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Tiêu đề IEC 62779-3: 2016-04
Trường học International Electrotechnical Commission
Chuyên ngành Electrical and Electronic Technologies
Thể loại Standards Document
Năm xuất bản 2016
Thành phố Geneva
Định dạng
Số trang 30
Dung lượng 799,13 KB

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Cấu trúc

  • 3.1 Interface type (9)
  • 3.2 Detection of HBC interface (9)
  • 3.3 Electromagnetic field coupling (9)
  • 3.4 Essential rating and characteristics (9)
    • 3.4.1 Signal transmission (9)
    • 3.4.2 Signal radiation (10)
  • 3.5 Other terms and definitions (10)
  • 4.1 General specifications (11)
  • 4.2 Electrical specifications ....................................................................................... 1 0 (12)
    • 4.2.1 Coupling specifications ................................................................................ 1 0 (12)
    • 4.2.2 Directional specifications .............................................................................. 1 0 (12)
    • 4.2.3 Transient specifications ................................................................................ 1 1 (13)
  • 4.3 Limiting values .................................................................................................... 1 1 (13)
    • 4.3.1 Details to be stated ...................................................................................... 1 1 (13)
    • 4.3.2 Electrical limiting values ............................................................................... 1 1 (13)
    • 4.3.3 Temperatures .............................................................................................. 1 1 (13)
    • 4.3.4 Humidity ...................................................................................................... 1 1 (13)
  • 3.4 Valeurs assignées et caractéristiques essentielles (22)
    • 3.4.1 Émission de signal (22)
    • 3.4.2 Rayonnement de signal (22)
  • 3.5 Autres termes et définitions (23)
  • 4.1 Spécifications générales (23)
  • 4.2 Spécifications électriques (25)
    • 4.2.1 Spécifications de couplage (25)
    • 4.2.2 Spécifications directionnelles (25)
    • 4.2.3 Spécifications transitoires (25)
  • 4.3 Valeurs limites (26)
    • 4.3.1 Détails à indiquer (26)
    • 4.3.2 Valeurs limites électriques (26)
    • 4.3.3 Températures (26)
    • 4.3.4 Humidité (26)

Nội dung

IEC 62779 3 Edition 1 0 201 6 04 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Semiconductor interface for human body communication – Part 3 Functional type and its operational c[.]

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Part 3: Funct ional t y pe and it s operat ional condit ions

Partie 3: Ty pe fonct ionnel et ses condit ions d’ut il sat ion

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THIS PUBLICATION IS COPY RIGHT PROTECTED

Co yrig t © 2 16 IEC, Ge e a, Switzer la d

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c p rig t or h v a e q ir y a o t o tainin a ditio al r i hts to this p blc tio , ple s c nta t th a dr es b low or

y ur lo al IEC memb r Natio al Commite for fur th r informatio

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Glos aire IEC - std.e ch/glos ary

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et e fa ç is,ext rait es d s art ic le Terme et Définit io s d s

p blc t io s IEC p ru s d p is 2 0 Plu c rt ain s e t ré s

a t érie re ext rait es d s p blc at io s d s CE 3 , 7 , 8 et

CIS R d l EC

Servic Clents - webst ore.e ch/cs

Si v ou d sire n u d n er d s c mme t aire s r c t t e

p blc t io o si v u av ez d s q e t io s c nt act ez-n u :

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Part 3: Functional ty pe and it s operational condit ions

Part ie 3: Ty pe fonct ionnel et ses conditions d’ut il sat ion

W arning! Ma e s re th t you o tain d this publc tion from a a thorize distribut or

