator is adju ted as fol ows:

a) if the DUT, or the primary protection element of a four- erminal DUT, is a gas dis harge

tub , the ste pnes of the le din front of the prosp ctive pulse s al b at le st 1 kV/n

at the impulse sp rk-over voltage of the gas dis harge tub d rin the test;

b) if the DUT, or the primary protection element of a four- erminal DUT, is a voltage-l mitin

device (e.g protective diode or varistor), the hig est tan ential ste pnes of the le din

front of the prosp ctive pulse is as des rib d by

is the c aracteristic imp dan e an d i/d t is the sp cified value

NOT Th s e ifie di/d t c re p n s to th a tu l di/dt in th D T d rin th te t As th D T h s a v ry low

imp d n e c mp re with 5 Ω or th s e ifie imp d n e, th c re t i a d th refore als d i/dt is d u le d rin

th te t

4.8.2 Verific tion proc dure

The lau c in l ne is then con ected to the test fixture (se Fig re 1)

If a test fixture type B is u ed, the internal con ection b twe n the protected an the

u protected con ector s al b tested for tran mis ion c aracteristic

For this purp se the DUT is removed an the same pulse as u der 4.8.1 (adju tment of the

pulse generator) is a pl ed The me s red output s al not difer from the output me s red

Trang 17

wire s ould b in re sed (a hig er ca acity wi lower the c aracteristic imp dan e an

improve the matc b twe n the pulse generator an the lo d)

To make s re that no u desired coupln b twe n the u protected an the protected side of

the test setup is present, verification tests s al b made with the fol owin modification on

the test setup:

If the DUT is a two- erminal element, it s al b re laced by a s ort circ it con ection of the

same len th an form as the c r ent p th throu h the DUT The con ection b twe n P

2an

the centre-pin of the protected con ector (se Fig re 2) s al b removed One test s al b

made with the centre-pin of the protected con ector lef o en an another one with this pin

con ected to the grou d (within the protected s el )

If the DUT is a fe d- hrou h device, it s al b re laced by a device of the same dimen ion

(d mmy DUT) made entirely of wel -con u tin metal an th s re resentin an ide l s ort

circ it The centre-pin of the protected con ector s al b con ected to the output pin of the

d mmy DUT

The p ak value of the resid al voltage me s red u der these con ition s al b les than 5 %

of the p ak value me s red in the final test

4.8.3 Te t

The d mmy DUT is re laced by the DUT, an the resid al voltage is me s red an comp red

to the verification criteria

4.8.4 Fin l e amination of the DUT

Afer the test, the DUT s al b examined for visible damage If visible damage is o served,

the DUT wi b de med to fai the test If there is no visible damage a fu ctional test s al b

p rformed to verify that the DUT is within its sp cification

4.9 Refer ing to this sta dard

When referen e is made to this stan ard, the fol owin ad itional information s al b given

Stan ard proced re:

– for me s rement on two- erminal

elements in fixture B:

len th of con ection wires, se overal

len th of DUT b twe n solder p ints (4.5.3)

Modification from stan ard proced re:

– c aracteristic imp dan e:

– modification of DUT: if con ectin wires of gas dis harge tub s are

c t away for me s rement in typ A fixture

– ad itional comp nents to the DUT for example ad itional circ it comp nents;

Trang 18

5 Meas rement method for HEMP combination fi ters

5.1 Verific tion s tup

The output of the pulse generator s al b verified prior to a plyin a pulse to a DUT The

typical setup for verification of the pulse test level is i u trated in Fig re 3

a

At le st o e of th two e clo ure s al b s ield d Care s o ld b ta e to minimiz ra iate a d c n u te

interfere c

Figure 3 – Typic l s tup for v rific tion of the puls te t le el

The pulse generator s al b con ected to the grou d plane The output ca le L1 s al also

b con ected to the grou d plane to ena le the s ort circ it pulse c r ent to b me s red

