Iec ts 62239 1 2015

Us rs sh uld theref ore print this do ument usin a c lo r printer... Stre s le els in th Th inte rate circ it ma ufa turers are in re sin ly l mitin th ir pro u ts to c mmercial or in u

Edition 2.0 2 15-0

Co yr ig t © 2 15 IEC, Geneva, Switz r lan

Al rig ts r eser ve Unles oth rwise sp cifie , n p rt of this p blc tio ma b r epr od c d or uti ze in a y form

or b a y me ns, ele tr onic or me h nic l in lu in p oto o yin a d microfim, with ut p rmis io in wr itin from

eith r IEC or IEC's memb r Natio al Commite in th c u tr y of th re u ste If y u h v a y q estio s a o t IEC

c p r i ht or h v a e q ir y a o t o tainin a ditio al ri hts to thisp blc tio , ple se c nta t th a dr es b low or

y ur lo al IEC memb r Natio al Commite for ur th r informatio

CH-121 Ge e a 2 info@ie c

Ab ut t he IEC

Th Intern tio al Ele trote h ic l Commis io (IEC) is th le din glo al org nizatio th t pr ep res a d p blsh s

Internatio al Sta d r ds for al ele tri al ele tr onic a d relate te h olo ies

About IEC publc tion

Th te h ic l c nte t of IEC p blc tio s is k pt u d r c nsta t r eview b th IEC Ple se ma e sure th t y u h v th

latest e itio ,a c rr ig n a or a ame dme t mig t h v b e p blsh d

IEC Cat alog e - webst ore.e ch/ cat alog e

Th st an -alo e a plc t io for c nsultin th e tire

biblo ra hic l informat io o IEC Intern tio al Sta d rds,

Te h ic l Sp cific tio s, Te h ic l R ep rts a d oth r

d c me ts A v aia le for PC, Ma OS, A ndroid Ta let s a d

iPa

IEC publc t ion s arc - www ie c / se rc pub

Th a v an e se rc e a les t o fin IEC p blc t io s b a

variety of crit eria (refere c n mb r, t ext, t ec nic l

c m itt e,…) It also gives informatio o projec t s, re la e

a d wit hdrawn p blc tio s

IEC Ju t Publs e - webst ore.e c / j st publs e

St ay u to d te o al n w IEC p blc tio s Just Pu lsh d

d t ais al n w p blc t io s rele se A v aia le o ln a d

also o c a mo t h b emai

Ele t ro e ia - www ele t ro e ia.org

Th world's le din o ln dic t io ary of elec t ro ic a d

ele t ric l t erms c ntainin more t ha 3 0 0 terms a d

d finitio s in En lsh a d Fre c , wit h e uiv ale t t erms in 15

a ditio al la g a es Also k nown as t he Int ern t io al

Elec t rot ec nic l Vo a ulary (IEV ) o ln

IEC Glos ar y - st d.e c / glos ary

More t ha 6 0 0 ele t rot ec nic l termin lo y e t ries in

En lsh a d Fre c e tra t ed fom t he Terms a d Definitio s

cla se of IEC p blc t io s is u d sin e 2 0 Some e t ries

h v e b e c le t ed fom e rler p blc tio s of IEC TC 3 ,

7 , 8 a d CIS R

IEC Cu t omer Servic Ce t re - webst ore.ec c / cs

If y ou wish to giv e us your fe d a k o t his p blc tio or

n e furt her as ista c , ple se c nta t t he Customer Serv ic

Ce t re:csc@ie c

Edit ion 2.0 2 15-0

1 Sc p 7

2 Normativ ref ere c s 7

3 Terms, d f i itio s a d a bre iatio s 7

3.1 Terms a d d f i itio s 8

3.2 Ab re iatio s 12 4 Te h ic l re uireme ts 13 4.1 Ge eral 13 4.2 Comp n nt s le tio 14 4.2.1 Ge eral 14 4.2.2 Ap l c tio c n itio s f or u e 14 4.2.3 Av i a i ty a d d ra i ty 14 4.2.4 Ad itio al p rforma c 14 4.2.5 Comp n nt id ntif i atio 14 4.3 Comp n nt a plc tio 15 4.3.1 Ge eral 15 4.3.2 Ele troma n tic c mp tibi ty (EMC) 15 4.3.3 Deratin a d stre s a aly is 15 4.3.4 Th rmal a aly is 16 4.3.5 Me h nic l a aly is 17 4.3.6 Te tin , te ta i ty, a d maintain bi ty 17 4.3.7 Avio ic ra iatio e viro me t 18 4.3.8 Ma a eme t of le d-f re termin tio f i is a d s ld rin 18 4.3.9 Co nterf eite , fra d le t a d re y le c mp n nt a oid n e 18 4.3.10 Moisture a d c r o io 19 4.3.1 Ad itio al c stomer relate a plc tio re uireme ts 19 4.4 Comp n nt q alf i atio 19 4.4.1 Ge eral 19 4.4.2 Minimum c mp n nt q alfic tio re uireme ts 2

4.4.3 Origin l c mp n nt ma ufa turer q alty ma a eme t 2

4.4.4 Origin l c mp n nt ma ufa turer pro e s ma a eme t a pro al 2

4.4.5 Demo stratio of c mp n nt q al f i atio 2

4.4.6 Qu lfic tio of c mp n nts from a s p ler th t is n t q al fie 2

4.4.7 Distrib tor pro e s ma a eme t a pro al 2

4.4.8 Su c ntra tor a s mbly fa i ty q alty a d pro e s ma a eme t a pro al 2

4.5 Co tin o s c mp n nt q al ty a s ra c 2

4.5.1 Ge eral q al ty a s ra c re uireme ts 2

4.5.2 On-g in c mp n nt q alty a s ra c 2

4.5.3 Pla own r in-h u e c ntin o s mo itorin 2

4.5.4 Comp n nt d sig a d ma ufa turin pro e s c a g mo itorin 2

4.6 Comp n nt d p n a i ty 2

4.6.1 Ge eral 2

4.6.2 Comp n nt a ai a i ty a d a s ciate ris a s s me t 2

4.6.3 Comp n nt o s le c n e 2

4.7 Comp n nt c mp tibi ty with th e uipme t ma ufa turin pro e s 2

4.8 Comp n nt d ta 2

4.8.1 Ge eral 2

4.8.2 Minimum c mp n nt d ta re uireme ts 2

4.9 Co fig ratio c ntrol 2

4.9.1 Ge eral 2

4.9.2 Altern tiv c mp n nts 2

4.9.3 Altern tiv s urc s 2

4.9.4 Eq ipme t c a g d c me tatio 2

4.9.5 Cu tomer n tific tio s a d a pro als 2

4.9.6 Fo al org niz tio 3

5 Pla a ministratio re uireme ts 3

5.1 Pla org niz tio 3

5.2 Pla terms a d d f i itio s 3

5.3 Pla f oc l p int 3

5.3.1 Primary interf ac 3

5.3.2 Pla fo al p int re p n ibi tie 3

5.4 Pla refere c s 3

5.5 Pla a plc bi ty 3

5.6 Pla impleme tatio 31

5.6.1 ECMP c mpl a c 31

5.6.2 Pla o je tiv s 31

5.6.3 Pla own r s b o tra te a tivitie 31

5.7 Pla a c pta c 31

5.8 Pla mainte a c 31

An e A (informativ ) Re uireme t matrix for IEC TS 6 2 9-1 3

An e B (informativ ) Ty ic l q al fic tio re uireme ts a d ty ic l c mp n nt minimum q alf i atio re uireme ts 5

An e C (inf ormativ ) Semic n u tor rel a i ty a d we r o t 5

An e D (inf ormativ ) Guid ln s for e viro me tal prote tio te h iq e a d f or c mp ris n of c mp n nts s e ific tio s 5

Bibl o ra h 7

Fig re 1 – Su p ct c mp n nts p rimeter 19 Ta le A.1 – Re uireme ts matrix 3

Ta le B.1 – Ty ic l q alf i atio re uireme ts a d ty ic l c mp n nt minimum q al fic tio re uireme ts 5

Ta le D.1 – En iro me tal prote tio te h iq e to b c n id re d rin th a io ic d sig pro e s 5

Ta le D.2 – Guid l n s f or th c mp ris n of intern tio aly a ai a le c mp n nt s e ific tio s – Micro irc its 6