A tt ention! Veui ez vou a s rer q e vous avez o te u c t te publc tion v ia u distribute r a ré

c olour

in ide

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FOREWORD 3

INTRODUCTION 5

1 Sco e 6

2 Normative ref eren es 6

3 Terms an def i ition 6

3.1 Interface typ 7

3.2 Detection of HBC interf ace 7

3.3 Electromag etic f ield coupl n 7

3.4 Es ential ratin an c aracteristic 7

3.4.1 Sig al tran mis ion 7

3.4.2 Sig al radiation 8

3.5 Other terms an defi ition 8

4 Interface typ 9

4.1 General sp cifi ation 9

4.1.1 Fu ction 9

4.1.2 Implementation 10 4.1.3 Comp tibi ty 10 4.2 Electrical sp cif i ation 10 4.2.1 Coupl n sp cif i ation 10 4.2.2 Directional sp cif i ation 10 4.2.3 Tran ient sp cif i ation 1

4.3 Limitin values 1

4.3.1 Detais to b stated 1

4.3.2 Electrical l mitin values 1

4.3.3 Temp ratures 1

4.3.4 Humidity 1

Biblogra h 12 Fig re 1 – HBC interf aces 6

Fig re 2 – Bloc diagram of interf ace 9

Ta le 1 – Coupl n sp cif i ation of a HBC interface 10 Ta le 2 – Direction sp cif i ation of a HBC interface 1

Ta le 3 – Tran ient sp cif i ation of a HBC electrode 1

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

Part 3: Functional type and its operational conditions

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

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th later

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International Stan ard IEC 6 7 9-3 has b en pre ared by IEC tec nical commit e 4 :

Semicon u tor devices

The text of this stan ard is b sed on the fol owin doc ments:

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A l st of al p rts in the IEC 6 7 9 series, publs ed u der the general title Semic nductor

devic s – Semic nd uctor intera e for h ma b dy c mmu ic tio , can b f ou d on the IEC

we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "htp:/we store.iec.c " in the data

related to the sp cifi publ cation At this date, the publ cation wi b

• with rawn,

• re laced by a revised edition, or

IMPORTANT – The 'colour inside' logo on th cov r pa e of this publ c tion in ic te

that it contains colours whic are considere to be us f ul for the cor e t

understa din of its conte ts Us rs s ould th ref ore print this doc me t u ing a

colour printer

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The IEC 6 7 9 series is comp sed of thre p rts as f ol ows:

• IEC 6 7 9-1 def i es general req irements of a semicon u tor interf ace f or h man b d

commu ication It in lu es general an f un tional sp cif i ation of the interf ace

• IEC 6 7 9-2 defi es a me s rement method on electrical p rforman es of an electrode

that con tru ts a semicon u tor interf ace for h man b d commu ication

• IEC 6 7 9-3 def i es f un tional typ of a semicon u tor interface for h man b d

commu ication, an o erational con ition of the interface

IEC 6 7 8-4 gives req irements on interf ace integrated circ its f or semicon u tor devices

Esp cial y, Cha ter I , Section 7 in this stan ard is a pl ed to interf ace circ its for a

commu ication network u in a general c an el, s c as wire or wireles However, a

c an el for HBC is the h man b d whose c an el pro erties, s c as sig al los an delay

profile, are dif f erent from the general c an el, so the Cha ter I , Section 7 can ot b a pled

to an interface f or HBC Furthermore, a stan ard on a commu ication protocol f or b d are

network (BAN) − IEEE 8 2.15.6 (IEEE Std 8 2.15.6-2 12), whic in lu es a commu ication

protocol for HBC was publ s ed in 2 12 A common interface for HBC s ould b defi ed to

sec re commu ication comp tibi ty b twe n variou devices that are implemented on/in ide

the h man b d or emb d ed in p ripheral eq ipments

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SEMICONDUCTOR DEVICES –

Part 3: Functional type and its operational conditions

This p rt of IEC 6 7 9 series def i es a f un tional typ of a semicon u tor interface for

h man b d commu ication (HBC) An interface f or HBC in lu es an electrode that is

ph sical stru ture to tran mit a data sig al to the h man b d or receive a tran mit ed data

sig al f rom the b d An electrode directly contacts with the h man b d in man cases, but it