The len th an ge metry of ca le L1 s al b c osen to minimize the in u tan e an s al b

the same as when the DUT is con ected (se An ex A) The in ulation of the ca le to the

grou d s ould b s f icient to avoid bre k own for al impulse voltages

If the size or setup of the DUT req ires a lon ca le L1, then the ca le may b co xial to

ac ieve the req ired pulse rise time at the DUT If the ca le selected is co xial, the s ield

s ould b p red b c , an the in er con u tor s al b exp sed an b n ed to the grou d

The c r ent pro e s al b placed arou d the exp sed in er con u tor Alternatively a co xial

c r ent s u t can b u ed

The p sition of the c r ent sen or s al b within 0,15 m from the grou d con ection Care

s al b taken to electricaly isolate the b d of the c r ent sen or from metal c s rfaces to

avoid grou d lo ps

5.2 Me s reme t s tup

Two typical me s rement setups are i u trated in Fig re 4 an Fig re 5 The pulse generator

output s al b directly con ected to the input terminal of the DUT throu h the same ca le as

u ed for verification

The c r ent sen or 1 an os i os o e 1 can b u ed o tional y to monitor the injected c r ent

into the DUT

The c r ent sen or 2 for the me s rement of resid al c r ent into the d mmy lo d s al

prefera ly be within 0,15 m of the output terminal of the DUT Alternatively a grou ded

Trang 19

The ca les L an L s al b as s ort as p s ible.

It may b neces ary to s ield the me s rement in trument an to isolate the p wer s p ly to

avoid interferen e d e to grou d lo ps

If a v lta e pro e is u e it s o ld b c n e te a ro s th lo d re istor

a

At le st o e of th two e clo ure s al b s ield d Care s o ld b ta e to minimiz ra iate a d c n u te

interfere c

Figure 4 – Ex mple of te t s tup usin one or two s ielde e clos re

F/O me n fibre o tic c n erter Fibre ln s ma b u e a a o tio to pro id a d gre of is latio s th t th

p ls g n rator a d o ci o c p s c n b p y ic ly s p rate to minimiz interfere c

If p ls g n rator a d inje tio c ble L1 are n t s ield d, th n o ci o c p s 1 a d 2 s o ld b in a s ield d

e clo ure to a oid pic -u Care s o ld b ta e to minimiz ra iate a d c n u te interfere c

Figure 5 – Ex mple of te t s tup using a s ielde e clos re

5.3 Me s reme t in trume t

5.3.1 Puls g nerators

Short circ it c r ent is defined as c r ent driven throu h a s ort circ it con ected to the

generator output Source imp dan e is defined as the generator p ak o en circ it voltage

Trang 20

Pulse test req irements can b selected from Ta le 1 an Ta le 2, for e rly- ime HEMP an

intermediate- ime HEMP resp ctively

In al c s s, for pra tic l re s n lower s urc imp d n e ma b u e Howe er th s urc imp d n e

s o ld n t b le s th n ty ic ly 10 Ω to e s reth t th a ple p ls v lta e is gre ter th n th bre k own

v lta e of th n n-ln ar c mp n nts in th D T

Table 2 – Ov rview of c n ucted interme iate- ime HEMP (CIP) te t

re uireme ts define in other spe ific tions

Type

Ris

time

FWHMa

In al c s s for pra tic l re s n lower s urc imp d n e ma b u e Howe er th s urc imp d n e

s o ld n t b le s th n ty ic ly 10 Ω to e s reth t th a ple p ls v lta e is gre ter th n th bre k own

v lta e of th n n-ln ar c mp n nts in th D T

c

No te t is re uire for ln le gth s orter th n 2 0 m

_ _ _ _ _ _ _

Trang 21

The s ort circ it c r ent of the pulse generator has a double exp nential waveform (se

Fig re 6)

Figure 6 – Do ble e pone tial wa eform

5.3.2 Os i los ope

The b n width of the os i os o e s al b wide enou h to resolve the fastest rise time

