Iec 60691 2015

3 D.1 Exten ed holdin temp rature con itionin test.. Af ter it has fu ctioned, the thermal-l n s al not b damaged when s bjected to temp ratures not ex e ding T m, in s c a way that the

Thermal- link s – R equirement s and appl cat ion guide

Prot ect eurs t hermiques – Ex igences et guide d'appl cat ion

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Thermal- link s – R equirement s and appl cat ion guide

Prot ect eurs t hermiques – Exigences et guide d'appl cat ion

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FOREWORD 4

INTRODUCTION 6

1 Sco e 7

2 Normative ref eren es 7

3 Terms an def i ition 8

4 General req irements 10 5 General notes on tests 1

6 Clas ification 13 6.1 Electrical con ition 13 6.2 Thermal con ition 14 6.3 Resistan e to trac in 14 7 Markin 14 8 Doc mentation 15 9 Con tru tional req irements 15 9.1 General 15 9.2 L ad sec renes tests 16 9.2.1 General 16 9.2.2 Ten i e test 16 9.2.3 Thru t test 1

7 9.2.4 Ben in /wist test 17 9.3 Contacts u ed f or the c r ent p th 18 9.4 Ac es ible mou tin brac ets or metal p rts 18 9.5 In ulatin materials 18 9.6 Resistan e to trac in 18 9.7 Cre p ge distan es an cle ran es 18 9.8 Temp rature an h midity c cle con itionin 19 9.9 Terminals an termination 19 10 Electrical req irements 19 10.1 Dielectric stren th 19 10.2 In ulation resistan e 2

10.3 Inter uptin c r ent 21

10.3.1 General 21

10.3.2 Sp cific con ition 21

10.4 Tran ient overlo d c r ent 2

10.5 Limited s ort-circ it test 2

10.5.1 General 2

10.5.2 Test method 2

10.5.3 Fu e size (ratin ) 2

10.5.4 Compl an e 2

1 Temp rature tests 2

1 1 General 2

1 2 Holdin temp rature, T h 2

1 3 Rated fu ctionin temp rature, T f 2

1 4 Maximum temp rature l mit, T m 2

1 5 Agein 2

12 Resistan e to ru tin 2

13 Man facturer’s val dation programme 2

An ex A (normative) Ap l cation guide 2

An ex B (normative) Alternative agein test f or thermal-ln s with T h gre ter than 2 0 °C f or u e in electric iron 2

An ex C (normative) Con u tive he t agein test 3

C.1 Con u tive he t agein test 3

C.2 Method 3

C.3 Agein 31

C.4 Res lts 3

C.5 Dielectric stren th test 3

C.6 Test oven 3

An ex D (informative) Exten ed holdin temp rature evaluation 3

D.1 Exten ed holdin temp rature con itionin test 3

D.2 L ad c r ent inter upt test 3

An ex E (normative) Se l agein test 3

An ex F (normative) Identification req irements 3

An ex G (normative) In el bi ty of markin s 3

An ex H (normative) Req irements f or thermal-l n p c aged as embl es 4

Biblogra h 4

Fig re 1 – Ben in /wist test 17 Fig re C.1 – Typical test f i ture as embly 3

Fig re C.2 – Typical thermal-l n test oven 3

Fig re D.1 – Typical terminal bloc s p ort test fixture 3

Fig re E.1 – Con itionin time vers s oven temp rature for pro osed temp rature in ex 3

Fig re G.1 – Ap aratu for testin d ra i ty of markin s 3

Ta le 1 – Test s hed le 13 Ta le 2 – Stren th of le d an terminal p rts – Minimum req ired ten i e an thru t test forces 17 Ta le 3 – Cre p ge distan es an cle ran es (a solute minimum values) 19 Ta le 4 – Test voltages for dielectric stren th 2

Ta le 5 – Test c r ent f or inter uptin test 21

Ta le 6 – Limited s ort-circ it test ca acity 2

Ta le H.1 – Pu h an pul force 41

Ta le H.2 – Minimum nominal cros -sectional are of con u tor 4

INTERNATIONAL ELECTROTECHNICAL COMMISSION

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International Stan ard IEC 6 6 1 has b en pre ared by s bcommite 3 C: Miniature fu es,

of IEC tec nical commite 3 : Fu es

This f ourth edition can els an re laces the third edition publ s ed in 2 0 , Amen ment 1:

2 0 an Amen ment 2: 2 10 This f ourth edition con titutes a tec nical revision

This fourth edition in lu es the f ol owin sig ificant tec nical c an es with resp ct to the

previou edition:

a) req irements f or thermal-l n p c aged as embl es;

b) renew the req irements an def i ition f or T

h-test;

c) c an e startin temp rature for inter upt c r ent test;

d) clarify req irements f or markin (p c in la el);

e) minimum Pro f Trac in In ex 17 in te d 12

The text of this stan ard is b sed on the fol owin doc ments:

Ful inf ormation on the votin for the a proval of this stan ard can b f oun in the re ort on

votin in icated in the a ove ta le

This publ cation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

The b sis f or this stan ard is the harmonization of the USA national stan ard, UL 10 0, f if th

edition (with rawn 2 0 ), an IEC 6 6 1:19 3, together with its Amen ment 1:19 5 an

– An ex F is req ired to b declared in the USA

In this stan ard, the fol owin typ is u ed:

– c mpl ian e st ateme ts: in ital i typ

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cif i publ cation At this date, the publ cation wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

Thermal-l n s, def i ed as non- eset a le devices fu ctionin on e only without refu ctionin ,

are widely a pl ed for the thermal protection of eq ipment in whic , u der fault (a normal)

con ition , one or more p rts may re c hazardou temp ratures

As these devices have several asp cts in common with miniature fu e-l n s an are u ed f or

o tainin a comp ra le degre of protection, this stan ard has en eavoured to lay down a

n mb r of b sic req irements for s c devices

THERMA L-LINKS –

This International Stan ard is a plca le to thermal-ln s inten ed f or in orp ration in

electrical a pl an es, electronic eq ipment an comp nent p rts there f, normal y inten ed

f or u e in o rs, in order to protect them again t ex es ive temp ratures u der a normal

con ition

NOT 1 Th e uipme t is n t d sig e to g n rate h at

NOT 2 Th ef fe tiv n s of th prote tio a ain t e c s iv temp rature lo ic ly d p n s u o th p sitio

a d meth d of mo ntin of th th rmal-ln , a wel a u o th c re t whic it is c ryin

This stan ard may b a plca le to thermal-l n s for u e u der con ition other than in o rs,

provided that the cl matic an other circ mstan es in the immediate s r ou din s of s c

thermal-l n s are comp ra le with those in this stan ard

This stan ard may b a plca le to thermal-ln s in their simplest f orms (e.g meltin strips or

wires), provided that molten materials exp led d rin fu ction can ot ad ersely interf ere with

the safe u e of the eq ipment, esp cial y in the case of han -held or p rta le eq ipment,

ir esp ctive of its p sition

An ex H of this stan ard is a pl ca le to thermal-l n p c aged as embl es where the

thermal-l n (s) has alre d b en a proved to this stan ard but p c aged in a metal c or non

-metal c hou in an provided with terminals/wirin le d

This stan ard is a pl ca le to thermal-ln s with a rated voltage not ex e din 6 0 V a.c or

d.c an a rated c r ent not ex e din 6 A

The o jectives of this stan ard are:

a) to esta l s u if orm req irements for thermal-l n s,

b) to def i e method of test,

c) to provide u eful information f or the ap l cation of thermal-l n s in eq ipment

This stan ard is not a pl ca le to thermal-l n s u ed u der extreme con ition s c as

cor osive or explosive atmospheres

This stan ard is not a pl ca le to thermal-ln s to b u ed in circ its on a.c with a f eq en y

lower than 4 Hz or hig er than 6 Hz

The f ol owin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 0 5:2 14, Aud io, video a d simil ar el ectro ic a p rat us – Safety re uireme ts