can ot maintain the contact con ition when an o ject, s c as clothes, exists b twe n the

interf ace an the b d or a ne r f ield commu ication is req ired; hen e, de en in on the

contact con ition, an interf ace f or HBC can b categorized into a contact an non-contact

typ as s own in Fig re 1 This p rt in lu es the categorization of the interface f or HBC

ac ordin to the contact con ition; an p rforman e p rameters c aracterizin the interf ace

of e c category

Ke

Huma Bo y Huma b d of a u er u in HBC Ele tro e Ph sic l stru ture totra smit a

ele tric l sig al to th h ma b d

or re eiv a sig al fom th h ma

b d

Figure 1 – HBC interf ac s

The f ol owin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le for its a pl cation For dated ref eren es, only the edition cited a pl es For

u dated ref eren es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

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3.1 Interf ac type

3.1.1

conta t type HBC interf ac

HBC interf ace whose electrode has a ph sical contact with the h man b d

Note 1 to e try: A c nta t-ty e HBC intera e g n rate a stro g ele troma n tic field whic is c u le with th

h ma b d thro g a ele tro e b c u e a p y ic l c nta t b a ele tro e c u e a d cre s in lo d

imp d n e of th intera e a d a in re s in o tp t c re t a c rdin ly

Note 2 to e try: This n te a ple to th Fre c la g a e o ly

3.1.2

non onta t type HBC interf ace

HBC interf ace whose electrode do s not have a ph sical contact with the h man b d

Note 1 to e try: Unlk a c nta t-ty e HBC intera e, a n n o ta t-ty e HBC intera e g n rate a we k

ele troma n tic f i ld thro g th ele tro e, in whic th f i ld is c u le with th h ma b d thro g a ele tro e

a d a o je t lo ate b twe n th h ma b d a d a ele tro e

Note 2 to e try: This n te a ple to th Fre c la g a e o ly

3.2 Dete tion of HBC interf ac

3.2.1

conta t dete tion

detection proces that determines whether an electrode has a ph sical contact with the

h man b d or not in the case of a contact-typ HBC interf ace

3.2.2

proximity d te tion

detection proces that determines whether an electrode is within a sp cif i distan e f rom the

h man b d or not in the case of a non ontact-typ HBC interface

3.3 Ele troma netic field coupl ng

3.3.1

field coupl ng

coupl n with the h man b d of an electromag etic f ield generated from a HBC interf ace

Note 1 to e try: De e din o a fe u n y of a sig al to b tra smite or re eiv d, a ele tric or ma n tic field

non-dire tional coupl ng

f ield coupl n whose amou t is in e en ent on the coupl n direction from an electrode to the

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Note 1 to e try: In th c s of a dire tio al c u ln , a c u ln lo s is d p n e t o a c u ln dire tio fom

th ele tro e to th h ma b d ; h we er, a c u ln lo s is a c n ta t ire p ctiv of a c u ln dire tio in th

tran mis ion ef f icien y cau ed by an electrode of a HBC interf ace

Note 1 to e try: A tra smis io eff i ie c c n b o tain d b c n ertin a dB s ale of a c u ln lo s into a %

f req en y ran e over whic a coupl n los is eq al to or les than a sp cif i value

Note 1 to e try: Th s e ific v lu is u u ly d termin d larg r b 3 dB fom a minimum c u ln lo s

Note 1 to e try: Th s e ific v lu is d termin d to s tisfy a pro er s n itivity le el of a HBC interf ac

Note 2 to e try: Th c u ln dista c is d f i e o ly for a n n o ta t-ty e intera e

3.4.2.2

dire tivity

DIR

c u ln

ran e of direction in an le or distan e at whic a coupl n los is eq al to or les than a

sp cif i value in the case of a directional coupl n

Note 1 to e try: Th s e ific v lu is d termin d to s tisfy a pro er s n itivity le el of a HBC intera e

3.5 Other terms a d definition

3.5.1

loa impe a c

Z

lo d

imp dan e se n by a HBC interf ace in a direction f rom an electrode toward the h man b d

