Iec 61340 5 1 2016

This stan ard covers the ESD control program req irements neces ary for setin up a program to han le ESDS, b sed on the historical exp rien e of b th mi tary an commercial organization..

Partie 5-1: Protection des dispositifs électroniques contre les phénomènes

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Partie 5-1: Protection des dispositifs électroniques contre les phénomènes

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CONTENTS

FOREWORD 3

INTRODUCTION 5

1 Sco e 7

2 Normative referen es 7

3 Terms an definition 8

4 Person el safety 9

5 ESD control program 10 5.1 General 10 5.1.1 ESD control program req irements 10 5.1.2 ESD co rdinator 10 5.1.3 Tai orin 10 5.2 ESD control program administrative req irements 10 5.2.1 ESD control program plan 10 5.2.2 Trainin plan 10 5.2.3 Prod ct q al fication 11 5.2.4 Compl an e verification plan 1

5.3 ESD control program plan tec nical req irements 11 5.3.1 General 1

5.3.2 Grou din /eq ip tential b n in s stems 12 5.3.3 Person el grou din 14 5.3.4 ESD protected are s (EPA) 15 5.3.5 Pack gin 17 5.3.6 Markin 17 An ex A (normative) Test method 19 Bibl ogra h 2

Fig re 1 – Sc ematic of an EPA with a grou d referen e 13

Fig re 2 – Sc ematic of an eq ip tential b n in s stem 14

Fig re A.1 – Fo twe r fu ctional testin (example) 19

Ta le 1 – Grou din /b n in req irements 14

Ta le 2 – Person el grou din req irements 15

Ta le 3 – EPA req irements 17

INTERNATIONAL ELECTROTECHNICAL COMMISSION

1) Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org nizatio for sta d rdizatio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q estio s c n ernin sta d rdizatio in th ele tric l a d ele tro ic fields To

this e d a d in a ditio to oth r a tivities, IEC p blsh s Intern tio al Sta d rds, Te h ic l Sp cific tio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (PAS) a d Guid s (h re fer refere to as “IEC

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in th su je t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n

n-g v rnme tal org nizatio s laisin with th IEC also p rticip te in this pre aratio IEC c la orates closely

with th Intern tio al Org nizatio for Sta d rdizatio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org nizatio s

2) Th formal d cisio s or a re me ts of IEC o te h ic l maters e pres , as n arly as p s ible, a intern tio al

c nse sus of o inio o th rele a t su je ts sin e e c te h ic l c mmite h s re rese tatio from al

intereste IEC Natio al Commite s

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Pu lc tio s is a c rate, IEC c n ot b h ld resp nsible for th wa in whic th y are use or for a y

misinterpretatio b a y e d user

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th later

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servic s c rie o t b in e e d nt c rtific tio b dies

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memb rs of its te h ic l c mmite s a d IEC Natio al Commite s for a y p rso al injury, pro erty d ma e or

oth r d ma e of a y n ture wh tso v r, wh th r dire t or in ire t, or for c sts (in lu in le al fe s) a d

e p nses arisin o t of th p blc tio , use of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

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in isp nsa le for th c re t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t some of th eleme ts of this IEC Pu lc tio ma b th su je t of

p te t rig ts IEC sh l n t b h ld resp nsible for id ntifyin a y or al su h p te t rig ts

International Stan ard IEC 613 0-5-1 has b en pre ared by IEC tec nical commite 101:

Electrostatic

This secon edition can els an re laces the first edition publ s ed in 2 0 This edition

con titutes a tec nical revision

This edition in lu es the fol owin sig ificant tec nical c an es with resp ct to the previou

edition:

a) Tec nical req irements were c an ed to al g IEC 613 0-5-1 with other in u try ESD

stan ard ;

b) Referen e doc ments were updated to reflect newly rele sed IEC stan ard ;

c) A section on prod ct q al fication was ad ed;

d) Ta le 4 was deleted an detai ed p ck gin req irements were defer ed to

e) Clau e A.1 was removed an is now in lu ed in IEC 613 0-4-6.

