804 k03 v3 x RAY檢驗作業規範 PTSGI EN(0816) ok 模版更新

X-ray 送驗流程X-ray inspection flow:X-ray inspection flow:... Solder ball short: This figure shows the phenomenon of the solder ball short of ram chip X-ray inspection flow:46-degree angle..

Revision History

Rev.

Status Revision Date Revised By Description

Added various NG diagrams on pages 10–23

3 2019/8/17 Rebel 1：增加英文翻译 Add English translation

2：增加越文翻译Add Vietnamese translation

目錄 CONTENTS

1.0 目的 PURPOSE 3

2.0 範圍 SCOPE 3

3.0 職責 RESPONSIBILITIES 3

4.0 作業流程 FLOWCHART 3

5.0 作業內容 ACTIVITIES DESCRIPTION 4

6.0 核決許可權 AUTHORITY 7

7.0 附件 APPENDIX 7

將欲以 X-ray 做不良分析之基板送至 X-ray 檢查機, 並填寫 “ X-ray 送驗申請單 ”

Send the PCBs for defect analysis by X-ray to the X-ray machine and fill out the “X-ray inspection application” form

X-ray 送驗流程(X-ray inspection flow):X-ray inspection flow):

Board

production

department

Send the PCB for inspection to X-ray

X-Ray inspection & analysis

Record the results and return PCBs End

Other

departments

Fill out the inspection application

Record the defects and issues and respond to the process engineer

Other departments can apply for inspection when it is necessary to use X-ray to

analyze the product or defective PCBs

Inspection area

無法以目視方式辨認焊錫情況之零件, 如 BGA, CSP 等零件

For PCB inspection parts of normal production or the first mass production of a new

model, the inspection area should focus on parts whose soldering cannot be verified by

visual inspection, such as parts including BGA and CSP

For PCBs sent from other departments, the inspection area should be bad parts position

or the desired inspection area

Inspection results

5.3.1 X-ray 檢驗人員於檢測完成後需將檢測結果登錄於 “ X-ray 檢測紀錄 及” “ X-ray 送驗申請單

There are three folders on the desktop, including Datacom photo, MobileCom photo and

SatCom photo

The data of the first 8 pieces must be saved and the data of other boards can be saved

separately upon SMT engineers' decision

should notify the engineer and stop the line for review.

本作業規範需經本廠區最高主管核准後實施，修正時亦同。

This guideline will be implemented after approval by the top manager of this factory Amendment shall

be approved in the same fashion

7.0 附件

Appendix:

附件一：X-RAY 送驗申請單 (X-ray inspection flow):Form No:804-K03-01)

Appendix 1: X-ray inspection application (X-ray inspection flow):Form No:804-K03-01)

附件二：X-RAY 檢測記錄 (X-ray inspection flow):Form No:804-K03-02)

Appendix 2: X-ray inspection record (X-ray inspection flow):Form No:804-K03-02)

一 各式 NG 圖式解說:

Descriptions of NG illustrations

1 短路(SHORT): SHORT):

1-1.錫膏造成錫球短路:使用低 KV 及低 μA A 檢測之,其因可能 Printer 印刷時造成錫膏短路, 此情形之改善方法為:確認鋼版是否狀況不佳、Printer 之設定及作動有誤等

上圖所示為:錫膏過多造成短路,KV & μA A 值建議為 90KV 及 5μA A,若 KV 值過高會造成少量的錫被穿透,影響判斷

Solder ball shorts caused by the solder paste: Use low KV and low μA A for inspection Solder paste short may result from printing This phenomenon can be improved by the following methods: confirm if the stencil is in good condition, printer setting or malfunction exists

The figure shows the short caused by excess solder paste It is recommended to inspect with 90KV and 5μA A A small amount of tin will be penetrated when KV value is too large and this will affect the judgement

1-2.錫球短路:此圖為 Ram 顆粒之錫球短路之現象,角度為 46 度

Solder ball short: This figure shows the phenomenon of the solder ball short of ram chip (X-ray inspection flow):46-degree angle)

1-3 錫球短路:此圖莫約為 85KV 及 10 μA A 之環境下之圖示.KV 值過高易造成誤判

Solder ball short: This figure shows the condition under an environment with around 85KV and 10μA A

A high KV value can easily lead to the misjudgment

1-4: 錫球偏移(X-ray inspection flow):46 度角):因 Mounter 機座標位置設定有偏差,錫膏雖有內聚力可將錫球拉回,但其偏差量過大且拉回之能力有限,故造成此現象,而該現象易形成空銲(X-ray inspection flow):OPEN)及錫裂 (X-ray inspection flow):Creak),未空焊時此偏移造成焊接面不足致強度較弱而影響該產品之可靠度

Solder ball shift (X-ray inspection flow):46-degree angle): Though the cohesion of solder paste can pull back solder balls, the excess shift and limited pull-back ability still result this phenomenon when the mounter coordinates settings contain shifts This phenomenon can lead to open and crack easily; when non-wetting exists, this shift will lead to insufficient soldering surface and lower strength and thus affect product reliability

1-5: 錫球偏移(X-ray inspection flow):0 度角):於 0 度角可檢測到內圈吃錫狀態

Solder ball shift (X-ray inspection flow):0 degree): It is possible to inspect the inner ring soldering at 0 degree inclination

1-6: 錫球偏移(X-ray inspection flow):0 度角檢測):可明確顯示其 MOUNTER 機程式座標設定偏差過大,使用 KV 需較低之值即可得知

Solder ball shift (X-ray inspection flow):0-degree inspection): Can clearly show the mounter coordinates program settings contain excess shifts It is possible to tell with a lower KV value

2.錫球遺失(SHORT): Missing Ball):

2-1:錫球 LOSE(X-ray inspection flow):0 度角):依據該圖示顯示,錫球週邊並無錫渣產生,無爆錫之疑慮,故應為 原材之錫球並未值所造成,否則其週邊應有錫渣分怖其週圍

Missing ball (X-ray inspection flow):0 degree): From this figure, it is clear that there is no solder flash around the specified solder location The solder ball must therefore be missing, otherwise there would be traces of solder

2-2:錫球空焊:影像接收器移動至 46 度角檢測,NG 之錫球上方有一錫墊,此為 PAD 之錫墊,錫球未能與錫墊相連接(X-ray inspection flow):Wetting),即為空焊(X-ray inspection flow):Open)

Open solder joint: Move the image receiver to a 46-degree angle for inspection There is one pad, the solder pad of PAD, above the NG solder ball An open occurs when the solder ball is not wetted with thepad

2-3 錫球空焊:

Open solder joint:

2-4: 錫球空焊:

Open solder joint:

2-5: 錫球空焊:SHIFT 造成之空焊(X-ray inspection flow):Open)

Open solder joint: This type of open is caused by shift

2-6: 錫球空焊:

Open solder joint:

2-7: 錫球空焊:

Open solder joint:

2-8: SOCKET 空焊:

Socket open:

3.氣泡之檢測(SHORT): Void Inspection):

3-1.錫球氣泡(X-ray inspection flow):Void):0 度角檢測,該氣泡過大至已無可靠度,可直接判斷為 NG

Solder void: Under 0 degree inspection, if voids are too large to be reliable, the inspection result can be defined as NG (X-ray inspection flow):rejected)

3-2: 錫球氣泡(X-ray inspection flow):Void):46 度角時檢測,氣泡之所在位置為錫球的上、中、下層,氣泡過大及過多,該產品之可靠度即越低

Solder ball void: When inspection is taken under a 46-degree angle, voids can be seen at the top, middle and bottom layers of solder ball Large voids or excess voids indicate lower product reliability