Note 1 to e try: In th c s of a n n o ta t-ty e intera e, th lo d imp d n e in lu e a imp d n e b a

o je t b twe n th h ma b d a d a HBCintera e

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If a HBC interf ace has a dif ferent category, a contact or non-contact typ , ac ordin to a

contact con ition, the con ition an typ of contact s ould b provided

4.1.1.2 Fu ctional de cription

An interf ace f or HBC is a device to tran mit a data sig al to the h man b d or receive a

tran mit ed data sig al from the b d If a pl ca le, dif feren es in fun tion of e c interf ace

typ s al b given

4.1.1.3 Bloc dia ram

Interface’s overal stru ture s al b given Detai s of the stru ture s al b given u in a

bloc diagram as presented in Fig re 2 b low

Comp rator Circ it to tra sf orm a a alo

sig al into a digital sig al

C R Clo k-d ta-e o ery circ it to

remo e jter in a digital sig al

HBC Mo em Circ it to mo ulate a d d mo ulate

a d ta sig al

Figure 2 – Bloc dia ram of interf ac

NOT 1 Th p werln n is re u tio f ilter c n b remo e if th p wer of th n is sig al is n t hig e o g to

s turate th a tiv c mp n nts in th intera e

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NOT 2 Ord r of th c mp n nts in th intera e c n b c a g d

If a pl ca le, a fun tional p rt f or contact or proximity detection s al b def i ed in a bloc

diagram Also, control sig als to s p ort a detection proces s ould b def i ed

4.1.2 Impleme tation

Pac age typ , f or example ceramic, plastic or glas , s al b given If a pl ca le, IEC an /or

national referen e n mb r of the outl ne drawin s al b stated

Material pro erties with resp ct to an electrode an electrode’s ph sical dimen ion s al b

stated

4.1.2.2.2 Ele trode loc tion

The p sition of the electrode to b implemented in a HBC interf ace s al b given Detai s on

the p sition, s c as distan es from a referen e p int in a HBC interf ace, s al b in lu ed

If a pl ca le, the p sition where an electrode s al not b implemented s al b stated

4.1.3 Compatibi ity

Comp tibi ty b twe n interf aces havin a dif ferent typ s al b stated

If a pl ca le, req ired con ition to ac ieve comp tibi ty s ould b given

4.2 Ele tric l spe if ic tions

Coupl n sp cif i ation of a HBC interf ace s al b given as s own in Ta le 1 b low

Table 1 – Coupl ng spe ific tions of a HBC interf ac

4.2.2 Dire tional spe ific tions

Direction sp cif i ation of a HBC interf ace s al b given as s own in Ta le 2 b low

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Table 2 – Dire tion spe if ic tions of a HBC interf ac

Tran ient sp cif i ation of a HBC electrode s al b given as s own in Ta le 3 below

Table 3 – Tra sie t spe if ic tions of a HBC ele trod

The fol owin detais s al b stated:

– An de en en y b twe n the lmitin values s al b sp cif ied

– If external y con ected an /or at ac ed elements have an in uen e on the l mitin values,

the elements an their con ition s al b sp cified

– If the l mitin values are ex e ded f or tran ient overlo d, the p rmis ible ex es es an

their d ration s al b sp cif ied

– Al voltages are ref eren ed to a sp cif i referen e terminal

– The lmitin values given s al cover an interface’s o eration over the sp cif ied ran e of

o eratin temp rature If the lmitin values are de en ent on temp rature, the

The fol owin temp ratures s al b stated:

a) Op ratin temp rature;

b) Storage temp rature

4.3.4 Humidity

The fol owin h midity con ition s al b stated:

a) Op ratin h midity;

b) Limitin values of h midity con ition

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IEEE 8 2.15.6:2 12, I EEE Standard for L c l a d Metro olita are n twork – P art 15.6:

Wirele s Body Are N etwork

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