IEC TS 6081 5 4 Edition 1 0 201 6 1 0 TECHNICAL SPECIFICATION Selection and dimensioning of high voltage insulators intended for use in polluted conditions – Part 4 Insulators for d c systems IE C T S[.]
Trang 1IEC T S 6081 5-4
Editio 1.0 2 16-10
pol uted conditions –
Part 4: Insulators for d.c systems
Trang 2THIS PUBLICA TION IS COPYRIGHT PROTECTED
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Trang 3IEC T S 6081 5-4
Editio 1.0 2 16-10
Part 4: Insulators for d.c systems
INT ERNAT IONAL
ELECT ROT ECHNICAL
Trang 4FOREWORD 4
INTRODUCTION 6
1 Sco e 7
2 Normative referen es 7
3 Terms, definition an a breviated terms 8
3.1 Terms an definition 8
3 2 Ab reviated terms
9 4 Prin iples 9
4.1 General 9
4.2 Overal desig proces 10 5 Materials 1
6 Site severity determination 12 6.1 Input data 12 6.2 d.c p l ution ac umulation cor ection: K p 12 6.3 Chemical comp sition of the p l ution layer (Typ A p lution) 13 6.4 Cor ectin for NSDD (Typ A p l ution) 13 6.5 Cor ectin for CUR (Typ A p l ution, ca an pin in ulators) 14 6.6 Ef ect of diameter on the p lution ac umulation K d 14 6.7 Cor ection for the n mb r of simi ar in ulators in p ral el: K s 14 7 Determination of the referen e d.c site severity 15 8 Determination of the referen e d.c USCD 16 9 Cor ection of the RUSCD for e c can idate in ulator 17 9.1 Cor ection for the efect of diameter on p l ution with tan p rforman e C d 17 9.2 Cor ection for altitu e C a 18 9.3 Determination of the req ired USCD for e c can idate 18 10 Chec in the profi e p rameters 19 10.1 General 19 10.2 Alternatin s ed defined by s ed overhan 19 10.3 Sp cin vers s s ed overhan 2
10.4 Minimum distan e b twe n s ed 2
10.5 Cre p ge distan e vers s cle ran e 21
10.6 Shed an le 2
10.7 Cre p ge factor 2
1 Desig verification 2
1 1 General 2
1 2 Op ratin exp rien e 2
1 3 L b ratory testin 2
An ex A (informative) Hy ro ho icity tran fer materials 2
A.1 Qual tative flas over b haviour 2
An ex B (informative) De en en e of USCD on p l ution severity 2
B.1 Pol ution typ A 2
B.2 Pol ution Typ B 2
Biblogra hic Referen es 2
Trang 5Fig re 1 – Overal desig proces for d.c in ulation – determination of d.c Site
Fig re A.1 – De en en y of sp cific flas over voltage over con u tivity of an
electrolyte (p rameter: weta i ty of s rface) 2
Fig re B.1 – d.c overhe d l nes Col ected field exp rien e on non HTM ins lators
(u co ted glas an p rcelain in ulators) 2
Fig re B.2 – d.c overhe d l nes Col ected field exp rien e on HTM in ulators
(comp site l ne in ulators) 2
Fig re B.3 – Comp site in ulators: Example of the influen e of CF on USCD
(la oratory tests), se CIGRE Broc ure [1] for more detais 2
Ta le 1 – Typical ran es of K
p
ac ordin to cl matic con ition 13
Trang 6INTERNATIONAL ELECTROTECHNICAL COMMISSION
Part 4: Insulators for d.c systems
1) Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin
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a re me t b twe n th two org niz tio s
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The main tas of IEC tec nical commite s is to pre are International Stan ard In
ex e tional circ mstan es, a tec nical commit e may pro ose the publ cation of a tec nical
sp cification when
• the req ired s p ort can ot b o tained for the publ cation of an International Stan ard,
despite re e ted ef orts, or
• the s bject is sti u der tec nical develo ment or where, for any other re son, there is the
future but no immediate p s ibi ty of an agre ment on an International Stan ard
Tec nical sp cification are s bject to review within thre ye rs of publ cation to decide
whether they can b tran formed into International Stan ard
IEC 6 815-4, whic is a tec nical sp cification, has b en pre ared by tec nical commite 3 :
In ulators
Trang 7The text of this tec nical sp cification is b sed on the fol owing doc ments:
Ful information on the votin for the a proval of this tec nical sp cification can b fou d in
the re ort on votin in icated in the a ove ta le
This doc ment has b en drafed in ac ordan e with the ISO/IEC Directives, Part 2
A l st of al p rts in the IEC 6 815 series, publ s ed u der the general title Sele cto n and
dime sio in o fhig -v lag e insu lato rs inte ded fo r use in p olute d co di o ns, can b fou d
on the IEC we site
The commite has decided that the contents of this doc ment wi remain u c an ed u ti the
sta i ty date in icated on the IEC we site u der "htp:/ we store.iec.c " in the data related to
the sp cific doc ment At this date, the doc ment wi b
