3.3 thermistor thermaly sen itive semicon u tin resistor whose primary fu ction is to ex ibit an imp rtant c an e in electrical resistan e with a c an e in b d temp rature 3.4 ne ativ te
Trang 1T hermistances à coef icient de température négatif à chauf age direct –
Partie 1: Spécification générique
Trang 2THIS PUBLICATION IS COPYRIGHT PROT CTED
Copyright © 2 16 IEC, Ge e a, Switzerla d
Al rig ts reserv d Unles oth rwise sp cifie , n p rt of this p blc tio ma b re ro u e or uti ze in a y form
or b a y me ns,ele tro ic or me h nic l in lu in p oto o yin a d microfim, with ut p rmis io in writin from
eith r IEC or IEC's memb r Natio al Commite in th c u try of th re u ster If y u h v a y q estio s a o t IEC
c p rig t or h v a e q iry a o t o tainin a ditio al rig tsto this p blc tio , ple se c nta t th a dres b low or
y ur lo al IEC memb r Natio al Commite for furth r informatio
Droits d re ro u tio réserv s Sa f in ic tio c ntraire, a c n p rtie d c te p blc tio n p ut être re ro uite
ni uti sé so s q elq e forme q e c soit et p r a c n pro é é, éle tro iq e o mé a iq e, y c mpris la p oto o ie
et les microfims, sa s la c rd é rit d l EC o d Comité n tio al d l EC d p ys d d ma d ur Si v usa ez d s
q estio s sur le c p rig t d l EC o si v us d sirezo te ir d s droits su pléme taires sur c te p blc tio , uti sez
les c ord n é s ci-a rès o c nta tez le Comité n tio al d l EC d v tre p ysd résid n e
Th Intern tio al Ele trote h ic l Commis io (IEC) is th le din glo al org nizatio th t pre ares a d p blsh s
Intern tio al Sta d rds for al ele tric l ele tro ic a d relate te h olo ies
Ab ut IEC publ c tio s
Th te h ic l c nte t of IEC p blc tio s is k pt u d r c nsta t re iew b th IEC Ple se ma e sure th t y u h v th
latest e itio , a c rig n a or a ame dme t mig t h v b e p blsh d
IEC Catalog e - webstore.ie c / catalog e
Th sta d-alo e a plc tio for c nsultin th e tire
biblo ra hic l infor matio o IEC Inter natio al Sta d rds,
Te h ic l Sp cific tio s, Te h ic l Re orts a d oth r
d c me ts Av ia le for PC, Ma OS, An r oid Ta lets a d
iPa
IEC publc tio s s arc - w w.ie c /se rc pub
Th a v n e se rc e a les to fin IEC p blc tio s b a
v riety of crite a (r efer en e n mb r, te t, te h ic l
c mmite ,…) It also giv s informatio o pr oje ts, re la e
a d w ith r awn p blc tio s
IEC J st Publs ed - webstore.ie c / j stpubls ed
Sta u to d te o al n w IEC p blc tio s Just Pu lsh d
d tais al n w p blc tio s rele se Av ia le o ln a d
also o c a mo th b emai
Ele to edia - ww w.ele to edia.org
Th w or l 's le din o ln dictio ary of ele tro ic a d
ele tr i al terms c ntainin 2 0 0 ter ms a d d finitio s in
En lsh a d Fre c , w ith e uiv le t terms in 15 a ditio al
la g a es Also k now n as th Inter natio al Ele tr ote h ic l
Vo a ulary (IEV) o ln
IEC Glos ary - std.ie c / glos ary
6 0 0 ele trote h ic l ter min lo y e tr i s in En lsh a d
Fre c e tr acte from th Terms a d Definitio s cla se of
IEC p blc tio s is u d sin e 2 0 Some e tr i s h v b e
c le te fr om e r lier p blc tio s of IEC TC 3 , 7 , 8 a d
CIS R
IEC Cu tomer Serv ic Cente - webstore.ie c / cs
If y u w ish to giv us y our fe d a k o this p blc tio or
n e furth r as ista c ,ple se c nta t th Customer Ser vic
Ce tr e: csc@ie c
A pro os de lIEC
L Commis io Ele trote h iq e Intern tio ale (IEC) est la première org nisatio mo diale q i éla ore et p ble d s
Normes intern tio ales p ur to t c q i a trait à léle tricité, à léle tro iq e et a x te h olo ies a p re té s
A pro os de publc tio s IEC
L c nte u te h iq e d s p blc tio s IEC est c nstamme t re u Ve i ez v us as urer q e v us p s é ez lé itio la
plus ré e te, u c rig n um o ame d me t p ut a oir été p blé
Catalog e IEC - webstore.ie c / catalog e
Ap lc tio a to ome p ur c nsulter to s les r enseig eme ts
biblo ra hiq es sur les Normes intern tio ales,
Sp cific tio s te h iq es, Ra p r ts te h iq es et a tr es
d c me ts d l EC Disp nible p ur PC, Ma OS, ta letes
An roid et iPa
Re h rc e de publc tio s IEC - w w.ie c / se rc pub
L r ec er ch a a c e p rmet d tr ou er d s p blc tio s IEC
e uti sa t difér ents c tères (n mér o d référe c , te te,
c mité d’étu es,…) Ele d n e a s i d s infor matio s sur les
pr ojets et les p blc tio s rempla é s o r etir ées
IEC J st Publs ed - webstore.ie c / j stpubls ed
Restez infor mé sur les n u eles p blc tio s IEC Just
Pu lsh d d tai e les n u eles p blc t io s p r ues
Disp nible e lg e et a s i u e fois p r mois p r emai
Ele to edia - ww w.ele to edia.org
L pr emier dictio n ir e e lg e d ter mes éle tro iq es et
éle tr i u s I c ntie t 2 0 0 termes et d finitio s e a glais
et e fr an ais, ainsi q e les ter mes é uiv le ts d ns 15
la g es a ditio n les Eg leme t a p lé Vo a ulair e
Ele tr ote h iq e Inter natio al (IEV) e lg e
Glos aire IEC - std.ie c / glos ary
6 0 0 e tré s termin lo iq es éle tr ote h iq es, e a glais
et e fr an ais, e tr aites d s articles Ter mes et Définitio s d s
p blc tio s IEC p r ues d p is 2 0 Plus c rtain s e tr ées
a té e res e traites d s p blc tio s d s CE 3 , 7 , 8 et
CIS R d l EC
Serv ic Clents - webstore.ie c / cs
Si v us d sir ez n us d n er d s c mme tair es sur c te
p blc tio o si v us a ez d s q estio s c nta tez-n us:
csc@ie c
Trang 3T hermistances à coef icient de température négatif à chauf age direct –
Partie 1: Spécification générique
Warnin ! Mak e s re th t y ou o tain d this publc tion from a a thorize distributor
Ate tion! Ve i ez v ou a s rer qu v ou av ez o te u c te publc tion via u distribute r a ré
Trang 4CONTENTS
FOREWORD 7
1 Sco e 9
2 Normative referen es 9
3 Terms an definition 10 4 General items 2
4.1 Units an s mb ls 2
4.2 Prefer ed values an a pro riate category 2
4.2.1 General 2
4.2.2 Ap ro riate category 2
4.3 Markin 2
4.3.1 General 2
4.3.2 Markin for smal size types s c as s rface mou t thermistors 21
4.3.3 Codin 21
4.4 Qual ty as es ment proced res 21
5 Test an me s rement proced res 21
5.1 General 21
5.2 Stan ard atmospheric con ition for testin 21
5.3 Dryin an recovery 2
5.3.1 Dryin 2
5.3.2 Recovery 2
5.4 Mou tin ( or s rface mou t thermistors only) 2
5.4.1 General 2
5.4.2 Substrate an p d 2
5.4.3 Mou tin on b ard 2
5.5 Vis al examination an c eck of dimen ion 2
5.5.1 Vis al examination 23 5.5.2 Dimen ion 2
5.6 Zero-p wer resistan e 24 5.6.1 General 2
5.6.2 Me s rement proced res 2
5.6.3 Req irements 2
5.7 B-value or resistan e ratio 2
5.7.1 General 2
5.7.2 Req irements 2
5.8 In ulation resistan e ( or in ulated typ s only) 2
5.8.1 General 2
5.8.2 Test method 2
5.8.3 Ap l ed voltage 2
5.8 4 Req irements 2
5.9 Voltage pro f ( or in ulated typ s only) 2
5.9.1 General 2
5.9.2 Test voltage 2
5.9.3 Req irements 28 5.10 Resistan e/emp rature c aracteristic 2
5.10.1 General 2
5.10.2 Test method 2
Trang 55.1 Dis ip tion factor (δ) 2
5.1 1 General 2
5.1 2 Initial me s rements 2
5.1 3 Test method 2
5.1 4 Req irements 3
5.12 Thermal time con tant by ambient temp rature c an e (τ a ) 3
5.12.1 General 3
5.12.2 Initial me s rements 3
5.12.3 Precon itionin 31