IEC 6 1 2:2 0 , Met hod for th d et ermin tion of the pro f a d t he c mp rativ tra king

ind ic s ofsol id insulat in materials

IEC 6 1 2:2 0 /AMD1:2 0

IEC 6 12 -2:2 14, Miniature fuses – Part 2: Cartridge fuse-l inks

IEC 6 216-5:2 0 , Elect ric l insulatin materials – Th rmal e d ura c pro ert ies – Part 5:

Determinatio of relativ th rmal e duran e ind ex (RTE) of a insul at ing material

IEC 6 6 4-1:2 0 , Insul ation c ordinat ion for e uipme t within l ow-volt ag syst ems – P art 1:

Principl es, re uireme ts a d tests

IEC 6 6 5-2-12:2 10, F ire h z rd testing – P art 2-12: Glowing/h t-wire b sed t est methods –

Gl ow-wire fl amma ility inde (GWFI ) test method for mat erials

IEC 6 6 5-2-12:2 10/AMD1:2 14

IEC 6 6 5-2-13:2 10, F ire h z rd testing – P art 2-13: Glowing/h t-wire b sed t est meth ds –

Gl ow-wire ig it ion temp rature (GWI T) test meth d for mat erials

IEC 60 9 -2-13:2 10/AMD1:2 14

IEC 60 9 -10-2:2 14, Fire h z rd testing – Part 10-2: Ab ormal h at – Ba pres ure t est

met hod

IEC 60 9 -1 -10:2 13, Fire h z rd test ing – Part 1 -10: Test flames – 50 W h rizo tal a d

v rtic l fl ame test methods

IEC 60 3 -1:2 13, Aut omat ic ele tric l c ntrols – Part 1: Ge eral re uireme ts

IEC 61210:2 10, Co n cting d evic s – F lat q ick -c n e t t ermin tions for el ectric l c p er

c nd uctors – Safety re uireme ts

series of thermal-ln s havin the same external dimen ion an common overal con tru tion,

deviatin fom e c other only in s c c aracteristic (in lu in ratin s) that, f or a given test,

the testin of one or a red ced n mb r of p rtic lar thermal-l n s of that series s al b taken

as re resentative for al the thermal-l n s of the series

temp rature of the thermal-l n stated by the man facturer, up to whic the mec anical an

electrical pro erties of the thermal-l n , havin c an ed its state of con u tivity, wi not b

imp ired for a given time

3.7

pi ot duty

ratin as ig ed to a switc in device that controls the coi of another electro-mec anical

device s c as a solenoid, relay or contactor

3.8

portable e uipme t

eq ipment whic is moved whi e in o eration or whic can e si y b moved f om one place to

another whi e con ected to the s p ly

metal c or non-metal c fu ible material that is p rt of a thermal-l n an is resp n ive to

temp rature by a c an e of state s c as f om sol d to lq id at the temp rature for whic it is

cal brated

3.13

thermal-l n

non- eset a le device in orp ratin a thermal element, whic wi o en a circ it on e only

when exp sed f or a s f ficient len th of time to a temp rature in ex es of that for whic it has

b en desig ed

3.14

tra sie t ov rloa c r e t

I

direct c r ent pulse train whic the thermal-ln is a le to with tan without imp irin its

c aracteristic

maximum temp rature at whic a thermal-l n can b maintained whi e con u tin the rated

lo d c r ent at the rated voltage for a p riod of 10 we k whic wi not cau e the thermal

-l n to o en circ it in ac ordan e with exten ed holdin temp rature evaluation

Note 1 to e try: This is a ratin for u er c n id ratio d rin th in e tig tio of th e d pro u t

Note 2 to e try: An e D s e if i s th e te d d h ldin temp rature e alu tio

3.17

con uctiv he t a eing te t

CHAT

test to evaluate a thermal-ln for u e in an a pl an e

Note 1 to e try: If it p rorms s tisf actoriy, th th rmal-ln wi b a sig e a C AT ratin This ratin is for e

d-pro u t u er c n id ratio d rin th in e tig tio of th e d-u e pro u t

Note 2 to e try: An e C s e if i s th c n u tiv h at a ein te t

4.1 Adeq ate protection of the eq ipment again t ex es ive temp ratures not only

de en s up n the pro erties of the thermal-l n but also to a large extent up n the mou tin

of the thermal-l n in the eq ipment Theref ore, in ad ition to go d en ine rin practice, the

req irements of the a pl cation g ide in An ex A s al b con idered

4.2 Thermal-ln s s al have adeq ate electrical an mec anical stren th an s al b

con tru ted so as to with tan al con ition of han l n lkely to b en ou tered d rin

mou tin an normal u e, when u ed within the req irements of this stan ard

4.3 When a thermal-l n c an es its state of con u tivity, no arc or flame s al b

maintained, nor material exp l ed that mig t imp ir the s r ou din are or otherwise cre te a

ris of electric s oc or fire

For thermal-l n s u in meltin strips or wires, care s ould b taken to prevent molten

material f rom s ort-circ itin or brid in cre p ge distan es an cle ran es in air, so as to

red ce the ris of imp irin the in ulation s stem of the eq ipment

Af ter it has fu ctioned, the thermal-l n s al not b damaged when s bjected to temp ratures

not ex e ding T

m, in s c a way that the safety of the eq ipment with regard to ris of electric

s oc hazard an electrical bre k own is imp ired The t hermal-ln s al not reclose aft er it has

o erated

4.4 For req irements for thermal-l n p c aged as embl es, se An ex H

5.1 The test con ition are as folows

5.1.1 Unles otherwise sp cified, only tests that are not req ired to b p rf ormed in ide an

en ironmental c amb r an /or test oven s al b car ied out u der the fol owin atmospheric

con ition :

– temp rature: 15 °C to 3 °C,

– relative h midity: 2 % to 7 %,

– air pres ure: 8,6 × 10

4

Pa to 1,0 × 10

5

Pa

The req ired atmospheric con ition d rin testin can b control ed when car yin out the

tests an d rin the d ration of the tests The req ired atmospheric con ition do not have to

b maintained in a test la oratory when tests are not p rormed

5.1.2 Where the con ition given in 5.1.1 have a sig ificant influen e, they s al b ke t

s bstantial y con tant d rin the tests

5.1.3 If the temp rature l mits given in 5.1.1 are to wide for certain tests, these s al b

re e ted, in case of doubt, at a temp rature of (2 ± 1) °C

5.2 In every test re ort, the ambient temp rature s al b stated If the stan ard con ition

f or relative h midity or pres ure are not f ulfi ed d rin the tests, a note to this eff ect s al b

ad ed to the re ort

5.3 If the res lt of a test is in uen ed, to an a precia le extent, by the p sition an method

of mou tin of the sp cimen, the most u favoura le con ition s al be c osen for the relevant

tests an recorded

5.4 If a thermal-l n has be n sp cif i al y desig ed for u e in a sp cial typ of eq ipment

an can ot b tested se arately, the tests of this stan ard s al b p rormed in that

eq ipment or in the relevant p rt of it, or simiar

5.5 When testin a homogene u series of thermal-l n s, al the tests s al b a pl ed to

thermal-l n s with the lowest an hig est T

f Thermal-ln s with intermediate rated f un tionin

temp ratures ne d only b s bjected to tests ac ordin to 10.3, 1 3, 1 4 an 1 5

5.6 The n mb r of sp cimen is as f ol ows

5.6.1 The total n mb r of sp cimen req ired is 4 Out of a total of 4 sp cimen , 15 are

ke t as sp res in case some of the tests have to b re e ted Out of a total of 4 sp cimen ,