Part 1: Preparation and maintenance of an

electronic components management plan

FOREWORD

1) Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org nizatio for sta d rdizatio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q estio s c n ernin sta d rdizatio in th ele tric l a d ele tro ic f i lds To

this e d a d in a ditio to oth r a tivities, IEC p blsh s Intern tio al Sta d rds, Te h ic l Sp cif i atio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cific tio s (PAS) a d Guid s (h re f ter ref ere to as “IEC

Pu lc tio (s) Th ir pre aratio is e truste to te h ic l c mmite s; a y IEC Natio al Commite intereste

in th su je t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n

n-g v rnme tal org nizatio s laisin with th IEC also p rticip te in this pre aratio IEC c la orates closely

with th Intern tio al Org nizatio f or Sta d rdizatio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org nizatio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pres , as n arly as p s ible, a intern tio al

c nse sus of o inio o th rele a t su je ts sin e e c te h ic l c mmite h s re rese tatio fom al

intereste IEC Natio al Commite s

3) IEC Pu lc tio s h v th form of e omme d tio s f or intern tio al use a d are a c pte b IEC Natio al

Commite s in th t se se Whie al re so a le ef forts are ma e to e sure th t th te h ic l c nte t of IEC

Pu lc tio s is a c rate, IEC c n ot b h ld resp nsible for th wa in whic th y are use or f or a y

misinterpretatio b a y e d user

4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra sp re tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

b twe n a y IEC Pu lc tio a d th c resp n in n tio al or re io al p blc tio sh l b cle rly in ic te in

th later

5) IEC itself d es n t pro id a y atestatio of c nf ormity In e e d nt c rtific tio b dies pro id c nformity

as es me t servic s a d, in some are s, a c s to IEC marks of c nf ormity IEC is n t resp nsible f or a y

servic s c rie o t b in e e d nt c rtif i atio b dies

6) Al users sh uld e sure th t th y h v th latest e itio of this p blc tio

7) No la i ty sh l ata h to IEC or its dire tors, emplo e s, serv nts or a e ts in lu in in ivid al e p rts a d

memb rs of its te h ic l c mmite s a d IEC Natio al Commite s f or a y p rso al injury, pro erty d ma e or

oth r d ma e of a y n ture wh tso v r, wh th r dire t or in ire t, or for c sts (in lu in le al f ees) a d

e p nses arisin o t of th p blc tio , use of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Use of th refere c d p blc tio s is

in isp nsa le for th c re t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t some of th eleme ts of this IEC Pu lc tio ma b th su je t of

p te t rig ts IEC sh l n t b h ld resp nsible f or id ntif yin a y or al su h p te t rig ts

Th main ta k of IEC te h ic l c mmite s is to pre are Intern tio al Sta d rd In

e c ptio al circ msta c s, a te h ic l c mmite ma pro o e th p blc tio of a te h ic l

s e ific tio wh n

• th re uire s p ort c n ot b o tain d for th p blc tio of a Intern tio al Sta d rd,

d s ite re e te ef forts, or

• th s bje t is sti u d r te h ic l d v lo me t or wh re, for a y oth r re s n, th re is th

f uture b t n imme iate p s ibi ty of a a re me t o a Intern tio al Sta d rd

Te h ic l s e if i atio s are s bje t to re iew within thre y ars of p blc tio to d cid

wh th r th y c n b tra sf orme into Intern tio al Sta d rd

IEC TS 6 2 9-1, whic is a te h ic l s e ific tio , h s b e pre are b IEC Te h ic l

Commite 10 : Pro e s ma a eme t f or a io ic

relate to th s e if i p blc tio At this d te, th p blc tio wi b

• tra sforme into a Intern tio al sta d rd,

IMPORTANT – T e 'c lour inside' lo o o the c ver page of this pu l cation in icate

that it c ntains c lo rs whic are c nsidered to be us f ul f or the c r ect

u derstanding of its c ntents Us rs sh uld theref ore print this do ument usin a

c lo r printer

This te h ic l s e ific tio pro id s th stru ture f or a io ic e uipme t ma ufa turers,

s b o tra tors, mainte a c fa i tie , a d oth r a ro p c c mp n nt u ers to d v lo th ir

own Ele tro ic Comp n nt Ma a eme t Pla s (ECMPs), h rein fer als ref er e to a ‘pla ’

This te h ic l s e ific tio state o je tiv s to b a c mpls e Th pla is n t pre criptiv

a d th s wh pre are pla s in c mpl a c with this te h ic l s e if i atio wi d c me t

pro e s s th t are th mo t eff ectiv a d ef ficie t for th m in a c mpl s in th o je tiv s of

this te h ic l s e ific tio In ord r to al ow f l xibi ty in impleme tin a d u d tin th

d c me te pro e s s, pla own rs are e c ura e to refer to th ir own intern l pro e s

d c me ts in te d of in lu in d taie pro e s d c me tatio within th ir pla s

NOT Th e uipme t ma ufa turer, ofte c le in th in ustry th origin l e uipme t ma ufa turer (OEM) is in

g n ral c nsid re as th pla own r

This c mp n nt ma a eme t te h ic l s e ific tio is inte d d for a ro p c u ers of

ele tro ic c mp n nts This te h ic l s e ific tio is n t inte d d for u e b th

ma uf acturers of ele tro ic c mp n nts Comp n nts s le te a d ma a e a c rdin to th

re uireme ts of a pla c mpla t with this te h ic l s e ific tio ma b a pro e b th

c n ern d p rtie for th pro o e a plc tio , a d f or oth r a plc tio s with e u l or le s

s v re re uireme ts

Org niz tio s th t pre are s c pla s ma pre are a sin le pla , a d u e it for al rele a t

pro u ts s p l e b th org niz tio , or ma pre are a s p rate pla f or e c rele a t

pro u t or c stomer

electronic components management plan

This p rt of IEC 6 2 9, whic is a te h ic l s e ific tio , d fin s th re uireme ts f or

d v lo in a Ele tro ic Comp n nts Ma a eme t Pla (ECMP) to a s re c stomers th t al

This d c me t pro id s a aid in th a ro p c c rtif i atio pro e s

Alth u h d v lo e f or th a io ic in u try, this pro e s ma b a pl e b oth r in u trial

s ctors

Th f olowin d c me ts, in wh le or in p rt, are n rmativ ly ref ere c d in this d c me t a d

are in is e s ble f or its a plc tio For d te ref ere c s, o ly th e itio cite a ple For

ame dme ts) a pl e

IEC 6 3 6-1:2 12, P roces manag me t for avionic – At mosp eric rad iat ion efects – Part

1: Ac ommodati n of at mosp eric rad iati n efects via single event efects within avionic

electro ic e uipme t

1

IEC TS 6 6 7-1, P roces manag me t for avionic – Aerospa e and defe ce electro ic

systems co taining l ead-fe sol der – Part 1: Pre arat i n for a l ead -fe co trol plan

IPC/JEDEC J-STD-2 , M oist ure/Reflow Se sitivity Cla sific tions for No h rme c Sol id St at e

Sura e Mou t Devices

3 Terms, def initions and abbreviations

For th p rp s s of this d c me t, th f olowin terms, d f i itio s a d a bre iatio s a ply

NOT In th ir pla , pla own rsc n use altern tiv d finitio s c nsiste t with c n e tio in th ir c mp n

_ _ _ _ _ _

1

A n w e itio is u d r d v lo me t It wi b p blsh d so n

b u ht o tsid th pla own r org niz tio , f rom a in e e d nt s p ler

Note 1 to e try: This in ic tes th t th pla own r d es n t ma ufa ture this in-h use

c mp nent man facturer

org niz tio re p n ible f or th c mp n nt s e ific tio a d its pro u tio

3.1.8

c mp nent obsole cence

a s n e of a aia i ty of a c mp n nt whic is n t pro ura le d e to th ma uf acturer(s)

c a in pro u tio

Note 1 to e try: Comp n nt o solesc n e ma a eme t is c nsid re as a eleme t of c mp n nt d p n a i ty

3.1.9

c mp nent qual f i ation

pro e s u e to d mo strate th t th c mp n nt is c p ble of me tin its s e ific tio f or al

th re uire c n itio s a d e viro me ts

3.1.12

c mp nent stan ardiz tio

pro e s of d v lo in a d a re in b c n e s s o u if orm e gin erin criteria f or pro u ts

a d meth d f or a hie in c mp tibi ty, intero era i ty, interc a g a i ty, or c mmo al ty of

Note 1 to e try: It is th pra tic of pro u in pro u ts whic are imitatio s or are f ak g o s or servic s This

a tivity infin es th intele tu l pro erty rig ts of th origin l ma ufa turer a d is a i e al a t Co nterf eitin

g n raly relates to wiful tra e mark inf rin eme t

[SOURCE: IEC TS 6 6 8-1:2 14, 3.1.4]

