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Tiêu đề Directly Heated Negative Temperature Coefficients Thermistors – Part 1: General Specification
Chuyên ngành Electrical Engineering
Thể loại International Standard
Năm xuất bản 2016
Thành phố Geneva
Định dạng
Số trang 120
Dung lượng 2,18 MB

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Cấu trúc

  • 4.1 Units and symbols (22)
  • 4.2 Preferred values and appropriate category (22)
    • 4.2.1 General (22)
    • 4.2.2 Appropriate category (22)
  • 4.3 Marking (22)
    • 4.3.1 General (22)
    • 4.3.2 Marking for small size types such as surface mount thermistors (23)
    • 4.3.3 Coding (23)
  • 4.4 Quality assessment procedures (23)
  • 5.1 General (23)
  • 5.2 Standard atmospheric conditions for testing (23)
  • 5.3 Drying and recovery (24)
    • 5.3.1 Drying (24)
    • 5.3.2 Recovery (24)
  • 5.4 Mounting (for surface mount thermistors only) (24)
    • 5.4.1 General (24)
    • 5.4.2 Substrate and pad (24)
    • 5.4.3 Mounting on board (24)
  • 5.5 Visual examination and check of dimensions (25)
    • 5.5.1 Visual examination (25)
    • 5.5.2 Dimensions (26)
  • 5.6 Zero-power resistance (26)
    • 5.6.1 General (26)
    • 5.6.2 Measurement procedures (26)
    • 5.6.3 Requirements (26)
  • 5.7 B -value or resistance ratio (27)
    • 5.7.1 General (27)
    • 5.7.2 Requirements (27)
  • 5.8 Insulation resistance (for insulated types only) (27)
    • 5.8.1 General (27)
    • 5.8.2 Test methods (27)
    • 5.8.3 Applied voltage (29)
    • 5.8.4 Requirements (30)
  • 5.9 Voltage proof (for insulated types only) (30)
    • 5.9.1 General (30)
    • 5.9.2 Test voltage (30)
    • 5.9.3 Requirements (30)
  • 5.20 Free fall (39)
    • 5.20.1 General (39)
    • 5.20.2 Initial measurements (39)
    • 5.20.3 Test procedures (39)
    • 5.20.4 Final inspection, measurements and requirements (39)
  • 5.21 Thermal shock (39)
  • 5.22 Cold (40)
    • 5.22.1 General (40)
    • 5.22.2 Initial measurements (40)
    • 5.22.3 Test procedures (40)
    • 5.22.4 Final inspection, measurements and requirements (40)
  • 5.23 Dry heat (40)
    • 5.23.1 General (40)
    • 5.23.2 Initial measurements (40)
    • 5.23.3 Test procedures (41)
    • 5.23.4 Final inspection, measurements and requirements (41)
  • 5.24 Damp heat, steady state (41)
    • 5.24.1 General (41)
    • 5.24.2 Initial measurements (41)
    • 5.24.3 Test procedures (41)
    • 5.24.4 Recovery (42)
    • 5.24.5 Final inspection, measurements and requirements (42)
  • 5.25 Endurance (42)
    • 5.25.1 General (42)
    • 5.25.2 Endurance at room temperature with applied continuous maximum (42)
    • 5.25.3 Endurance at room temperature with applied cyclic maximum current ( I max25) (for inrush current-limiting thermistors only) (43)
    • 5.25.4 Endurance at T 3 and P max (44)
    • 5.25.5 Endurance at upper category temperature (45)
    • 5.25.6 Maximum permissible capacitance (for inrush current-limiting (45)
  • 5.26 Shear (adhesion) test (for surface mount thermistors only) (47)
    • 5.26.1 General (47)
    • 5.26.2 Test conditions (47)
    • 5.26.3 Requirements (47)
  • 5.27 Substrate bending test (for surface mount thermistors only) (48)
    • 5.27.1 General (48)
    • 5.27.2 Initial measurements (48)
    • 5.27.3 Test procedures (48)
    • 5.27.4 Final inspection and requirements (48)
  • 5.28 Component solvent resistance (48)
    • 5.28.1 General (48)
    • 5.28.2 Initial measurements (48)
    • 5.28.3 Test conditions (48)
    • 5.28.4 Requirements (49)
  • 5.29 Solvent resistance of marking (49)
    • 5.29.1 General (49)
    • 5.29.2 Test conditions (49)
    • 5.29.3 Requirements (49)
  • 5.30 Salt mist (49)
    • 5.30.1 General (49)
    • 5.30.2 Test conditions (49)
  • 5.31 Sealing (49)
  • 5.32 Composite temperature/humidity cycle (49)
    • 5.32.1 General (49)
    • 5.32.2 Initial measurements (49)
    • 5.32.3 Test conditions (50)
    • 5.32.4 Final inspection, measurements and requirements (50)
  • A.1 Clause and subclause numbers of IEC 6041 0:1 973 (51)
  • B.1 Drafting (52)
  • B.2 Reference standard (52)
  • B.3 Circulation (52)
  • C.1 Mounting for surface mount thermistors (53)
  • Q.1 General (56)
  • Q.2 Primary stage of manufacture (56)
  • Q.3 Structurally similar components (56)
  • Q.4 Qualification approval procedures (57)
    • Q.4.1 General (57)
    • Q.4.2 Test procedure for qualification approval (57)
    • Q.4.3 Maintenance of qualification approval (57)
  • Q.5 Quality conformance inspection (58)
  • Q.6 Certified test records of released lots (58)
  • Q.7 Delayed delivery (58)
  • Q.8 Release for delivery under qualification approval before the completion of (58)
  • Q.9 Alternative test methods (58)

Nội dung

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T hermistances à coef icient de température négatif à chauf age direct –

Partie 1: Spécification générique

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CONTENTS

FOREWORD 7

1 Sco e 9

2 Normative referen es 9

3 Terms an definition 10 4 General items 2

4.1 Units an s mb ls 2

4.2 Prefer ed values an a pro riate category 2

4.2.1 General 2

4.2.2 Ap ro riate category 2

4.3 Markin 2

4.3.1 General 2

4.3.2 Markin for smal size types s c as s rface mou t thermistors 21

4.3.3 Codin 21

4.4 Qual ty as es ment proced res 21

5 Test an me s rement proced res 21

5.1 General 21

5.2 Stan ard atmospheric con ition for testin 21

5.3 Dryin an recovery 2

5.3.1 Dryin 2

5.3.2 Recovery 2

5.4 Mou tin ( or s rface mou t thermistors only) 2

5.4.1 General 2

5.4.2 Substrate an p d 2

5.4.3 Mou tin on b ard 2

5.5 Vis al examination an c eck of dimen ion 2

5.5.1 Vis al examination 23 5.5.2 Dimen ion 2

5.6 Zero-p wer resistan e 24 5.6.1 General 2

5.6.2 Me s rement proced res 2

5.6.3 Req irements 2

5.7 B-value or resistan e ratio 2

5.7.1 General 2

5.7.2 Req irements 2

5.8 In ulation resistan e ( or in ulated typ s only) 2

5.8.1 General 2

5.8.2 Test method 2

5.8.3 Ap l ed voltage 2

5.8 4 Req irements 2

5.9 Voltage pro f ( or in ulated typ s only) 2

5.9.1 General 2

5.9.2 Test voltage 2

5.9.3 Req irements 28 5.10 Resistan e/emp rature c aracteristic 2

5.10.1 General 2

5.10.2 Test method 2

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5.1 Dis ip tion factor (δ) 2