5.12.4 Test method 31
5.12.5 Final me s rements an req irements 31
5.12.6 Req irements 31
5.13 Thermal time con tant by co l n afer self he tin (τ ) 31 5.13.1 General 31
5.13.2 Initial me s rements 31
5.13.3 Precon itionin 31
5.13.4 Test method 3
5.13.5 Final me s rements an req irements 3
5.14 Ro u tnes of termination (not a pl ca le to s rface mou t thermistors) 3
5.14.1 General 3
5.14.2 Initial me s rements 3
5.14.3 Test method 3
5.14.4 Test Ua 1 – Ten ie 3
5.14.5 Test Ub – Ben in (half the n mb r of termination ) 3
5.14.6 Test Uc – Torsion (remainin termination ) 3
5.14.7 Final me s rements an req irements 3
5.15 Resistan e to solderin he t 3
5.15.1 General 3
5.15.2 Precon itionin 3
5.15.3 Test proced re 3
5.15.4 Recovery 3
5.15.5 Final in p ction, me s rement an req irements 3
5.16 Soldera i ty 3
5.16.1 General 3
5.16.2 Test proced re 3
5.16.3 Final in p ction, me s rements an req irements 3
5.17 Ra id c an e of temp rature 3
5.17.1 General 3
5.17.2 Initial me s rements 35 5.17.3 Test proced res 3
5.17.4 Final in p ction, me s rements an req irements 3
5.18 Vibration 3
5.18.1 General 3
5.18.2 Initial me s rements 36 5.18.3 Test proced res 3
5.18.4 Final in p ction, me s rements an req irements 3
5.19 Shock 3
Trang 65.19.2 Initial me s rements 3
5.19.3 Mou tin 3
5.19.4 Test proced res 3
5.19.5 Final in p ction, me s rements an req irements 3
5.2 Fre fal 3
5.2 1 General 3
5.2 2 Initial me s rements 3
5.2 3 Test proced res 3
5.2 4 Final in p ction, me s rements an req irements 3
5.21 Thermal s ock 37 5.21.1 General 3
5.21.2 Initial me s rements 3
5.21.3 Test proced res 3
5.21.4 Final in p ction, me s rements an req irements 3
5.2 Cold 3
5.2 1 General 3
5.2 2 Initial me s rements 3
5.2 3 Test proced res 3
5.2 4 Final in p ction, me s rements an req irements 3
5.2 Dry he t 3
5.2 1 General 3
5.2 2 Initial me s rements 3
5.2 3 Test proced res 3
5.2 4 Final in p ction, me s rements an req irements 3
5.2 Damp he t, ste d state 3
5.2 1 General 3
5.2 2 Initial me s rements 3
5.2 3 Test proced res 3
5.2 4 Recovery 4
5.2 5 Final in p ction, me s rements an req irements 4
5.2 En uran e 4
5.2 1 General 4
5.2 2 En uran e at ro m temp rature with a pl ed contin ou maximum c r ent (I max2 ) ( or inru h c r ent l mitin thermistors only) 4
5.2 3 En uran e at ro m temp rature with a pl ed c cl c maximum c r ent (I max2 ) ( or inru h c r ent l mitin thermistors only) 41
5.2 4 En uran e at T 3 an P max 4
5.2 5 En uran e at up er category temp rature 4
5.2 6 Maximum p rmis ible ca acitan e ( or inru h c r ent l mitin thermistors only) 4
5.2 She r (ad esion) test ( or s rface mou t thermistors only) 45 5.2 1 General 4
5.2 2 Test con ition 4
5.2 3 Req irements 4
5.2 Substrate b n in test ( or s rface mou t thermistors only) 4
5.2 1 General 4
5.2 2 Initial me s rements 46 5.2 3 Test proced res 4
5.2 4 Final in p ction an req irements 4
Trang 75.2 1 General 4
5.2 2 Initial me s rements 4
5.2 3 Test con ition 4
5.2 4 Req irements 4
5.2 Solvent resistan e of markin 4
5.2 1 General 4
5.2 2 Test con ition 4
5.2 3 Req irements 4
5.3 Salt mist 4
5.3 1 General 4
5.3 2 Test con ition 4
5.31 Se l n 4
5.3 Comp site temp rature/h midity c cle 4
5.3 1 General 4
5.3 2 Initial me s rements 47 5.3 3 Test con ition 4
5.3 4 Final in p ction, me s rements an req irements 4
An ex A (normative) Interpretation of sampl n plan an proced res as des rib d in IEC 6 410:19 3 for u e within q al ty as es ment s stems 49 A.1 Clau e an s bclau e n mb rs of IEC 6 410:19 3 4
An ex B (normative) Rules for the pre aration of detai sp cification for directly he ted thermistors for electronic eq ipment for u e within q al ty as es ment s stems 5
B.1 Drafin 5
B.2 Referen e stan ard 5
B.3 Circ lation 5
An ex C (informative) Typical examples of mou tin s for me s rements of directly he ted thermistors 51
C.1 Mou tin for s rface mou t thermistors 51
An ex D (informative) Referen e to IEC 6 5 9-1:2 0 5
An ex Q (normative) Qual ty as es ment proced res 5
Q.1 General 5
Q.2 Primary stage of man facture 54 Q.3 Stru tural y simi ar comp nents 5
Q.4 Qual fication a proval proced res 5
Q.4.1 General 5
Q.4.2 Test proced re for q al fication a proval 5
Q.4.3 Maintenan e of q al fication a proval 5
Q.5 Qual ty conforman e in p ction 5
Q.6 Certified test record of rele sed lots 5
Q.7 Delayed delvery 5
Q.8 Rele se for del very u der q al fication a proval b fore the completion of group B tests 5
Q.9 Alternative test method 56 Q.10 Un heck d p rameters 5
Bibl ogra h 5
Fig re 1 – Typical resistan e- emp rature c aracteristic for NTC thermistors 13
Fig re 2 – Decre sed p wer dis ip tion c rve 15
Trang 8Fig re 4 – Basic circ it for zero-p wer resistan e me s rement 2
Fig re 5 – Example of Method 1 for testin the in ulation resistan e 2
Fig re 6 – Example of Method 2 for testin the in ulation resistan e (1) 2
Fig re 7 – Example of Method 2 for testin the in ulation resistan e (2) 2
Fig re 8 – Example of Method 3 for testin the in ulation resistan e 2
Fig re 9 – Example of Method 4 for testin the in ulation resistan e 2
Fig re 10 – Example of test c amb r 2
Fig re 1 – Dis ip tion factor me s rin circ it 3
Fig re 12 – Thermal time con tant me s rin circ it 3
Fig re 13 – En uran e at ro m temp rature with I max2 evaluatin circ it 41
Fig re 14 – Maximum p rmis ible ca acitan e test circ it (Method 1) 4
Fig re 15 – Maximum p rmis ible ca acitan e test circ it (Method 2) 4
Fig re C.1 – Mou tin for me s rements of s rface mou t thermistors 5
Ta le 1 – L wer an up er category temp ratures an d ration of the damp he t, ste d state test 2
Ta le 2 – Ten i e force 3
Trang 9INTERNATIONAL ELECTROTECHNICAL COMMISSION
1) Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org nizatio for sta d rdizatio c mprisin
al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote
intern tio al c -o eratio o al q estio s c n ernin sta d rdizatio in th ele tric l a d ele tro ic fields To
this e d a d in a ditio to oth r a tivities, IEC p blsh s Intern tio al Sta d rds, Te h ic l Sp cific tio s,
Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (PAS) a d Guid s (h re fer refere to as “IEC
Pu lc tio (s)”) Th ir pre aratio is e truste to te h ic l c mmite s; a y IEC Natio al Commite intereste
in th su je t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n
n-g v rnme tal org nizatio s laisin with th IEC also p rticip te in this pre aratio IEC c la orates closely
with th Intern tio al Org nizatio for Sta d rdizatio (ISO) in a c rd n e with c n itio s d termin d b
a re me t b twe n th two org nizatio s
2) Th formal d cisio s or a re me ts of IEC o te h ic l maters e pres , as n arly as p s ible, a intern tio al
c nse sus of o inio o th rele a t su je ts sin e e c te h ic l c mmite h s re rese tatio from al
intereste IEC Natio al Commite s
3) IEC Pu lc tio s h v th form of re omme d tio s for intern tio al use a d are a c pte b IEC Natio al
Commite s in th t se se Whie al re so a le eforts are ma e to e sure th t th te h ic l c nte t of IEC