3.1.14

c unterfeited c mpo ent

material g o imitatin or c p in a a th ntic material g o whic ma b c v re b th

prote tio of o e or more re istere or c nfid ntial intel e tu l pro erty rig ts

Note 1 to e try: A c u tereite c mp n nt is o e wh se id ntity or p digre h s b e altere or misre rese te

b itssu pler

Id ntity = origin l ma ufa turer, p rt n mb r, d te c d , lot n mb r,testin ,insp ctio , d c me tatio or wara ty

etc

Pe igre = origin, own rship history, stora e,h n ln , p ysic l c n itio , pre io suse etc

[SOURCE: IEC TS 6 6 8-1:2 14, 3.1.5]

3.1.15

f rau ulent c mp nent

ele tro ic c mp n nt pro u e or distrib te eith r in violatio of re io al or lo al law or

re ulatio , or with th inte t to d c iv th c stomer

Note 1 to e try: This in lu es, b t is n t lmite to th f olowin whic are e amples of c mp n nts whic are

f ra d le tly sold as n w o esto a c stomer:

(1) a stole c mp n nt;

(2) a c mp n nt scra p d b th origin l c mp n nt ma ufa turer (O M) or b a y user;

(3) a re y le c mp n nt, th t b c mes a f ra d le t re y le c mp n nt wh n it is a disas emble c mp n nt

resold as n w c mp n nt (se Fig re 1), wh re ty ic ly th re is e id n e of prior use a d rework ( e.g

sold r, re-platin or le d re-ata hme t a tivity)o th p c a e termin tio s;

(4) a c u terf eit c mp n nt,c p ,imitatio , f ul or p rtial su stitute of bra ds;

(5) f ra d le t d sig s, mo els, p te ts, sof tware or c p rig t sold as b in n w a d a th ntic F r e ample: a

c mp n nt wh se pro u tio a d distrib tio are n t c ntrole b th origin lma ufa turer;

(6) u lc nse c piesof a d sig ;

(7) a disg ise c mp n nt (remarkin of origin l ma ufa turer n me, ref ere c d te/c d or oth r id ntifiers

etc.), whic ma b a c u tereit c mp n nt;se Fig re 1;

(8) c mp n nt with ut intern l si c n die or with su stitute si c n die whic is n t th origin l ma uf acturer’s

Note 1 to e try: De e d bi ty is g n raly c ara terise b th f olowin fo r p rameters: rela i ty,

maintain bi ty, a aia i ty, safety

3.1.17

f ran his d distributor or agent

in ivid al or c rp rate org niz tio th t is le al y in e e d nt f rom th f ra c is r (in this

c s th ele tro ic c mp n nt ma uf acturer or OCM) a d wh a re s u d r c ntra t to

distrib te pro u ts u in th fra c is r’s n me a d s le n twork

Note 1 to e try: Distrib tio a tivities are c rie o t in a c rd n e with sta d rds set a d c ntrole b th

f ra c iser Shipme ts a ainst ord rs pla e c n b disp tc e eith r dire t fom th OCM or th fa c ise

distrib tor or a e t In oth r words, th fa c ise distrib tor e ters into c ntra tu l a re me ts with o e or more

ele tro ic c mp n nt ma uf acturers to distrib te a d sel said c mp n nts Distrib tio a re me ts ma b

stip late a c rdin to th folowin criteria: g o ra hic l are , ty e of cle tele (a io ics for e ample), ma imum

ma ufa turin lot size Comp n nts so rc d thro g this ro te are prote te b th O M’s wara ty a d su ple

with f ul tra e bi ty

[SOURCE: IEC TS 6 6 8-1:2 14, 3.1.9]

3.1.18

Electro ic Compo ents Management Plan

ECMP

pla own r's d c me t th t d fin s th pro e s s a d pra tic s f or a plyin c mp n nts to

a e uipme t or ra g of e uipme t a d whic g n ral y a dre s s al rele a t a p cts of

c ntrol n c mp n nts d rin s stem d sig , d v lo me t, pro u tio , a d p st pro u tio

Note 1 to e try: Resistors, c p citors, dio es, inte rate circ its, h brids, a plc tio sp cif i inte rate circ its,

wo n c mp n nts a d rela s are e amples of ele tro ic c mp n nt

3.1.2

electro ic eq ipment

f un tio in ele tro ic d vic pro u e b th pla own r, whic in orp rate ele tro ic

c mp n nts

Note 1 to e try: En items, su -as embles, ln -re la e ble u its a d sh p-re la e ble u its are e amples of

ele tro ic e uipme t

3.1.21

f lig t eq ipment

e uipme t u e for th a tiv flyin of th aircraf t (UAV, etc.) a d a s ciate with a tiv

f l in of th aircraf t s c a flg t re ord rs, etc

Note 1 to e try: This e clu es e uipme t fite to th aircraft n t a tiv ly in olv d with th f lyin of th aircraft,

su h as in-flg t e tertainme t, g le e uipme t, etc

3.1.2

NAND

Negative-AND

lo ic g te whic pro u e , in digital ele tro ic , a o tp t th t is fals (0) o ly if al its in uts

are tru (1) a d a o tp t tru (1) if o e or b th in uts are fals (0)

rec cled c mp nent

ele tric l c mp n nt remo e f rom its origin l pro u t or a s mbly a d a aia le for re s

Note 1 to e try: Th c mp n nt h s a th ntic lo os, tra emarks a d markin s Howe er, it ty ic ly h s n

o tp t to me sure th usef ul lfe remainin f or its re se A re y le c mp n nt c n fai e rler th n a n w o e

wh n re-as emble into a oth r pro u t or as embly A re y le c mp n nt ma also b p ysic ly or E D

d ma e d rin th remo al pro es

[SOURCE: IEC TS 6 6 8-1:2 14, 3.1.17]

risk management

a t or pra tic of d aln with ris th t in lu e pla nin for ris , a s s in (id ntifyin a d

a aly in ) ris are s, d v lo in ris h n l n o tio s, mo itorin ris s to d termin h w

ris s h v c a g d, a d d c me tin th o eral ris ma a eme t pro ram

3.1.3

sin le event ef fect

SEE

re p n e of a c mp n nt c u e b th imp ct of a sin le p rticle (f or e ample g la tic

c smic ra s, s lar e erg tic p rticle , e erg tic n utro s a d proto s)

Note 1 to e try: Th ra g of resp nses c n in lu e b th n n-d stru tiv (f or e ample u set a d d stru tiv (for

e ample latc -u or g te ru ture) p e ome a

[SOURCE: IEC 6 3 6-1:2 12, 3.4 ]

3.1.31

su c ntractor a s mbly faci tie

e uipme t to th pla own rs drawin s a d bi s of material a d te t s e ific tio s with ut

ownin th intel e tu l pro erty rig ts to th e uipme t

ma me t th d f i itio of fra d le t or c u terf eit c mp n nt

Note 1 to e try: Susp ct c mp n nts ma in lu e b t are n t lmite to:

AQEC Aero p c q al f i d ele tro ic c mp n nt (s e IEC TS 6 5 4-1)

BGA Bal grid ar a (relate to a ele tro ic c mp n nt p c a e)

EMC Ele troma n tic c mp tibi ty

FPGA Field-pro ramma le g te ar a

H3TRB Hig h midity, hig temp rature re ers bia

HAST Hig ly a c lerate stre s te tin

HCI Hot c r ier inje tio

HTOL Hig temp rature o eratin lfe

IECQ Intern tio al ele trote h ic l s stem q al ty

OEM Origin l e uipme t ma uf acturer

STACK STACK Intern tio al, a n n-profit c n ortium

re uireme ts whic a ply to al ele tro ic c mp n nts, in lu in of f- h -s elf c mp n nts,

whic are d f i e b th c mp n nt ma uf acturer's d ta s e t, a d c stom c mp n nts,

o to th sta d rd lst Comp n nts s o ld th n b s le te f rom th sta d rd lst f or u e in

s e ific a plc tio s Th s le tio pro e s ma in lu e le els of prefere c This ma refer

Th c n itio s f or u e of th c mp n nt s al b a e u tely id ntif i d from th c mp n nt

s e ific tio b s d o th c mp n nt ma uf acturer’s d ta s e t a d a y a ditio al

(c mp n nt a plc tio ) a d 4.6 (c mp n nt d p n a i ty) In s me a pl c tio s a AQEC

c mp n nt in c nf ormity with IEC TS 6 5 4-1 or a c stom c mp n nt with s e ial d sig

c ara teristic or s e ial s re nin ma b re uire in te d Us rs n e to d mo strate wh

d mo stratio s ma in lu e (1) th a aly is of c mp n nt f i ld history of simiar e uipme t in

If a ditio al p rforma c is re uire ( or e ample u s re nin , u ratin , a ditio al

u iq ely id ntif i d (Se th rmal a aly is, 4.3.4.)