5.1 1 General 2

5.1 2 Initial me s rements 2

5.1 3 Test method 2

5.1 4 Req irements 3

5.12 Thermal time con tant by ambient temp rature c an e (τ a ) 3

5.12.1 General 3

5.12.2 Initial me s rements 3

5.12.3 Precon itionin 31

5.12.4 Test method 31

5.12.5 Final me s rements an req irements 31

5.12.6 Req irements 31

5.13 Thermal time con tant by co l n afer self he tin (τ ) 31 5.13.1 General 31

5.13.2 Initial me s rements 31

5.13.3 Precon itionin 31

5.13.4 Test method 3

5.13.5 Final me s rements an req irements 3

5.14 Ro u tnes of termination (not a pl ca le to s rface mou t thermistors) 3

5.14.1 General 3

5.14.2 Initial me s rements 3

5.14.3 Test method 3

5.14.4 Test Ua 1 – Ten ie 3

5.14.5 Test Ub – Ben in (half the n mb r of termination ) 3

5.14.6 Test Uc – Torsion (remainin termination ) 3

5.14.7 Final me s rements an req irements 3

5.15 Resistan e to solderin he t 3

5.15.1 General 3

5.15.2 Precon itionin 3

5.15.3 Test proced re 3

5.15.4 Recovery 3

5.15.5 Final in p ction, me s rement an req irements 3

5.16 Soldera i ty 3

5.16.1 General 3

5.16.2 Test proced re 3

5.16.3 Final in p ction, me s rements an req irements 3

5.17 Ra id c an e of temp rature 3

5.17.1 General 3

5.17.2 Initial me s rements 35 5.17.3 Test proced res 3

5.17.4 Final in p ction, me s rements an req irements 3

5.18 Vibration 3

5.18.1 General 3

5.18.2 Initial me s rements 36 5.18.3 Test proced res 3

5.18.4 Final in p ction, me s rements an req irements 3

5.19 Shock 3

Trang 6

5.19.2 Initial me s rements 3

5.19.3 Mou tin 3

5.19.4 Test proced res 3

5.19.5 Final in p ction, me s rements an req irements 3

5.2 Fre fal 3

5.2 1 General 3

5.2 2 Initial me s rements 3

5.2 3 Test proced res 3

5.2 4 Final in p ction, me s rements an req irements 3

5.21 Thermal s ock 37 5.21.1 General 3

5.21.2 Initial me s rements 3

5.21.3 Test proced res 3

5.21.4 Final in p ction, me s rements an req irements 3

5.2 Cold 3

5.2 1 General 3

5.2 2 Initial me s rements 3

5.2 3 Test proced res 3

5.2 4 Final in p ction, me s rements an req irements 3

5.2 Dry he t 3

5.2 1 General 3

5.2 2 Initial me s rements 3

5.2 3 Test proced res 3

5.2 4 Final in p ction, me s rements an req irements 3

5.2 Damp he t, ste d state 3

5.2 1 General 3

5.2 2 Initial me s rements 3

5.2 3 Test proced res 3

5.2 4 Recovery 4

5.2 5 Final in p ction, me s rements an req irements 4

5.2 En uran e 4

5.2 1 General 4

5.2 2 En uran e at ro m temp rature with a pl ed contin ou maximum c r ent (I max2 ) ( or inru h c r ent l mitin thermistors only) 4

5.2 3 En uran e at ro m temp rature with a pl ed c cl c maximum c r ent (I max2 ) ( or inru h c r ent l mitin thermistors only) 41

5.2 4 En uran e at T 3 an P max 4

5.2 5 En uran e at up er category temp rature 4

5.2 6 Maximum p rmis ible ca acitan e ( or inru h c r ent l mitin thermistors only) 4

5.2 She r (ad esion) test ( or s rface mou t thermistors only) 45 5.2 1 General 4

5.2 2 Test con ition 4

5.2 3 Req irements 4

5.2 Substrate b n in test ( or s rface mou t thermistors only) 4

5.2 1 General 4

5.2 2 Initial me s rements 46 5.2 3 Test proced res 4

5.2 4 Final in p ction an req irements 4

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5.2 1 General 4

5.2 2 Initial me s rements 4

5.2 3 Test con ition 4

5.2 4 Req irements 4

5.2 Solvent resistan e of markin 4

5.2 1 General 4

5.2 2 Test con ition 4

5.2 3 Req irements 4

5.3 Salt mist 4

5.3 1 General 4

5.3 2 Test con ition 4

5.31 Se l n 4

5.3 Comp site temp rature/h midity c cle 4

5.3 1 General 4

5.3 2 Initial me s rements 47 5.3 3 Test con ition 4

5.3 4 Final in p ction, me s rements an req irements 4

An ex A (normative) Interpretation of sampl n plan an proced res as des rib d in IEC 6 410:19 3 for u e within q al ty as es ment s stems 49 A.1 Clau e an s bclau e n mb rs of IEC 6 410:19 3 4

An ex B (normative) Rules for the pre aration of detai sp cification for directly he ted thermistors for electronic eq ipment for u e within q al ty as es ment s stems 5

B.1 Drafin 5

B.2 Referen e stan ard 5

B.3 Circ lation 5

An ex C (informative) Typical examples of mou tin s for me s rements of directly he ted thermistors 51

C.1 Mou tin for s rface mou t thermistors 51

An ex D (informative) Referen e to IEC 6 5 9-1:2 0 5

An ex Q (normative) Qual ty as es ment proced res 5

Q.1 General 5

Q.2 Primary stage of man facture 54 Q.3 Stru tural y simi ar comp nents 5

Q.4 Qual fication a proval proced res 5

Q.4.1 General 5

Q.4.2 Test proced re for q al fication a proval 5

Q.4.3 Maintenan e of q al fication a proval 5

Q.5 Qual ty conforman e in p ction 5

Q.6 Certified test record of rele sed lots 5

Q.7 Delayed delvery 5

Q.8 Rele se for del very u der q al fication a proval b fore the completion of group B tests 5

Q.9 Alternative test method 56 Q.10 Un heck d p rameters 5

Bibl ogra h 5

Fig re 1 – Typical resistan e- emp rature c aracteristic for NTC thermistors 13

Fig re 2 – Decre sed p wer dis ip tion c rve 15

Trang 8

Fig re 4 – Basic circ it for zero-p wer resistan e me s rement 2

Fig re 5 – Example of Method 1 for testin the in ulation resistan e 2

Fig re 6 – Example of Method 2 for testin the in ulation resistan e (1) 2

Fig re 7 – Example of Method 2 for testin the in ulation resistan e (2) 2

Fig re 8 – Example of Method 3 for testin the in ulation resistan e 2

Fig re 9 – Example of Method 4 for testin the in ulation resistan e 2

Fig re 10 – Example of test c amb r 2

Fig re 1 – Dis ip tion factor me s rin circ it 3

Fig re 12 – Thermal time con tant me s rin circ it 3

Fig re 13 – En uran e at ro m temp rature with I max2 evaluatin circ it 41

Fig re 14 – Maximum p rmis ible ca acitan e test circ it (Method 1) 4

Fig re 15 – Maximum p rmis ible ca acitan e test circ it (Method 2) 4

Fig re C.1 – Mou tin for me s rements of s rface mou t thermistors 5

Ta le 1 – L wer an up er category temp ratures an d ration of the damp he t, ste d state test 2

Ta le 2 – Ten i e force 3

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memb rs of its te h ic l c mmite s a d IEC Natio al Commite s for a y p rso al injury, pro erty d ma e or

oth r d ma e of a y n ture wh tso v r, wh th r dire t or in ire t, or for c sts (in lu in le al fe s) a d

e p nses arisin o t of th p blc tio , use of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Use of th refere c d p blc tio s is

in isp nsa le for th c re t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t some of th eleme ts of this IEC Pu lc tio ma b th su je t of

p te t rig ts IEC sh l n t b h ld resp nsible for id ntifyin a y or al su h p te t rig ts

International Stan ard IEC 6 5 9-1 has b en pre ared by IEC tec nical commit e 4 :

Ca acitors an resistors for electronic eq ipment

This third edition can els an re laces the secon edition publ s ed in 2 0 This edition

con titutes a tec nical revision Ta les, fig res an referen es have b en revised

The text of this stan ard is b sed on the fol owin doc ments:

Ful information on the votin for the a proval of this stan ard can b fou d in the re ort on

Trang 10

This publcation has b en drafed in ac ordan e with the ISO/IEC Directives, Part 2.