The text of this stan ard is b sed on the fol owin doc ments:

Ful information on the votin for the a proval of this stan ard can b fou d in the re ort on

votin in icated in the a ove ta le

This publcation has b en drafed in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts in the IEC 613 0 series, publ s ed u der the general title Electrostatc , can

b fou d on the IEC we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "htp:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

• amen ed

This p rt of IEC 613 0 covers the req irements neces ary to desig , esta l s , implement

an maintain an electrostatic dis harge (ESD) control program for activities that: man facture,

proces , as emble, in tal , p ck ge, la el, service, test, in p ct, tran p rt or otherwise

han le electrical or electronic p rts, as embles an eq ipment s s e tible to damage by

electrostatic dis harges gre ter than or eq al to 10 V h man b d model (HBM), 2 0 V

c arged device model (CDM) an 3 V on isolated con u tors Isolated con u tors were

historicaly re resented by mac ine model (MM) The 3 V l mit is related to the level

ac ieva le u in ionizers sp cified in this stan ard The MM test is no lon er req ired for

q al fication of devices, only the HBM an CDM tests are The MM test is retained in this

stan ard for proces control of isolated con u tors only

An contact an ph sical se aration of materials or flow of sol d , l q id , or p rticle-laden

gases can generate electrostatic c arges Common sources of ESD in lu e c arged:

p rson el, con u tors, common p lymeric materials, an proces in eq ipment ESD

damage can oc ur when:

• a c arged p rson or o ject comes into contact with an ESD sen itive device (ESDS);

• an ESDS comes into direct contact with a hig ly con u tive s rface whi e exp sed to an

electrostatic field;

• a c arged ESDS comes into contact with another con u tive s rface whic is at a diferent

electrical p tential This s rface may or may not b grou ded

Examples of ESDS are microcirc its, dis rete semicon u tors, thick an thin fi m resistors,

h brid devices, printed circ it b ard an piezo lectric cry tals It is p s ible to determine

device an item s s e tibi ty by exp sin the device to simulated ESD events The ESD

with tan voltage determined by sen itivity tests u in simulated ESD events do s not

neces ari y re resent the a i ty of the device to with tan ESD from re l sources at that

voltage level However, the levels of sen itivity are u ed to esta l s a b sel ne of

s s e tibi ty data for comp rison of devices with eq ivalent p rt n mb rs from diferent

man facturers Thre dif erent models have b en u ed for q al fication of electronic

comp nents – h man b d model (HBM), mac ine model (MM), an c arged device model

(CDM) In c r ent practice devices are q al fied only u in HBM an CDM s s e tibi ty tests

This stan ard covers the ESD control program req irements neces ary for setin up a

program to han le ESDS, b sed on the historical exp rien e of b th mi tary an commercial

organization The fu damental ESD control prin iples that form the b sis of this stan ard are

as fol ows

• Avoid a dis harge from an c arged, con u tive o ject (p rson el an esp cial y

automated han l n eq ipment into the ESDS This can b ac ompls ed by b n in or

electrical y con ectin al con u tors in the en ironment, in lu in p rson el, to a known

grou d or contrived grou d (as on b ard s ip or on aircraf This atac ment cre tes an

eq ip tential b lan e b twe n al con u tin o jects an p rson el Electrostatic

protection can b maintained at a p tential dif erent from a “zero” voltage grou d p tential

as lon as al con u tive o jects in the s stem are at the same p tential

• Avoid a dis harge from an c arged ESD sen itive device Chargin can res lt from direct

contact an se aration or it can b in u ed by an electric field Neces ary in ulators in

the en ironment can ot lose their electrostatic c arge by at ac ment to grou d Ionization

s stems provide neutralzation of c arges on these neces ary in ulators (circ it b ard

materials an some device p ck ges are examples of neces ary in ulators) The ESD

hazard cre ted by electrostatic c arges on the neces ary in ulators in the work place is

as es ed to en ure that a pro riate action are implemented, ac ordin to the risk

• On e outside of an electrostatic dis harge protected are (hereinafer refer ed to as an

EPA) it is general y not p s ible to control the a ove items, therefore, ESD protective

p ck gin may b req ired ESD protection can b ac ieved by en losin ESD sen itive

prod cts in static protective materials, althou h the typ of material de en s on the

adeq ate protection Outside an EPA, static dis harge s ieldin materials are

recommen ed Whi st al of these materials are not dis u sed in this stan ard, it is

imp rtant to recog ize the dif eren es in their a pl cation For more information se