4.2.5 Comp nent identif icatio

Ea h s le te c mp n nt s al b c mpre e siv ly id ntif i d within th s le tio pro e s

NOT As o iate c mp n nt d ta a d informatio are a dres e in 4.8.2

4.3 Comp nent ap l cation

4.3.1 General

4.3.1.1 Appl catio pro e s s

d c me te in a pla Not al of th c te orie lste b low are rele a t to e ery c mp n nt

a pl c tio ; th ref ore, th re uireme ts lste b low are a plc ble o ly if rele a t to th

giv n a plc tio Th pla s al :

1) Do ume t th pro e s s th t are e p cte to b a plc ble to th majority of th pla

own r’s pro u ts, with th u d rsta din th t s me of th d c me te pro e s s ma n t

b u e for s e ific pro rams or s e ific f un tio alty of pro u ts

2) Verify if th e uipme t c ntainin th c mp n nt is c p ble of c ntin in to me t its

p rforma c re uireme ts a d s e if i atio s thro g o t th ma ufa turin , f ul s rvic

stora e, a d o eratin l f etime

Ta le D.1 pro id s more inf ormatio o e viro me tal prote tio te h iq e whic ma b

Th fol owin a plc tio pro e s s are n t s e ific to a in ivid al c mp n nt, b t are

ty ic l y e c u tere wh n th c mp n nt is pla e into a circ it a s mbly

4.3.2 Electromag etic c mpatibi ty (EMC)

EMC is d mo strate b a aly is, te tin a d simulatio to c stomer re uireme ts Th

c mp n nt p rforma c s al b c p ble of EMC c mpla c at e uipme t le el

Certain c mp n nts, for e ample hig p wer switc in c mp n nts, ma pro u e more

ele troma n tic sig al th n oth r ty e a d a ditio al y c rtain c mp n nts c n b more

s s e tible to ele troma n tic interfere c th n oth rs EMC a p cts at ele tro ic

c mp n nt le el h v b e a dre s d in th IEC 619 7 s rie a d IEC 6 13 s rie Te tin

is ty ic l y c r ie o t at ele tro ic e uipme t le el

4.3.3 Derating an stre s analysis

4.3.3.1 Verif ication of deratin criteria

Th d c me te pro e s s s al v rify th t th c mp n nt is u e within th o eratin l mits

s e ifie b th origin l c mp n nt ma ufa turer a c rdin to a d c me te s t of d ratin

criteria, b s d wh re er p s ible o th c mp n nt ma uf acturer’s d ratin criteria a d

meth d a d th re f ter u in th pla own r’s a pro riate d ratin criteria a d meth d

4.3.3.2 Fai ure to me t derating criteria

Al in ta c s in whic a c mp n nt fai s to me t th d ratin criteria a o e (s e 4.3.3.1) s al

b d c me te in th d sig re ord , with th c r e tiv a tio , or th ju tific tio for n t

s tisfyin th criteria s al b d c me te

Comp n nts h n le in th ma n r d s rib d in JEP14 are c n id re to b u e within th

s e ific tio lmits pro id d b th ma uf acturer, if intern l p rameters a d te h ic l d ta

u e f or c mp n nt th rmal mo el n (whic e c mp s e th a plc tio ) are d c me te

with th c mp n nt ma ufa turer d ta JEP14 o tln s two imp rta t a aly e relate to

th rmal c n id ratio s of th a pl c tio : rela i ty a d fu ctio al p rforma c , b th of whic

emplo a pro e s uti zin ju ctio temp rature a aly is Th s a aly e ma re uire

inf ormatio f rom th c mp n nt ma ufa turer n t pro id d in p bl s e d ta s e ts In th s

a pro riate a pl c tio of th c mp n nt with re ard to th s is u s

NOT Deratin th d vic stres ors c n mitig te semic n u tor we r o t me h nisms (se 4.6.7) a d c uld

e a le impro eme t of b th th d vic rela i ty a d th d vic o eratin lf e c p bi ty Th d ratin c n ta e

se eral f orms whic in lu e v lta e d ratin , o eratin f re u n y re u tio , c mp n nt h ld in sta d y ti th

re uire re u tio of p wer is dis ip te a d e viro me t impro eme t Meth ds of th rmal d ratin of

semic n u tor d vic s are d taie in JE 14 a d meth ds for d terminin a c leratio f actors f orm testin in

4.3.3.3.2 Comp nent us d o tside the original c mp nent man facturers’

specif icatio s (u ratin pro e s)

s e ific tio s ( h rmal, v lta e, fre u n y, etc) is stro gly dis o ra e

Wh re n c mp n nts are a aia le th t are fu ctio aly a pro riate a d o erate with th

lmits s e ifie , th u e of AQEC c mp n nts (s e 4.4.5.3.2.3) to IEC TS 6 5 4-1, within a

own r is to c nta t th origin l c mp n nt ma ufa turer to d termin if th y are wi in to

pro u e a s ita le AQEC c mp n nt or to p rf orm th u ratin pro e s (c stom p rt n mb r

or cre tio of a n w COTS c mp n nt Th a o e pro e s s are to b folowe b fore th

pla own r c n id rs u in his own u ratin pro e s

s e ific tio s a d u rate b th pla own r, th pla own r s al impleme t a c p bi ty

a s s me t pro e s in lu in ris s a s s me t a d ris s mitig tio in th a pl c tio Th

pla own r s al d mo strate h w th u ratin pro e s is c ntrole

NOT Temp rature u ratin isa dres e in 4.3.4.2

4.3.3.3.3 Identificatio of uprated c mpo ent

A lst of th s c mp n nts u e o tsid th o eratin l mits s e if i d b th origin l

c mp n nt ma uf acturer s al b cle rly id ntif i d b th pla own r with s e ific c mp n nt

ref ere c s a d c stom drawin s Th c stomer s al b n tif i d of this l st u o re u st

4.3.4 T ermal analysis

4.3.4.1 T ermal suitabi ty verificatio

Th d c me te pro e s s s al v rify th t th c mp n nt is u e within th temp rature

lmits s e ifie b th origin l c mp n nt ma ufa turer, or b th pla own r

Wh re n c mp n nts are a aia le th t are f un tio aly a pro riate a d o erate within th

lmits s e if i d, th u e of AQEC c mp n nts (s e 4.4.5.3.2.3) to IEC TS 6 5 4-1, within a

own r c n c nta t th origin l c mp n nt ma uf acturer to d termin if th y are wi in to

pro u e a s ita le AQEC c mp n nt or to p rf orm th u ratin pro e s (c stom p rt n mb r

or cre tio of a n w COTS c mp n nt Th a o e pro e s s are pref er e b f ore th pla

own r c n id rs u in its own u ratin pro e s (s e 4.3.4.2)

4.3.4.2 Temperature u ratin

a s s me t pro e s in lu in ris s a s s me t a d ris s mitig tio in th a pl c tio Th

Re omme d tio s a d g id ln s o h w to d this are c ntain d in IEC TR 6 2 0-1 a d

ma b u e in a ditio to th pla pre are a c rdin to this te h ic l s e ific tio (ref er to

4.3.3.3) Note th t u e of IEC TR 6 2 0-1 is a n n-pref er e te h iq e Eq iv le t

pro e ure from oth r d c me ts ma als b p rmis ible if ju tif i d

NOT 1 A c mmo ma imum temp rature f or semic n u tor d vic s is th ju ctio temp rature In some

insta c s, oth r lmitin temp ratures c n b sp cifie f or semic n u tor d vic s driv n b p ysic l pro erties of

materials use in p c a in , b n p d a d le d fame, etc a d oth r ty es of c mp n nts Wh n th a plc tio

th rmal a alysis h s su c s fuly impleme te th th rmal a d stres a alysis pro es o tln d in 4.3.3, in

a c rd n e with th c mp n nt ma uf acturer, th c mp n nt is c nsid re to b use within th ma ufa turer’s

ratin

NOT 2 In some insta c s, th ma uf acturer d es n t sp cify th ma imum temp rature Howe er, th ma imum

temp rature c n b c lc late f rom oth r informatio su ple b th c mp n nt ma ufa turer