A l st of al p rts in the IEC 6 5 9 series, publs ed u der the general title D ire cty h ated

n g tv temp erature co ficie t th rmistors, can b fou d on the IEC we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site un er "htp:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

• amen ed

Trang 11

DIRECTLY HEATED NEGATIVE TEMPERATURE

COEFFICIENT THERMISTORS –

Part 1: Generic specification

This p rt of IEC 6 5 9 is a pl ca le to directly he ted negative temp rature co ficient

thermistors, typical y made from tran ition metal oxide materials with semicon u tin

pro erties

It esta l s es stan ard terms, in p ction proced res an method of test for u e in sectional

an detai sp cification of electronic comp nents for q al ty as es ment or an other

purp se

The folowin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le for its a pl cation For dated referen es, only the edition cited a pl es For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 0 2, Markin code s forre sistors a d cap aciors

IEC 6 0 8-1:2 13, En iro me tal te stn – Part 1: G e neral a d gu ida ce

IEC 6 0 8-2-1, En iro me tal testn – Part 2-1: Tests – Tests A: Cold

IEC 6 0 8-2-2, En iro me tal te stn – Part 2-2: Te sts – Te sts B: Dry h at

IEC 6 0 8-2-6, En iro me tal testn – Part 2-6: Tests – Test Fc: Vib rato (sinusoidal

IEC 6 0 8-2-1 , Basic e viro me tal te stn procedures – Part 2-1 : Tests – Test Ka: Sal

mist

IEC 6 0 8-2-14, En iro me tal testn – Part 2-14: Tests – Test N: Ch nge of tem p erature

IEC 6 0 8-2-17, Basic e nviro me ntal te stn p rocedure s – Part 2-17: Tests – Te st Q: Se ln

IEC 6 0 8-2-2 , En iro me tal te stn – Part 2-20: Tests – Test T: Test meth ds for

solderab il y a d resista ce to solderin h at of de vice s wih le ds

IEC 6 0 8-2-21, En iro me tal te stn – Part 2-21: Tests – Te st U: Rob ustne ss of

termin to s a d integral mou ntn de ices

IEC 6 0 8-2-2 , En iro me taltestn – Part 2-27: Te sts – Te st Ea a d guida ce: Sh ck

IEC 6 0 8-2-31, En iro me tal testn – Part 2-31: Te sts – Te st Ec: Rou gh h ndln sh cks,

p rimariy for e u ip me t ty e sp e cime s

IEC 6 0 8-2-3 , En iro me tal testn – Part 2-38: Te sts – Test Z/AD : Comp sie

Trang 12

IEC 6 0 8-2-4 :19 0, Basis En iro me tal testn procedure s – Part 2-4 : Te sts – Te st XA

a d guida ce: Immersio in cle nin solv nts

IEC 6 0 8-2-4 :19 0/AMD1:19 3

IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Tests – Test Kb : Sal mist, cyclc (sodiu m

chloride solutio )

IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Te sts – Te st Ta: Solderab il y te stn of

ele ctro ic comp n nts b y th wetin b ala ce meth d

IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Tests – Test Td: Test meth ds for

solderab il y, re sista ce to dis olu tio of metal zato a d to solderin h at of surface

mou ntn de vice s (SMD)

IEC 6 0 8-2-6 , En iro me tal testn – Part 2-69: Te sts – Te st Te: Solderab il y te stn of

ele ctro ic comp n nts for su rface mountn de ices (SMD) b y th wet n b ala ce meth d

IEC 6 0 8-2-7 , En iro me tal testn – Part 2-78: Tests – Test Cab : Damp h at, ste dy

state

IEC 6 2 4, Me sureme nt of th dime sio s of a cylndrical comp on nt wih a ial te rm in to s

IEC 61 9 -2, Qual y as es me t systems – Part 2: Selecto a d use of samp lin p la s for

inspe cto of electro ic comp on nts a d p ck g s

IEC 6 717, Meth d for th determin to of th sp ace re uired b y cap aciors a d re sistors

wih u nidirecto al termin to s

IEC 612 9-2-7, Materials for p rinted b oards a d othe r interco n ctng structures – Part 2-7:

Reinforced b ase mate rials clad a d u nclad – Ep xide wo e E-glas lamin te d she et of

define d flammab il y (v rtcal b u rnin test, cop pe r-clad

3 Terms and definitions

For the purp ses of this doc ment, the fol owin terms an definition a ply

3.1

type

group of prod cts havin simiar desig fe tures man factured by the same tec niq es an

fal n within the man facturer's u ual ran e of ratin s for these prod cts

Note 1 to e try: Mo ntin a c s ories are ig ore , pro id d th y h v n sig ific nt efe t o th test results

Note 2 to e try: Ratin s c v r th c mbin tio of

– ele tric l ratin s,

Trang 13

3.3

thermistor

thermaly sen itive semicon u tin resistor whose primary fu ction is to ex ibit an imp rtant

c an e in electrical resistan e with a c an e in b d temp rature

3.4

ne ativ temperature coef icie t thermistor

NTC thermistor

thermistor in whic the resistan e decre ses with in re sin temp rature

Note 1 to e try: In g n ral th term 'NTC th rmistor' is use

3.5

dire tly he te ne ativ temperature coef icie t thermistor

thermistor whic o tain its resistan e variation by the c an es of ph sical con ition

Note 1 to e try: Ph sic l c n itio s in lu e th c re t thro g th th rmistor, ambie t temp rature, h midity,

win v lo ity, g s, etc

3.6

indire tly h ate ne ativ temperature coef icie t thermistor

thermistor whic o tain its resistan e variation primari y by the c an e of temp rature of the

thermistor, d e to the c an e of a c r ent throu h a se arate he ter whic is in close contact

with, but electricaly in ulated from, the thermistor element

Note 1 to e try: Th temp rature of th th rmistor c n also b c a g d b th c a g s of p ysic l c n itio s

su h as c re t thro g th th rmistor eleme t itself, ambie t temp rature, h midity, win v lo ity, g s, etc

Note 2 to e try: This term is for informatio o ly

3.7

positiv temperature coef icie t th rmistor

PTC thermistor

thermistor in whic the resistan e in re ses with in re sin temp rature

Note 1 to e try: In g n ral th term 'P C th rmistor' is use

Note 2 to e try: Thisterm is for informatio o ly

3.8

thermistor with wire terminations

thermistor provided with wire termination

3.9

thermistor without wire terminations

thermistor provided only with two metal zed faces, to b u ed as electrical contacts