Pu lc tio s is a c rate, IEC c n ot b h ld resp nsible for th wa in whic th y are use or for a y
misinterpretatio b a y e d user
4) In ord r to promote intern tio al u iformity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s
tra sp re tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e
b twe n a y IEC Pu lc tio a d th c r esp n in n tio al or re io al p blc tio sh l b cle rly in ic te in
th later
5) IEC itself d es n t pro id a y atestatio of c nformity In e e d nt c rtific tio b dies pro id c nformity
as es me t servic s a d, in some are s, a c s to IEC marks of c nformity IEC is n t resp nsible for a y
servic s c rie o t b in e e d nt c rtific tio b dies
6) Al users sh uld e sure th t th y h v th latest e itio of this p blc tio
7) No la i ty sh l ata h to IEC or its dire tors, emplo e s, serv nts or a e ts in lu in in ivid al e p rts a d
memb rs of its te h ic l c mmite s a d IEC Natio al Commite s for a y p rso al injury, pro erty d ma e or
oth r d ma e of a y n ture wh tso v r, wh th r dire t or in ire t, or for c sts (in lu in le al fe s) a d
e p nses arisin o t of th p blc tio , use of, or rela c u o , this IEC Pu lc tio or a y oth r IEC
Pu lc tio s
8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Use of th refere c d p blc tio s is
in isp nsa le for th c re t a plc tio of this p blc tio
9) Ate tio is drawn to th p s ibi ty th t some of th eleme ts of this IEC Pu lc tio ma b th su je t of
p te t rig ts IEC sh l n t b h ld resp nsible for id ntifyin a y or al su h p te t rig ts
International Stan ard IEC 6 5 9-1 has b en pre ared by IEC tec nical commit e 4 :
Ca acitors an resistors for electronic eq ipment
This third edition can els an re laces the secon edition publ s ed in 2 0 This edition
con titutes a tec nical revision Ta les, fig res an referen es have b en revised
The text of this stan ard is b sed on the fol owin doc ments:
Ful information on the votin for the a proval of this stan ard can b fou d in the re ort on
Trang 10This publcation has b en drafed in ac ordan e with the ISO/IEC Directives, Part 2.
A l st of al p rts in the IEC 6 5 9 series, publs ed u der the general title D ire cty h ated
n g tv temp erature co ficie t th rmistors, can b fou d on the IEC we site
The commit e has decided that the contents of this publ cation wi remain u c an ed u ti
the sta i ty date in icated on the IEC we site un er "htp:/we store.iec.c " in the data
related to the sp cific publ cation At this date, the publ cation wi b
• reconfirmed,
• with rawn,
• re laced by a revised edition, or
• amen ed
Trang 11DIRECTLY HEATED NEGATIVE TEMPERATURE
COEFFICIENT THERMISTORS –
Part 1: Generic specification
This p rt of IEC 6 5 9 is a pl ca le to directly he ted negative temp rature co ficient
thermistors, typical y made from tran ition metal oxide materials with semicon u tin
pro erties
It esta l s es stan ard terms, in p ction proced res an method of test for u e in sectional
an detai sp cification of electronic comp nents for q al ty as es ment or an other
purp se
The folowin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an
are in isp n a le for its a pl cation For dated referen es, only the edition cited a pl es For
u dated referen es, the latest edition of the referen ed doc ment (in lu in an
amen ments) a pl es
IEC 6 0 2, Markin code s forre sistors a d cap aciors
IEC 6 0 8-1:2 13, En iro me tal te stn – Part 1: G e neral a d gu ida ce
IEC 6 0 8-2-1, En iro me tal testn – Part 2-1: Tests – Tests A: Cold
IEC 6 0 8-2-2, En iro me tal te stn – Part 2-2: Te sts – Te sts B: Dry h at
IEC 6 0 8-2-6, En iro me tal testn – Part 2-6: Tests – Test Fc: Vib rato (sinusoidal
IEC 6 0 8-2-1 , Basic e viro me tal te stn procedures – Part 2-1 : Tests – Test Ka: Sal
mist
IEC 6 0 8-2-14, En iro me tal testn – Part 2-14: Tests – Test N: Ch nge of tem p erature
IEC 6 0 8-2-17, Basic e nviro me ntal te stn p rocedure s – Part 2-17: Tests – Te st Q: Se ln
IEC 6 0 8-2-2 , En iro me tal te stn – Part 2-20: Tests – Test T: Test meth ds for
solderab il y a d resista ce to solderin h at of de vice s wih le ds
IEC 6 0 8-2-21, En iro me tal te stn – Part 2-21: Tests – Te st U: Rob ustne ss of
termin to s a d integral mou ntn de ices
IEC 6 0 8-2-2 , En iro me taltestn – Part 2-27: Te sts – Te st Ea a d guida ce: Sh ck
IEC 6 0 8-2-31, En iro me tal testn – Part 2-31: Te sts – Te st Ec: Rou gh h ndln sh cks,
p rimariy for e u ip me t ty e sp e cime s
IEC 6 0 8-2-3 , En iro me tal testn – Part 2-38: Te sts – Test Z/AD : Comp sie
Trang 12IEC 6 0 8-2-4 :19 0, Basis En iro me tal testn procedure s – Part 2-4 : Te sts – Te st XA
a d guida ce: Immersio in cle nin solv nts
IEC 6 0 8-2-4 :19 0/AMD1:19 3
IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Tests – Test Kb : Sal mist, cyclc (sodiu m
chloride solutio )
IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Te sts – Te st Ta: Solderab il y te stn of
ele ctro ic comp n nts b y th wetin b ala ce meth d
IEC 6 0 8-2-5 , En iro me tal testn – Part 2-5 : Tests – Test Td: Test meth ds for
solderab il y, re sista ce to dis olu tio of metal zato a d to solderin h at of surface
mou ntn de vice s (SMD)
IEC 6 0 8-2-6 , En iro me tal testn – Part 2-69: Te sts – Te st Te: Solderab il y te stn of
ele ctro ic comp n nts for su rface mountn de ices (SMD) b y th wet n b ala ce meth d
IEC 6 0 8-2-7 , En iro me tal testn – Part 2-78: Tests – Test Cab : Damp h at, ste dy
state
IEC 6 2 4, Me sureme nt of th dime sio s of a cylndrical comp on nt wih a ial te rm in to s
IEC 61 9 -2, Qual y as es me t systems – Part 2: Selecto a d use of samp lin p la s for
inspe cto of electro ic comp on nts a d p ck g s
IEC 6 717, Meth d for th determin to of th sp ace re uired b y cap aciors a d re sistors
wih u nidirecto al termin to s
IEC 612 9-2-7, Materials for p rinted b oards a d othe r interco n ctng structures – Part 2-7:
Reinforced b ase mate rials clad a d u nclad – Ep xide wo e E-glas lamin te d she et of
define d flammab il y (v rtcal b u rnin test, cop pe r-clad
3 Terms and definitions
For the purp ses of this doc ment, the fol owin terms an definition a ply
3.1
type
group of prod cts havin simiar desig fe tures man factured by the same tec niq es an
fal n within the man facturer's u ual ran e of ratin s for these prod cts
Note 1 to e try: Mo ntin a c s ories are ig ore , pro id d th y h v n sig ific nt efe t o th test results
Note 2 to e try: Ratin s c v r th c mbin tio of
– ele tric l ratin s,
Trang 133.3
thermistor
thermaly sen itive semicon u tin resistor whose primary fu ction is to ex ibit an imp rtant
c an e in electrical resistan e with a c an e in b d temp rature
3.4
ne ativ temperature coef icie t thermistor
NTC thermistor
thermistor in whic the resistan e decre ses with in re sin temp rature
Note 1 to e try: In g n ral th term 'NTC th rmistor' is use
3.5
dire tly he te ne ativ temperature coef icie t thermistor
thermistor whic o tain its resistan e variation by the c an es of ph sical con ition