NOT 3 Verif i atio pro es es c n in lu e a alysis, mo el n , th rmal surv y, simulatio , or testin Testin is

NOT Verific tio pro es es c n in lu e a alysis, mo el n , simulatio , or testin

4.3.5.2 Mec anical stre s s generated b temperature variatio (c cl n )

Th d c me te pro e s s s al v rify th t th c mp n nt is c mp tible with th me h nic l

stre s s g n rate b mismatc e of c ef ficie ts of th rmal e p n io of th diff ere t

materials thro g o t th a pl c tio lfetime

NOT Verific tio pro es es c n in lu e a alysis, mo el n , simulatio , or testin

4.3.6 Te tin , te tabi ty, an maintainabi ty

Th d c me te pro e s s s al a s re te ta i ty a d maintain bi ty of th e uipme t b

th pla own r

Th f oc s h re is o te tin a d te ta i ty with re ard to c mp n nt v rif i atio , n t o

s fware or s stem v rific tio Ex mple in lu e b ard le el or s b-a s mbly le el te tin ,

pro isio f or te t pin , a d e s rin th t oth r e uipme t le el te ts wi b a ai a le to v rify

c mp n nt fu ctio at th a pro riate le el Ex a stiv te tin of c mple c mp n nts is n t

alwa s re lstic, b t d c me te pro e s s s o ld a s re s me le el of e alu tio of al

c mp n nts at a pro riate p ints in th pro u tio flow

Th d c me te pro e s s s al v rify th t th c mp n nts wi o erate s c e sful y in th

a pl c tio with re ard to th eff ects of atmo p eric ra iatio o th m in a c rd n e with

Cla s 9 (SEE c mpl a c ) of IEC 6 3 6-1:2 12 a d with ref ere c to th oth r p rts of th

IEC 6 3 6 s rie

Th s ef fe ts in lu e v rio s ty e of sin le e e t eff ects (SEE), s c a sin le e e t u s t

(SEU), sin le e e t latc -u (SEL), sin le e e t b rn-o t (SEB) a d sin le e e t fu ctio al

inter u t (SEFI) If ra iatio ef fe ts are a c mmo ate b th e uipme t d sig , th n th

Guid n e o th eff ects of atmo p eric ra iatio ma b fo n in th IEC 6 3 6 s rie Th

eff ects of atmo p eric ra iatio a d th ir a c mmo atio s al b a s s e a d d c me te

Th SEE a s s me t is a hie e thro g q a tifyin th SEE rate in a io ic s stems in

a c rd n e with IEC 6 3 6-1, b s d o :

a) th atmo p eric n utro e viro me t;

b) th c mp n nts in a giv n s stem;

c) th SEE re p n e of th s c mp n nts to e erg tic n utro s

NOT Th S E resp nse of d vic s is c mplc te a d h s b e sh wn to in re se sig if i a tly with a v n in

inte rate circ it te h olo ies, f or e ample, re u e fe ture size Th s for f eature sizes of < 3 nm in SR Ms, al

n utro intera tio s are e p cte to result in two or more u sets within th memory ara c mp re to

te h olo ies of >15 nm wh re a pro imately 3 % to 5 % of th intera tio s resulte in multi-c l u sets In a

simiar ma n r diff ere t re isio s of th same c mp n nt (id ntic l p rt n mb r) in orp ratin mo ific tio s in

th ir die f abric tio pro es , c n dramatic ly c a g f rom n se sitivity to a pro o n e S E se sitivity

4.3.7.2 In u ed radiatio

Wh n a io ic ele tro ic is s bje t to larg amo nts of total d s ra iatio , f or e ample a a

re ult of stru tural X-ra s a aly is or of X-ra in p ctio in th ele tro ic b ard a s mbly

NOT 1 IEC T 6 6 7-1 ta es into c nsid ratio th p te tial d leterio s ef fe ts of tin whisk rs as p rt of th

le d-fe c ntrol pla ; this c n ern isa dres e b IEC T 6 6 7-2

NOT 2 Guid ln s for pla nin p rf orma c testin for systems c ntainin le d-f re sold r a d finish s are

in lu e in IEC T 6 6 7-3

4.3.9 Cou terfeited, frau ulent and rec cled c mp nent av idance

IEC TS 6 6 8-1 giv s re uireme ts a d g id ln s to a sist with a oidin c u terf eite ,

f ra d le t a d re y le c mp n nts a d with ma a in s s e t c mp n nts (s e Fig re 1)

NOT : Th f i ure is ta e f rom IEC T 6 6 8-1:2 14, 4.4.3

Fig re 1 – Suspect c mp nents perimeter

Th pla own r s al h v a ris mitig tio pla d s ribin h w to a oid a d pre e t th u e

of c u terfeite , fra d le t a d re y le c mp n nts u in intern tio al sta d rd , f or

e ample IEC TS 6 6 8-1 or SAE AS5 5 or a e uiv le t meth d

NOT 1 Th risk as o iate with n n-f ra c ise distrib torsis c nsid re in IEC T 6 6 8-2

NOT 2 Th d f i itio s for c u terf eite , fa d le t a d re y le c mp n nts are fo n in IEC T 6 6 8-1 or

SAE AS5 5

4.3.10 Moisture an c r osio

Th d c me te pro e s s s al v rify th t th c mp n nt is c mp tible with th s stem

a pl c tio e viro me t for moisture a d c r o io

4.3.1 Additional c stomer related ap l cation requirements

Wh n th mis io profi e (s e 4.6.8) c ntain a ditio al c stomer re uireme ts whic are

o tsid th s o e of this pla , th n th pla own r s al d mo strate h w th s re uireme ts

are a c mpls e

4.4 Comp nent qual ficatio

4.4.1 General

Th d c me te pro e s s s al v rify th t th in tal e c mp n nt is q alfie for th

a pl c tio re uireme ts f or p rf orma c a d rela i ty thro g th pro e s s lste in this

4.4.2 Minimum c mp nent qual f ication req irements

Comp n nts s al b o tain d from ma ufa turers wh me t th re uireme ts of 4.4.3, 4.4.4,

s stem is a major p rt of th pla own r v rific tio

NOT An intern tio aly re o nise q alty ma a eme t system c n b rele a t p rts of th ISO 9 0 series or

e uiv le t

4.4.3.2 Qual ty system a s s ment

Wh re th origin l c mp n nt ma uf acturer is n t a s s e in a c rd n e with 4.4.3.1 a o e

ma a eme t s stem of th origin l c mp n nt ma uf acturer is maintain d, in lu in e a l n

a a dit o th c mp n nt ma uf acturin f aci ty c n u te b s ita ly train d a ditors in

a c rd n e with a intern tio al y re o nis d q alty ma a eme t s stem

NOT An intern tio aly re o nise q alty ma a eme t system c n b rele a t p rts of th ISO 9 0 series or

e uiv le t

4.4.4 Original c mp nent manuf acturer proce s management appro al

Th pla own r s al v rify th t th origin l c mp n nt ma ufa turer h s a ma ufa turin

pro e s c p bi ty uti sin ma uf acturin te h olo ie with d mo stra le re e ta i ty whic

ma b s tis e b o e of th f ol owin :

a) Ap ro al of th c mp n nt ma ufa turin pro e s b a rele a t a th rity or b d , with

s e ific v rific tio th t th ma uf acturin pro e s re ults in d mo strate pro u t

rela i ty in lu in th c mp n nt q alfic tio pro e s for e c c mp n nt v rifyin th t th

in tale c mp n nt is q al fie for th circ it a plc tio re uireme ts Th s re uireme ts

in lu e p rforma c a d rel a i ty thro g th pro e s s lste in this te h ic l s e ific tio

a d in lu in te t pro e ure , s mpln a d criteria of a c pta c (with th d fin d margin )

This c n b d mo strate b a y of th f olowin (s e 4.4.5.2 to 4.4.5.3), b t th c oic s al

b ju tif i d

NOT Ad itio al v ld tio c n b c nsid re (se 4.4.3.5).