Note 1 to e try: This term is for informatio o ly

3.10

ins late thermistor

thermistor co ted with materials s c as resin, glas or ceramic, ca a le of me tin the

req irements of the in ulation resistan e an voltage pro f tests when sp cified in the test

s hed le

3.1

non-ins late thermistor

thermistor with or without co tin materials for s rfacin of elements but not inten ed to me t

the req irements of the in ulation resistan e an voltage pro f tests when sp cified in the

Trang 14

3.12

s rfa e mount thermistor

thermistor whose smal dimen ion an nature or s a e of termination ma e it s ita le for

u e in h brid circ its an on printed b ard

thermistor for s n ing

thermistor whic resp n s to temp rature c an es an therefore is u ed for temp rature

<inru h c r ent l mitin thermistors> value of the d.c resistan e of a thermistor when its

thermal sta i ty is re c ed with the maximum c r ent p s in

Note 1 to e try: This term is for informatio o ly

3.17

ma imum permis ible c pa ita c

<inru h c r ent lmitin thermistors> maximum p rmis ible ca acitan e value of a ca acitor

whic can b con ected to a thermistor u der lo din

3.18

zero-power re ista c

R

T

value of the d.c resistan e of a thermistor, when me s red at a sp cified temp rature, u der

s c con ition that the c an e in resistan e d e to the internal generation of he t is

negl gible with resp ct to the total er or of me s rement

3.19

nominal zero-p wer re ista c

nominal value of zero-p wer resistan e at the stan ard referen e temp rature of 2 °C,

u les otherwise sp cified

3.2

re ista c -temperature c ara teristic

relation hip b twe n the zero-p wer resistan e an the b d temp rature of a thermistor

Note 1 to e try: Ty ic l resista c - emp rature c ara teristic for NTC th rmistors is sh wn in Fig re 1

Trang 15

NOT Slg tly d wnward c n e e c rv wh n th temp rature ra g is larg

Figure 1 – Typic l re ista c -temperature c ara teristic for NTC thermistors

Note 2 to e try: Th resista c law folows a pro imately th formula:

ae

TTB

RR

B is th th rmal se sitivity in e (se 3.2 )

This formula is o ly a plc ble for re rese tin th resista c v riatio o er a restricte temp rature ra g For

more pre ise re rese tatio of th R/T-c rv , a resista c /emp rature relatio sh uld b sp cifie in ta ulate

form in th d tai sp cific tio

3.21

re ista c ratio

ratio of the zero-p wer resistan e of a thermistor me s red at the referen e temp rature of

2 °C to that me s red at 8 °C, or at s c other p irs of temp ratures as may b pres rib d

b– T

a)] × ln(R

a/R

b)

R

b

is the zero-p wer resistan e (Ω) at temp rature T

b (K)

Note 1 to e try: Th B-v lu c n alsob e pres e b th folowin formula (c mmo lo arithm)

B = 2,3 3× [ T

a

×T

b) T

b– T

a) × lo (R

a/R

b)

Note 2 to e try: Th prefer e v lu s for T

a

a d T

b

are 2 8,15 K a d 3 8,15 K, resp ctiv ly Th se v lu s are

e uiv le t to + 5 °C a d + 5 °C, resp ctiv ly

Note 3 to e try: Wh re th d tai sp cific tio prescrib s th t th B-v lu sh uld b me sure at oth r

temp ratures, th sp cifie v lu s (in k lvins) sh l b use for T

b

T (K)

Trang 16

zero-power temperature coef icie t of re ista c

α

T

ratio at a sp cified temp rature (T) of the rate of c an e of zero-p wer resistan e with

temp rature to the zero-p wer resistan e of the thermistor, expres ed by the formula

α

T

= (1/R

T) × (dR

T/dT) × 10

c te ory temperature ra g

ran e of ambient temp ratures for whic the thermistor has b en desig ed to o erate

contin ou ly at zero-p wer, defined by the temp rature l mits of the a pro riate category

Note 1 to e try: This term is for informatio o ly

3.2

upper c te ory temperature,

T

ma

maximum ambient temp rature for whic a thermistor has b en desig ed to o erate

contin ou ly at zero-p wer

3.2

lower c te ory temperature

T

min

minimum ambient temp rature for whic a thermistor has b en desig ed to o erate

contin ou ly at zero-p wer

3.2

stora e temperature ra g

ran e of ambient temp ratures for whic a thermistor can b stored contin ou ly u der n

o-lo d con ition

Note 1 to e try: This term is for informatio o ly

3.2

de re s d power dis ipation c rv

<al ex e t inru h c r ent l mitin thermistors> c rve that expres es the relation b twe n the

ambient temp rature an the maximum p wer dis ip tion P

a T

Note 1 to e try: This relatio is usu ly e pres e asin Fig re2 a)or, altern tiv ly, as in Fig re 2 b)

Trang 17

a) Curv a

b) Curv b

Figure 2 – De re s d p wer dis ipation c rv

Note 2 to e try: This term is for informatio o ly

3.2

ma imum power dis ipation at rate ambie t temperature

P

ma T

maximum value of the p wer dis ip tion whic can b contin ou ly a pl ed to the thermistor

at the rated ambient temp rature T

R

d cre se ln arly to zero at a temp rature T

IEC T

Trang 18

R

TTTT

PP

TT

Rmama

TTTT

PP

TT

e u l to th lower c te ory temp rature T

min.(°C) or hig er;

= 5 °C, u les oth rwise sp cifie in th

d tai sp cific tio ;

T

4

is th temp rature (°C) sp cifie in th d tai sp cific tio , a o e whic zero-p wer sh l b a ple T

4is

e u l to, or lower th n, th u p r c te ory temp rature T

max(°C)

Note 2 to e try: Curv b (se Fig re 2 b) in 3.2 )

Th ma imum p wer dis ip tio is c nsta t b twe n temp rature T

2

a d T

3 T

2

= 0 °C, u les oth rwise sp cifie

in th d tai sp cific tio Wh n th temp rature e c e s T

3, th p wer dis ip tio must b d cre se ln arly to

zero at a temp rature T

4

Th ma imum p wer dis ip tio at ambie t temp rature T in g n ral isc lc late as folows:

Th ma imum p wer dis ip tio c n b e pres e b th folowin formula:

mama

R

TTTT

PP

TT

e u l to, or lower th n th u p r c te ory temp rature T

max(°C)

Note 3 toe try: This term is for informatio o ly

3.31

ma imum c r e t at ambie t temperature of 2 °C

I

ma 2

<inru h c r ent l mitin thermistors> maximum value of c r ent (d.c or r.m.s values for Sine

wave s a ed a.c.) whic can b contin ou ly a pl ed to the thermistor at an ambient

temp rature of 2 °C

Note 1 to e try: Th ma imum p wer dis ip tio at ambie t temp rature of 2 °C (P

ax2) is c lc late b

Trang 19

a d T

3th

c re t is c nsta t Wh n th temp rature e c e s T

3, th c re t must b d cre se ln arly to zero at a

2mama

TTTT

II

2mama

TTTT

II

Trang 20

temp rature T

max(°C)or lower

Note 2 to e try: Curv d (se Fig re 3 b) in 3.31)