3 are divided into 1 groups as ig ed by alpha etical let ers f om A to K Eac group

con ists of thre sp cimen Tests s al b p rf ormed in the order in icated in Ta le 1 but, if

so req ired, tests may b re e ted, f or example the test on markin (see Clau e 7)

Ad itional samples may b ne ded ac ordin to Note 2 of Ta le 1

For o tional tests, ad itional samples s ould b req ired as p r the a pl ca le an exes

5.6.2 If, in an of the tests car ied out in ac ordan e with an relevant test clau e, a f ai ure

is re orted, the cau e of the fai ure wi b identified an cor ective action taken Based on the

f ai ure analy is re ort an the cor ective action, as a minimum, the test seq en e s al b

re e ted on twice the n mb r of evised sp cimen , an no f urther f ai ures are al owed

If no cor ective action are neces ary, the test s ould b re e ted with double the same size

an no further deviation is al owed

5.6.3 For req irements for thermal-l n p c aged as embl es, se An ex H

5.7 The con u tive he t agein test of An ex C is a pl ca le when declared by the

Markin (vis al in p ctio o ly) X X

9 Co structio al req irements

10 Ele tric l req irements

If th c n itio s of v lta e, p wer a d c re t in 10.3.2.3, 10.3.2.4 a d 10.3.2.5 are n t c v re b o e te t,

a minimum of thre s mple s o ld b te te f or e c c n itio

6.3 Re ista c to tra king

With regard to resistan e to trac in , the f ol owin ran es are u ed:

a) pro f trac in in ex f rom 17 to 2 9;

b) pro f trac in in ex gre ter than or eq al to 2 0

NOT Th s ra g s are b s d o te t meth d f or s rf ac tra kin laid d wn in IEC 6 1 2

7.1 Eac thermal-l n s al b marked with the fol owin :

a) typ or catalog e referen e;

b) man facturer’s name or trade mark;

c) rated fu ctionin temp rature T

d) date code whic identif ies the date of man f acture an whic do s not re e t f or at le st

10 ye rs, an a factory location or code, stamp d on the thermal-l n or the smal est

p c agin

If there is only one f actory, the f actory location may b omit ed

Catalog e or referen e n mb rs s ould define those p rameters s c as temp rature, c r ent

an voltage, whic together clas ify a thermal-l n

7.2 The rated fu ctionin temp rature T

f

may b omit ed if a diff erent typ or catalog e

referen e is employed for e c dif ferent fu ctionin temp rature

7.3 Markin s al b in el ble an legible

Compl ian e with t he re uireme ts for Ind el i ility of mark ings is c e k ed b t he test in

An e G using the a p ratus sh wn in F ig re G.1 L gibility is c e k d b insp ctio After

th a eing tests of 1 4, c mpl ian e is c e k d b insp ct io

7.4 The markin in ac ordan e with a), b), c) an d) in 7.1 s al b printed ad itional y on

the p c in , together with a referen e to this stan ard

7.5 If the thermal-l n is smal in size, an not inten ed to b re laced, the markin s in

ac ordan e with b) to d) in 7.1 s al b printed on the p c agin , together with a referen e to

this stan ard

Complian e is c e k d b insp ctio

The man f acturer s al provide in the tec nical doc mentation, catalog es or in tru tional

le flets the f ol owin inf ormation, in ad ition to that req ired in Clau e 7:

a) clas ification in ac ordan e with Clau e 6;

b) for e c of the clas ification ;

1) c aracteristic temp ratures T

f, T

h, T

m

;

2) c aracteristic c r ents I

r, I , I ;

3) rated voltage U

r

;

c) s ita i ty for se l n in, or u e with impreg atin fluid or cle nin solvents;

d) inf ormation for mou tin the thermal-l n in the eq ipment

e) thermal-ln s smal in size an not inten ed to b re laced

For re son of saf ety, it s ould b made cle r in the doc mentation that a thermal-l n is a

non- e airable item an that, in case of re lacement, an eq ivalent thermal-l n f om the

same man f acturer an havin the same catalog e referen e s ould b u ed, mounted in

exactly the same way

f ) the p sition of the metal s re n, if it is located at a distan e other than 12,7 mm away

f rom the l ve p rts in the case of a thermal-l n havin an exp sed element

9 Constructional requirements

9.1.1 Thermal-l n s s al have adeq ate mec anical stren th an sta i ty so as to

with tan the stres es l kely to b en ou tered d rin han lng, normal u e an fault

con ition of the relevant en -u e eq ipment

9.1.2 Ta terminals s al b con tru ted in ac ordan e with IEC 61210 an the maximum

p rmis ible temp rature of the u ed Ta materials s al b in ac ordan e with Ta le A.1 of

IEC 61210:2 10 (Ta s / Integrated)

9.1.3 Cur ent-car yin p rts s al b con tru ted in s c a way that contact pres ure is not

tran mit ed throu h non-metal c material other than ceramic, or an material con idered as

havin s f ficient dimen ional sta i ty over the ran e of temp ratures to b exp cted, u les

there is s ff i ient resi en e in the cor esp n in metal p rts to comp n ate for an s rin age

or distortion of the non-metal c material

Cur ent-car yin p rts s al have the neces ary mec anical stren th, b ca a le of car yin

the rated c r ent an s al b of a material that is ac e ta le f or the p rtic lar a pl cation

For c r ent-car yin p rts, temp rature lmits s ould b con idered ac ordin to Ta le 13 of

IEC 6 7 0-1:2 13

9.1.4 Friction s al not b u ed to sec re u in ulated l ve p rts (in lu in terminals) to

s p ortin s r aces if there is a ris of s c p rts turnin or s if tin their p sition, res ltin in

the red ction of cre p ge distan es an cle ran es to les than those req ired elsewhere in

this stan ard The sec rity of contact as embl es s al b s c that al g ment of contacts is

maintained

9.1.5 L ad an terminal p rts s al b sec red so that stres on them d rin in tal ation

an normal u e do s not imp ir o eration of the thermal-l n Thermal-l n s u in se ls with

f ormed le d for u e in a plan es or comp nents s al not b b nt les than 3 mm f rom the

thermal-l n se l

L ad may b b nt les than 3 mm f rom the se l if:

a) the thermal-l n man facturer's b n in fixture an proced re do s not tran mit stres to

the thermal-l n o eratin mec anism, an if;

b) formed test samples s al b s bjected to the b n in / wist le d sec renes test of 9.2.4

an the rated f un tionin temp rature test of 1 3

9.1.6 Thermal-l n s with le d smal er than 0,21 mm

2

s al b provided with a pl cation

in tru tion that in tru t the u er how to mou t the device in eq ipment, takin into

con ideration the device's temp rature resp n e The in tru tion s al also in lu e g idan e

on the eff ects that movement an vibration in the eq ipment may have on the thermal-l n 's

terminals, con ection an other mou tin comp nents

9.1.7 A terminal for a soldered con ection s al have provision, s c as a hole, for holdin

the con u tor in e en ently of solder

9.1.8 When a pl ca le, provision s al b made for sec rely mou tin a thermal-l n in

p sition

9.1.9 Thermal-l n s inten ed to b emb d ed in win in s an the l ke ne d not have

provision for mou tin

9.1.10 Bolts, s rews, or other p rts u ed for mou tin an as embly havin a thermal-l n

s al b in e en ent of those u ed f or sec rin comp nent p rts of the as embly

9.1.1 Compl ian e is c e k ed b th lead se ure es t ests of 9.2 Mou ting a d

se ureme t instru t io s sh l l b provid ed wit h th rmal -l inks for the ma ufa t urer of t he e

d-prod uct in a c rd an e with An e A

9.2 Le d s c re e s te ts

If force a pl ed to thermal-l n wire le d cau es bre k own of one or more p rts le din

directly or in irectly to stres b in a pl ed to the o eratin mec anism, the tests des rib d in