4.4.5.3.2 Comp nent man facturer tec nolog q al ficatio data

4.4.5.3.2.1 Suitable c mp nent manuf acturer data

Origin l c mp n nt ma uf acturers p rf orm a d re ord d ta from initial a d re ular o -g in

q al f i atio te tin o sig ific nt n mb rs of c mp n nts Th pla own r s al re iew s c

d fin d q alfic tio te tin with a c pta c criteria a d re ultin d ta for s ita i ty in th

e d a plc tio a d v ld te th t e c c mp n nt ty e uti z d is a e u tely q al fie for th

c stomer p rf orma c re uireme ts Comp n nt ma ufa turers pro u e c mp n nts a ro s

a wid ra g of mark t s ctors, a d q alf i atio te tin wi refle t th s Stre s le els in th

Th inte rate circ it ma ufa turers are in re sin ly l mitin th ir pro u ts to c mmercial or

in u trial temp rature ra g pro u ts This tre d is mo t pro o n e in th f un tio al are s

th t are critic l to a io ic pro u ts, micro ro e s rs, FPGAs a d memorie

4.4.5.3.2.3 Us of AQEC

Th u e of d ta o tain d from a a io ic q al f i d ele tro ic c mp n nt ma uf acturer (a

p r IEC TS 6 5 4-1) is p rmite a d e c ura e This d ta is n t g ara te d p rforma c

d ta a d it wi b n c s ary f or th a io ic ma ufa turer to v ld te th t e c d vic

uti z d me ts th c stomer p rforma c re uireme ts in 4.3, 4.4 a d 4.6

NOT Comp n nts c mpla t with AQEC are ty ic ly sole so rc pro u ts F rth r, e c AQEC d vic ty e c n

b teste to dif fere t le els, th refore th re is n sta d rdizatio g ara te d f rom o e AQEC ma ufa turer to

a oth r for th same n min l c mp n nt

Th AQEC pro ram is b sic l y a me h nism to o tain d ta f rom th d vic ma ufa turer

whic is n t f ormal y a ai a le Th a aia i ty of this d ta d e n t s b titute for g ara te d

p rforma c d ta a d d vic c ara teristic c a g s are n t n c s ari y g in to b c v re

b PCNs or oth r c a g n tific tio

4.4.5.3.3 In-s rvice ex erien e

Satisfa tory p rf orma c in lu in rela i ty of th c mp n nt in a simiar or h rs er

e viro me t s al b d c me te

4.4.5.3.4 Simi arity

Th pla s al a dre s th gro n rule for a s s me t b simi arity to oth r c mp n nts

in lu in d c me tary e id n e from te t d ta or in-s rvic e p rie c of a pre io sly

q al fie a s ciate c mp n nt For f urth r d tais o simiarity rule , ref er to rele a t

For e uipme t whic c ntain s f tware, c mp n nt v ld tio c n d mo strate or v rify th t

th c mp n nts a d th o eratio al s f ware are c mp tible o er th e tire o eratin ra g

of th e uipme t

Th pla own r c n d fin s ita le, d f i e a d ju tifie fu ctio al margin of th a plc tio

to v l d te th t c mp n nt v riatio wi n t c u e e uipme t fai ure d rin o eratio

If pla own r v ld tio is uti z d b c u e th c mp n nt q alfic tio inf ormatio a aia le

ma uf acturer fra c is is c n id re th lower ris of b in c u terf eite or fra d le t Th

pla own r s al v rify th t th distrib tors h v a d c me te q alty ma a eme t s stem in

a simi ar wa to 4.4.3.1 or 4.4.3.2, relate to th origin l c mp n nt ma uf acturer, b s d o ,

a a minimum re uireme t, a intern tio aly re o nis d q al ty ma a eme t s stem for al

its a tivitie in lu in stora e, c mp n nt h n ln , tra e bi ty, te tin , s ipme t,

informatio a d te h ic l d ta h n ln

NOT An intern tio aly re o nise q alty ma a eme t system c n b rele a t p rts of th ISO9 0 or

AS/E /JISQ910 seriesor e uiv le t

Th pla own r s al v rify th t th distrib tors h v a c u terfeite ele tro ic c mp n nts

a oid n e pro e s

Wh n th distrib tor a c pts return d sto k f rom c stomers, th s c mp n nts wi h v to

b c n id re in th c u terf eit or f ra d le t ris ma a eme t pla

4.4.7.2 Franc is d distributors

Wh re er p s ible th s p ly of c mp n nts from a origin l c mp n nt ma ufa turer or

origin l c mp n nt ma uf acturer fra c is s al b s le te o er n n fra c is d distrib tors

NOT Fra c ise distrib tors c n so n impleme t a ti-c u tereit mitig tio s b se o th forth omin SAE AS

6 9

4.4.7.3 Non- ranc is d or n n-authoris d distrib tors

If th pla own r or its distrib tor s p le c mp n nts oth r th n f rom a origin l c mp n nt

ma uf acturer or origin l c mp n nt ma ufa turer f ra c is th n th s c mp n nts are

c n id re at hig er ris of b in c u terf eite or fra d le t th n th s from fra c is d

distrib tors Th pla own r s al impleme t in th frame of its c u terf eit ele tro ic

c mp n nts a oid n e pro e s me s re f or pre e tin a d a oidin pro ureme t a d

s p ly of c u terfeite or fra d le t c mp n nts

NOT 1 IEC T 6 6 8-2 of fers c nsid ratio s, re uireme ts a d g id ln s for a oidin th use of c u terf eite ,

re y le a d fa d le t c mp n nts wh n th se c mp n nts are p rc ase o tsid of f ra c ise distrib tor

n tworks

NOT 2 Usu ly this pra tic c resp n s to e c ptio al circ msta c s a d after h vin e h uste al o tio s

within th origin l c mp n nt ma ufa turer a d th f ra c ise system Purc asin thro g n n-f ra c ise

c a n ls is c nsid re as a d ro atio pro es with hig risk f or whic th pla own r is f uly resp nsible

4.4.8 Sub o tractor a s mbly faci ty q al ty an proce s management appro al

c mp n nts u e thro g o t th pro u tio c cle, prior to d l v ry This is to a s re th t th

imp ct of c mp n nt ma ufa turer lot to-lot v riatio s, lot to-lot a s mbly h n l n v riatio s,

etc are minimiz d a d c ntrol e This wi a s re th d lv re c mp n nts c nform to th

d lv re e uipme t re uireme ts

4.5.2 On-g in c mp nent q al ty a suran e

4.5.2.1 Comp nent manufacturer qual ty a surance

a cre ite c mp n nt a s s me t s stem, whic in lu e a me n to a s s c ntin o s

q al ty a s ra c Su h a s s me t s stems in lu e a plc ble intern tio al a d in u try

c n e s s sta d rd , or th pla own r's a pro e pro e s f or e alu tio of th origin l

c mp n nt ma ufa turer’s intern l q alty a s ra c pro e s s

NOT Ex mples of g v rnme t or in ustry sta d rds are th D D q alfie ma uf acturers lsts, DSC (JAN),

AEC-Q10 , AEC-Q2 0, AEC-Q101, IEC T 6 6 6-1 or S A K S/0 01 a d CEC /IECQ a pro e ele tro ic

c mp n ntssuita le for th a plc tio

4.5.2.2 Comp nent q al ty a suran e data

Wh re th re uireme t of 4.5.2.1 is n t met, th pla own r s al h v a d c me te pro e s

to a s re th t c mpla c to th c mp n nt s e ific tio is maintain d, eith r b origin l

c mp n nt ma ufa turer te t or pla own r te t wh re:

NOT Ty ic l q alty as ura c pro es es in lu e statistic l pro es c ntrol p rio ic q alf i atio testin ,

c mp n nt testin a d scre nin , etc

4.5.4 Comp nent de ign an man f acturin pro e s c an e mo itoring

Th pro e s f or tra kin (or d te tin ), a d mo itorin c mp n nt d sig a d ma ufa turin

pro e s c a g d ta, with a aly is a d a pro riate c re tiv a tio s, s al b d c me te

in lu in th eff ects of th s c a g s o e uipme t p rforma c a d u in d sig c a g

pro e ure in a c rd n e with 4.9 This pro e s c uld in lu e: dire t informatio f rom

c mp n nt ma uf acturers or distrib tors, s arin te h ic l informatio s urc s, oth r u ers’

inf ormatio , f un tio al or p y ic l a aly is d rin in-h u e pro e sin

NOT 1 Most of th c mp n nts use in a rosp c a plc tio s are d sig e , ma ufa ture a d targ te f or

oth r in ustries, a d are b y n th c ntrol of th pla own r Fre u nt d sig a d ma uf acturin c a g s are

ma e to impro e yield, re u e c st, a d e h n e p rf orma c Alth u h th se c a g s are d c me te b th

c mp n nt ma ufa turer a d e alu te for th ir ef fe ts o hig -v lume a plc tio s, th ir eff ects o th u iq e

a plc tio s of th pla own r ma n t b e alu te or d c me te b th c mp n nt ma uf acturer Th p rp se

of 4.5.4 is to d scrib a pro es to mo itor th c mp n nts to d te t a y c a g s th t ma aff ect th ir

p rorma c in th a plc tio s of th pla own r

Ty ic l y, th pro e s s in lu e:

ma uf acturer or distrib tor;

b) a e alu tio pro e s, s c a p rio ic f un tio al te tin a d/or d stru tiv p y ic l

a aly is or c n tru tio a aly is (a s min a initial p y ic l a aly is) of a s mple of

c) a re iew of th c mp n nt ma ufa turer’s rela i ty mo itorin d ta or q al ty d ta to lo k

f or f ai ure a d oth r re orts of c a g

NOT 2 Altern tiv ly, a pro es of p rio ic lot re-q alf i atio of th c mp n nt c n b d c me te If use , th

p rio ic lot re-q alf i atio pro es c n b d scrib d h re a d in lu e test fe u n y, sample size, etc