Th ma imum c re t is c nsta t b twe n temp rature T

2

a d T

3 T

2

= 0 °C, u les oth rwise sp cifie in th

d tai sp cific tio

Wh n th temp rature e c e s T

3, th c re t sh l b d cre se ln arly to zero at a

2mama

TTTT

II

Note 3 to e try: This term is for informatio o ly

3.3

dis ipation fa tor

δ

p wer dis ip tion req ired for a thermistor to raise its temp rature by 1 K an whic is

generaly the ratio of the p wer dis ip tion c an e to the res ltin thermistor b d

temp rature c an e at a sp cified ambient temp rature

3.3

re p ns time

time req ired for a thermistor to c an e its temp rature b twe n two defined con ition when

s bjected to a c an e in ambient temp rature, p wer or a combination of temp rature an

p wer

Note 1 to e try: Resp nse time me sure in se o ds

Note 2 to e try: Be a se of th impra tic bi ty to me sure resp nse time dire t, two meth ds are d fin d to

me sure th th rmal time c nsta t dire t

Note 3 to e try: This term is for informatio o ly

Note 1 to e try: τ is me sure in se o ds

Note 2 to e try: Ste c a g a d me ium are sp cifie in th d tai sp cific tio

Trang 21

he t c pa ity

C

th

energ the thermistor ne d to raise 1 K in temp rature

Note 1 to e try: Th h at c p city is me sure in jo les a d is c lc late b th folowin formula:

Note 2 toe try: He t c p city is c mpletely d termin d b th c mp n nt d sig

Note 3 toe try: This term is for informatio o ly

3.3

volta e c r e t c ara teristic

relation hip b twe n the voltage (d.c a.c r.m.s.) acros the thermistor an the a pl ed

ste d -state c r ent when the thermistor re c es a thermal eq i brium con ition in sti air or

in the sti medium sp cified in the detai sp cification, at 2 °C or at the temp rature

er or d e to the internal generation of he t (self he tin ) of the thermistor, whic can b

contin ou ly a pled to the thermistor in its practical u e

Note 1 to e try: Unles oth rwise sp cifie in th d tai sp cific tio , ∆T is e u l to 1 K Th relatio ship amo g

TT

RT

RU

TT

is th ma imum o eratin p wer for lmite self h atin ;

δ is th dis ip tio fa tor;

∆T is th temp rature rise of th th rmistor d e to its intern l g n ratio of h at

is th v lu of resista c at temp rature T

Note 2 to e try: This term is for informatio o ly

Trang 22

4 General items

4.1 Units a d s mbols

Units, gra hical s mb ls, leter s mb ls an terminolog s ould, whenever p s ible, b ta en

from the folowin International Stan ard :

– IEC 6 0 7-1;

– IEC 6 0 0;

– IEC 6 617;

– ISO 8 0 0-1:2 0

When further items are req ired, they s ould b derived in ac ordan e with the prin iples of

the International Stan ard l sted a ove

4.2 Prefer e v lu s a d appropriate c te ory

Prefer ed cl matic categories only s al b given in the prefer ed values

4.2.2 Appropriate c te ory

The thermistors covered by this p rt of IEC 6 5 9 are clas ified into cl matic categories

ac ordin to the general rules given in IEC 6 0 8-1:2 13, An ex A

The up er an lower category temp ratures an the d ration of the damp he t, ste d state

test s al b selected from Ta le 1

Table 1 – L wer a d up er c te ory temperature a d d ration of

a) nominal zero-p wer resistan e;

b) man facturer's name an /or trade mark;

c) date of man facture;

d) toleran e on nominal zero-p wer resistan e;

Trang 23

The p ck gin containin the thermistor(s) s al b cle rly mark d with al the information

l sted a ove

An ad itional markin s al b so a pl ed that no confu ion can arise

4.3.2 Marking for smal size type s c a s rfa e mou t thermistors

Smal size typ s s c as s rface mou t thermistors are general y not mark d on the b d If

some markin can b a pl ed, smal size typ s s al b cle rly mark d with as man as

p s ible of the a ove items as is con idered u eful An d pl cation of information in the

markin on the thermistor s ould b avoided

4.3.3 Coding

Where codin for resistan e value, toleran e or date is u ed, the method s al b one

selected from those given in IEC 6 0 2

4.4 Qual ty a s s me t proc dure

Se An ex Q

The sectional an /or blank detai sp cification s al contain ta les s owin the tests to b

p rformed, whic me s rements are to b made b fore an af er e c test or s bgroup of

tests, an the seq en e in whic they s al b car ied out The stages of e c test s al b

car ied out in the order writen The me s rin con ition s al b the same for initial an

final me s rements

If national sp cification within an q al ty as es ment s stem in lu e method other than

those sp cified in the sectional an /or blank detai sp cification , they s al b ful y des rib d

5.2 Sta dard atmosph ric conditions for te ting

Unles otherwise sp cified, al tests an me s rements s al b made u der stan ard

atmospheric con ition for testin as given in IEC 6 0 8-1:2 13, 4.3:

– temp rature: 15 °C to 3 °C;

– relative h midity: 2 % to 7 %;

– air pres ure: 8 kPa to 10 kPa

Before the me s rements are made, the thermistor s al b stored at the me s rin

temp rature for a time s f icient to al ow the entire thermistor to re c this temp rature The

same p riod as is pres rib d for recovery at the en of a test is normaly s f icient for this

purp se

Durin me s rements, the thermistor s al not b exp sed to drau hts, direct s n-ray or

other influen es lk ly to cau e er or

When me s rements are made at a temp rature other than the sp cified temp rature, the

res lts s al , when neces ary, b cor ected to the sp cified temp rature The ambient

temp rature d rin the me s rements s al b stated in the test re ort

When tests are con u ted in a seq en e, the final me s rements of one test may b ta en as

Trang 24

5.3 Drying a d re ov ry

5.3.1 Dryin

Where dryin is cal ed for in the sp cification, the thermistor s al b con itioned b fore

me s rement is made, u in proced re 1 or proced re 2 as caled for in the detai

The thermistor s al then b alowed to co l in a desic ator u in a s ita le desic ant,

s c as activated alumina or si ca gel, an s al b k pt therein from the time of removal

from the oven to the b gin in of the sp cified tests

5.3.2 Re ov ry

Unles otherwise sp cified, recovery s al ta e place u der the stan ard atmospheric

con ition for testin (5.2) If recovery has to b made u der closely control ed con ition , the

controled recovery con ition of IEC 6 0 8-1:2 13, 4.4.2, s al b u ed

5.4 Mounting ( or s rfa e mount th rmistors only)

Surface mou t thermistors s al b fixed on to the printed wirin b ard with wave solderin or

reflow solderin as sp cified in 5.4.2 an 5.4.3

5.4.2 Substrate a d pa

The printed wirin b ard that mou t the thermistors s al fulfi the folowin req irements

a) The s bstrate material s al normaly b a 1,6 mm thick e oxide woven glas fa ric

laminated printed b ard (as defined in IEC 612 9-2-7) or a 0,6 5 mm alumina s bstrate

an s al not afect the res lt of an test or me s rement The detai sp cification s al

in icate whic material is to b u ed for the electrical me s rements

b) The s bstrate s al have metal zed lan are s of pro er sp cin to p rmit mou tin of

s rface mou t thermistors an s al provide electrical con ection to the s rface mou t

thermistor terminals The detai s s al b sp cified in the detai sp cification

If another method of mou tin a pl es, the method s al b cle rly sp cified in the detai