Note 1 to e try: Ph sic l c n itio s in lu e th c re t thro g th th rmistor, ambie t temp rature, h midity,
win v lo ity, g s, etc
3.6
indire tly h ate ne ativ temperature coef icie t thermistor
thermistor whic o tain its resistan e variation primari y by the c an e of temp rature of the
thermistor, d e to the c an e of a c r ent throu h a se arate he ter whic is in close contact
with, but electricaly in ulated from, the thermistor element
Note 1 to e try: Th temp rature of th th rmistor c n also b c a g d b th c a g s of p ysic l c n itio s
su h as c re t thro g th th rmistor eleme t itself, ambie t temp rature, h midity, win v lo ity, g s, etc
Note 2 to e try: This term is for informatio o ly
3.7
positiv temperature coef icie t th rmistor
PTC thermistor
thermistor in whic the resistan e in re ses with in re sin temp rature
Note 1 to e try: In g n ral th term 'P C th rmistor' is use
Note 2 to e try: Thisterm is for informatio o ly
3.8
thermistor with wire terminations
thermistor provided with wire termination
3.9
thermistor without wire terminations
thermistor provided only with two metal zed faces, to b u ed as electrical contacts
Note 1 to e try: This term is for informatio o ly
3.10
ins late thermistor
thermistor co ted with materials s c as resin, glas or ceramic, ca a le of me tin the
req irements of the in ulation resistan e an voltage pro f tests when sp cified in the test
s hed le
3.1
non-ins late thermistor
thermistor with or without co tin materials for s rfacin of elements but not inten ed to me t
the req irements of the in ulation resistan e an voltage pro f tests when sp cified in the
Trang 143.12
s rfa e mount thermistor
thermistor whose smal dimen ion an nature or s a e of termination ma e it s ita le for
u e in h brid circ its an on printed b ard
thermistor for s n ing
thermistor whic resp n s to temp rature c an es an therefore is u ed for temp rature
<inru h c r ent l mitin thermistors> value of the d.c resistan e of a thermistor when its
thermal sta i ty is re c ed with the maximum c r ent p s in
Note 1 to e try: This term is for informatio o ly
3.17
ma imum permis ible c pa ita c
<inru h c r ent lmitin thermistors> maximum p rmis ible ca acitan e value of a ca acitor
whic can b con ected to a thermistor u der lo din
3.18
zero-power re ista c
R
T
value of the d.c resistan e of a thermistor, when me s red at a sp cified temp rature, u der
s c con ition that the c an e in resistan e d e to the internal generation of he t is
negl gible with resp ct to the total er or of me s rement
3.19
nominal zero-p wer re ista c
nominal value of zero-p wer resistan e at the stan ard referen e temp rature of 2 °C,
u les otherwise sp cified
3.2
re ista c -temperature c ara teristic
relation hip b twe n the zero-p wer resistan e an the b d temp rature of a thermistor
Note 1 to e try: Ty ic l resista c - emp rature c ara teristic for NTC th rmistors is sh wn in Fig re 1
Trang 15NOT Slg tly d wnward c n e e c rv wh n th temp rature ra g is larg
Figure 1 – Typic l re ista c -temperature c ara teristic for NTC thermistors
Note 2 to e try: Th resista c law folows a pro imately th formula:
ae
TTB
RR
B is th th rmal se sitivity in e (se 3.2 )
This formula is o ly a plc ble for re rese tin th resista c v riatio o er a restricte temp rature ra g For
more pre ise re rese tatio of th R/T-c rv , a resista c /emp rature relatio sh uld b sp cifie in ta ulate
form in th d tai sp cific tio
3.21
re ista c ratio
ratio of the zero-p wer resistan e of a thermistor me s red at the referen e temp rature of
2 °C to that me s red at 8 °C, or at s c other p irs of temp ratures as may b pres rib d
b– T
a)] × ln(R
a/R
b)
R
b
is the zero-p wer resistan e (Ω) at temp rature T
b (K)
Note 1 to e try: Th B-v lu c n alsob e pres e b th folowin formula (c mmo lo arithm)
B = 2,3 3× [ T
a
×T
b) T
b– T
a) × lo (R
a/R
b)
Note 2 to e try: Th prefer e v lu s for T
a
a d T
b
are 2 8,15 K a d 3 8,15 K, resp ctiv ly Th se v lu s are
e uiv le t to + 5 °C a d + 5 °C, resp ctiv ly
Note 3 to e try: Wh re th d tai sp cific tio prescrib s th t th B-v lu sh uld b me sure at oth r
temp ratures, th sp cifie v lu s (in k lvins) sh l b use for T
b
T (K)
Trang 16zero-power temperature coef icie t of re ista c
α
T
ratio at a sp cified temp rature (T) of the rate of c an e of zero-p wer resistan e with
temp rature to the zero-p wer resistan e of the thermistor, expres ed by the formula
α
T
= (1/R
T) × (dR
T/dT) × 10
c te ory temperature ra g
ran e of ambient temp ratures for whic the thermistor has b en desig ed to o erate
contin ou ly at zero-p wer, defined by the temp rature l mits of the a pro riate category
Note 1 to e try: This term is for informatio o ly
3.2
upper c te ory temperature,
T
ma
maximum ambient temp rature for whic a thermistor has b en desig ed to o erate
contin ou ly at zero-p wer
3.2
lower c te ory temperature
T
min
minimum ambient temp rature for whic a thermistor has b en desig ed to o erate
contin ou ly at zero-p wer
3.2
stora e temperature ra g
ran e of ambient temp ratures for whic a thermistor can b stored contin ou ly u der n
o-lo d con ition
Note 1 to e try: This term is for informatio o ly
3.2
de re s d power dis ipation c rv
<al ex e t inru h c r ent l mitin thermistors> c rve that expres es the relation b twe n the
ambient temp rature an the maximum p wer dis ip tion P
a T
Note 1 to e try: This relatio is usu ly e pres e asin Fig re2 a)or, altern tiv ly, as in Fig re 2 b)
Trang 17a) Curv a
b) Curv b
Figure 2 – De re s d p wer dis ipation c rv
Note 2 to e try: This term is for informatio o ly
3.2
ma imum power dis ipation at rate ambie t temperature
P
ma T
maximum value of the p wer dis ip tion whic can b contin ou ly a pl ed to the thermistor
at the rated ambient temp rature T
R
d cre se ln arly to zero at a temp rature T
IEC T
Trang 18R
TTTT
PP
TT
Rmama
TTTT
PP
TT
e u l to th lower c te ory temp rature T
min.(°C) or hig er;
= 5 °C, u les oth rwise sp cifie in th
d tai sp cific tio ;
T
4
is th temp rature (°C) sp cifie in th d tai sp cific tio , a o e whic zero-p wer sh l b a ple T
4is
e u l to, or lower th n, th u p r c te ory temp rature T
max(°C)
Note 2 to e try: Curv b (se Fig re 2 b) in 3.2 )
Th ma imum p wer dis ip tio is c nsta t b twe n temp rature T
2
a d T
3 T
2
= 0 °C, u les oth rwise sp cifie
in th d tai sp cific tio Wh n th temp rature e c e s T
3, th p wer dis ip tio must b d cre se ln arly to
zero at a temp rature T
4
Th ma imum p wer dis ip tio at ambie t temp rature T in g n ral isc lc late as folows:
Th ma imum p wer dis ip tio c n b e pres e b th folowin formula:
mama
R
TTTT
PP
TT
e u l to, or lower th n th u p r c te ory temp rature T
max(°C)
Note 3 toe try: This term is for informatio o ly
3.31
ma imum c r e t at ambie t temperature of 2 °C
I
ma 2
<inru h c r ent l mitin thermistors> maximum value of c r ent (d.c or r.m.s values for Sine
wave s a ed a.c.) whic can b contin ou ly a pl ed to the thermistor at an ambient
temp rature of 2 °C