IEC 613 0-5-3

Eac comp n has diferent proces es, an so wi req ire a diferent blen of ESD

prevention me s res for an o timum ESD control program Me s res s ould b selected,

b sed on tec nical neces ity an careful y doc mented in an ESD control program plan, so

that al con erned can b s re of the program req irements

Trainin is an es ential p rt of an ESD control program in order to en ure that the p rson el

in olved u derstan the eq ipment an proced res they are to u e in order to b in

compl an e with the ESD control program plan Trainin is also es ential in raisin awarenes

an u derstan in of ESD is ues Without trainin , p rson el are ofen a major source of

ESD risk With trainin , they b come an efective first l ne of defen e again t ESD damage

Reg lar compl an e verification c ecks an tests are es ential to en ure that eq ipment

remain efective an that the ESD control program is cor ectly implemented in compl an e

with the ESD control program plan

ELECTROSTATICS –

Part 5-1: Protection of electronic devices from

electrostatic phenomena – General requirements

This p rt of IEC 613 0 a pl es to activities that: man facture, proces , as emble, in tal ,

p ck ge, la el, service, test, in p ct, tran p rt or otherwise han le electrical or electronic

p rts, as embl es an eq ipment with with tan voltages gre ter than or eq al to 10 V HBM,

2 0 V CDM an 3 V for isolated con u tors ESDS with lower with tan voltages may

req ire ad itional control elements or adju ted l mits Proces es desig ed to han le items

that have lower ESD with tan voltage(s) can sti claim compl an e to this stan ard

This stan ard provides the req irements for an ESD control program IEC TR 613 0-5-2 [9]

1

provides g idan e on the implementation of this stan ard

This stan ard do s not a ply to electrical y initiated explosive devices, flamma le l q id ,

gases an p wders

The purp se of this stan ard is to provide the administrative an tec nical req irements for

esta l s in , implementin an maintainin an ESD control program (hereinaf er refer ed to

as the “program”)

NOT Isolate c n u tors were historic ly re rese te b MM

The folowin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le for its a pl cation For dated referen es, only the edition cited a pl es For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 613 0-2-3, Electrostatc – Part 2-3: Meth ds ofte st for determinin th resista ce a d

resistviy of sold p la ar materials used to a oid ele ctrostatc ch rge ac u mulato

IEC 613 0-4-1, Electrostatc – Part 4-1: Sta dard te st meth ds for sp ecific a p licato s –

Electrical resista ce of flo r co e rin s a d instaled flo rs

IEC 613 0-4-3, Ele ctrostatc – Part 4-3: Sta dard test meth ds for sp ecific a p licato s –

IEC 613 0-4-5, Ele ctrostatc – Part 4-5: Sta dard test meth ds for sp e cific ap p licato s –

Meth ds for ch racterizin th electrostatc p rotecto of fo twe ra dflo rin in com b in to

wih a p e rso

IEC 613 0-4-6, Electrostatc – Part 4-6: Sta dard test meth ds for sp ecific a p licato s –

Wrist strap s

_ _ _ _ _ _ _

IEC 613 0-4-7, Electrostatc – Part 4-7: Sta dard te st meth ds for sp ecific a p licato s –

Io izato

IEC 613 0-4-9, Electrostatc – Part 4-9: Sta dard te st meth ds for sp ecific a p licato s –

G arme ts

IEC 613 0-5-3, Ele ctrostatc – Part 5-3: Protecto of electro ic de vices from electrostatc

p he ome a – Prop ertes a d re uireme ts clas ificato for p ack gin inte ded for

electrostatc dis h rge se si v de ices

3 Terms and definitions

For the purp ses of this doc ment, the fol owin terms an definition a ply

NOT For th p rp ses of this d c me t “e rth” a d “gro n ” h v th same me nin

3.1

c arge d vic model

CDM

ESD stres model that a proximates the dis harge event that oc urs when a c arged

comp nent is q ickly dis harged to another o ject at a dif erent electrostatic p tential

Note 1 to e try: Ch rg d d vic mo elis d scrib d in A SI/E D /JEDEC JS-0 2-2 14 [1]

Note 2 to e try: This n te o ly a ples to th Fre c la g a e

3.2

common ground point

grou ded device or location where the con u tors of two or more ESD control items are

3.3

common conn ction point

device or location where the con u tors of two or more ESD control items are con ected in

order to brin the ESD protective items to the same electrical p tential throu h eq ip tential

b n in

3.4

e uip te tial bon

electrical con ection of con u tive p rts (or items u ed to control ESD) so that they are at

s bstantial y the same voltage u der normal an fault con ition

3.5

ele trostatic dis h rge

ESD

ra id tran fer of c arge b twe n b dies that are at diferent electrostatic p tentials

Note 1 to e try: This n te o ly a ples to th Fre c la g a e

3.6

ESD control items

materials or prod cts desig ed to prevent the generation of static c arge an /or dis ip te

static c arges that have b en generated so as to prevent damage to ESD sen itive devices

Note 1 to e try: This n te o ly a ples to th Fre c la g a e.