9.2.2, 9.2.3 an 9.2.4 s al b con u ted There s al b no displacement of p rts that would

ten to reclose a thermal-ln or red ce cre p ge distan es or cle ran es as a res lt of the

tests sp cified in 9.2.2 an 9.2.3 There s al b no displacement of p rts other than the wire

le d as a res lt of the test sp cified in 9.2.4

9.2.2 Te si e te t

The thermal-l n s al b s p orted in an con enient man er in order not to damage it

an a ten i e force as sp cif ied in Ta le 2 s al b a pl ed to e c le d for 1 min

9.2.3 Thrust te t

The thermal-l n s al b s p orted u in an con enient me n s c that it is not damaged

an a thru t f orce as sp cified in Ta le 2 s al b a pl ed to e c le d for 1 min at a distan e

9.3 Conta ts u e f or the c r e t path

Contacts u ed f or the c r ent p th in a thermal-l n s al with tan the voltage stres

determined by the voltage source in the circ it Cur ent-car yin elements or contacts,

together with their terminals, are u ual y isolated fom metal p rts s c as mou tin brac ets,

metal en los res an the lke, by in ulatin material

9.4 Ac e sible mou ting bra k ts or metal parts

If mou tin brac ets or metal p rts of the thermal-ln 's en los re are ac es ible or

con ected throu h low imp dan es to metal en los res of the eq ipment ac es ible to the

u er f rom the outside, the in ulation b twe n the c r ent-car yin elements of the thermal-ln

an s c con u tive en los res s al b adeq ate u der sp cified con ition of ambient

temp rature an h midity

9.5 In ulating materials

For req irements for thermal-l n p c aged as embl es, se An ex H

9.6 Re ista c to tra king

9.6.1 If in ulatin material u ed for the s p ort of c r ent-car yin p rts, contacts an

terminals is exp sed d rin normal u e to de osition of moisture or d st, it s al b resistant

to trac in

9.6.2 For material other th n c ramic, c mpl ian e is c e k d b p rormin a tra k in test

in a c rd an e with IEC 6 1 2 o sp cime s or fl at t est piec s of e uiv lent insulat in

material Th P ro f Tra king Ind ex (PTI ) v lues sh l l b d eclared b the ma ufa turer, b t

n t l es t ha 175 V

9.7 Cre pa e dista c s a d cle ra c s

9.7.1 The cre p ge distan es an cle ran es b twe n c r ent-car ying p rts (contacts

together with their terminals) an the outside of the thermal-l n hou in in lu in in ulated

metal p rts there f , s al b not les than the values in Ta le 3 The values in icated are

a solute minimum values an in lu ive of man facturin toleran es

At ention is drawn to the fact that the external cre p ge distan es an cle ran es sp cified in

Ta le 3 is al owed, in some cases, b smal er than those req ired by certain a pl an e or

eq ipment stan ard In s c cases, ad itional me n s ould b provided when a thermal

-l n is mou ted in the eq ipment in order to adju t the cre p ge distan es an cle ran es to

the values req ired by the relevant eq ipment stan ard

9.7.2 These distan es do not a ply b twe n the o en contacts of a thermal-l n

Compl ian e is c e k d b me suring th d ist an es c n ern d

NOT 1 Th cle ra c s/cre p g dista c s are s e ifie a c rdin to IEC 6 6 4-

NOT 2 Th v lu s s e if i d are f or ty ic l a plc tio s of th rmal-ln s a s min :

g) material gro p I

9.8 Temperature a d humidity c cle conditioning

9.8.1 Thermal-l n s s al not b ad ersely in uen ed by h midity present in the ambient

con ition for whic they are inten ed

9.8.2 For temp rature an h midity c cle con itionin , the thermal-l n samples s al b

s bjected to thre complete con itionin c cles Eac c cle s al con ist of 2 h at T

h

f ol owed immediately (within 15 min) by at le st 2 h at (3 ± 5) °C an (9 ± 5) % relative

h midity, f ol owed by 8 h at (0 ± 2) °C

9.8.3 Complian e is c e k ed b su je t in the sp cime s to t he d iele tric st re gth (se

10.1) a d insulatio resistan e (se 10.2) tests of this stand ard

NOT 1 For a th rmal-ln with a n n-ele tric ly c n u tiv c s b d , th diele tric a d in ulatio re ista c

te ts are p rorme af ter remo al of th s mple fom th c n itio in c amb r

NOT 2 For a th rmal-ln with a ele tric ly c n u tiv c s b d , th in ulatio re ista c te t is c n u te

b twe n th termin ls af ter remo al of th s mple fom th c n itio in c amb r

9.9 Terminals a d termination

For req irements for thermal-ln p c aged as embl es, se An ex H

10 Ele trical requireme ts

10.1 Diele tric stre gth

10.1.1 The dielectric stren th of thermal-l n s s al b adeq ate b th b f ore an after

havin o erated, an also af ter havin b en s bjected to the tests of 9.8

If a pl ca le, the test is con u ted b twe n:

i) Cur ent car yin p rts an en los re (wra p d in metal f oi ), or,

i ) Cur ent car yin p rts an in ulated exp sed metal p rts

10.1.2 Compl ian e is c e k d b a plyin th a pro riat e test voltag b t wee th relevant

circ its sp cified in Ta l e 4 immed iately after the tests of9.8, ifa p c bl e, a d also aft er the

temp rature t ests ofCla se 1

Table 4 – Te t volta e f or diele tric stre gth

2 U

r+ 1 0 0 V

r

10.1.3 A p wer tran former with an output of not les than 10 VA is req ired for this test

10.1.4 The in ulation is s bjected to a test voltage with a s bstantial y sine-wave form

havin a f eq en y b twe n 4 Hz an 6 Hz

10.1.5 Initial y not more than half the pres rib d voltage is a pl ed It is then raised with a

rate of rise of a proximately 5 0 V/s to the ful value

10.1.6 Immediately af ter the h midity test, the en los re s al b wra p d in metal f oi an

the test voltage s al b a pl ed for 1 min acros the dis on ection an b twe n the c r ent

car yin an the metal foi

10.1.7 The sp cimen are de med to comply with the req irements if no f las over or

bre k own oc urs

10.2 In ulation re ista c

10.2.1 The in ulation resistan e of thermal-ln s s al b adeq ate b th b fore an af ter

havin c an ed their state of con u tivity, an also af ter havin b en s bjected to the

relevant tests of 9.8

If a pl ca le, the test is con u ted b twe n:

i) Cur ent car yin p rts and en los re (wra p d in metal f oi ), or,

i ) Cur ent car yin p rts an in ulated exp sed metal p rts

10.2.2 Complian e is c e k d b me suring the insul ation resist an e of th thermal-link

after th t est of 9.8, b fore a d after h ving o erat ed in the temp rature test of Cla se 1

Th insul ation resistan e sh l b me sured with a d.c volt ag of 2 U

r

b twee the c re t

c ryin p rts a d t he e cl osure, (wra p d in met al fo , if a p c ble) or b twee c r e t

c ryin p rts a d insulated e p sed metal p rts, a d b twee t he termin ls

NOT A d.c te t v lta e is u e in ord r to elmin te p s ible d viatio s d e to c p citiv c re ts