Note 1 to e try: Th ma imum p wer dis ip tio at ambie t temp rature of 2 °C (P
ax2) is c lc late b
Trang 19a d T
3th
c re t is c nsta t Wh n th temp rature e c e s T
3, th c re t must b d cre se ln arly to zero at a
2mama
TTTT
II
2mama
TTTT
II
Trang 20temp rature T
max(°C)or lower
Note 2 to e try: Curv d (se Fig re 3 b) in 3.31)
Th ma imum c re t is c nsta t b twe n temp rature T
2
a d T
3 T
2
= 0 °C, u les oth rwise sp cifie in th
d tai sp cific tio
Wh n th temp rature e c e s T
3, th c re t sh l b d cre se ln arly to zero at a
2mama
TTTT
II
Note 3 to e try: This term is for informatio o ly
3.3
dis ipation fa tor
δ
p wer dis ip tion req ired for a thermistor to raise its temp rature by 1 K an whic is
generaly the ratio of the p wer dis ip tion c an e to the res ltin thermistor b d
temp rature c an e at a sp cified ambient temp rature
3.3
re p ns time
time req ired for a thermistor to c an e its temp rature b twe n two defined con ition when
s bjected to a c an e in ambient temp rature, p wer or a combination of temp rature an
p wer
Note 1 to e try: Resp nse time me sure in se o ds
Note 2 to e try: Be a se of th impra tic bi ty to me sure resp nse time dire t, two meth ds are d fin d to
me sure th th rmal time c nsta t dire t
Note 3 to e try: This term is for informatio o ly
Note 1 to e try: τ is me sure in se o ds
Note 2 to e try: Ste c a g a d me ium are sp cifie in th d tai sp cific tio
Trang 21he t c pa ity
C
th
energ the thermistor ne d to raise 1 K in temp rature
Note 1 to e try: Th h at c p city is me sure in jo les a d is c lc late b th folowin formula:
Note 2 toe try: He t c p city is c mpletely d termin d b th c mp n nt d sig
Note 3 toe try: This term is for informatio o ly
3.3
volta e c r e t c ara teristic
relation hip b twe n the voltage (d.c a.c r.m.s.) acros the thermistor an the a pl ed
ste d -state c r ent when the thermistor re c es a thermal eq i brium con ition in sti air or
in the sti medium sp cified in the detai sp cification, at 2 °C or at the temp rature
er or d e to the internal generation of he t (self he tin ) of the thermistor, whic can b
contin ou ly a pled to the thermistor in its practical u e
Note 1 to e try: Unles oth rwise sp cifie in th d tai sp cific tio , ∆T is e u l to 1 K Th relatio ship amo g
TT
RT
RU
TT
is th ma imum o eratin p wer for lmite self h atin ;
δ is th dis ip tio fa tor;
∆T is th temp rature rise of th th rmistor d e to its intern l g n ratio of h at
is th v lu of resista c at temp rature T
Note 2 to e try: This term is for informatio o ly
Trang 224 General items
4.1 Units a d s mbols
Units, gra hical s mb ls, leter s mb ls an terminolog s ould, whenever p s ible, b ta en
from the folowin International Stan ard :
– IEC 6 0 7-1;
– IEC 6 0 0;
– IEC 6 617;
– ISO 8 0 0-1:2 0
When further items are req ired, they s ould b derived in ac ordan e with the prin iples of
the International Stan ard l sted a ove
4.2 Prefer e v lu s a d appropriate c te ory
Prefer ed cl matic categories only s al b given in the prefer ed values
4.2.2 Appropriate c te ory
The thermistors covered by this p rt of IEC 6 5 9 are clas ified into cl matic categories
ac ordin to the general rules given in IEC 6 0 8-1:2 13, An ex A
The up er an lower category temp ratures an the d ration of the damp he t, ste d state
test s al b selected from Ta le 1
Table 1 – L wer a d up er c te ory temperature a d d ration of
a) nominal zero-p wer resistan e;
b) man facturer's name an /or trade mark;
c) date of man facture;
d) toleran e on nominal zero-p wer resistan e;
Trang 23The p ck gin containin the thermistor(s) s al b cle rly mark d with al the information
l sted a ove
An ad itional markin s al b so a pl ed that no confu ion can arise
4.3.2 Marking for smal size type s c a s rfa e mou t thermistors
Smal size typ s s c as s rface mou t thermistors are general y not mark d on the b d If
some markin can b a pl ed, smal size typ s s al b cle rly mark d with as man as
p s ible of the a ove items as is con idered u eful An d pl cation of information in the
markin on the thermistor s ould b avoided
4.3.3 Coding
Where codin for resistan e value, toleran e or date is u ed, the method s al b one
selected from those given in IEC 6 0 2
4.4 Qual ty a s s me t proc dure
Se An ex Q
The sectional an /or blank detai sp cification s al contain ta les s owin the tests to b
p rformed, whic me s rements are to b made b fore an af er e c test or s bgroup of
tests, an the seq en e in whic they s al b car ied out The stages of e c test s al b
car ied out in the order writen The me s rin con ition s al b the same for initial an
final me s rements
If national sp cification within an q al ty as es ment s stem in lu e method other than
those sp cified in the sectional an /or blank detai sp cification , they s al b ful y des rib d
5.2 Sta dard atmosph ric conditions for te ting
Unles otherwise sp cified, al tests an me s rements s al b made u der stan ard
atmospheric con ition for testin as given in IEC 6 0 8-1:2 13, 4.3:
– temp rature: 15 °C to 3 °C;
– relative h midity: 2 % to 7 %;
– air pres ure: 8 kPa to 10 kPa
Before the me s rements are made, the thermistor s al b stored at the me s rin
temp rature for a time s f icient to al ow the entire thermistor to re c this temp rature The
same p riod as is pres rib d for recovery at the en of a test is normaly s f icient for this
purp se
Durin me s rements, the thermistor s al not b exp sed to drau hts, direct s n-ray or
other influen es lk ly to cau e er or
When me s rements are made at a temp rature other than the sp cified temp rature, the
res lts s al , when neces ary, b cor ected to the sp cified temp rature The ambient
temp rature d rin the me s rements s al b stated in the test re ort
When tests are con u ted in a seq en e, the final me s rements of one test may b ta en as
Trang 245.3 Drying a d re ov ry
5.3.1 Dryin
Where dryin is cal ed for in the sp cification, the thermistor s al b con itioned b fore
me s rement is made, u in proced re 1 or proced re 2 as caled for in the detai
The thermistor s al then b alowed to co l in a desic ator u in a s ita le desic ant,
s c as activated alumina or si ca gel, an s al b k pt therein from the time of removal
from the oven to the b gin in of the sp cified tests
5.3.2 Re ov ry
Unles otherwise sp cified, recovery s al ta e place u der the stan ard atmospheric
con ition for testin (5.2) If recovery has to b made u der closely control ed con ition , the
controled recovery con ition of IEC 6 0 8-1:2 13, 4.4.2, s al b u ed
5.4 Mounting ( or s rfa e mount th rmistors only)
Surface mou t thermistors s al b fixed on to the printed wirin b ard with wave solderin or
reflow solderin as sp cified in 5.4.2 an 5.4.3
5.4.2 Substrate a d pa
The printed wirin b ard that mou t the thermistors s al fulfi the folowin req irements
a) The s bstrate material s al normaly b a 1,6 mm thick e oxide woven glas fa ric
laminated printed b ard (as defined in IEC 612 9-2-7) or a 0,6 5 mm alumina s bstrate