4.6 Compo ent depen abi ty

4.6.1 General

e-me t a d maintain bi ty of th c mp n nts u e thro g o t th c stomer a re d wara ty

p rio or mainte a c p rio a d/or a re d l f etime of th e uipme t pro id d th e d u er

u e th e uipme t within th a re d e viro me tal lmits

Th f ol owin ris are s ma b a dre s d a p rt of th a o e ris a s s me t with re ard

to d sig , pro u tio , pro ureme t or mark tin pro e s s or pra tic s:

1) n w te h olo y a aia i ty or maturity for me tin th s e ifie re uireme ts;

1 ) la k of pro ctiv me s re for c mp n nt o s le c n e

NOT 1 Th se risk are s c n in lu e low v lume ma uf acturers, alo atio risks, fin n ial sta i ty of

ma ufa turers, sin le so rc ma ufa turers, etc

NOT 2 In ut f or c nsid ratio of metrics c n in lu e: te h olo y risk a d maturity, lfe c cle, le el of c n d n e

in th ma ufa turer, pre icte o solesc n e, mo o-so rc c mp n nt, ma ufa turer su ply f ile inf ormatio ,

impre ise ma ufa turer sp cif i atio of c mp n nt p rf orma c (sp cif i d as “y ic l”, n t sp cifie , etc.),

c mp n nts oth r th n th se re diy a aia le in larg v lumes a d id ntif i d o a io ics te h olo y ro dma s

Use of c mp n nts o tsid th ma uf acturer’s sp cif i atio s a d c mp n nt o solesc n e are sp cific risk is u s

c ntin e pro u tio a d s p ort a re uire

IEC TS 6 4 2 a d SAE STD-0 16 pro id g id l n s re ardin c mp n nt o s le c n e

NOT This in lu es pro es es use to re ct to c mp n nt o solesc n e o c re c s Th y c n in lu e brid e

sto k or lf etime b ys,id ntific tio of altern tiv so rc s,e uipme t re-d sig , etc

Comp n nt o s le c n e aware e s in lu e pro e s s th t id ntify e istin a d imp n in

c mp n nt dis o tin a c c a g s in c mp n nt d sig or ma ufa turin pro e s s Th

pla own r c n u e o e or more e tern l s rvic s a d s e if i a plc tio s or d ta a e for

in ta c s in whic a origin l c mp n nt ma uf acturer (OCM) h s a n u c d a e d of

l fe (EOL) or la t time b y (LTB) o p rtu ity This re ort wi b d l v re to th c stomer

f or re iew/a pro al a re uire in th p rc a e c ntra t;

b) th p te tial is u s d s rib d in 4.6

4.6.7 Semic n uctor rel abi ty and we r o t

Semic n u tor we r o t c n id ratio s u in a ai a le s ita le mo els f or th a plc tio

pro e s n d a d b low in lu in SRAMs, DRAMs (SDRAMs, DDR s rie ), fla h memorie

(NOR lo ic g te, NAND lo ic g te), MRAMs, micro ro e s rs, FPGAs; wh n a ai a le,

a aly is of d ta from th origin l c mp n nt ma uf acturer c n le d to id ntify rela i ty a d

we r o t ris s a c rdin to giv n a pl c tio stre s le els Refer to An e C f or a ditio al

inf ormatio

JESD 4 pro id s g id n e to d termin th c mp n nt l f etime b s d o th q alfic tio

re orts write b th origin l c mp n nt ma ufa turer In th e e t te t d ta is n t a aia le

f rom th ma uf acturers, or a aly is b s d o u to d te mo els, th n th pla own r s o ld

d mo strate th ir own pro e s for a hie in s tisfa tory s rvic l f e for th a plc tio (b

a aly is, te tin , field return s rv y, etc.)

4.6.8 Rel abi ty a s s ment

re uireme ts in lu in th e p cte lf etime of th mis io

• Id ntify th c mp n nt stre s c n itio s th t c uld p te tial y s orte c mp n nt lfetime

in th a pl c tio a d th f ai ure me h nisms in olv d

• Verify th t th c mp n nt uti z d is c mp tible with th a plc tio mis io pro le a d

th rel a i ty re uireme ts thro g th pro e s s lste in this te h ic l s e ific tio ,

in lu in s mic n u tor we r o t c ara teristic whic wo ld n t b c mp tible with th

re uire a pl c tio lf etime, a d id ntify a d lst th c mp n nt th t is s s e tible to

we r o t prior to th e d of th a plc tio l fetime

• Ju tify th lf etime of th in tal e c mp n nt in th a plc tio a d d mo strate

mitig tio a tio s in c s th c mp n nt is s s e tible to we r o t prior to th e d of th

a plc tio lfetime a d wo ld n t b s tisfa tory toward th a plc tio rela i ty

re uireme ts

• Th s pro e s s in lu e c mp n nt q al f i atio (in lu in a lfe te t re uireme t,

a s ra c of q al ty (c n iste c ), e uipme t rela i ty a s s me ts, q alfic tio of th

e uipme t (e viro me tal), a d e uipme t rel a i ty mo itors a d mainte a c pla s

Refer to An e C f or a ditio al informatio o s mic n u tor we r o t

NOT 1 This c n b pro u e eith r b usin a sta d rd meth d, origin l c mp n nt ma ufa turer rela i ty

tests,e uipme t f i ld return d ta, simiarity with a y oth r simiar a plc tio s,etc

NOT 2 Th d scriptio of mis io pro le at c mp n nt le el in lu es th f olowin f eatures: altitu e f actors,

temp rature profie a d y, n mb r of o eratin h urs a d y, n mb r of d y mis io a y ar a d th d sig lfe of

th a plc tio in y ars

This is p rt of a d sig f or a rel a i ty a pro c

4.7 Comp nent c mpatibi ty with the eq ipment man f acturing pro e s

a) id ntify th k y ma uf acturin , a s mbly, s ip in , h n ln , stora e, te t, re air a d

rework pro e s s b th pla own r a d a s ciate s b o tra tors; a d

b) d s rib h w th ir imp ct o c mp n nts is id ntifie , d c me te a d c ntrol e

Here f ter are s me e ample of a tio s or p e ome a th t c n cre te d ma e to

1) c mp n nt s ip in , h n l n , a d stora e (s ort a d lo g term): me h nic l d ma e,

c r o io , etc

2) ele tro tatic dis h rg (ESD) d ma e d rin c mp n nt stora e a d h n l n , d rin

e c ste of th e uipme t a s mbly pro e s Us of th rele a t s ctio s of MIL-

HDBK-2 3, IEC 613 0-5-1, a d/or IEC TR 613 0-5-2 wi aid in th pre e tio of ESD d ma e;

3) u e of le d-f re termin te c mp n nts a d le d-f re s ld r a s mbly if th t pro e s is

u e b th pla own r or his s b-c ntra tors (s e IEC TS 6 6 7-1 a d IEC TS 6 6 7-2);

4) moisture s n itivity d ma e (MSL) d rin e c ste of th e uipme t a s mbly pro e s

Th d ta c n ot n c s ariy re id in o e d ta a e a d ma b retrie e f rom s v ral

d ta a e or d ta retrie al s stems a ro s th pla own r's b sin s A relatio al a pro c

c n b u e wh rein th d ta s stem pro id s a c s to th d ta For e ample, if th

c mp n nt q alfic tio d ta is c l e te a d store b th c mp n nt ma ufa turer, th pla

own r’s d ta s stem c uld c n ist of a pro e s, s f ware, a d h rdware to a c s th t d ta

thro g th c mp n nt ma uf acturer’s we p g or oth r s urc , pro id d th a c s is

a ai a le wh n n e e As a oth r e ample, a y d ta th t is s e if i to a pro ram, s c a

f un tio al simulatio re ults or th rmal a aly is d ta, c uld b a c s ible via a p th thro g

th pro ram d ta Th pla own r ma wis to id ntify pro e s s th t were d v lo e a d

d c me te for oth r initiativ s, s c a ISO 9 0 , ISO/TS 16 4 , AS/EN/JISQ 9 0 , or