10.2.3 Th sp cime s are de med t o c mply wit h t he re uireme ts if t he insul at ion

resist an e me sured b twe n t he c r e t c rying p rts a d the e closure, (wra p d in

metal fo , if a p c bl e) or b twe n c re t c rying p rts a d insulated ex posed metal p rts

is n t les tha 2 MΩ, a d a ros th d isc n e t ion is not les t ha 0,2 MΩ

10.3 Inter upting c r e t

10.3.1 Ge eral

A thermal-l n s al inter upt the a pl ca le test c r ent sp cified in Ta le 5 at 1,1 times the

rated voltage, U

r, u der the con ition sp cified in 10.3.2.1 to 10.3.2.1

NOT Th main p rp s of this te t is to e alu te th me h nic l a d ele tric l inte rity of th th rmal-ln to

interu t a c rtain lo d

10.3.2 Spe ific con itions

10.3.2.1 An non ur ent-car yin metal p rt that is an in erent p rt of the thermal as embly

an that may b b n ed electrical y to a normal y-earthed exp sed p rt of the en -prod ct

s al b con ected throu h a q ic actin an hig bre kin 1 A fu e (se IEC 6 12 -2:2 14,

Stan ard s e t 1) to e rth

Table 5 – Te t c r e t for inter upting te t

Ad itio aly a c rdin to ma ufa turer´s d claratio (o ly in c mbin tio with re istiv / in u tiv lo d)

10.3.2.2 For a thermal-l n havin an exp sed element, a metal s re n s al b located

12,7 mm away f rom l ve p rts The s re n s al b con ected to the o p site p le of the test

circ it throu h a q ic actin an hig bre kin 1 A fu e (se IEC 6 12 -2:2 14, Stan ard

s e t 1) The distan e is me s red b twe n the s re n an the ne rest p int of the element

when the element is in the o en p sition

10.3.2.3 Based on the inten ed u e of a thermal-l n , the s re n may b located at a

distan e other than 12,7 mm if ac e ta le to b th the man facturer an the en u er

10.3.2.4 The test circ it s al have an o en circ it voltage within 1,1 to 1,15 times the

rated voltage of the thermal-l n to b tested This toleran e may b ex e ded with the

man facture's con ent The closed circ it voltage of the test circ it when car yin the rated

c r ent s al not c an e by more than 2,5 % of the rated voltage

10.3.2.5 The toleran e of the test c r ent s al b within ± ,5 % of the sp cified test c r ent

10.3.2.6 If a thermal-l n has the same c r ent ratin at more than one voltage, a test at the

hig est voltage is con idered to b re resentative of tests at the lower voltages

10.3.2.7 If a thermal-l n has more than one voltage ratin within a sp cif i p wer factor

group, the tests s al cover the con ition of maximum voltage, p wer, an c r ent One test

may cover two of these con ition

10.3.2.8 For thermal-l n s as ig ed a pi ot d ty ratin , the test lo d s al con ist of an

electromag et re resentative of the mag et coi lo d that the thermal-l n is inten ed to

control The test c r ent s al b the normal c r ent whic s al b determined f om the

voltage an volt-amp re ratin of the thermal-l n For an alternatin c r ent thermal-l n , the

p wer f actor s al b 0,3 or les an the inru h c r ent c aracteristic of the coi s al b

10 times the normal c r ent The test s al b con u ted with the armature closed

10.3.2.9 Complian e is c e k d b t he fo owin tes

Th samples sh ll b plac d in a t est o e , stabilized at a temp rature ofT

f -3 K (or l ower if

de l ared b t he ma ufa turer) Th t hermal-li ks in t he t est oven sh l l the b e ergized a d

th o e temp rature in re sed at th rate of (2 ± 1) K/min a d the t est sh l l b c ntinu d

u t il the thermal-link fu ctions or t he o e temp rature re c es 3 K a ove T

f

Furt hermore t he thermal-li ks sh l l o e t he test circ it at a temp rature b low or e u l to T

f

The thermal-l n may o erate immediately after b in energized, in whic case the

temp rature in re se of (2 + 1) K/min is not neces ary an the test may b sto p d

10.3.2.10 Th o e temp rature ma b mo it ored b me ns of a thermo o ple attac ed to

a id entic l b t n n-fu ct ioning t hermal-l ink mo nt ed ad jac nt to the sampl es u d er t est

10.3.2.1 A thermal-l i k t hat is rat ed for c ntrol l ing a altern t in -c re t motor is

a c ptable for al tern t ing c re t p ot d uty witho t furt her interu tin c re t tests if, d uring

the original int eru t in c r e t tes the p wer fa t or was 0,5 or les , a d if t he pil ot duty

inrush c re t at t he same volt ag is not more th n 67 % of th rat ed loc ed rot or c re t

(LRA) of t he d evic

10.3.2.12 There s al b no damage to the integral le d of a thermal-l n The case of an

en losed element s al remain intact Th q ic a t ing a d high bre king 1 A fuse (se

I EC 6 127-2:2 14, Standard sh et 1) sp cified in 10.3.2.1 an 10.3.2.2 s al not f un tion

(o en) An exp sed element s al not arc to adjacent metal p rts an material s al not b

exp l ed whic may harm the s r ou din are

10.3.2.13 Aft er these tests, the insulatio resistan e sh ll c mply with th re uireme ts of

10.2

10.4 Tra sie t ov rloa c r e t

10.4.1 Thermal-l n s s al with tan re e ted c r ent s rges, con idered as b in normal in

most a plcation

10.4.2 Compl ian e is c e k d b the foll owing t est , p rormed u d er n rmal c nd it io s as

sp cified in Cla se 5 (i.e ro m ambient c ndit io s)

10.4.3 DC c r ent pulses, with an ampltu e of 15 I

r

an a d ration of 3 ms with 10 s

intervals are a pl ed for 10 s c es ive c cles throu h the c r ent p th

10.4.4 Aft er the tes th re sh l l b n int er u t ion of th c re t p th n r ot her d ama e in

th se se of this sta dard

10.5 Limite s ort circ it te t

10.5.1 Ge eral

10.5.1.1 When declared by a man facturer, a thermal-l n is tested as des rib d in 10.5.2

an 10.5.3

10.5.1.2 If the l mited s ort-circ it test is con u ted on the thermal-l n itself with

ac e ta le res lts, the test ne d not b re e ted d rin the in estigation of the en -prod ct

10.5.2 Te t method

10.5.2.1 Thre samples ofthe t hermal-l ink sh l b su jected t o a limit ed sh rt -circ it tes

10.5.2.2 Th test sha b c nd ucted at a voltag within ±5 % tol era c of t he rated v ltag

U

r

10.5.2.3 Th thermal-l i k sh l l b c n e t ed in series wit h a n n-re ewable fuse pro erly

sele ted for the a p c t ion in a c rd an e wit h 10.5.3 Th circ it sh l l l imit the c re t to t he

a p c ble valu sp cified in Ta le 6, me sured wit ho t the thermal -l i k in the circ it

10.5.2.4 Th p wer fa tor of the circ it sh ll b 0,9 to 1,0, u les a lower p wer fa tor is

a c ptable t o b t h t he ma ufa turer a d th e d user

10.5.2.5 Th thermal-l ink sh l l b c n e ted in th circ it b two 915 mm l en ths of c p er

wire h ving a cros -se t ion l are as ind ic t ed in Ta l e 6 of IEC 6 7 30-1:2 13 Cott on sh l l

suro nd t he thermal-l i k, or a metal scre n loc ted 50 mm away – or les if a c ptabl e to

b t h the ma ufa t urer a d the e d user – fom a p rts ofthe thermal-link during the tes

Table 6 – Limite s ort circ it te t c pa ity

Combined ratin of thermal-ln

S ortcircuit c pa ity

For th flu re c nt lamp b la t te t, th lmite s ort-circ it te t c p city s al b 2 0 A

10.5.2.6 Eac thermal-l i k sh l l b su jected t o o e t est

10.5.3 Fus size (rating)

Th fuse size for th l imit ed sh rt-circ it tests sh ll b :

a) 2 A for a thermal-l i k rated 0 V to 125 V a d 15 A for a thermal-l i k rat ed 12 V t o 6 0 V,

u les a l arg r fuse size is n c s itated b b) to f)

b) 2 A for a thermal-l ink int end ed for use in flu resc nt lamp b llas Th fuse sh l l h v

design c ara teristics su h th t it wil l n t o e in les th n 12 s whe c rying 4 A

c) For a thermal-li k h ving motor ratings, th l arg st stand ard size b twee 3 0 % a d