an s al not afect the res lt of an test or me s rement The detai sp cification s al
in icate whic material is to b u ed for the electrical me s rements
b) The s bstrate s al have metal zed lan are s of pro er sp cin to p rmit mou tin of
s rface mou t thermistors an s al provide electrical con ection to the s rface mou t
thermistor terminals The detai s s al b sp cified in the detai sp cification
If another method of mou tin a pl es, the method s al b cle rly sp cified in the detai
5.4.3.2 Solder bath method
When the detai sp cification sp cifies wave solderin , the fol owin mou tin proced re
a pl es
a) Smal dots of the glue s al b a pl ed b twe n the con u tors of the s bstrate by me n
Trang 25b) The s rface mou t thermistors s al b placed on the dots u in twe zers To en ure that
no glue is a pl ed to the con u tors, the s rface mou t thermistors s al not b moved
a out
c) The s bstrate with the s rface mou t thermistors s al b he t tre ted in an oven at
10 °C for 15 min
d) The s bstrate s al b soldered in a wave-solderin a p ratu The a p ratu s al b
adju ted to have a pre-he tin temp rature of 8 °C to 13 °C, a solder b th at
2 0 °C ± 5 °C an a solderin time of 5 s ± 0,5 s
The solderin o eration s al b re e ted on e ( wo c cles in total)
IEC 6 0 8-2-4 :19 0/AMD1:19 3, 3.1.2)
5.4.3.3 Reflow method
When the detai sp cification sp cifies reflow solderin , the fol owin mou tin proced re
a pl es
a) The solder u ed in preform or p ste form s al b si ver b arin (2 % minimum) eutectic
Sn/Pb solder together with a non-activated flux as stated in IEC 6 0 8-2-2 Alternative
solders s c as 6 /4 or 6 /3 may b u ed on s rface mou t thermistors the
con tru tion of whic in lu es solder le c b r iers The Pb- re solder u ed in preform or
p ste form s al b Sn9 ,5-Ag3,0-Cu0,5 or derivative solder together with a flu as stated
in IEC 6 0 8-2-5
b) The s rface mou t thermistor s al then b mou ted as fol ows
1) Mou t the preform solder on the lan with an a pro riate method
2) Ap ly the solder p ste on the lan with an a pro riate method Set the thermistor in
b twe n the lan p rt of the printed wirin b ard If u in the preform solder, a ply
flu to the solderin p rt with an a pro riate method
c) The s bstrate s al then b placed in or on a s ita le he tin s stem (molten solder, hot
plate, tu nel oven, etc.) The temp rature of the u it s al b maintained b twe n 215 °C
an 2 0 °C, u ti the solder melts an reflows formin a homogene u solder b n , but
for not lon er than 10 s
d) Flu s al b removed by a s ita le solvent (se IEC 6 0 8-2-4 :19 0/AMD1:19 3, 3.1.2)
Al s bseq ent han ln s al b s c as to avoid contamination Care s ould b ta en to
maintain cle nl nes in test c amb rs an d rin p st test me s rements
e) In the case of u in reflow solderin , the fol owin a ply
1) The detai sp cification may req ire a more restricted temp rature ran e
2) If va our phase solderin is a pl ed, the same method may b u ed with the
temp ratures ada ted
5.5 Vis al e amination a d c e k of dime sion
5.5.1 Vis al e amination
5.5.1.1 Ge eral
The con ition, workman hip an finis s al b satisfactory as determined by vis al
examination
5.5.1.2 Marking
Markin s al b legible as determined by vis al examination
Trang 265.5.2 Dime sions
5.5.2.1 Ga gin
The dimen ion in icated in the detai sp cification as b in s ita le for gau in s al b
c eck d an s al comply with the values pres rib d in the detai sp cification
Where a pl ca le, me s rements s al b made in ac ordan e with IEC 6 2 4 or IEC 6 717
5.5.2.2 Detai
Al dimen ion pres rib d in the detai sp cification s al b c eck d an they s al comply
with the values pres rib d
5.6 Zero-p wer re ista c
The zero-p wer resistan e s al b me s red at the temp rature given in the detai
sp cification
5.6.2 Me s reme t proc dure
The thermistors s al b s bjected to the proced res of the zero-p wer resistan e as fol ows
a) The thermistors s al b mou ted by their normal me n in cor osion-resistant cl ps on a
mou tin plate made of an a pro riate in ulatin material
b) The thermistors s al then b de ply in erted into a me s rement b th containin a non
-cor osive an non-red cin medium, close to the thermometer an for a len th of time
ne ded to re c a sta le re din of the zero-p wer resistan e
c) The zero-p wer resistan e s al b me s red ac ordin to the b sic circ it of Fig re 4
d) Implementation al me s rements s al b made without self he tin of the devices
(zero-p wer con ition)
The total er or of me s rement of p wer dis ip tion, temp rature toleran e an the er or of
the me s rin eq ipment s al not ex e d 10 % of the toleran e sp cified in the detai
Trang 275.7 B-v lue or re ista c ratio
Calc late the B-value (se 3.2 ) or the resistan e ratio (se 3.21) u in zero-p wer
resistan e values me s red at 2 °C an 8 °C (or at s c other p irs of temp ratures as
may b pres rib d in the detai sp cification) u in the method sp cified in 5.6
5.7.2 Re uireme ts
The B-value or the resistan e ratio s al b within the sp cified toleran e
5.8 Ins lation re ista c ( or in ulate type only)
The in ulation resistan e of the protective co tin s al b me s red as sp cified in the detai
sp cification The exp sed electrode of the thermistor an the other p le s al b a s ficient
distan e from e c other so as not to b s ort circ ited directly
5.8.2 Te t methods
Ac ordin to the in tru tion given in the detai sp cification, one of the fol owin test
method is u ed
a) Method 1
The non-in ulated p rts of the thermistor s al b wra p d in a go d in ulatin material
The thermistor is placed in a ves el containin metal c b l s of 1,6 mm ± 0,2 mm diameter
or 1,0 mm ± 0,2 mm diameter, so that only the metal zed p rt is immersed The metal of
the b l s s al b s c that it do s not develo a resistive s rface
An example of Method 1 is s own in Fig re 5
An example of Method 2 is s own in Fig res 6 an 7
An electrode is immersed in the solution
IEC
Th rmistor u d r test
Metal c b ls
Trang 28Figure 6 – Ex mple of Method 2 for te tin the in ulation re ista c (1)
Figure 7 – Ex mple of Method 2 for te tin the in ulation re ista c (2)
c) Method 3
A metal foi s al b wra p d closely arou d the b d of the thermistor
For those typ s not havin axial termination , a sp ce of 1 mm to 1,5 mm s al b lef
b twe n the ed e of the foi an e c termination For those typ s havin axial
termination , the foi s al b wra p d rou d the whole b d of the thermistor protru in
by at le st 5 mm from e c en , provided that the minimum sp ce of 1 mm b twe n the
foi an the termination can b maintained The en s of the foi s al not b folded over the
Insulatio -resista c meter
Th rmistor u d r test
Insulatio - esista ce meter
Wa ter (≤10 Ω • m)
Water-a sorbin material
Trang 29D ime sio s in mi imetres
Figure 8 – Ex mple of Method 3 for te ting the ins lation re istan e
d) Method 4
The thermistor s al b clamp d in the trou h of a 9 ° metal c V-block of s c a size that
the thermistor b d do s not exten b yon the extremities of the block