AS/EN/JISQ 910 to s tisfy th s stem f or c mp n nt d ta

NOT 1 Ty ic l d ta in lu es:

• Comp n nt d ta sh et or sp cific tio d ta, f or e ample, in ut a d o tp t p rameters, v lta e ratin ,

p c a in dime sio s, a aia i ty d ta,etc

• Comp n nt a plc tio d ta, f or e ample, fu ctio al simulatio d ta, bre d o rd test d ta, th rmal a alysis

d ta, stru turala alysis d ta, a d ele troma n tic emis io a d susc ptibi ty d ta

• Comp n nt q alfic tio d ta, for e ample, c mp n nt ma ufa turer q alf i atio test d ta, c mp n nt

q alfic tio d ta,simiarity a alysis results, a d c mp n nt in-servic d ta use f or q alf i atio

• Comp n nt q alty as ura c d ta, f or e ample, c mp n nt ma uf acturer statistic l pro es c ntrol d ta,

c mp n nt ma ufa turer c mp n nt scre nin d ta, c mp n nt scre nin d ta, a d E S d ta fom hig

er-le el as embly scre nin use to re u e or elmin te scre nin

• Ma uf acturin a d as embly d ta, for e ample, pla own r statistic l pro es c ntrol d ta, E S d ta f rom

ma uf acturin a d as embly,a d in-pro es a d f i al fu ctio al test

• Customer’s reje t d ta

• In-servic d ta

NOT 2 It is a ticip te th t thisinf ormatio wi b a aia le to th c stomer u o re u st

4.8.2 Minimum c mp nent data requirements

informatio are a aia le to e s re s ita i ty in th a plc tio :

• For of f- h -s elf c mp n nts: d ta s e t, te h ic l a d a pl c tio n te , c n itio s of

u e, q alfic tio a d q al ty mo itorin d ta, p c a in d ta, rela i ty d ta, a aia i ty

informatio , stora e c n itio s, a s mbly d ta ( or e ample, s ld rin c n itio s),

pro u tibi ty d ta (in lu in stora e, s ld rin c n itio s, etc.), le d- re statu a d le

d-fre termin tio finis

s e ific tio , ma ufa turer d ta a d pro e s, rela i ty, s e ific te ts a d s re nin , a d

a s ciate in-h u e c ntin o s mo itorin )

NOT Most of th a o e informatio c n b a aia le fom th c mp n nt ma uf acturer

If th informatio is mo if i d, or a ditio al inf ormatio is re uire to s tisfy th s ita i ty in

b) a d c me te p th to th origin l c mp n nt ma ufa turer is re uire ;

c) e c time th d c me te p th is mis in , p rtic lar q alfic tio or/a d a ditio al

d c me tatio is re uire to e s re c mp tibi ty with th a pl c tio

4.9.3 Alternative so rce

Altern tiv s urc s of c mp n nt ma b q alfie a d id ntif i d in th pla own r

c mp n nt d ta a e to re u e p te tial ris s to c mp n nt pro ureme t or to s lv a

o s le c n e or u a aia i ty pro lem of th pre io s s urc s

In this c s , th altern tiv s urc c mp n nt p rf orma c ( it, form, f un tio a d

NOT Ate tio c n b p id to d te t “false” altern tiv so rc s (h same die or c mp n nt ty e c uld b

p c a e , teste a d distrib te b two or more c mp n nt ma uf acturers)

4.9.4 Equipment c ange d c mentatio

Al c mp n nt s b titutio s s al b d c me te a d in lu e th f ol owin informatio a p r

a re me t b twe n th in olv d p rtie ( y ic l y b twe n th c stomer a d th pla own r):

k) imp ct of th c a g o rel a i ty, s f ety, a d oth r critic l e uipme t re uireme ts;

re re e tativ , etc.);

m) wh th r or n t th n w c mp n nt is u rate

NOT Usu ly, PCNs are store in a c ntrole , retrie a le d ta system A c p of th PCN form c n b in lu e

as a a n x to th pla

4.9.5 Customer notifications an appro als

Cu tomer n tific tio s a d a pro als s al b d f i e b twe n pla own r a d c stomer, if

re uire Sin e th c stomer n tif i atio a d a pro al pro e s is l k ly to b u iq e to e c

c stomer-s p l er relatio s ip, relate re uireme ts are b y n th s o e of th b s l n

c mp n nt ma a eme t pro e s d s rib d in this te h ic l s e ific tio , a d s o ld b

d c me te in th c ntra tu l a re me ts b twe n th pla own r a d th c stomer

4.9.6 F cal organiz tion

A fo al org niz tio (intern l to th pla own r) for c n g ratio c ntrol s al b id ntifie in

5.3.1 Primary interf ace

Th pla s al id ntify a a th rity or a org niz tio to s rv a th primary interfa e

b twe n th pla own r a d o tsid p rtie in mat ers p rtainin to th pla

5.3.2 Plan f ocal p int re p nsibi tie

Th pla ’s fo al p int s al:

• a s re th t th pla is re iewe a d u d te a n c s ary;

• e s re th t a y e gin erin is u s are c mpre e siv ly re olv d in a timely ma n r

NOT Th use of a d dic te fu ctio al gro p, su h as a c mp n nt e gin erin gro p, gre tly in re ses th

eff i ie c a d ef f ectiv n s of impleme tin a d maintainin a pla own r’s ECMP

b) th ra g of e uipme t ma uf acture b th pla own r to whic th pla a ple

NOT 1 Th ra g of e uipme t is n t inte d d to b a lst of p rt n mb rs It c n in lu e, for e ample, th

a plc ble mark t se me t su h as:“ his pla a plesto al e uipme t ma ufa ture for a rosp c a plc tio s.”It

also c n in lu e a ef fe tivity d te, f or e ample, “his pla a ples to al n w e uipme t, a d to c mp n nts

su stitute into e istin e uipme t.” Th ra g of e uipme t also c n b lmite or re uire b c rtain c ntra tu l

a re me ts

NOT 2 Gro n su p rt test e uipme t, f lig t d mo strator as embles, a d prototy es are ty ic ly e empt fom

th ECMP re uireme ts, u les th pla own r states oth rwise in th pla

d s rib d in 4.1 to 4.9 d p n in o pro ram or pro u t ln re uireme ts Th pla

own r ma , with a pro riate ju tific tio , ame d th a o e lst of re uireme ts b a din

5.6.3 Plan owner sub ontracted activitie

Th pla own r s al flow d wn to its p te tial s b o tra tors th IEC TS 6 2 9-1 a pl c ble

re uireme ts or e d rs a re p n ible of th s b o tra te a tivitie th impleme tatio of

th a pro riate a tio s to f ulfi 4.1 to 4.9

In eith r c s , th pla own r s al s tisfy a d d mo strate, with o je tiv e id n e,

maintainin c mpl a c with th a pl c ble cla s s of this te h ic l s e ific tio re ardle s

of th s urc f rom whic th c mp n nts are o tain d a d s p le

5.7 Plan ac eptan e

a c pta le to b th p rtie , if th c stomer c o s s to e ercis th rig t of pla a c pta c

re uireme ts of this te h ic l s e ific tio

NOT

– An ECMP pla c n b c rtifie b a intern tio al c rtific tio b d

– A pla own r ECMP pla c n b a dite b th c stomer A lower le el tier’s ECMP pla c n b a dite b th

pla own r a d/or th c stomer Informatio re ardin ski s of th a ditor a d his trainin c n b fo n , f or

e ample, in a plc ble se tio s of IECQ d c me ts: IECQ 0 -4, IECQ OD 7 2 a d IECQ OD 7 3

– Th pla own r c n g t o je tiv e id n e th t th su c ntra tor’s pro u t satisf i s th re uireme ts of this

te h ic l sp cif i atio , a c rdin to:

1) c rtif i atio a d/or a dit of th su c ntra tor’s ECMP;

2) a pro riate tests or a alyses

5.8 Plan maintenan e

re isio is re uire

Annex A

(inf or mative)

Ta le A.1 pro id s th re uireme ts matrix for this te h ic l s e if i atio

Table A.1 – Req irements matrix

cle rly id ntif i d b

th pla own r with