4 0 % of the fu lo d c re t rat ing for n n-h rmetic mot ors a d b t we n 17 5 % a d

2 5 % of the fu lo d c re t ratin for h rmet ic-refigeratio mot ors

d) For a thermal -l ink intend ed for use in motor-gro p circ its, t he larg st stand ard fuse size

b sed o th sum oft he fu lo d ratin s of a l oads ex ce t the larg st mot or rat ing, plus

3 0 % t o 4 0 % of the ful lo d c re t rating of t he larg st motor if the mot or is a n

n-h rmetic typ , or pl us 17 5 % to 2 5 % of t he fu l oad c re t rat in ofthe l arg st motor if

the mot or is a h rmet ic-refigerat io c mpres or t yp

e) For a thermal-link intend ed for use in el ectric sp c -h ating e uipme t , b sed o 125 %

of the amp re rat in If 125 % of t he amp re rat in results in a val ue for whic t here is n

sta dard fuse size, the n x t larg st fuse size sh l l b used

f) For a thermal-l ink h vin other ratings, b sed o t he ratin in amp res of the n xt larg st

sta dard fuse size

g) Ifa c ptabl e in a c rda c with th e d-product re uireme ts, a smal l er fuse size t ha

sp cified in c) t o f)

10.5.4 Compl a c

Th re sh l l b n ignition of t he c tton me tio ed i n 10.5.2 or the evid en e of a risk of fire

during the test or el ectric sh c after th tes

11 Temperature tests

1 1.1 The c aracteristic temp ratures of thermal-l n s s al comply with the values an

toleran es as declared by the man f acturer an with the req irements of Clau e 1

1 1.2 The fu ctionin temp rature, T

f, s al not b influen ed by thermal agein

1 1.3 Compl ian e is c e k ed b su ject ing sp cime s t o o e or more tests me tion d

b low, in the ord er giv n in Ta l e 1

1 1.4 Op ration of thermal-ln s s al b sig al ed by s ita le me n , for example, l g t

emit in diodes with series resistors lmitin the sig al c r ent to a maximum of 10 mA

1 1.5 Op ration of thermal-l n s s al b c ec ed after e c test ste

1 1.6 In order to o tain the req ired ac urac of temp rature set in s, in icated test

temp ratures s al b me s red with an ac urac of ±1 K of the nominal temp rature up to

10 °C an ±1 % of the nominal temp rature a ove 10 °C

1 1.7 Care s al f urthermore b taken that temp rature dif feren es in that p rt of the oven

where the sp cimen are tested, do not ex e d at any p int:

• ± ,5 % of the nominal temp rature hig er than 2 0 °C; an

• ±1 K at the nominal temp rature of 2 0 °C or lower

1 1.8 This may b o tained for example by placin the specimen within a thic -wal ed

aluminium b x mou ted in s c a way that it is not in direct contact with the internal wal s of

the oven

1 2 Holding temperature, T

h

1 2.1 Samples of group K (3 sp cimen in series) are con ected to a resistive lo d circ it

that is metered to draw the rated c r ent throu h the thermal-l n The sp cimen s al b

maintained at a temp rature eq ivalent to the holdin temp rature (T

h) sp cified by the

man facturer The circ it is lo ded for 2 h or as declared by the man facturer, whic ever is

hig er

1 2.2 Compl ian e is d et ermined b c e k ing t he c nt inuity of t he t hermal l i k after

c mpletion of the t es Th th rmal-l ink sh l n t c a g its stat e ofc nd uctivity

1 2.3 For req irements for thermal-l n p c aged as embl es, se An ex H

1 3 Rate f unctioning temperature, T

f

1 3.1 For devices rated les than 2 0 °C, the thermal-l n s s al b exp sed in the test

oven or oi b th to T

f– 12 K or as declared by the man facturer, but not hig er than 2 K b low

the lowest toleran e The temp rature s al then b sta i zed, s own when two con ec tive

re din s taken 5 min a art are within 1 K of e c other

1 3.2 For devices rated 2 0 °C or hig er, the thermal-ln s s al b exp sed to T

f– 2 K,

or as declared by the man facturer, but not hig er than 2 K b low the lowest toleran e The

temp rature s al then be sta i zed, s own when two con ec tive re din s taken 5 min a art

are within 1 K of e c other

1 3.3 The temp rature s al then b in re sed ste di y with a rate of rise b twe n

0,5 K/min to 1 K/min, u ti al sp cimen have fu ctioned

1 3.4 The in ivid al fu ctionin temp rature of thermal-ln s, rated les than 2 0 °C, s al

b recorded an they s al b not les than as declared by the man f acturer, or T

f– 10 K if

no declaration is made

1 3.5 For thermal-l n s rated at 2 0 °C or hig er, the recorded temp rature s al b not

les than that declared by the man f acturer, or T

f– 2 K if no declaration is made

1 3.6 For thermal-ln s rated lower than 2 0 °C, or hig er than 2 0 °C, the temp rature

s al not b gre ter than T

f

NOT Th e uipme t re omme d d f or th te ts of 1 3 is s own in Cla s C.6

1 4 Ma imum temperature l mit, T

1 4.1 The sp cimen s al b s bjected to T

m

50

−

°C, a dielectric test as p r 10.1, an an

in ulation resistan e test as p r 10.2, s al b con u ted

1 4.3 To overcome p s ible ef fects of thermal inertia of the sp cimen an an neces ary

con ection , an also to faci tate the introd ction of the sp cimen into a s ita le he tin

c amb r, the sp cimen can b in erted into a san b x maintained at T

m

1 4.4 The T

f

mtests may b cond cted in se arate eq ipment an samples may co l

down d rin tran fer f rom the T

f

to T

m test

1 4.5 No flas over, bre k own or refu ctionin s al oc ur At the con lu ion of this test al

sp cimen s al have fu ctioned

1 5 Agein

1 5.1 In order to verify whether agein at hig temp rature has a deleteriou eff ect,

thermal-l n s s al b s bjected to the series of test ste s of 1 5.4

1 5.2 The temp rature s al b maintained con tant within ±1 K

1 5.3 An sp cimen remainin intact at the con lu ion of e c ste s al b s bmit ed to

the next ste

Co formity sh l l b c nsidered satisfa t ory if a sp cime s h ve fu ct ion d aft er the first two

ste s

1 5.4 Test ste s are as folows:

1 5.4.1 Ste 1: If req ested by the man facturer, the sp cimen are s bjected to a

temp rature c osen b twe n T

− 15 K for thre we k At the con lu ion of the test, at le st 5 % of

the sp cimen s al not have f un tioned u les the sp cimen have alre d b en s bmited

to step 1, in whic case al sp cimen may have fu ctioned

12.1 Iron an ste l p rts s al b protected again t cor osion by enamel n , galvanizin ,

platin or other eq ivalent me n

12.2 Cor osion protection is not req ired for p rts made of stainles ste l

12.3 Thermal-ln s provided with one or more fer ou p rts s al not b ad ersely aff ected

by p s ible ru tin of s c p rts

12.4 Compl ian e is c e k ed b insp cting sp cime s of Gro ps A, B a d C after the

temp rature a d h mid it y c cle c nd itionin test of 9.18 Th sp cime s are dried in air at a

suit abl e temp rature a d the fer o s p rts sh ll sh w n sign of rustin that mig t imp ir the

p rorma c of t he thermal-l inks in t he se se of this st and ard

13 Manuf acturer’s v l dation programme

13.1 The man facturer s al con u t reg lar in p ction for prod ction control an tests f or

val datin p r orman e as p r 13.2 an 13.3

13.2 The man f acturer s al test thre samples e c , for al temp rature ratin s for thermal

-l n s, on e every two ye rs f or 10.3 (Inter uptin c r ent , 1 3(Rated f un tionin temp rature)

an 1 4 (Maximum temp rature l mit f olowed by the tests of 10.1 (Dielectric stren th) an