3.8

ESD s n itiv de ic

ESDS

sen itive device, integrated circ it or as embly that may b damaged by electrostatic field or

electrostatic dis harge

3.9

ESD withsta d volta e

hig est voltage level that do s not cau e device fai ure

Note 1 to e try: Th d vic p s es al teste lower v lta es

ESD stres model that a proximates the dis harge from the fin ertip of a typical h man b in

onto a pin of a device with another pin grou ded

Note 1 to e try: Huma b d mo el is d scrib d in IEC 6 7 9-2 [2]

Note 2 to e try: Thisn te o ly a ples to th Fre c la g a e

3.12

ma hin model

MM

ESD stres model that a proximates the dis harge to a device pin d e to contact of

eq ipment or to ls s c as those fou d in the man facturin l ne

Note 1 to e try: Ma hin mo el isd scrib d in IEC 6 7 9-2 [3]

Note 2 to e try: Thisn te o ly a ples to th Fre c la g a e

terminal u ed to con ect p rts to e rth for safety re son

4 Personnel safety

The proced res an eq ipment des rib d in this stan ard may exp se p rson el to

hazardou electrical con ition Users of this stan ard are resp n ible for selectin

eq ipment that compl es with a pl ca le laws, reg latory codes an b th external an internal

p l c Users are cautioned that this stan ard can ot re lace or s p rsede an req irements

for p rson el safety

Electrical hazard red ction practices s al b exercised an pro er grou din in tru tion for

eq ipment s al b folowed

5 ESD control program

5.1.1 ESD control program re uireme ts

The ESD control program s al in lu e al the administrative an tec nical req irements of

this stan ard The ESD control program s al doc ment the lowest ESD with tan voltage(s)

that can b han led The organization s al esta l s , doc ment, implement, maintain an

verify the compl an e of the program in ac ordan e with the req irements of this stan ard

5.1.2 ESD coordinator

A p rson s al b as ig ed by the organization with the resp n ibi ty for implementin the

req irements of this stan ard in lu in esta ls in , doc mentin , maintainin an verifyin

the compl an e of the program

5.1.3 Tai oring

This stan ard, or p rtion of it, may not a ply to al a pl cation Tai orin is ac ompl s ed by

evaluatin the a pl ca i ty of e c req irement for the sp cific a plcation Up n completion

of the evaluation, req irements may b ad ed, modified or deleted Tai orin decision ,

in lu in rationale an tec nical ju tification, s al b doc mented

5.2 ESD control program a ministrativ re uireme ts

5.2.1 ESD control program pla

The organization s al pre are an ESD control program plan that ad res es e c of the

req irements of the program Those req irements are:

The plan is the prin ip l doc ment for implementin an verifyin the program The goal is a

ful y implemented an integrated program that conforms to internal q al ty s stem

req irements The plan s al a ply to al a plca le facets of the organization’s work

5.2.2 Trainin pla

The trainin plan s al define al p rson el that are req ired to have ESD awarenes an

prevention trainin At a minimum, initial an rec r ent ESD awarenes an prevention

trainin s al b provided to al p rson el who han le or otherwise come into contact with an

ESDS Initial trainin s al b provided b fore p rson el han le ESD sen itive devices The

typ an freq en y of ESD trainin for p rson el s al b defined in the trainin plan The

trainin plan s al in lu e a req irement for maintainin employe trainin record an s al

doc ment where the record are stored Trainin method an the u e of sp cific tec niq es

are at the organization’s dis retion The trainin plan s al in lu e method u ed by the

5.2.3 Produ t q al fic tion

The organization s al q al fy al ESD control items that are selected for u e as p rt of the

ESD control program Ta les 2 an 3 l st the req ired prod ct q alfication test method ,

as ociated l mits for e c ESD control item an other req irements as stated in this stan ard

Ac e ta le eviden e of prod ct q al fication in lu es:

a) Prod ct data s e ts publ s ed by the man facturer of the ESD control item:

1) The data s e t s al referen e the req ired IEC test method for that item

2) The data s e t l mits s al , at a minimum, comply with the l mits for that ESD control

item

b) Test re orts from an in e en ent la oratory: the test re ort s al referen e the a pl ca le

IEC test method an the l mits s al comply with the l mits for that item as sp cified in this

stan ard

c) Test re orts generated internal y by the organization for its own u e: the test re ort s al

referen e the a pl ca le IEC test method an the lmits s al comply with the l mits for that

item

d) For ESD control items that were in tal ed by the organization b fore the ado tion of this

stan ard, on-goin compl an e verification record can b u ed as eviden e of prod ct

q al fication

For ESD control items that are not l sted in Ta les 2 an 3, but are con idered to b a p rt of

the ESD control program, the organization u in s c items s al q alfy these prod cts prior

to u e The test method u ed for prod ct q al fication an the u er defined ac e tan e l mits

for e c item s al b doc mented in the ESD control program plan

NOT IEC TR 613 0-5-2 c ntains g id n e for items n t lste in Ta les 2 a d 3 of this d c me t

5.2.4 Compl a c v rific tion pla

A compl an e verification plan s al b esta ls ed to en ure the organization’s fulfi ment of

the req irements of the plan Proces monitorin (me s rements) s al b con u ted in

ac ordan e with a compl an e verification plan that identifies the tec nical req irements to b

verified, the me s rement l mits an the freq en y at whic those verification s al oc ur

The compl an e verification plan s al doc ment the test method u ed for proces monitorin

an me s rements If the organization u es dif erent test method to re lace those of this

stan ard, the organization s al b a le to s ow that the res lts ac ieved cor elate with the

referen ed stan ard Where test method are devised for testin items not covered in this

stan ard, these s al b adeq ately doc mented in lu in cor esp n in test l mits

Compl an e verification record s al b esta ls ed an maintained to provide eviden e of

conformity to the tec nical req irements

The test eq ipment selected s al b ca able of ma in the me s rements defined in the

compl an e verification plan

Con ideration s ould b ta en regardin the lowest relative h midity levels exp rien ed by

the organization; some of the me s rements s ould b made u der these con ition

5.3 ESD control program pla te h ic l re uireme ts

The folowin s bclau es des rib the es ential tec nical req irements u ed in the

develo ment of an ESD control program

The req ired l mits are b sed on the test method or stan ard l sted in Ta le 1, Ta le 2 an

Ta le 3 The compl an e verification plan s al doc ment the method u ed to verify the

method an cor esp n in l mits u ed by the organization that difer from the test method

or referen es in Ta les 1 to 3 s al b doc mented with a tec nical ju tification that s p orts

their u e

Some of the tec nical elements l sted in Ta les 1 to 3 do not have a defined lower resistan e

l mit However, a minimum resistan e value may b req ired for safety re son

Se relevant national req irements an /or IEC 6 3 4[4] series, IEC TS 6 4 9-1[5]

IEC TS 6 4 9-2[6] IEC 61010-1[7] an IEC 61 4 [8]

5.3.2 Grounding/e uipote tial b nding s stems

In order to elminate ESD damage, it is neces ary to el minate dif eren es in p tential

b twe n ESDS an other con u tors that ESDS mig t come into contact with s c as

p rson el, automated han l n eq ipment, fixtures an mo i e eq ipment Al items that come

into contact with ESDS an are ca a le of con u tin electricity s al b con ected to grou d

or electricaly b n ed in order to el minate diferen es in p tential This can b ac ieved in

thre diferent way :

• Grou din u in protective e rth

The first an prefer ed ESD grou d is protective e rth if avai a le In this case, the ESD

control elements an grou ded p rson el are con ected to protective e rth (se

Fig re 1)

• Grou din u in fu ctional grou d

The secon ac e ta le ESD grou d is ac ieved throu h the u e of a fu ctional grou d

This con u tor can b a grou d rod, sta e or a se arate wirin s stem that is b n ed to

the AC grou d at the main service p nel (se Fig re 1); in order to el minate diferen es in

p tential b twe n protective e rth an the fu ctional grou d s stem, the two s stems

s al b electrical y b n ed together where p s ible

• Eq ip tential b n in

In the event that a grou d faci ty is not avai a le, ESD protection can b ac ieved by

con ectin al of the ESD control items together at a common con ection p int (se

Fig re 2) The maximum resistan e b twe n an protective item an the common

con ection p int s al comply with the lmits esta l s ed for the protective items as p r

