804 k03 v3 x RAY檢驗作業規範 PTSGI EN(0816) ok final

1.0 目的 PURPOSEPURPOSE...32.0 範圍 PURPOSESCOPE...3 3.0 職責 PURPOSERESPONSIBILTY...3 4.0 作業流程 PURPOSE FLOW CHART...4 5.0 作業內容 PURPOSEACTIVITIES...4 6.0 核決許可權 PURPOSEAUTHORITY...7 7.0 附件 PU

Trang 2

1.0 目的 (PURPOSE)PURPOSE) 3

2.0 範圍 (PURPOSE)SCOPE) 3

3.0 職責 (PURPOSE)RESPONSIBILTY) 3

4.0 作業流程 (PURPOSE) FLOW CHART) 4

5.0 作業內容 (PURPOSE)ACTIVITIES) 4

6.0 核決許可權 (PURPOSE)AUTHORITY) 7

7.0 附件 (PURPOSE)APPENDIX) 8

本資料為啟碁科技股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成其他形式使用

The Information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.

Form No.: 2-JQ-021-04,002

表單 Title

Trang 3

Engineering staff are responsible for operating and inspecting all PCBs for inspection, filling

out inspection records and notifying the results of defective boards to the process engineer

3.2 其他部門

Other departments

將欲以 X-ray 做不良分析之基板送至 X-ray 檢查機, 並填寫 “ X-ray 送驗申請單 ”

Send the PCBs for defect analysis by X-ray to the X-ray machine and fill out the “X-ray inspection application” form

Trang 4

4.0 作業流程 (PURPOSE) FLOW CHART)

X-ray 送驗流程(PURPOSE)X-ray inspection flow):

本資料為啟碁科技股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成其他形式使用 The Information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.

X-Ray inspection

& analysis

Record the results and return PCBs

Record the defects and issues and respond to the process engineer

OK

NG

Trang 5

PCB production lines (PURPOSE)front and back) send 2 PCBs every 2 hours under normal production.

All PCBs with BGA repair must be inspected by X-ray

5.1.4 其他部門

Other departments 其他部門研判須利用 X-ray 分析產品或不良品時, 可依申請流程送驗

Other departments can apply for inspection when it is necessary to use X-ray to analyze the

product or defective PCBs

5.2 檢測位置

Inspection area 5.2.1 生產線正常生產或新機種首次量產時送驗之 PCB 檢測零件:

無法以目視方式辨認焊錫情況之零件, 如 BGA, CSP 等零件

For PCB inspection parts of normal production or the first mass production of a new model, the inspection area should focus on parts whose soldering cannot be verified byvisual inspection, such as parts including BGA and CSP

5.2.2 其他部門送驗之 PCB 以不良零件位置或欲檢測位置為檢測區域

For PCBs sent from other departments, the inspection area should be bad parts position

or the desired inspection area

Trang 6

5.3 檢測結果

Inspection results 5.3.1 X-ray 檢驗人員於檢測完成後需將檢測結果登錄於 “X-ray 檢測紀錄及” “X-ray 送驗

Trang 7

5.4.3 储存文件名称设计方式如下：

The file should be named as follows:

_ _ _ _ _ _ _ - _ _ _ _ _ - _ _ _ _ _ _

年月日(PURPOSE)举例：050622)yy/mm/dd (PURPOSE)e.g.: 050622)

M/O号码(PURPOSE)举例：22323)M/O number (PURPOSE)e.g.: 22323)

55阶产品名称(PURPOSE)举例：UMA01.006)55-level product name (PURPOSE)e.g.: UMA01.006) 5.5 异常反应：

Reaction to abnormality:

5.5.1 首 8 片检测若发现异常时，得通知 SMT 工程师了解处理，并重新调整 SMT 生产参数，再重新检测，直到合格为止。

When any abnormality of the first 8 pieces is discovered, staff should notify SMTengineer to confirm and readjust SMT production parameters for reproduction untilproducts pass the inspection

6.0 核決許可權 (PURPOSE)AUTHORITY)

本作業規範需經本廠區最高主管核准後實施，修正時亦同。

This guideline will be implemented after approval by the top manager of this factory Amendment shall be approved in the same fashion

Trang 8

7.0 附件：

Appendix:

附件一：X-RAY送驗申請單 (PURPOSE)Form No:804-K03-01)

Appendix 1: X-ray inspection application (PURPOSE)Form No:804-K03-01)

附件二：X-RAY檢測記錄 (PURPOSE)Form No:804-K03-02)

Appendix 2: X-ray inspection record (PURPOSE)Form No:804-K03-02)

Form No.: 2-JQ-021-04,002

Trang 9

一 各式NG 圖式解說:

Descriptions of NG illustrations

1 短路(SHORT): SHORT): ):

1-1.錫膏造成錫球短路:使用低KV 及低 μA A 檢測之,其因可能Printer 印刷時造成錫膏短路, 此情形之改善方法為:確認鋼版是否狀況不佳、Printer 之設定及作動有誤等