10.2 (In ulation resistan e) The pre-con itionin tests des rib d in 9.2 (L ad sec renes

tests) may b omited

13.3 The tests of 10.3 s al b con u ted on

a) the hig est rated voltage,

b) the hig est rated c r ent,

with a.c an /or d.c in the case of a resistive or motor lo d, or with a.c in the case of

in u tive, pi ot d ty or electric dis harge lamp lo d; an

d) the c r ent an circ it con ition declared by the man facturer in the case of a sp cial lo d

Non-compl an e in an of the tests s al b s bject to a review an re etition as p r Clau e 5

Annex A

(nor mative)

Appl cation guide

A.1 In tru tion for mou tin given by the man facturer of the thermal-l n s al b fol owed,

esp cial y in the case where thermal-ln s are provided with a co tin or u ed in impreg ated

win in s

A.2 Thermal-l n s s al b c osen s c that al prevai n electrical req irements with regard

to in ulation resistan e, dielectric stren th, cre p ge distan es in air an cle ran es are met

u der normal an fault con ition , sp cified in the relevant eq ipment stan ard For example,

f or au io, vide an simi ar electronic devices, se IEC 6 0 5

A.3 Thermal-l n s s al b c osen s c that, in the mou ted p sition, their electrical an

thermal in ulation s al not b degraded by thermal overs o t ef fects prod ced u der fault

con ition in the eq ipment

A.4 If thermal-l n s in the f orm of meltin wires or strips are a pl ed, b r iers s al b

provided so that sag in of s c elements or p s ible dro lets of molten metal cannot

prod ce harmful eff ects

A.5 If s c meltin wires are clamp d or pres ed u der s rews, rivets or terminals, it s al

b verif ied that mec anical cre p ge phenomena do not res lt in u ac e ta le electrical

contacts

NOT For h n -h ld or p rta le e uipme t, this pro isio a ple ire p ctiv of th ir p sitio

A.6 Electrical con ection s al fu ction as inten ed over the ran e of temp ratures to

whic they may b exp sed in the eq ipment

A.7 Con ectors an terminals s al not lo sen e si y d e to vibration, s oc , thermal c cl n

an the l ke

A.8 Soldered con ection , if any, s al not rely solely on the solder aloy for their mec anical

rigidity but s al in lu e mec anical an horin , for example a wire b nt throu h a hole in a

terminal

A.9 The mec anical stren th an rigidity of the hardware u ed f or mou tin the thermal-ln

s al b adeq ate Brac ets, clamps or s rews u ed for mou tin the thermal-l n s al

with tan thru t an ten i e forces, torq es, vibration an c clc temp rature c an es

exp cted d rin normal o eratin con ition of the eq ipment

A.10 The mou ted thermal-l n s al b adeq ately protected f rom harmful ef fects prod ced

by p s ible spi age of l q id fom the eq ipment, for example by covers

A.1 In order to avoid p s ible damage to the thermal-ln , the man facturer s ould b

con ulted when the en -u e a pl cation in olves se l n in or the u e of cle nin solvents

B.1 Thermal-l n s u ed to protect electric iron where the normal holdin temp rature is

2 0 °C or gre ter an whic , in the event of f ai ure, rises ra idly to a fu ctionin temp rature

of 3 0 °C or hig er, are not req ired to fol ow the u ual agein test des rib d in 1 5

B.2 The alternative agein test is con u ted as p r the man facturer’s declaration

Annex C

(nor mative)

Conductive heat ageing test

NOT In th USA, An e C is re uire to b d clare For al oth r c u trie , An e C is a plc ble wh n

d clare b th ma ufa turer

C.1 Conductive he t ageing test

The fol owin con u tive he t agein test s al b con u ted on thermal-l n s with a T

fratin

of 17 °C or a ove The test is o tional for thermal-l n s with a T

fratin les than 17 °C

The con u tive he t agein test may be omited if the thermal-l n is of eutectic typ an is

con tru ted without contacts

C.2 Method

Thirty samples s al b s bjected to the test Eac of thre groups con istin of ten sample

thermal-l n s, s al b sec red to a test fixture as embly an placed on an electrical y he ted

static-air test oven con tru ted in ac ordan e with C.6 an s bjected to the test des rib d in

C.2.2 to C.4 The oven cover of the test oven, as s own in Fig re C.2, s al b re laced with

the test fixture as embly as s own in Fig re C.1 The aluminium test b x section an the

ceramic oven l ner section, s own in Fig re C.2, s al b removed f om the test oven

C.2.2 Typic l te t fixture a s mbly

A typical test fixture as embly as s own in Fig re C.1 con ists of an aluminium plate,

2 9 mm × 2 9 mm an 6,4 mm thic on whic ten thermal sec rin cl ps are mou ted on the

outer p rimeter of the plate an serve to sec re the thermal-l n to the s rf ace of the plate

An electrical in ulator, con istin of two layers of 0,0 5 mm thic p lyamide f ilm an a

nominal total thic nes of 0,15 mm, s al b placed arou d e c thermal-l n to electrical y

in ulate it fom the aluminium plate The le d of e c adjacent thermal-l n s al b welded

together to form a series circ it The wire size, typ of wire, or termination method selected to

con ect the thermal-ln to the electrical lo d, s al not signif i antly aff ect the temp rature of

the thermal-ln to whic the lo d is con ected The test fixture may b modified so that al 3

test samples may b tested on one test fixture as embly Multiple test fixtures may be u ed

with the samples divided into multiple groups

C.2.3 Temperature s t ing

The test fixture as embly s al b placed on the thermal-l n test oven as the cover, with the

thermal-l n s p sitioned on the outside s rf ace of the aluminium plate The test oven s al b

rated 10 A, 12 V a.c or 2 0 V a.c

C.2.4 Temperature be a iour

The temp rature on the aluminium plate an the thermal-ln s s al b control ed by the

len th of time the test oven remain “on” Durin the “on” p riod, the thermal-l n s s al also

b he ted as a res lt of con u tin a lo d c r ent of 10 A at 12 V a.c f rom the he tin

element of the test oven con ected in series with the thermal-l n s

Ex e tion: If the thermal-l n is rated les than 10 A, a se arate circ it with an external lo d

set f or the thermal-l n rated c r ent s al b con ected to the thermal-l n The lo d c r ent

s al b c cled con ur ently with the test oven he tin element Whenever a thermal-ln

o en , the test oven he tin element s al remain of f u ti the o en thermal-l n is removed

an the thermal-l n test location is byp s ed

C.2.5 Temperature monitoring

The temp rature of e c thermal-l n s al b monitored by a thermocouple welded to the

up ermost side of the thermal-l n b d The thermal-l n havin the hig est temp rature

s al b u ed for control n the len th of the oven “on” p riod Verification of the sta i ty of

the temp rature of the thermal-l n b d s al b determined 2 h after the start of the test At

that time, the temp rature of eig t out of ten (8 %) thermal-ln s s al b within 12 K of the

hig est monitored temp rature

T

f

is the rated f un tionin temp rature of the thermal-l n s For e c ste , a toleran e of

60

−

K

s al b u ed for control n the test oven “on” an “of f” p riod

The load c r ent “on” time throu h the tested device s al b at le st 5 s but not lon er than

10 s as declared by the man facturer These values may b ex e ded d rin the ramp-up

p riod if the req ired agein temp rature of the ste in olved (Ste A to Ste G alowin the