Ta les 2 an 3

Whic ever grou din /b n in s stem is selected, it s al b refer ed to as “grou d” in the

remain er of this stan ard

6 Prote tiv e rth or fu ctio al gro n ( u ctio al gro n , if use , sh l b b n e to prote tiv e rth)

Figure 1 – Sc ematic of a EPA with a ground refere c

CAUTION: Users are ad ised to con ult local an national electrical codes an reg lation

b fore ma in an con ection to faci ty electrical wirin s stems

Figure 2 – Sc ematic of a e uipote tial bonding s stem

Table 1 – Groundin /bondin re uireme ts

Te hnic l requirement Groun ing metho Te t metho /stan ard Required l mits)

Gro n in /b n in system Prote tiv e rth Natio al ele tric l system

Al p rson el s al b grou ded or eq ip tential y b n ed ac ordin to the req irements

b low when han l n ESDS When p rson el are se ted at ESD protective workstation , they

s al b con ected to grou d via a wrist stra s stem

For stan in o eration , p rson el can b grou ded via a wrist stra s stem or by a

fo twe r- lo rin s stem When a fo twe r- lo rin s stem is u ed, p rson el s al we r ESD

• the total resistan e of the s stem ( rom the p rson, throu h the fo twe r an flo rin to

grou d) s al b les than 1,0 × 10

9

Ω;

• the maximum b d voltage generation s al b les than 10 V

Table 2 – Person el grou din re uireme ts

For situ tio swh re a E D g rme t is use as p rt of th wrist stra gro n in p th, th total system

resista c in lu in th p rso , g rme t a d gro n in c rd sh uld b les th n 3,5 × 10

gp refers to resista c to gro n a le p int

from th resista c v lu s th t were me sure for pro u t q alfic tio for th fo twe r a d th flo r to

c mply with th < 10 V b d v lta e g n ratio a d use th se resista c s for c mpla c v rific tio

5.3.4.1 Ha dl n ESDS a d a c s to EPA

Han ln of ESDS without ESD protective coverin or p ck gin s al b p rformed in an

EPA The b u daries of the EPA s al b cle rly identified as EPA bou daries (e.g, Caution

sig s in icatin the existen e of the EPA can b p sted an con pic ou to p rson el prior to

entry to the EPA.)

NOT An E A c n, for e ample, c nsist of a b idin , a e tire ro m or a sin le workstatio

Ac es to the EPA s al b lmited to p rson el who have completed a pro riate ESD

trainin Untrained in ivid als s al b es orted by trained p rson el whi e in an EPA

5.3.4.2 Ins lators

Al non-es ential in ulators an items (plastic an p p r), s c as cof e c ps, fo d

wra p rs an p rsonal items s al b removed from the workstation or an o eration where

The ESD thre t as ociated with proces es ential in ulators or electrostatic field sources

s al b evaluated to en ure that:

• the electrostatic field at the p sition where the ESDS are han led s al not ex e d

If the me s red electrostatic field or s rface p tential ex e d the stated l mits, ionization or

other c arge mitigatin tec niq es s al b u ed

Some of the me s rements s ould b ta en at the lowest exp cted relative h midity

exp rien ed by the faci ty

NOT 1 Th se me sureme ts are ma e b se o th fre u n y d fin din th c mpla c v rific tio pla

NOT 2 An E Dthre t is c nsid re a metal to metal c nta t whie th E DSis in th prese c of th field

NOT 3 Th a c rate me sureme t of ele trostatic fields re uires th t th p rso ma in th me sureme t is

fami ar with th o eratio of th me surin e uipme t Most h n h ld meters re uire th t th re din b ta e at

a fix d dista c from th o je t Th y also n rmaly sp cify th t th o je t h s a minimum dime sio of fix d size

in ord r to o tain a a c rate re din

5.3.4.3 Isolate condu tors

When esta l s in an ESD control plan, if a con u tor that comes into contact with an ESDS

item can ot b grou ded or eq ip tential y b n ed together, then the proces s al en ure

that the dif eren e in p tential b twe n the con u tor an the contact of the ESDS item is

les than 3 V

This can b ac ompl s ed by me s rin the ESDS item an the con u tor by u in : a non