上圖所示為:錫膏過多造成短路,KV & μA A 值建議為90KV 及5μA A,若KV 值過高會造成少量的錫被穿透,影響判斷

Solder ball shorts caused by the solder paste: Use low KV and low μA A for inspection Solder paste short may result from printing This phenomenon can be improved by the following methods: confirm

if the stencil is in good condition, printer setting or malfunction exists

The figure shows the short caused by excess solder paste It is recommended to inspect with 90KV and 5μA A A small amount of tin will be penetrated when KV value is too large and this will affect the judgement

Trang 10

1-2.錫球短路:此圖為Ram顆粒之錫球短路之現象,角度為46 度

Solder ball short: This figure shows the phenomenon of the solder ball short of ram chip (PURPOSE)46-degree angle)

Form No.: 2-JQ-021-04,002

Trang 11

1-3 錫球短路:此圖莫約為85KV 及10 μA A 之環境下之圖示.KV 值過高易造成誤判

Solder ball short: This figure shows the condition under an environment with around 85KV and 10μA A A high KV value can easily lead to the misjudgment

1-4: 錫球偏移(PURPOSE)46 度角):因Mounter 機座標位置設定有偏差,錫膏雖有內聚力可將錫球拉回,但其偏差量過大且拉回之能力有限,故造成此現象,而該現象易形成空銲(PURPOSE)OPEN)及錫裂 (PURPOSE)Creak),未空焊時此偏移造成焊接面不足致強度較弱而影響該產品之可靠度

Solder ball shift (PURPOSE)46-degree angle): Though the cohesion of solder paste can pull back solder balls, the excess shift and limited pull-back ability still result this phenomenon when the mounter

coordinates settings contain shifts This phenomenon can lead to open and crack easily; when wetting exists, this shift will lead to insufficient soldering surface and lower strength and thus affect product reliability

Trang 12

non-1-5: 錫球偏移(PURPOSE)0 度角):於0 度角可檢測到內圈吃錫狀態

Solder ball shift (PURPOSE)0 degree): It is possible to inspect the inner ring soldering at 0 degree inclination

Form No.: 2-JQ-021-04,002

Trang 13

1-6: 錫球偏移(PURPOSE)0 度角檢測):可明確顯示其MOUNTER 機程式座標設定偏差過大,使用 KV 需較低之值即可得知

Solder ball shift (PURPOSE)0-degree inspection): Can clearly show the mounter coordinates program settings contain excess shifts It is possible to tell with a lower KV value

Trang 14

2.錫球遺失(SHORT): Missing Ball):

2-1:錫球LOSE(PURPOSE)0 度角):依據該圖示顯示,錫球週邊並無錫渣產生,無爆錫之疑慮,故應為原材之錫球並未值所造成,否則其週邊應有錫渣分怖其週圍

Missing ball (PURPOSE)0 degree): From this figure, it is clear that there is no solder flash around the specifiedsolder location The solder ball must therefore be missing, otherwise there would be traces of solder

Trang 15

2-2:錫球空焊:影像接收器移動至46 度角檢測,NG之錫球上方有一錫墊,此為PAD之錫墊,錫球未能與錫墊相連接(PURPOSE)Wetting),即為空焊(PURPOSE)Open)

Open solder joint: Move the image receiver to a 46-degree angle for inspection There is one pad, the solder pad of PAD, above the NG solder ball An open occurs when the solder ball is not wetted with the pad

Trang 16

2-3 錫球空焊:

Open solder joint:

Form No.: 2-JQ-021-04,002

Trang 17

2-4: 錫球空焊:

Open solder joint:

Trang 18

Form No.: 2-JQ-021-04,002

Trang 19

2-7: 錫球空焊:

Open solder joint:

Trang 20

2-8: SOCKET 空焊:

Socket open:

Form No.: 2-JQ-021-04,002

Trang 21

3.氣泡之檢測(SHORT): Void Inspection):

3-1.錫球氣泡(PURPOSE)Void):0 度角檢測,該氣泡過大至已無可靠度,可直接判斷為NG

Solder void: Under 0 degree inspection, if voids are too large to be reliable, the inspection result can

be defined as NG (PURPOSE)rejected)

Trang 22

3-2: 錫球氣泡(PURPOSE)Void):46 度角時檢測,氣泡之所在位置為錫球的上、中、下層,氣泡過大及過多,該產品之可靠度即越低

Solder ball void: When inspection is taken under a 46-degree angle, voids can be seen at the top, middle and bottom layers of solder ball Large voids or excess voids indicate lower product

reliability

本資料為啟碁科技股份有限公司專有之財產,非經書面許可,不准透露或使用本資料,亦不准複印,複製或轉變成其他形式使用

The Information contained herein is the exclusive property of WNC and shall not be distributed, reproduced, or disclosed in whole or in part without prior written permission of WNC.

Form No.: 2-JQ-021-04,002

Định dạng
Số trang	22
Dung lượng	3,27 MB