5.4.3.2 Solder bath method

When the detai sp cification sp cifies wave solderin , the fol owin mou tin proced re

a pl es

a) Smal dots of the glue s al b a pl ed b twe n the con u tors of the s bstrate by me n

Trang 25

b) The s rface mou t thermistors s al b placed on the dots u in twe zers To en ure that

no glue is a pl ed to the con u tors, the s rface mou t thermistors s al not b moved

a out

c) The s bstrate with the s rface mou t thermistors s al b he t tre ted in an oven at

10 °C for 15 min

d) The s bstrate s al b soldered in a wave-solderin a p ratu The a p ratu s al b

adju ted to have a pre-he tin temp rature of 8 °C to 13 °C, a solder b th at

2 0 °C ± 5 °C an a solderin time of 5 s ± 0,5 s

The solderin o eration s al b re e ted on e ( wo c cles in total)

IEC 6 0 8-2-4 :19 0/AMD1:19 3, 3.1.2)

5.4.3.3 Reflow method

When the detai sp cification sp cifies reflow solderin , the fol owin mou tin proced re

a pl es

a) The solder u ed in preform or p ste form s al b si ver b arin (2 % minimum) eutectic

Sn/Pb solder together with a non-activated flux as stated in IEC 6 0 8-2-2 Alternative

solders s c as 6 /4 or 6 /3 may b u ed on s rface mou t thermistors the

con tru tion of whic in lu es solder le c b r iers The Pb- re solder u ed in preform or

p ste form s al b Sn9 ,5-Ag3,0-Cu0,5 or derivative solder together with a flu as stated

in IEC 6 0 8-2-5

b) The s rface mou t thermistor s al then b mou ted as fol ows

1) Mou t the preform solder on the lan with an a pro riate method

2) Ap ly the solder p ste on the lan with an a pro riate method Set the thermistor in

b twe n the lan p rt of the printed wirin b ard If u in the preform solder, a ply

flu to the solderin p rt with an a pro riate method

c) The s bstrate s al then b placed in or on a s ita le he tin s stem (molten solder, hot

plate, tu nel oven, etc.) The temp rature of the u it s al b maintained b twe n 215 °C

an 2 0 °C, u ti the solder melts an reflows formin a homogene u solder b n , but

for not lon er than 10 s

d) Flu s al b removed by a s ita le solvent (se IEC 6 0 8-2-4 :19 0/AMD1:19 3, 3.1.2)

Al s bseq ent han ln s al b s c as to avoid contamination Care s ould b ta en to

maintain cle nl nes in test c amb rs an d rin p st test me s rements

e) In the case of u in reflow solderin , the fol owin a ply

1) The detai sp cification may req ire a more restricted temp rature ran e

2) If va our phase solderin is a pl ed, the same method may b u ed with the

temp ratures ada ted

5.5 Vis al e amination a d c e k of dime sion

5.5.1 Vis al e amination

5.5.1.1 Ge eral

The con ition, workman hip an finis s al b satisfactory as determined by vis al

examination

5.5.1.2 Marking

Markin s al b legible as determined by vis al examination

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5.5.2 Dime sions

5.5.2.1 Ga gin

The dimen ion in icated in the detai sp cification as b in s ita le for gau in s al b

c eck d an s al comply with the values pres rib d in the detai sp cification

Where a pl ca le, me s rements s al b made in ac ordan e with IEC 6 2 4 or IEC 6 717

5.5.2.2 Detai

Al dimen ion pres rib d in the detai sp cification s al b c eck d an they s al comply

with the values pres rib d

5.6 Zero-p wer re ista c

The zero-p wer resistan e s al b me s red at the temp rature given in the detai

sp cification

5.6.2 Me s reme t proc dure

The thermistors s al b s bjected to the proced res of the zero-p wer resistan e as fol ows

a) The thermistors s al b mou ted by their normal me n in cor osion-resistant cl ps on a

mou tin plate made of an a pro riate in ulatin material

b) The thermistors s al then b de ply in erted into a me s rement b th containin a non

-cor osive an non-red cin medium, close to the thermometer an for a len th of time

ne ded to re c a sta le re din of the zero-p wer resistan e

c) The zero-p wer resistan e s al b me s red ac ordin to the b sic circ it of Fig re 4

d) Implementation al me s rements s al b made without self he tin of the devices

(zero-p wer con ition)

The total er or of me s rement of p wer dis ip tion, temp rature toleran e an the er or of

the me s rin eq ipment s al not ex e d 10 % of the toleran e sp cified in the detai

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5.7 B-v lue or re ista c ratio

Calc late the B-value (se 3.2 ) or the resistan e ratio (se 3.21) u in zero-p wer

resistan e values me s red at 2 °C an 8 °C (or at s c other p irs of temp ratures as

may b pres rib d in the detai sp cification) u in the method sp cified in 5.6

5.7.2 Re uireme ts

The B-value or the resistan e ratio s al b within the sp cified toleran e

5.8 Ins lation re ista c ( or in ulate type only)

The in ulation resistan e of the protective co tin s al b me s red as sp cified in the detai

sp cification The exp sed electrode of the thermistor an the other p le s al b a s ficient

distan e from e c other so as not to b s ort circ ited directly

5.8.2 Te t methods

Ac ordin to the in tru tion given in the detai sp cification, one of the fol owin test

method is u ed

a) Method 1

The non-in ulated p rts of the thermistor s al b wra p d in a go d in ulatin material

The thermistor is placed in a ves el containin metal c b l s of 1,6 mm ± 0,2 mm diameter

or 1,0 mm ± 0,2 mm diameter, so that only the metal zed p rt is immersed The metal of

the b l s s al b s c that it do s not develo a resistive s rface

An example of Method 1 is s own in Fig re 5

An example of Method 2 is s own in Fig res 6 an 7

An electrode is immersed in the solution

IEC

Th rmistor u d r test

Metal c b ls

Trang 28

Figure 6 – Ex mple of Method 2 for te tin the in ulation re ista c (1)

Figure 7 – Ex mple of Method 2 for te tin the in ulation re ista c (2)

c) Method 3

A metal foi s al b wra p d closely arou d the b d of the thermistor

For those typ s not havin axial termination , a sp ce of 1 mm to 1,5 mm s al b lef

b twe n the ed e of the foi an e c termination For those typ s havin axial

termination , the foi s al b wra p d rou d the whole b d of the thermistor protru in

by at le st 5 mm from e c en , provided that the minimum sp ce of 1 mm b twe n the

foi an the termination can b maintained The en s of the foi s al not b folded over the

Insulatio -resista c meter

Th rmistor u d r test

Insulatio - esista ce meter

Wa ter (≤10 Ω • m)

Water-a sorbin material

Trang 29

D ime sio s in mi imetres

Figure 8 – Ex mple of Method 3 for te ting the ins lation re istan e

d) Method 4

The thermistor s al b clamp d in the trou h of a 9 ° metal c V-block of s c a size that

the thermistor b d do s not exten b yon the extremities of the block

The clampin force s al b s c as to maintain adeq ate contact b twe n the thermistor

an the block

The thermistor s al b p sitioned in the V-block in ac ordan e with the fol owin

– For c l n rical thermistors: the thermistor s al b p sitioned in the block so that the

termination furthest from the axis of the thermistor is ne rest to one of the faces of the

block

– For rectan ular thermistors: the thermistor s al b p sitioned in the block so that the

termination ne rest to the ed e of the thermistor is ne rest to one of the faces of the

block

– For c l n rical an rectan ular thermistors with axial le d : an out of centre

p sitionin of the p int of emergen e of the termination from the b d s al b

ig ored

An example of Method 4 is s own in Fig re 9

Figure 9 – Ex mple of Method 4 for te ting the ins lation re istan e

e) Method 5

The thermistor s al b clamp d b twe n metal plates The clampin force s al b s c

as to maintain adeq ate contact b twe n the thermistor an the plates

Trang 30

con ected together as one p le an the metal c b l s, the water (≤10 Ω·m), metal foi ,

