Iec ts 62564 1 2016

IEC TS 62564 1 Edition 3 0 201 6 07 TECHNICAL SPECIFICATION Process management for avionics – Aerospace qualified electronic components (AQEC) – Part 1 Integrated circuits and discrete semiconductors[.]

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y ur lo al IEC memb r Natio al Commite for f ur th r infor matio

Th Inter natio al Ele tr ote h ic l Commis io (IEC) is th le din glo al or ga iz tio th t pr ep r es a d p bls e

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CONTENTS

FOREWORD 3

INTRODUCTION 5

1 Sco e 6

2 Normative ref eren es 6

3 Terms, def i ition an a breviation 7

3.1 Terms an def i ition 7

3.2 Ab reviation 9

4 Tec nical req irements 9

4.1 AQEC plan 9

4.2 AQEC doc mentation 10 4.2.1 General 10 4.2.2 AQEC data s e t 10 4.2.3 Material content 10 4.2.4 AQEC visibi ty 10 4.2.5 AQEC l f e exp ctan y 10 4.2.6 Device tec nolog 11 4.2.7 SEE data 1

4.2.8 Termination f i is 1

4.2.9 Third p rty p rt n mb rs 1

4.3 AQEC p rforman e 12

4.3.1 Perf orman e 12

4.3.2 Fu ctional p rameters 13

4.3.3 Known l mitation 13

4.4 Qual ty s stem certif i ation 13

4.5 Comp nent q al f i ation an re-q al fi ation 13

4.6 AQEC q al ty as uran e an rel a i ty monitorin 13

4.7 Prod ct c an e notif i ation (PCN) 14

4.8 L st time bu (LTB) notif i ation 14

4.9 Obsoles en e management 14

4.10 Cou terfeit prevention 14

4.1 User or c stomer g ide 14

An ex A (informative) AQEC material content an con tru tion ta le 15

An ex B (informative) Ad itional desired data 17

Bibl ogra h 18

Ta le A.1 – AQEC material content an con tru tion 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION

Part 1: Integrated circuits and discrete semiconductors

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cif i atio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (PAS) a d Guid s (h re f ter refere to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n

n-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio for Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th formal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

c n e s s of o inio o th rele a t s bje ts sin e e c te h ic l c mmite h s re re e tatio f rom al

intere te IEC Natio al Commite s

3) IEC Pu lc tio s h v th form of re omme d tio s f or intern tio al u e a d are a c pte b IEC Natio al

Commite s in th t s n e Whie al re s n ble eforts are ma e to e s re th t th te h ic l c nte t of IEC

Pu lc tio s is a c rate, IEC c n ot b h ld re p n ible for th wa in whic th y are u e or f or a y

misinterpretatio b a y e d u er

4) In ord r to promote intern tio al u iformity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra s are tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

b twe n a y IEC Pu lc tio a d th c r e p n in n tio al or re io al p blc tio s al b cle rly in ic te in

th later

5) IEC its lf d e n t pro id a y ate tatio of c nformity In e e d nt c rtif i atio b die pro id c nformity

a s s me t s rvic s a d, in s me are s, a c s to IEC mark of c nformity IEC is n t re p n ible for a y

s rvic s c rie o t b in e e d nt c rtific tio b die

6) Al u ers s o ld e s re th t th y h v th late t e itio of this p blc tio

7) No la i ty s al ata h to IEC or its dire tors, emplo e s, s rv nts or a e ts in lu in in ivid al e p rts a d

memb rs of its te h ic l c mmite s a d IEC Natio al Commite s for a y p rs n l injury, pro erty d ma e or

oth r d ma e of a y n ture wh ts e er, wh th r dire t or in ire t, or f or c sts (in lu in le al fe s) a d

e p n e arisin o t of th p blc tio , u e of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Us of th refere c d p blc tio s is

in is e s ble f or th c re t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t s me of th eleme ts of this IEC Pu lc tio ma b th s bje t of

p te t rig ts IEC s al n t b h ld re p n ible f or id ntifyin a y or al s c p te t rig ts