-contact electrostatic voltmeter or a hig imp dan e contact electrostatic voltmeter

NOT Th 3 V lmit is relate toth le ela hie a le usin io izers sp cifie inthis sta d rd

5.3.4.4 ESD control items

An EPA s al b esta l s ed wherever ESD sen itive prod cts are han led without ESD

protective coverin or p ck gin However, there are man diferent way to esta l s an

ESD control program Ta le 3 l sts some o tional ESD control items whic can b u ed to

control static electricity For those ESD control items that are selected for u e in the ESD

control program, the req ired ran e for that item b comes man atory

If the l mits in Ta le 3 are ex e ded, the ESD control program s al in lu e a taiorin

statement as req ired by 5.1.3

Table 3 – EPA re uireme ts

Ω

R

p-p

< 1 × 109

Ωf

IEC 613 0-2-3 R

g

< 1 × 109

Ω IEC613 0-4-1 R

g

< 1 × 109

Ω

a

For pro u t q alfic tio , th e viro me tal c n itio s for testin sh uld b (12 ± 3) % R a d 2 °C ± 2 °C

Wh n n t sp cifie in th refere c d IEC sta d rd, th minimum e viro me tal c n itio in time for pro u t

q alfic tio sh uld b 4 h urs

b

Th test meth ds in th c mpla c v rific tio c lumnrefer to th b sic test pro e ureo ly It is n t

e p cte th t th test meth d wi b folowe in its e tirety

c

Symb ls use in this ta le: R

p-p refers to p int to p int resista c R

grefers to resista c to gro n a d R

ESD protective p ck gin an p ck ge markin s al b in ac ordan e with c stomer

contracts, purc ase orders, drawin or other doc mentation When the contract, purc ase

order, drawin or other doc mentation do s not define ESD protective p ck gin , the

organization s al define ESD protective p ck gin req irements for ESDS within the plan

b sed on IEC 613 0-5-3 Pack gin , when req ired, s al b defined for al material

movement within EPAs, b twe n EPAs, b twe n jo sites, field service o eration an to the

c stomer

5.3.6 Marking

ESDS, s stem or p ck gin markin s al b in ac ordan e with c stomer contracts,

drawin or other doc mentation do s not define ESDS, s stem or p ck gin markin , the

organization, in develo in the ESD control program plan, s al con ider the ne d for

markin If it is determined that markin is req ired, it s al b doc mented as p rt of the

plan

Annex A

(normative)

Test methods

The o erator s al stan with one fo t on the con u tive fo twe r electrode The han contact

plate s al b pres ed to verify that the p rson/o twe r s stem resistan e is within

ac e ta le p rameters (se Fig re A.1) The test s al b re e ted for the other fo t The test

a p ratu can b an integrated, commercial y avai a le tester or other in trumentation that is

ca a le of me s rin resistan e from 5,0 × 10

Bibl ography

[1] ANSI/ESDA/JEDEC JS-0 2-2 14, ESDA/JED EC J int Sta dard for Electrostatc

Device Se si viy Testn – Ch rg d Device Model (CD M) – De vice Le e l

[2] IEC 6 7 9-2 , Semico ductor de ice s – Mech nical a d clmatc te st meth ds –

Part 2 : Electrostatc dis h rge (ESD) se si viy testn – Hu ma b ody model (HBM)

[3] IEC 6 7 9-2 , Semico ductor de ice s – Me ch nical a d clmatc te st meth ds –

Part 27:Electrostatc dis h rge (ESD ) se si viy testn – Machin model (MM)

[4] IEC 6 3 4 (al p rts), Low-v la e electrical instalato s

[5] IEC TS 6 4 9-1, Efects ofcurre nt o hu ma b eings a d lv stock – Part 1: G en ral

asp ects

[6] IEC TS 6 4 9-2, Efects of curre nt o hu ma b e in s a d lv stock – Part 2: Sp ecial

asp e cts

[7] IEC 61010-1, Safety re uirem ents for electrical e u ipme t for me sureme t, co trol

a d lab oratory use – Part 1: G e neral re qu ireme ts

[8] IEC 61 4 , Protecto against electric sh ck – Commo asp cts for instalato a d

e u ipme t

[9] IEC TR 613 0-5-2, Electrostatc – Part 5-2: Protecto of electro ic de ices from

ele ctrostatc p e nome na – Use r guide