V-block, metal plates or ac es ory as the other p le

The voltage s al b a pl ed for 1 min, or for s c s orter time as is neces ary to o tain a

sta le re din , the in ulation resistan e b in re d at the en of that p riod

5.8.4 Re uireme ts

When thermistors are meas red as sp cified, the in ulation resistan e s al b not les than

the a pro riate fig re sp cified in the detai sp cification

5.9 Volta e proof ( or ins late type only)

The thermistors are tested as sp cified in 5.9.2 As req ired by the detai sp cification One of

the test method given in 5.8.2 s al b u ed

5.9.2 Te t volta e

The a pled voltage s al b that sp cified in the a pl ca le safety doc ment

In the a sen e of a safety doc ment, an alternatin voltage with a freq en y of 5 Hz or

6 Hz an with a p a value of 1,4 times the isolation voltage sp cified in the detai

sp cification s al b a pl ed for 6 s ± 5 s b twe n al termination of the thermistor

con ected together as one p le an the metal c b l s, the metal foi , the V-block, the metal

plates, the ac es ory or the cle n water as the other p le

The voltage s al b a pl ed grad al y at a rate of a proximately 10 V/s The test time may

b red ced to 1 s provided the test voltage is in re sed by 2 %

5.9.3 Re uireme ts

There s al b no bre kdown or flas over

5.10 Re ista c /temperature c ara teristic

5.10.1 Ge eral

The method of test s al b as des rib d in 5.10.2

5.10.2 Te t methods

The me s rin temp rature s al b selected from those given in Ta le 1 an the

resistan e/emp rature c aracteristic s al b me s red u in the method des rib d in 5.6.2

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5.1 2 Initial me s reme ts

The zero-p wer resistan e s al b me s red at the temp rature T

b, whic is eq ivalent to

8 °C ± 0,1 °C, u les otherwise pres rib d in the detai sp cification, an s al b recorded

5.1 3 Te t methods

Unles otherwise pres rib d in the detai sp cification, the thermistors with wire termination

s al b grip ed by cl ps 2 mm ± 1,5 mm from the b d of the thermistor

Thermistors with other than wire termination s al b s p orted by clps, if practica le,

ac ordin to An ex C An ex e tion to this s al b ful y des rib d in the detai sp cification

The cl ps car yin the thermistors s al then b en losed in a c amb r havin a volume at

le st 1 0 0 times that of the thermistors u der test The wires s al b so p sitioned that no

thermistor is within 7 mm of an other thermistor, or the wals of the c amb r (se Fig re 10)

D ime sio s in mi imetres

Figure 10 – Ex mple of te t c amber

The air in the c amb r s al b stationary an s al b at a temp rature of 2 °C ± 5 °C The

thermistors s al b con ected in the circ it as s own in Fig re 1

The hig imp dan e voltmeter an the ammeter s al have an ac urac b t er than 1 %

Trang 32

is within 5 % of the zero-p wer

resistan e value at T

b When sta le re din s have b en ac ieved, the values of U

b– 2 ) W/°C

The dis ip tion factor s al b within the l mits pres rib d in the detai sp cification

5.12 Thermal time consta t by ambie t temperature c a ge (τ

a)

i

is calc lated as fol ows:

T

i = T

b– (T

b– T

a) × 0,6 2

Trang 33

ta es for the thermistor to re c the zero-p wer resistan e at T

or lq id ( low rate an vis osity) s al b defined in the detai sp cification

NOT This meth d is n t suita le for miniature th rmistors b c use th c a g of temp rature d rin tra sfer

from th first to th se o d me ium c n le d to a c nsid ra le me surin er or

5.13 Thermal time consta t by cool ng af er s lf-he ting (τ

c)

b– (T

b– T

a) × 0,6 2

Unles otherwise pres rib d in the detai sp cification, the thermistor s al b mou ted an

en losed in a c amb r as des rib d in 5.1 2 Before in ertion in the c amb r, the thermistor

s al b con ected in the circ it s own in Fig re 12

The hig -imp dan e voltmeter an the ammeter s al have an ac urac b t er than 1 % The

resistan e me s rin eq ipment s al have an ac urac of 0,1 % or b ter

Trang 34

c re t flowin thro g NTC th rmistor u d r test

Figure 12 – Thermal time consta t me s ring circ it

5.13.4 Te t method

The method of me s rement s al b as des rib d b low

With contacts AA closed, the c r ent I

Th

s al b adju ted u ti the ratio U

Th/I

Th

is within 6 %

to 8 % of the zero-p wer resistan e at T

b

an sta le re din s have b en ac ieved

Throw switc to close contacts BB an start the timin when the zero-p wer resistan e me ts

the con ition as des rib d a ove Sto timin when the zero-power resistan e at T

The thermal time con tant s al me t the l mits pres rib d in the detai sp cification

The medium u ed in 5.13.2 an 5.13.3, the temp rature toleran e on T

a

b, air ( low rate)

or lq id ( low rate an vis osity) s al b defined in the detai sp cification

5.14 Ro ustne s of termin tions (not appl c ble to s rfa e mou t thermistors)

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Unles otherwise sp cified in the detai sp cification, the force to b a pl ed for 10 s s al b

as fol ows

– For al typ s of termination ex e t wire termination : 2 N

– For wire termination : se Ta le 2

For circ lar-se tio wires, strips or pins, th n min l cros -se tio al are is e u l to th v lu c lc late

from th n min l dime sio (s) giv n in th rele a t sp cific tio For stra d d wires, th n min l cros

-se tio al are is o tain d b ta in th sum of th cros -se tio al are s of th in ivid al stra ds of th

c n u tor sp cifie in th rele a t sp cific tio

5.14.5 Te t Ub – Be ding (half th number of terminations)

Two con ec tive b n s s al b a pled (method 1)

5.14.6 Te t Uc – Torsion (remaining terminations)

Two rotation of 18 ° s al b a pled (severity 2)

5.14.7 Fin l me s reme ts a d re uireme ts

Afer e c of these tests the thermistors s al b vis al y examined There s al b no visible

damage

Afer the test, the a pro riate p rameter(s) given in the detai sp cification s al b me s red

an s al comply with the req irements pres rib d in the detai sp cification

5.15 Re ista c to sold rin he t

5.15.1 Ge eral

Trang 36

The test con ition s al b defined in the relevant sp cification.

a) For al thermistors ex e t those of items b) an c) b low:

IEC 6 0 8-2-2 , Test Tb, Method 1 (solder b th)

b) For thermistors not desig ed for u e in printed b ard , but with con ection inten ed for

solderin as in icated in the detai sp cification:

1) IEC 6 0 8-2-2 , Test Tb, Method 1 (solder b th);

2) IEC 6 0 8-2-2 , Test Tb, Method 2 (solderin iron )

c) For s rface mou tin thermistors:

IEC 6 0 8-2-5 , reflow or solder b th method

5.15.4 Re ov ry

The p riod of recovery s al , u les otherwise sp cified in the detai sp cification, b not les

than 1 h or more than 2 h, ex e t for s rface mou t thermistors, for whic the p riod of

recovery s al b 2 h ± 2 h

5.15.5 Fin l in pe tion, me s reme t a d re uireme ts

For al thermistors, ex e t s rface mou t thermistors, the folowin s al a ply

– When the test has b en car ied out, the thermistors s al b vis al y examined

– There s al b no visible damage an the markin s al b legible

– The thermistors s al then b me s red as pres rib d in the relevant sp cification

Surface mou t thermistors s al b vis aly examined an me s red an s al me t the

req irements as pres rib d in the relevant sp cification

5.16 Solderabi ity

5.16.1 Ge eral

Not a pl ca le to those termination whic are des rib d as “not desig ed for solderin ” in

the detai sp cification

The relevant sp cification s ould pres rib whether agein is to b a pl ed If ac elerated

agein is req ired, one of the agein proced res given in IEC 6 0 8-2-2 s ould b a pl ed

Unles otherwise stated in the relevant sp cification, the test s ould b car ied out with non

-activated flu

5.16.2 Te t proc dure

Unles otherwise stated in the relevant sp cification, one of the fol owin tests as set out in

Trang 37

The test con ition s al b defined in the relevant sp cification.

a) For al thermistors ex e t those of items b) an c) b low:

1) IEC 6 0 8-2-2 , Test Ta, Method 1 (solder b th)

De th of immersion ( rom the se tin plane or comp nent b d ): 2,0 mm, u in a

thermal in ulatin s re n of 1,5 mm ± 0,5 mm thicknes ;

2) IEC 6 0 8-2-2 , Test Ta, Method 2 (solderin iron);

3) IEC 6 0 8-2-5

b) For thermistors not desig ed for u e in printed b ard , but with con ection intended for

solderin as in icated in the detai sp cification:

1) IEC 6 0 8-2-2 , Test Ta, Method 1 (solder b th)

De th of immersion ( rom the se tin plane or comp nent b d ): 3,5mm;

2) IEC 6 0 8-2-2 , Test Ta, Method 2 (solderin iron )

c) For s rface mou tin thermistors:

1) IEC 6 0 8-2-5 , reflow or solder b th method;

2) IEC 6 0 8-2-6 , solder b th or solder glo ule method

5.16.3 Fin l inspe tion, me s reme ts a d re uireme ts

The termination s al b examined for go d tin ing as eviden ed by fre flowin of the

solder with wetin of the termination

The thermistors s al me t the req irements as pres rib d in the relevant sp cification

5.17 Rapid c a ge of temperature

The thermistors s al b s bjected to the proced re of Test Na of IEC 6 0 8-2-14 as fol ows

– The lower temp rature T

A

s al b the lower category temp rature

– The hig er temp rature T

B

s al b the up er category temp rature

– The n mb r of c cles s al b selected from: 5, 10, 2 , 5 , 10 , 5 0 an 1 0 0

– The medium of the test c amb r, if dif erent from air, s al b sp cified in the detai

sp cification

5.17.4 Fin l inspe tion, me s reme ts a d re uirements

The thermistors s al b vis al y examined There s al b no visible damage an the markin

s al b legible

The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the

method sp cified The c an e in value comp red with that me s red in 5.17.2 s al not

Trang 38

For in ulated typ s, the in ulation resistan e s al b me s red ac ordin to 5.8 an s al b

The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the

method sp cified an s al b recorded

5.18.3 Te t proc dure

The thermistors s al b sec rely mou ted by their termination an /or by their normal

mou tin me n , as defined in the detai sp cification

The desig of the thermistor may b s c that sp cial mou tin fixtures are req ired in its u e

In this case, the detai sp cification s al des rib the mou tin fixtures an they s al b

u ed in the p rforman e of the vibration, bump an s ock tests

The thermistors s al b s bjected to the proced re of Test Fc of IEC 6 0 8-2-6, u in the

degre of severity given in the detai sp cification

Durin the last hour of vibration in e c direction of movement, an electrical me s rement

s al b made to determine intermit ent contact, o en circ it or s ort circ it as defined in the

detai sp cification Detectin eq ipment s al b s f iciently sen itive to detect an

inter uption

5.18.4 Fin l in pe tion, me s reme ts a d re uireme ts

Afer the test the thermistors s al b vis al y examined There s al b no visible damage

The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in

the method sp cified The c an e in value comp red to the initial y me s red value s al not

ex e d the lmit sp cified in the detai sp cification

5.19 Shoc

5.19.1 Ge eral

The method of test s al b as des rib d b low

5.19.2 Initial me s reme ts

The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the

method sp cified an s al b recorded

Trang 39

5.19.5 Fin l in pe tion, me s reme ts a d re uirements

Afer the test the thermistors s al b vis al y examined There s al b no visible damage

The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in

the method sp cified The c an e in value comp red to the initial y me s red value s al not

ex e d the lmit sp cified in the detai sp cification

The thermistors s al b s bjected to the Proced re 1 of IEC 6 0 8-2-31

5.2 4 Fin l in pe tion, me s reme ts a d re uirements

Afer the test, the thermistors s al b vis al y examined There s al b no visible damage

The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in

the method sp cified The c an e in value comp red to the initial y me s red value s al not

ex e d the lmit sp cified in the detai sp cification

The thermistors s al b s bjected to the proced re of Test Nc of IEC 6 0 8-2-14 as fol ows

– The lower temp rature T

A

s al b the lower category temp rature

– The hig er temp rature T

– The n mb r of c cles s al b selected from: 5, 10, 2 , 5 an 10

– The medium of the test b th, if diferent from water or oi , s al b sp cified in the detai

sp cification

5.21.4 Fin l in pe tion, me s reme ts a d re uireme ts

Trang 40

The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in

the method sp cified The c an e in value comp red to the initial y me s red value s al not

ex e d the lmit sp cified in the detai sp cification

5.2 Cold

5.2 1 Ge eral

The method of test s al b as des rib d b low

5.2 2 Initial me s reme ts

The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the

method sp cified an s al b recorded

5.2 3 Te t proc dure

The method of test s al b as des rib d b low

a) Method 1

The thermistors for sen in a pl cation s al b s bjected to the proced re of Test Ab of

IEC 6 0 8-2-1 u in the degre of severity of the lower category temp rature as

pres rib d in the detai sp cification The lower category temp rature s al b selected

from Ta le 1 an the d ration of the test s al b selected from 2 h, 16 h, 7 h, 9 h,

16 h, 2 0 h, 5 0 h an 1 0 0 h

The sp cimen may b lo ded in the test c amb r u der an temp rature b twe n the test

ro m temp rature an the lower category temp rature

b) Method 2

The thermistors for other a pl cation s al b s bjected to the proced re of Test Ad of

IEC 6 0 8-2-1 u in the degre of severity of the lower category temp rature as

pres rib d in the detai sp cification The lower category temp rature s al b selected

from Ta le 1 an the d ration of the test s al b selected from 2 h, 16 h, 7 h, 9 h,

16 h, 2 0 h, 5 0 h an 1 0 0 h

5.2 4 Fin l in pe tion, me s reme ts a d re uireme ts

The thermistors s al b vis al y examined There s al b no visible damage an the markin

s al b legible

The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the

method sp cified The c an e in value comp red with that me s red in 5.2 2 s al not

ex e d the l mit sp cified in the detai sp cification

For in ulated typ s, the in ulation resistan e s al b me s red ac ordin to 5.8 an s al b

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