The main tas of IEC tec nical commite s is to pre are International Stan ard In

ex e tional circ mstan es, a tec nical commit e may pro ose the publ cation of a tec nical

sp cif i ation when

• the req ired s p ort can ot b o tained for the publ cation of an International Stan ard,

despite re e ted ef f orts, or

• the s bject is sti u der tec nical develo ment or where, f or an other re son, there is the

f uture but no immediate p s ibi ty of an agre ment on an International Stan ard

Tec nical sp cif i ation are s bject to review within thre ye rs of publ cation to decide

whether they can b tran f ormed into International Stan ard

IEC TS 6 5 4-1, whic is a tec nical sp cif i ation, has b en pre ared by IEC tec nical

commit e 10 : Proces management f or avionic

This third edition can els an re laces the secon edition, publ s ed in 2 1 This edition

con titutes a tec nical revision

This edition in lu es the f ol owin sig if i ant tec nical c an es with resp ct to the previou

f ) information ad ed regardin comp nents' l fe exp ctan y in 4.2.5

GEIA-STD-0 0 -0 1 (Ju e 2 0 ), Aero p c Qu lified Electro ic Comp n nt (AQEC)

Re uireme ts, Volume 1 – I nte rated Circ its a d Semic nd uctors, has served as a b sis f or

the ela oration of this tec nical sp cif i ation

The text of this tec nical sp cif i ation is b sed on the folowin doc ments:

En uiry draft Re ort o v tin

Ful information on the votin for the a proval of this tec nical sp cif i ation can b fou d in

the re ort on votin in icated in the ab ve ta le

This publcation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts in the IEC 6 5 4 series, u der the general title P ro e s ma a eme t for

a io ic – Aero p c q alified ele tro ic c mp n nts (AQEC), can b fou d on the IEC

we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "htp:/we store.iec.c " in the data

related to the sp cifi publ cation At this date, the publ cation wi b

• tran formed into an International stan ard,

Aerosp ce q al f ied electronic comp nents (AQEC) plan are develo ed by man facturers in

order to doc ment compl an e with AQEC req irements For AQEC desig ated comp nents,

the intention is to

a) provide AQEC u ers ac es to inf ormation f rom the AQEC man facturers that is

neces ary for u in commercial-of f -the-s elf (COTS) prod cts;

b) b t er ena le AQEC u ers to as es whether these p rts are ca a le of o eratin rel a ly

in their a plcation ;

c) minimize deviation f rom the AQEC man f acturers’ COTS prod cts;

d) have minimal imp ct on the AQEC man facturers’ stan ard o eratin or bu ines

proced res;

e) promote commu ication b twe n the AQEC man facturers an u ers

PROCESS MANAGEMENT FOR AVIONICS –

Part 1: Integrated circuits and discrete semiconductors

This p rt of IEC 6 5 4, whic is a Tec nical Sp cif i ation, defi es the minimum req irements

f or integrated circ its an semicon u tors whic are desig ated as an “a rosp ce q al f ied

electronic comp nent (AQEC) It a pl es to integrated circ its an semicon u tors ex ibitin

the fol owin at ributes:

a) a minimum set of req irements, or inf ormation provided by the p rt man f acturer, whic

wi al ow a stan ard COTS comp nent to b desig ated AQEC by the man facturer;

b) as a minimum, e c COTS comp nent (desig ated AQEC) wi have b en desig ed,

f abricated, as embled, an tested in ac ordan e with the comp nent man facturer’s

req irements for stan ard data b ok comp nents;

c) q al f i ation o an q al ty s stems f or, the COTS comp nents to b desig ated as AQEC

s ould in lu e the man f acturer’s stan ard , o eratin proced res, an tec nical

sp cif i ation This inf ormation s ould b avai a le when req ested;

d) comp nents man factured b fore the man f acturer has ad res ed AQEC req irements,

but uti zin the same proces es, are also con idered AQEC compl ant;

e) ad itional desired atributes of a device desig ated AQEC ( hat wi s p ort AQEC u ers)

are fou d in An ex B of this tec nical sp cif i ation

NOT Parts q alf i d to mi tary s e if i atio s (e c pt th s id ntif i d a b in f or “lo istic s p ort p rp s s

o ly) are c n id re AQEC; th remain er of this te h ic l s e ific tio o ly a dre s s n n-mi tary s e if i atio

p rts

Parts q al fied to AEC-Q10 , grade 0 throu h to grade 3 are con idered AQEC F r those

a pl cation where a 0 °C to +7 °C temp rature ran e is a pro riate, grade 4 is also

con idered to b AQEC The u ers s ould doc ment that the grade category u ed is

comp tible with the a pl cation in ac ordan e with their IEC TS 6 2 9-1 electronic

comp nents management plan (ECMP)