The clampin force s al b s c as to maintain adeq ate contact b twe n the thermistor
an the block
The thermistor s al b p sitioned in the V-block in ac ordan e with the fol owin
– For c l n rical thermistors: the thermistor s al b p sitioned in the block so that the
termination furthest from the axis of the thermistor is ne rest to one of the faces of the
block
– For rectan ular thermistors: the thermistor s al b p sitioned in the block so that the
termination ne rest to the ed e of the thermistor is ne rest to one of the faces of the
block
– For c l n rical an rectan ular thermistors with axial le d : an out of centre
p sitionin of the p int of emergen e of the termination from the b d s al b
ig ored
An example of Method 4 is s own in Fig re 9
Figure 9 – Ex mple of Method 4 for te ting the ins lation re istan e
e) Method 5
The thermistor s al b clamp d b twe n metal plates The clampin force s al b s c
as to maintain adeq ate contact b twe n the thermistor an the plates
Trang 30con ected together as one p le an the metal c b l s, the water (≤10 Ω·m), metal foi ,
V-block, metal plates or ac es ory as the other p le
The voltage s al b a pl ed for 1 min, or for s c s orter time as is neces ary to o tain a
sta le re din , the in ulation resistan e b in re d at the en of that p riod
5.8.4 Re uireme ts
When thermistors are meas red as sp cified, the in ulation resistan e s al b not les than
the a pro riate fig re sp cified in the detai sp cification
5.9 Volta e proof ( or ins late type only)
The thermistors are tested as sp cified in 5.9.2 As req ired by the detai sp cification One of
the test method given in 5.8.2 s al b u ed
5.9.2 Te t volta e
The a pled voltage s al b that sp cified in the a pl ca le safety doc ment
In the a sen e of a safety doc ment, an alternatin voltage with a freq en y of 5 Hz or
6 Hz an with a p a value of 1,4 times the isolation voltage sp cified in the detai
sp cification s al b a pl ed for 6 s ± 5 s b twe n al termination of the thermistor
con ected together as one p le an the metal c b l s, the metal foi , the V-block, the metal
plates, the ac es ory or the cle n water as the other p le
The voltage s al b a pl ed grad al y at a rate of a proximately 10 V/s The test time may
b red ced to 1 s provided the test voltage is in re sed by 2 %
5.9.3 Re uireme ts
There s al b no bre kdown or flas over
5.10 Re ista c /temperature c ara teristic
5.10.1 Ge eral
The method of test s al b as des rib d in 5.10.2
5.10.2 Te t methods
The me s rin temp rature s al b selected from those given in Ta le 1 an the
resistan e/emp rature c aracteristic s al b me s red u in the method des rib d in 5.6.2
Trang 315.1 2 Initial me s reme ts
The zero-p wer resistan e s al b me s red at the temp rature T
b, whic is eq ivalent to
8 °C ± 0,1 °C, u les otherwise pres rib d in the detai sp cification, an s al b recorded
5.1 3 Te t methods
Unles otherwise pres rib d in the detai sp cification, the thermistors with wire termination
s al b grip ed by cl ps 2 mm ± 1,5 mm from the b d of the thermistor
Thermistors with other than wire termination s al b s p orted by clps, if practica le,
ac ordin to An ex C An ex e tion to this s al b ful y des rib d in the detai sp cification
The cl ps car yin the thermistors s al then b en losed in a c amb r havin a volume at
le st 1 0 0 times that of the thermistors u der test The wires s al b so p sitioned that no
thermistor is within 7 mm of an other thermistor, or the wals of the c amb r (se Fig re 10)
D ime sio s in mi imetres
Figure 10 – Ex mple of te t c amber
The air in the c amb r s al b stationary an s al b at a temp rature of 2 °C ± 5 °C The
thermistors s al b con ected in the circ it as s own in Fig re 1
The hig imp dan e voltmeter an the ammeter s al have an ac urac b t er than 1 %
Trang 32is within 5 % of the zero-p wer
resistan e value at T
b When sta le re din s have b en ac ieved, the values of U
b– 2 ) W/°C
The dis ip tion factor s al b within the l mits pres rib d in the detai sp cification
5.12 Thermal time consta t by ambie t temperature c a ge (τ
a)
i
is calc lated as fol ows:
T
i = T
b– (T
b– T
a) × 0,6 2
Trang 33ta es for the thermistor to re c the zero-p wer resistan e at T
or lq id ( low rate an vis osity) s al b defined in the detai sp cification
NOT This meth d is n t suita le for miniature th rmistors b c use th c a g of temp rature d rin tra sfer
from th first to th se o d me ium c n le d to a c nsid ra le me surin er or
5.13 Thermal time consta t by cool ng af er s lf-he ting (τ
c)
b– (T
b– T
a) × 0,6 2
Unles otherwise pres rib d in the detai sp cification, the thermistor s al b mou ted an
en losed in a c amb r as des rib d in 5.1 2 Before in ertion in the c amb r, the thermistor
s al b con ected in the circ it s own in Fig re 12
The hig -imp dan e voltmeter an the ammeter s al have an ac urac b t er than 1 % The
resistan e me s rin eq ipment s al have an ac urac of 0,1 % or b ter
Trang 34c re t flowin thro g NTC th rmistor u d r test
Figure 12 – Thermal time consta t me s ring circ it
5.13.4 Te t method
The method of me s rement s al b as des rib d b low
With contacts AA closed, the c r ent I
Th
s al b adju ted u ti the ratio U
Th/I
Th
is within 6 %
to 8 % of the zero-p wer resistan e at T
b
an sta le re din s have b en ac ieved
Throw switc to close contacts BB an start the timin when the zero-p wer resistan e me ts
the con ition as des rib d a ove Sto timin when the zero-power resistan e at T
The thermal time con tant s al me t the l mits pres rib d in the detai sp cification
The medium u ed in 5.13.2 an 5.13.3, the temp rature toleran e on T
a
b, air ( low rate)
or lq id ( low rate an vis osity) s al b defined in the detai sp cification
5.14 Ro ustne s of termin tions (not appl c ble to s rfa e mou t thermistors)
Trang 35Unles otherwise sp cified in the detai sp cification, the force to b a pl ed for 10 s s al b
as fol ows
– For al typ s of termination ex e t wire termination : 2 N
– For wire termination : se Ta le 2
For circ lar-se tio wires, strips or pins, th n min l cros -se tio al are is e u l to th v lu c lc late
from th n min l dime sio (s) giv n in th rele a t sp cific tio For stra d d wires, th n min l cros
-se tio al are is o tain d b ta in th sum of th cros -se tio al are s of th in ivid al stra ds of th
c n u tor sp cifie in th rele a t sp cific tio
5.14.5 Te t Ub – Be ding (half th number of terminations)
Two con ec tive b n s s al b a pled (method 1)
5.14.6 Te t Uc – Torsion (remaining terminations)
Two rotation of 18 ° s al b a pled (severity 2)
5.14.7 Fin l me s reme ts a d re uireme ts
Afer e c of these tests the thermistors s al b vis al y examined There s al b no visible
damage
Afer the test, the a pro riate p rameter(s) given in the detai sp cification s al b me s red
an s al comply with the req irements pres rib d in the detai sp cification
5.15 Re ista c to sold rin he t
5.15.1 Ge eral
Trang 36The test con ition s al b defined in the relevant sp cification.