(< 10 n , DC to > 100 MHz for the e rly- ime HEMP an DC to > 1 MHz for the intermedi

ate-time HEMP) an s al have minimum sen itivity as req ired for me s rement sen itivity The

req ired input imp dan e of the s o e ampl fier de en s on the typ of voltage or c r ent

pro e an s al b selected ac ordin ly ( ypical y 5 Ω or 1 MΩ)

5.3.3 Cur e t s ns rs

The me s rement b n width of the c r ent sen ors s ould cover the freq en y ran e of

10 kHz to 10 MHz for the e rly- ime HEMP an DC to 1 MHz for the intermediate pulse

The total me s rement ran e in combination with the s o e's vertical ampl fier ran e s al b

0 A to 5 0 0 A for the e rly- ime HEMP an 0 A to 2 0 A for the intermediate- ime HEMP For

the me s rement of c r ents to grou d a resistive c r ent s u t mig t give the most ac urate

r es lts

5.3.4 Te t lo ds

Durin al tests a DUT test lo d ac ordin to the test mode an a DUT wirin setup as defined

in Ta le 3 s al b u ed The toleran e of the test lo d s al b ±10 % if not stated otherwise

The test modes can b selected from the fol owin l st, de en in on the a pl cation of the

DUT As a minimum, the nominal lo d mode(s) s al b p rfor med

• ETM1: Early- ime HEMP / o en-circ it

• ETM2: Early- ime HEMP / nominal lo d

• ETM3: Early- ime HEMP / s ort circ it

• ITM1: Intermediate- ime HEMP / o en-circ it

• ITM2: Intermediate- ime HEMP / nominal lo d

• ITM3: Intermediate- ime HEMP / s ort circ it

IETime

– eαt

R

a d FWHM

Trang 22

Sin e o en-circ it me s rements are dif ic lt, a ≥ 1 MΩ lo d mig t b a go d c oice sin e

typical voltage pro es of os i os o es have a ≥ 1 MΩ input imp dan e

Ta le 3 s ows the test modes as req ired for diferent typ s of DUTs The termination lo d

imp dan es of the DUT for the e rly- ime HEMP s al b c osen ac ordin to Ta le 3

The DUT wirin setups (WSs) are as fol ows:

WS2 is an example of wirin setup, whic may b u ed for a multi-lne DUT with lnes whic

are coupled to e c other either electrical y or mag etical y (e.g by c r ent comp n ated

in u tors or if there are dif erential mode protection comp nents) One lne is tested at a time

an the secon an al other l nes (das ed l nes) are con ected together at the output side

an grou ded The l nes that are not tested s ould remain o en at the input side to avoid

Trang 23

De e din o th D T d sig , eith r WS1 or WS2 s al b a ple Th 2 Ω lo d h s b e d fin d in MIL

-S D-18 -12 -1 for p wer ln s Sh rtcirc it a d o e -circ it lo d c n itio s are o tio al th refore n

re uireme t is d fin d in this sta d rd

5.5 Me s reme t proc dure

To minimize the p s ibi ty of DUT damage, a series of pulses at in re sin ampl tu es s al

b a pled for al a plca le test modes ETM1 to ETM3 an ITM1 to ITM3

CAUTION: The DUT may have l mited pulse l fe It s ould b c ec ed for degradation b fore

u in in service or further test

5.5.2 Verific tion of puls s

Perform the verification of the test level with 10 %, 2 %, 4 %, 8 % an 10 % of the

maximum test c r ent (se Fig re 3) an record the verified levels, the c argin voltage an

generators set in s req ired to ac ieve these test levels

NOT Th ampltu e of 10 % a d 2 % of th ma imum te t le el ma n t b p s ible for c rtain p ls

g n rators

The me s rement proced res s al b as fol ows:

a) Set up a DUT an me s rement in truments ac ordin to 5.2

b) Set up the test circ it config ration in the desired test modes (se 5.4)