6

0

−

K toleran e) has not yet b en at ained on the thermal-l n havin the hig est temp rature

an whic is b in u ed for control n the len th of the oven “on” p riod The thermal-l n

may or may not b energized d rin the ramp-up p riod

C.3.2 Co l n operation

Twice e c we k, the test oven s al b de-energized an the test fixture al owed to co l to

ro m temp rature The co l-down p riod s al b f or 12 h on the third an f ifth day of e c

we k The total agein time for e c ste s al not in lu e the co l-down p riod or the time

when the test oven is of f d e to a thermal-l n fu ctionin

C.3.3 Premature operation

If a thermal-l n f un tion prior to completin the total agein p riod, the thermal-l n s al b

byp s ed in order to retain contin ity of the series circ it Durin the recon ection proces ,

the remainin thermal-l n s s al not b disturb d Ad itional wire le d of pro er size an

typ are to b u ed

C.4 Results

As a res lt of the test, e c thermal-l n s al o erate as inten ed, s al b electrical y o en,

an there s al b no dielectric bre k own as a res lt of the test pres rib d in Clau e C.5

C.5 Diele tric strength test

With referen e to Clau e C.4, fol owin the test, e c thermal-ln s al b s bjected to the

dielectric stren th test of 10.1, a pl ed b twe n the le d or terminals of the o ened thermal

-l n after the test samples have b en brou ht to ro m temp rature

Dime sion in inc e a d (mil limetre )

The test a p ratu s al con ist of an electrical y he ted, static-air oven A typical example of

s c an oven is s own in Fig re C.2 The oven s al b located in a ro m f re of drau hts

an the ambient temp rature s al b maintained re sona ly con tant d rin the test

The oven des rib d in Fig re C.2 has a two-section core con istin of a non-metal c oven

l ner an a metal test b x

The interior s rf aces of the oven des rib d in Fig re C.2 con ist of a fire ric or a l ke typ of

s rf ace whic s ield radiant he t an red ces he t los Se ms an joints s al b tig t

The in er metal test b x of the oven des rib d in Fig re C.2 has 6,4 mm thic wal s The test

b x s al rest on inorganic bloc s an s al b s ielded fom radiant he t The temp ratures

arou d the thermal-l n s al b monitored by thermocouples located in ide the metal test b x

The temp rature reg latin s stem of the oven s al b s c that the temp rature of the air at

the test location is maintained within 0,5 K

Key

1 te t s mple c amb r

2 temp rature mo itorin a d re ordin th rmo o ple

3 aluminiumte t b x s ctio , s p orte o f our c ramic b to s

4 low-d n ity f ire bric o e

Annex D

(inf or mative)

Extended holding temperature evaluation

NOT An e D is a plc ble wh n d clare b th ma ufa turer

D.1 Extende holding temperature conditioning test

D.1.1 Twenty-f i e devices s al b placed in an electrical y he ted static-air oven f or a

p riod of 10 we k whi e maintainin the rated lo d c r ent at the rated voltage The test

oven s al b con tru ted in ac ordan e with Clau e C.6 an Fig re C.2 ex e t for overal

dimen ion variation an also the in lu ion of the terminal bloc s p ort test f i ture sec rin

the thermal-ln s A typical example of the terminal bloc s p ort test fixture is s own in

Fig re D.1

D.1.2 Eac thermal-l n s al b con ected in series to the terminals of the test fixture as

s own in Fig re D.1 The internal cavity of the test oven s al b he ted so that the b d

temp rature of e c sample s al b maintained at the rated T

h- 0value A thermocouple

s al b at ac ed to e c thermal-ln to monitor the b d temp rature

D.1.3 The temp rature toleran es maintained for the samples s al b

100

−

K for al

2 samples d rin the f irst two we k of con itionin an ±10 % of the T

h- 0value (stated

in °C) for at le st 2 of the 2 samples f or the remin er of the test time

D.1.4 Al samples that do not ex eed +10 % of the T

h–10ratin s al not b o en at the

con lu ion of the con itioning After the con itionin p riod, al but two of the samples

s al b s bjected to the load c r ent inter upt test of Clause D.2 The remainin two

samples s al b s bjected to the rated fun tionin temp rature test of 1 3

D.2 Load cur ent inter upt test

D.2.1 The samples s al b placed in a test oven that has b en sta i zed at 10 K b low the

rated fu ctionin temp rature, T

f, of the sample Eac thermal-l n is then energized an the

oven temp rature s al b in re sed at the rate of (2 ± 1) K/min an the test s al be

contin ed u ti the thermal-l n f un tion or the oven temp rature re c es 3 K a ove T

f

D.2.2 Eac thermal-ln s al bre k the sp cified lo d c r ent at the sp cif ied voltage There

s al b no damage to the integral le d of the thermal-l n The internal as embly of e c

sample s al b vis al y examined after the inter upt test There s al b no weldin or u d e

burnin or pit in of the contacts or o eratin mec anism

Us 3,3 mm

2

c p er wire to jump fom row to row of th th rmal-ln s a d in a d o t of th b x thro g th h le in

th ld

Se ure th rmo o ple le d to th rmal-ln b d Exit b x thro g th n are t h le in th ld

Fig re D.1 – Typic l terminal bloc s pport te t f ixture

IE C

Re e t f or fo r a ditio al

rows of th rmal-ln s

E.1 This test a pl es to se ls an p tin comp u d Af ter the con itionin , as sp cified

b low, the samples s al b tested to determine critical electrical an mec anical pro erty

values The average value for e c pro erty on the con itioned samples s al b at le st

5 % of the average value determined on u con itioned samples

Se ls an p tin comp u d ne d not b tested if they alre d comply with the relevant UL

stan ard

E.2 For e c pro erty to b evaluated, ten samples s al b con itioned for 1 0 0 h at the

oven temp rature determined f rom the resp ctive thermal en uran e profi e l ne in Fig re E.1

The temp rature in ex is the me s red normal o eratin temp rature or T

h, but not les than

6 °C The samples are then brou ht to ro m temp rature

On the same thermal en uran e profi e l ne as s own in Fig re E.1, a s orter or lon er time

at a hig er or lower oven temp rature, resp ctively, may b employed if agre a le to b th the

man facturer an the en -u er, but a p riod of at le st 3 0 h s al b u ed

Annex F

(nor mative)

Identification requirements

NOT In th USA, An e F is re uire to b d clare For al oth r c u trie , An e F is a plc ble wh n

d clare b th ma ufa turer

F.1 The proced re des rib d b low s al b con u ted on a n mb r of samples of thermal

-l n s employin eutectic-typ elements f or identification purp ses

F.2 The thermal activity of the thermal-l n 's al oy, determined by u e of thermal-analy is

a p ratu employin a dif ferential s an in calorimeter, s al b comp red with a ref eren e

material that is thermaly inert over the ran e of temp rature ratin of the material The

temp rature of the sample an referen e material s al b raised at a predetermined rate an

the thermal dif ferential b twe n the two materials s al b gra hical y recorded on the Y axis

again t in re sin temp rature on the X axis This gra h s al in lu e the thermal y active

temp rature ran e, i.e the en othermic meltin p int of the sample material This p int is

re resented by a downward p ak on the gra h

F.3 The identif i ation test s al b con u ted on thermal-l n s employin organic-material

elements An inf ared sp ctrum s al b o tained f om the material by u e of an inf ared

sp ctro hotometer Sampln method an in trument set in s u ed in o tainin the sp ctrum

s al b recorded

F.4 To confirm adeq ate se l n , 2 samples s al b s bmerged 2 ,4 mm b low the

s race in hot mineral oi , maintained at 125 °C for 1 min There s al b no air bub les

es a in , in icatin that the thermal-l n is se led This proced re s al b con u ted on

thermal-l n s identified as se led