a) For al thermistors ex e t those of items b) an c) b low:
IEC 6 0 8-2-2 , Test Tb, Method 1 (solder b th)
b) For thermistors not desig ed for u e in printed b ard , but with con ection inten ed for
solderin as in icated in the detai sp cification:
1) IEC 6 0 8-2-2 , Test Tb, Method 1 (solder b th);
2) IEC 6 0 8-2-2 , Test Tb, Method 2 (solderin iron )
c) For s rface mou tin thermistors:
IEC 6 0 8-2-5 , reflow or solder b th method
5.15.4 Re ov ry
The p riod of recovery s al , u les otherwise sp cified in the detai sp cification, b not les
than 1 h or more than 2 h, ex e t for s rface mou t thermistors, for whic the p riod of
recovery s al b 2 h ± 2 h
5.15.5 Fin l in pe tion, me s reme t a d re uireme ts
For al thermistors, ex e t s rface mou t thermistors, the folowin s al a ply
– When the test has b en car ied out, the thermistors s al b vis al y examined
– There s al b no visible damage an the markin s al b legible
– The thermistors s al then b me s red as pres rib d in the relevant sp cification
Surface mou t thermistors s al b vis aly examined an me s red an s al me t the
req irements as pres rib d in the relevant sp cification
5.16 Solderabi ity
5.16.1 Ge eral
Not a pl ca le to those termination whic are des rib d as “not desig ed for solderin ” in
the detai sp cification
The relevant sp cification s ould pres rib whether agein is to b a pl ed If ac elerated
agein is req ired, one of the agein proced res given in IEC 6 0 8-2-2 s ould b a pl ed
Unles otherwise stated in the relevant sp cification, the test s ould b car ied out with non
-activated flu
5.16.2 Te t proc dure
Unles otherwise stated in the relevant sp cification, one of the fol owin tests as set out in
Trang 37The test con ition s al b defined in the relevant sp cification.
a) For al thermistors ex e t those of items b) an c) b low:
1) IEC 6 0 8-2-2 , Test Ta, Method 1 (solder b th)
De th of immersion ( rom the se tin plane or comp nent b d ): 2,0 mm, u in a
thermal in ulatin s re n of 1,5 mm ± 0,5 mm thicknes ;
2) IEC 6 0 8-2-2 , Test Ta, Method 2 (solderin iron);
3) IEC 6 0 8-2-5
b) For thermistors not desig ed for u e in printed b ard , but with con ection intended for
solderin as in icated in the detai sp cification:
1) IEC 6 0 8-2-2 , Test Ta, Method 1 (solder b th)
De th of immersion ( rom the se tin plane or comp nent b d ): 3,5mm;
2) IEC 6 0 8-2-2 , Test Ta, Method 2 (solderin iron )
c) For s rface mou tin thermistors:
1) IEC 6 0 8-2-5 , reflow or solder b th method;
2) IEC 6 0 8-2-6 , solder b th or solder glo ule method
5.16.3 Fin l inspe tion, me s reme ts a d re uireme ts
The termination s al b examined for go d tin ing as eviden ed by fre flowin of the
solder with wetin of the termination
The thermistors s al me t the req irements as pres rib d in the relevant sp cification
5.17 Rapid c a ge of temperature
The thermistors s al b s bjected to the proced re of Test Na of IEC 6 0 8-2-14 as fol ows
– The lower temp rature T
A
s al b the lower category temp rature
– The hig er temp rature T
B
s al b the up er category temp rature
– The n mb r of c cles s al b selected from: 5, 10, 2 , 5 , 10 , 5 0 an 1 0 0
– The medium of the test c amb r, if dif erent from air, s al b sp cified in the detai
sp cification
5.17.4 Fin l inspe tion, me s reme ts a d re uirements
The thermistors s al b vis al y examined There s al b no visible damage an the markin
s al b legible
The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the
method sp cified The c an e in value comp red with that me s red in 5.17.2 s al not
Trang 38For in ulated typ s, the in ulation resistan e s al b me s red ac ordin to 5.8 an s al b
The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the
method sp cified an s al b recorded
5.18.3 Te t proc dure
The thermistors s al b sec rely mou ted by their termination an /or by their normal
mou tin me n , as defined in the detai sp cification
The desig of the thermistor may b s c that sp cial mou tin fixtures are req ired in its u e
In this case, the detai sp cification s al des rib the mou tin fixtures an they s al b
u ed in the p rforman e of the vibration, bump an s ock tests
The thermistors s al b s bjected to the proced re of Test Fc of IEC 6 0 8-2-6, u in the
degre of severity given in the detai sp cification
Durin the last hour of vibration in e c direction of movement, an electrical me s rement
s al b made to determine intermit ent contact, o en circ it or s ort circ it as defined in the
detai sp cification Detectin eq ipment s al b s f iciently sen itive to detect an
inter uption
5.18.4 Fin l in pe tion, me s reme ts a d re uireme ts
Afer the test the thermistors s al b vis al y examined There s al b no visible damage
The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in
the method sp cified The c an e in value comp red to the initial y me s red value s al not
ex e d the lmit sp cified in the detai sp cification
5.19 Shoc
5.19.1 Ge eral
The method of test s al b as des rib d b low
5.19.2 Initial me s reme ts
The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the
method sp cified an s al b recorded
Trang 395.19.5 Fin l in pe tion, me s reme ts a d re uirements
Afer the test the thermistors s al b vis al y examined There s al b no visible damage
The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in
the method sp cified The c an e in value comp red to the initial y me s red value s al not
ex e d the lmit sp cified in the detai sp cification
The thermistors s al b s bjected to the Proced re 1 of IEC 6 0 8-2-31
5.2 4 Fin l in pe tion, me s reme ts a d re uirements
Afer the test, the thermistors s al b vis al y examined There s al b no visible damage
The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in
the method sp cified The c an e in value comp red to the initial y me s red value s al not
ex e d the lmit sp cified in the detai sp cification
The thermistors s al b s bjected to the proced re of Test Nc of IEC 6 0 8-2-14 as fol ows
– The lower temp rature T
A
s al b the lower category temp rature
– The hig er temp rature T
– The n mb r of c cles s al b selected from: 5, 10, 2 , 5 an 10
– The medium of the test b th, if diferent from water or oi , s al b sp cified in the detai
sp cification
5.21.4 Fin l in pe tion, me s reme ts a d re uireme ts
Trang 40The a pro riate p rameters given in the relevant detai sp cification s al b me s red u in
the method sp cified The c an e in value comp red to the initial y me s red value s al not
ex e d the lmit sp cified in the detai sp cification
5.2 Cold
5.2 1 Ge eral
The method of test s al b as des rib d b low
5.2 2 Initial me s reme ts
The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the
method sp cified an s al b recorded
5.2 3 Te t proc dure
The method of test s al b as des rib d b low
a) Method 1
The thermistors for sen in a pl cation s al b s bjected to the proced re of Test Ab of
IEC 6 0 8-2-1 u in the degre of severity of the lower category temp rature as
pres rib d in the detai sp cification The lower category temp rature s al b selected
from Ta le 1 an the d ration of the test s al b selected from 2 h, 16 h, 7 h, 9 h,
16 h, 2 0 h, 5 0 h an 1 0 0 h
The sp cimen may b lo ded in the test c amb r u der an temp rature b twe n the test
ro m temp rature an the lower category temp rature
b) Method 2
The thermistors for other a pl cation s al b s bjected to the proced re of Test Ad of
IEC 6 0 8-2-1 u in the degre of severity of the lower category temp rature as
pres rib d in the detai sp cification The lower category temp rature s al b selected
from Ta le 1 an the d ration of the test s al b selected from 2 h, 16 h, 7 h, 9 h,
16 h, 2 0 h, 5 0 h an 1 0 0 h
5.2 4 Fin l in pe tion, me s reme ts a d re uireme ts
The thermistors s al b vis al y examined There s al b no visible damage an the markin
s al b legible
The a pro riate p rameter(s) given in the detai sp cification s al b me s red u in the
method sp cified The c an e in value comp red with that me s red in 5.2 2 s al not
ex e d the l mit sp cified in the detai sp cification
For in ulated typ s, the in ulation resistan e s al b me s red ac ordin to 5.8 an s al b