c) Inject a pulse into the DUT with the verified generator c argin voltages in 5.5.2

d) Record the me s rement res lts of the resid al waveform Either the c r ent waveform or

voltage waveform s al b me s red

Trang 24

5.6 Ev luation of te t re ults

The p s / ai res lts s al b clas ified in terms of the p ak c r ent or voltage, the p ak rate

of rise an ro t action at the output of a HEMP combination fi ter The req ired p rforman e

criteria are given in Ta le 4, Ta le 5 an Ta le 6 for the e rly- ime HEMP test

Table 4 – Performa c criteria of fi ter a ainst e rly- ime HEMP –

s

L v l 1 IEC 610 0-6-2 (in u trial) U

Load/R

Load

Nomˆ

2⋅Ua

2 × 108

Load

Nomˆ

Ua

2 × 108

3,2

7

8,0 × 10-

L v l 3

Sp cialc s

(Mi-Std-18 -12 -1)

Nb

Trang 25

Table 6 – Performa c criteria of fi ter a ainst e rly- ime HEMP –

s

A/

sA

L v l 1 IEC 610 0-6-2 (in u trial) U

Load/R

Load

Nomˆ

Ua

2 × 108

3,2 × 10-

7

8,0 × 10-2

L v l 3

Sp cial c s

(Mi-Std-18 -12 -1)

0,1b

1c

5b

5c

107

1,6 × 10-3 b

1,6 ×10-2 c

For the intermediate- ime HEMP test, resid als are not defined However the test s al b

p rformed to en ure that the HEMP combination fiter is not damaged d rin the test This

s al b c ec ed by en urin that the HEMP combination fiter o erates normal y af er the test

5.7 Te t report

For e c ste in the testin seq en e, the fol owin p rameters s ould b in lu ed in the test

re ort:

a) Waveform, p ak c r ent an source imp dan e of verified pulse

b) Test mode, wirin set up (in lu in con ection diagram if dif erent from examples given)

c) Test lo d resistan e

d) Pe k c r ent or voltage of resid al pulse

e) Me s red waveform of resid al pulse

f Maximum di dt , an ro t integral of resid al pulse, if req ired

g) Comp rison of res lts with req ired p rforman e criteria

The total n mb r of pulses a pl ed to the DUT d rin the test seq en e s ould b recorded

Trang 26

Annex A

(informative)

Investigation for the establ shment of a measurement setup

With the me s rement setup some variation were in estigated for improvement of the

re e ta i ty an re rod cibi ty of the me s rement res lt An ex A s mmarises this

in estigation to i u trate the sen itivity of the test procedure to the test setup

A.2 Variation of the cable connecte for the measurement of short circuit

cur ent

The output of the pulse generator s al b cal brated prior to a plyin a pulse to a protective

device The setup for cal bration is i u trated in Fig re A.1

For the cal bration of the s ort circ it c r ent waveform, the output of the pulse generator

s al b s orted to the grou d of the generator throu h a ca le, L1 The c r ent on the ca le

s al b me s red u ing a c r ent sen or an an os i os o e

It was in estigated how the wave s a e is af ected by the variation of the size an the len th

of the ca le Me s rements were p rformed with the ca les havin a cros -section of 9 mm

The me s rement res lts are s own in Ta le A.1 an Fig re A.2 to Fig re A.7

It was con lu ed that ca le L1 for the waveform cal bration of s ort circ it c r ent s al b as

thic an s ort as p s ible It is recommen ed that the ca le L1 s al have a cros -section of

Puls g n rator

Gro n pla e

Co xial c ble

Trang 27

Table A.1 – Me s reme t re ults for the wa eform c l bration of s ort circ it c r e t