The f olowin doc ments are ref er ed to in the text in s c a way that some or al of their

content con titutes req irements of this doc ment For dated referen es, only the edition

cited a pl es For u dated referen es, the latest edition of the ref eren ed doc ment (in lu in

an amen ments) a pl es

IEC TS 6 2 9-1, P ro e s ma a eme t for a io ic – M an g me t plan – P art 1: P re aratio

a d mainte a c of a electro ic c mp n nts ma a eme t pla

IEC 6 3 6-1, P ro e s ma a eme t for a io ic – Atmo p eric rad iatio efe ts – P art 1:

Ac ommodation of atmo p eric rad iatio efe ts via sin le e e t efe ts within a io ic

electro ic e uipme t

IEC T 6 6 8-1, P ro e s ma a eme t for a io ic – Co ntereit pre e tio − P art 1:

Av id in th u e ofc u tereit, fa dule t a d re y led electro ic c mp n nts

ISO 9 01, Qu lity ma a eme t s stems – Re uirements

J-STD-0 8, N otific tio Standard for P rodu t Dis o tinu n e

doc ment pre ared by or f or the man f acturer to des rib an AQEC prod ct

Note 1 to e try: It in lu e a d ta s e t a d ma in lu e oth r d c me ts, s c a material d s riptio s,

e viro me tal te t pro e ure , q alty mo itorin pro e s s, etc It ma b a sta d-alo e d c me t or a cle rly

d n te item within a larg r d c me tatio s stem Th re ma b a ditio al d ta a s ciate with s e ific

a plc tio s whic ma b re u ste s p rately

3.1.2

in trument pre ared by the plan owner (se 3.1.10) that cle rly, con isely, an

u ambig ou ly doc ments the proces es u ed by the plan owner to satisf y the req irements

of this tec nical sp cif i ation

Note 1 to e try: Th pla c ntain a dita le c nte t

microcirc it (device with a hig circ it-element den ity) in whic al or some of the circ it

elements are in e ara ly as ociated an electrical y intercon ected (on one or more

s bstrates, in a u iq e in ivisible p c age) so that the microcirc it is con idered to b

in ivisible f or the purp se of con tru tion an commerce

3.1.5

s micon uctor

dis rete s micon uctor de ic

semicon u tor device that is sp cif ied to p rf orm an elementary fun tion an that is not

divisible into se arate comp nents fun tional in themselves (for example diodes, tran istors,

o tocouplers, LEDs an related prod cts)

3.1.7

c stomer

us r

de ig er

original eq ipment man facturer (OEM) that proc res integrated circ its an /or

semicon u tor devices compl ant with this tec nical sp cif i ation an u es them to desig ,

prod ce, an maintain s stems

doc ment pre ared by the man facturer that des rib s the electrical, mec anical, an

en ironmental c aracteristic of the comp nent

3.1.10

ma ufa turer

pla owner

prod cer of integrated circ its, microcirc its, or other semicon u tor devices that may b

desig ated AQEC

Note 1 to e try: A ma ufa turer ma pro u e th c mp n nts dire tly or ma o ers e s b o tra te

ma ufa turin a c rdin to th ir own pro e s s Th ma uf acturer is als th pla own r

3.1.1

s ppl er

distributor of comp nents

Note 1 to e try: A pla for c ntrol n AQEC in e tory is in pla e in ord r to s p ly AQECs A ma ufa turer c n

b a s p ler in th c s wh re n distrib tor is in olv d

s a e, size, ar an ement of p rts, visible asp ct, mode in whic a p rt exists or manifests

itself , or the material an item is con tru ted from

3.2 Abbre iations

AQEC Aerosp ce q al f ied electronic comp nent

Bi-CMOS Bip lar CMOS

BPSG Boro hosphosi cate glas

COTS Commercial of f the s elf

CMOS Complementary metal oxide semicon u tor

DDR Double data rate

DSCC Def en e s p ly centre Columbu (se htp:/ www.d c dla.mi /

DSIAC Def en e s stems information analy is center

ECMP Electronic comp nent management plan

FFF Form, f it an f un tion

FIT Fai ures in time

FPGA Field programma le gate ar ay

GIDEP Government in u try data ex han e program

HAST Hig ly ac elerated stres test

HCI Hot car ier injection

HTOL Hig temp rature o eratin l fe

LED Lig t emit in diode

MCU Multiple cel upset

TDDB Time de en ant dielectric bre k own

VID Ven or item drawin (controled an rele sed by DSCC)

4 Tec nical requirements

The proces es u ed to en ure compl an e with the f ol owin req irements s al b