Trang 29

The setup for the resid al c r ent me s rement is s own in Fig re A.8 Resid al c r ent is

me s red on the ca le L at the output of the protective device u in c r ent sen or 2 when a

pulse is injected to the input of the protective device

It is general y req ired to me s re the p ak c r ent, p ak rate of rise an ro t action of the

resid al c r ent waveform when the protective device p rforman e is me s red

It was in estigated how the wave s a e is af ected by the variation of the ca le len th L

A s ort pulse of 1 kA c r ent is injected to a HEMP combination fi ter u in a 0,4 m ca le L1;

the me s rement was p rformed with the ca les havin a cros -section of 4 mm

Trang 30

It was con lu ed that the len th of ca le L for resid al c r ent me s rement was not so

mu h af ected with the variation of the len th in this me s rement, b cau e the rise time of

the resid al c r ent was alre d slowed by the action of the protective device

Trang 31

Figure A.9 – Me s reme t re ult of pe k c r e t

with v riation of me s reme t c ble L2

Figure A.10 – Me s reme t re ult of pe k rate of ris

with v riatio of me s reme t c ble L2

Figure A.1 – Me s reme t re ult of root a tio with v riation of me s reme t c ble L2

In ad ition, the me s rement was p rformed with the thre diferent p sition as fol ows (se

Fig re A.12):

– Position 1: c r ent sen or 2 is at the terminal side of the output (protected are ) of a

protective device

– Position 2: c r ent sen or 2 is at the mid le p int of the ca le L , whic is dif erent

de en in on the ca le len th

IEIEIE

Trang 32

Me s rement res lts are s own in Fig re A.13 to Fig re A.15.

It was con lu ed that the p sition of c r ent sen or 2 for resid al c r ent me s rement were

not so mu h af ected by the me s rement res lts, b cau e the rise time of the resid al

c r ent was alre d slowed by the action of the protective device Therefore, it is

recommen ed that c r ent sen or 2 s al b placed within 0,15 m from the output terminal

(protected are ) of the protective device

Figure A.12 – Variation of the po ition of c r e t s ns r 2 o th me s reme t c ble L2

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Fig re A.14 – Pe k rate of ris with v riation of c ble L2 a d at dif ere t positions

Figure A.15 – Root a tion with v riation of c ble L2 a d at dif ere t positions

A.4 Variation of load impedanc and c ble length for connection betwee load

and ground

For the me s rement setup (se Fig re A.8), the me s rement res lts of a variation of lo d

imp dan e are s own in Ta le A.3 an Fig re A.16 to Fig re A.18

It was con lu ed that in re sin the lo d imp dan e for resid al c r ent me s rement could

red ce the me s rement d namic ran e Therefore, it is recommen ed that lo d imp dan e

for the me s rement of resid al c r ent is low In this case, the voltage me s rement is

p s ible for the resid al c r ent with the voltage pro e at the defined lo d imp dan e The

me s red voltage can b con erted to c r ent

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Trang 34

1,1 × 10-3

5,6 × 10-4

3,7 × 10-4

≤ 10 ≤ 1,0 × 10

7

≤ 1,6 × 10

-Figure A.16 – Me s reme t re ult of pe k c r e t with v riatio of loa impe a c

Figure A.17 – Me s reme t re ult of pe k rate of ris with v riation of loa impe a c

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Figure A.18 – Me s reme t re ult of root a tion with variation of loa impe a c

A.5 Variation of the cable le gth betwe n load and ground

Me s rement setup of the variation of the ca le len th L b twe n lo d an grou d is s own

in Fig re A.19

The me s rement res lts are s own in Ta le A.4 an Fig re A.2 to Fig re A.2

It was con lu ed that the len th of ca le (L ) con ected b twe n lo d an grou d plane for

resid al c r ent me s rement was not so mu h afected with the variation of the len th in this

me s rement, b cau e the rise time of the resid al c r ent was alre d slowed by the action

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Table A.4 – Me s reme t re ults for v riation of the c ble

3,7 × 10-4

3,7 × 10-4

3,6 × 10-4

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Figure A.2 – Me s reme t re ult of root a tio with v riation of me s reme t c ble L3

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Annex B

(informative)

Test method for the quantitative determination

of the direct response behaviours of a coaxial surge protector

An ex B provides a practical method to o tain the direct resp n e b haviours of a s rge

protective device (SPD), esp cial y the co xial typ protector, an of a voltage bre k own

device, for example a gas dis harge tub (GDT) This method covers the resid al voltage

me s rement, the resp n e time me s rement an the direct voltage-l mitin resp n e

b haviour flowin throu h an SPD in the time domain

The test setup con ists of a pulse generator, lau c in l ne, wide-b n p wer divider,

aten ators, os i os o e an co xial ca les as s own in Fig re B.1

Figure B.1 – Te t s tup with a power divider for te tin prote tiv de ic s

The lau c in l ne is con ected to the p wer divider, an the DUT is con ected to one of the

circ it bran hes of a p wer divider

A p wer divider is u ed to matc the imp dan e at e c bran h circ it in order to ke p the

same s rge imp dan e alon the direction of the pro agatin wave Ca les, at en ators an

termination lo d in the test setup are wel matc ed The p wer divider s ould b desig ed to

avoid bre k own an to confirm the ac urac of the resistan es in ide the p wer divider to

mitigate s mmetric er or

The thre bran hes are the lau c in bran h (L

0), the normal bran h (L

example 5 Ω or 7 Ω

One has to b aware of the fol owin asp cts:

– In order to matc the forward an b c ward travel n wave pro agatin alon the ca les,

the terminal lo d of e c bran h s ould also b equal to Z

c

an the value of e c

resistan e in ide the p wer divider s ould b

3cZ

C

Puls g n rator

Trang 39

The waveform at the terminal of the normal bran h an the DUT bran h s ould be recorded

by two c an els of the same os i os o e

Fig re B.2 s ows V

0(b fore the s rge ar ester firin ) an V

F(af er the s rge ar ester firin )

pro agatin alon the bran hes

(a)

(b)

Figure B.2 – Wa e propa ating along the bra c e

The me s red waveforms at e c bran h terminal are s own as fol ows:

1

)(

L1

L 10

L1L0

1C

0

τττ

tV

At

L 2

L 1L0

2C

1

)(

0

ττ

ττ

tVt

0Z

Os i o c p

Z

CL

Trang 40

where A is the at en ation factor of the at en ator, =

in

o tV

A

V( or a commercial aten ator, the

at en ation factor is u ual y given in decib ls, th s con ersion to a ratio is es ential), an

stan for the time delay on the cor esp n in co xial ca le Notice that if the

dimen ion of the DUT or the p wer divider is not negl gible, the time delay within the devices

s ould b taken into con ideration as wel

One can directly get the resp n e time of the SPDs by comp rin the two me s red

waveforms More ver, by solvin the eq ation set (B.1) and (B.2), we can o tain the output

pulse of generatorV (t)

0, the a pled pulse on the DUT

()

20tV

an the in u ed pulseV (t)

F

whic is the direct resp n e b haviour flowin throu h the SPD in the time domain

For practical a pl cation , a simplfied test setup could b a pl ed when the dimen ion of the

p wer divider or the DUT is smal enou h to neglect the time delay when the wave pro agates

throu h these devices Fig re B.3 s ows the simplfied test setup for this case

Fig re B.3 – Simpl fie te t s tup for te ting prote tiv de ic s

The distin tive fe tures of the simpl fied pro osed test setup are as fol ows:

• The p wer divider an the DUT are con ected directly, an the dimen ion of the p wer

divider an the DUT are smal enou h to neglect time delay

1L

• Cho se the same len th for ca le

1

2

L , to make s re the two bran hes’

waveforms re c the terminals at the same time to simpl fy the computation

1

)(

LFLL0

1C

0

ττ

tV

AtV

2C

1

)(

0

ττ

τ

tVt

V

tV

0Z

C

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