• reconfirmed,
• with rawn,
• re laced by a revised edition, or
A bi n ual version of this publcation may b is ued at a later date
IMPORTANT – The 'c lo r inside' log on the c v r pa e of this publ c tion in ic te
that it c ntains c lo rs whic are c nsid re to be us ful for the c r e t
understa ding of its c nte ts Us rs s o ld therefore print this do ume t using a
c lour printer
Trang 8Work has b en goin on in CIGRE C4.3 3 an the IEC to prod ce d.c p l ution desig g ides
that re resent the c r ent state of the art The CIGRE work has res lted in an HV d.c
Polution Ap l cation Guidel nes broc ure [1] an the IEC work in this final p rt of IEC 6 815
– Sele cto n anddime nsio in ofhig -v lage insu lators inte ded fo r use in p oluted co di o s
– Part 4: Insu lators for d.c systems
The work re resents a h ge ac umulation of p l ution p rforman e k owled e from variou
sources (b th publ s ed an u publ s ed) never b fore colated into a sin le o u
Contrary to the p rts of IEC 6 815 de l n with a.c this tec nical sp cification covers b th
p lymeric an glas an p rcelain in ulators for d.c s stems in a sin le publ cation It also
covers h brid in ulators ( he ceramic core is ful y covered by a p lymer)
NOT Th pre e t d c me t d e n t a ply to in ulators with c atin s, d e to th v riety of c atin s to b
c n id re This ma b re o sid re at th n xt re isio of this te h ic l s e ific tio , afer g inin more
k owle g a de p rie c a d a b ter d finitio of th c atin c ara teristic a d re uireme ts
The a pro c for d.c in ulator desig an selection with resp ct to p l ution given in this p rt
is diferent to that u ed for a.c The key dif eren es are:
• A simpl fied a pro c is presented whic is inten ed for prel minary desig However,
sin e u der d.c p l ution buid-up an its efects can b more severe than u der a.c the
final desig s ould b b sed as mu h as p s ible on a direct p l ution severity me s red
u der d.c for the site b in stu ied Eq al y direct evaluation of the in ulators selected by
this proces s ould b con idered (A statistical desig a pro c is avaia le in the
CIGRE g idelnes for d.c p lution [1]);
• Two a pro c es are con idered to estimate p lution severity: one u in prior d.c site
severity exp rien e, the other u in site severity me s rements on a.c or u energised
in ulators;
• Cor ection of site severity for sp cific p rameters that have an influen e u der d.c (e.g
p lution u iformity ratio, ef ect of diameter on p l ution ac umulation, NSDD) are
con idered;
• Direct tran fer from cor ected site p l ution severity to neces ary USCD without an u e of
dis rete site severity clas es (as made in IEC 6 815 Parts 2 an 3);
• Recog ition is made of the improved p rforman e of Hy ro ho icity Tran fer Materials
(HTM) as a practical solution for man desig s, nota ly at UHV, whi e takin into ac ou t
p tential hy ro ho icity los ;
• Imp rtan e of the influen e of altitu e;
• Distin t diameter cor ection for flas over p rforman e
Althou h there is some p sitive exp rien e with val dation by testin of traditional glas an
p rcelain in ulators, the ful tran lation of s c test res lts to service con ition is sti u der
con ideration An s c exp rien e is mainly lac in for comp site in ulators, sin e an
agre d stan ardised testin proced re is not yet avai a le The pro lem is ac entuated to
p rcelain/glas as wel comp site tec nolog by the contin in rise in s stem voltages where
over-desig may res lt in u re lstic in ulator len th or heig ts Hen e for this first edition
the verification of a c osen in ulator solution by testin is entirely s bject to agre ment
For p lymeric, nota ly HTM, the p l ution with tan may not b the only neces ary desig
information The desig stres s ould b selected not only to avoid flas over, but also to
as ure a l mited agein of the in ulators in service This item is however out of the s o e of
the present sp cification
Ap lcation with controled in o r en ironment are not in lu ed in the s o e of this
Trang 9SELECTION AND DIMENSIONING OF HIGH-VOLTAGE
Part 4: Insulators for d.c systems
This p rt of IEC 6 815, whic is a Tec nical Sp cification, is a pl ca le as first a pro c for
the determination of the req ired d.c Unified Sp cific Cre p ge Distan e for in ulators with
resp ct to p lution To avoid ex es ive over or u der desig , existin o eration exp rien e
s ould b comp red an eventual y ad itional a pro riate tests may b p rformed by
agre ment b twe n s p ler an c stomer
It is a pl ca le to:
• Glas an p rcelain in ulators;
• Comp site an h brid in ulators with an HTM or non-HTM hou in
This p rt of IEC 6 815 gives sp cific g idel nes an prin iples to ar ive at an informed
ju gement on the pro a le b haviour of a given in ulator in certain p l ution en ironments
The stru ture an a pro c of this p rt of IEC 6 815 are simi ar to those explained in Part 1,
but ada ted for the sp cific is ues en ou tered with p l uted HV d.c in ulation
The aim of this Tec nical Sp cification is to give the u er simpl fied me n to:
• Identify is ues sp cific to d.c a plcation that can afect the c oice an desig proces ;
• Determine the eq ivalent d.c Site Pol ution Severity (SPS) from me s rements, cor rectin
for electrostatic efects, diameter, p lution distribution an comp sition;
• Determine the referen e USCD for dif erent can idate in ulatin solution , takin into
ac ou t materials, dimen ion an ris factors;
• Evaluate the s ita i ty of dif erent in ulator profi es;
• Dis u s the a pro riate method to verify the p rforman e of the selected in ulators, if
req ired;
This simplfied proces is inten ed to b u ed when comp ra le o erational exp rien e from
existin d.c s stem is in omplete or not avai a le
The simplfied desig a pro c mig t res lt in a solution that ex e d the ph sical con traints
of the project More refined a pro c es for s c cases, e.g u in a statistical a pro c , are
given in the CIGRE d.c g idel nes [1] In extreme cases, e.g for ex e tional y severe site
con ition , alternative solution s c as c an in the l ne route, relocation of con erter
station or u in an in o r d.c yard may ne d to b con idered
The fol owin doc ments are refer ed to in the text in s c a way that some or al of their
content con titutes req irements of this doc ment For dated referen es, only the edition
cited a ples For u dated referen es, the latest edition of the referen ed doc ment (in lu in
an amen ments) a pl es
Trang 10IEC TS 612 5, Artficial p lu tio tests o hig h-v lage ce ramic and gla s insulators to b e
used o d.c syste ms
IEC TS 6 815-1:2 0 , Sele c tio and dime sio in o f high-v lag insu lators inte dedfo r use
in p oluted c o ndi o s – Part 1: D efini o s, info rmato and g en ral p rinciples
IEC TS 6 815-2, Selecto and dime sio in of high-v lag e insu lato rs inte ded fo r use in
poluted condi o s – Part 2: Ceramic and gla s insu lato rs fo r a.c systems
IEC TS 6 815-3, Sele cto n and dime sio nin of hig h-v lage insu lato rs inte ded fo r use in
poluted c o ndi o s – Part 3 : Polyme r insu lators fo r a.c systems
IEC TS 6 0 3, G u idanc e o th mea u reme nt ofh dro h bic ity of insu lato r surfaces
3 Terms, definitions and abbreviated terms
• IEC Electro edia: avai a le at ht p:/ www.electro edia.org/
• ISO Onl ne browsin plat orm: avai a le at htp:/ www.iso.org/o p
3.1.1
Unifie Spe ific Cre pag Dista c
USCD
cre p ge distan e of an in ulator divided by the maximum o eratin voltage acros the
in ulator It is general y expres ed in mm/kV
Note 1 to e try: For d.c th ma imum o eratin v lta e is th d.c s stem v lta e a d fin d in IEC 6 0 1-5
3.1.2
Refere c d.c Unifie Spe ific Cre pa e Dista c
RUSCDdc
value of Unified Sp cific Cre p ge Distan e for a d.c s stem at a p l ution site determined
from ESDD an NSDD values cor ected for NSDD, CUR, etc ac ordin to this doc ment
Note 1 to e try: This is g n raly e pre s d in mm/kV
Note 1 to e try: Refere to a Polutio Uniformity Ratio (PU ) in s mec u trie
Note 2 to e try: This is refere to a Co tamin tio Uniformity Ratio in s me c u trie
Trang 11Note 1 to e try: Furth r informatio o HTM is giv n in An e A.
3.2 Abbre iate terms
ESDD Eq ivalent Salt De osit Den ity
HTM Hy ro ho icity Tran fer Material
NSDD Non Soluble De osit Den ity
SDD Salt De osit Den ity
SES Site Eq ivalent Sal nity
SPS Site Polution Severity
USCD Unified Sp cific Cre p ge Distan e
RUSCD Referen e Unified Sp cific Cre p ge Distan e
CUR Polution (Contamination) Uniformity Ratio
RUSCDd Referen e d.c Unified Sp cific Cre p ge Distan e
4 Principles
The overal proces of in ulation selection an dimen ionin can b s mmarised as fol ows:
• Determination of the a pro riate a pro c (deterministic, statistical etc.) as a fu ction of
avai a le k owled e, time an resources as recommen ed in IEC TS 6 815-1 The
fol owin ste s con ern the simpl fied, deterministic a pro c as des rib d in IEC TS
6 815-1; if the statistical a pro c is c osen, ple se refer to IEC TS 6 815-1 for ful
detai s
Therefore, u in IEC TS 6 815-1:
• col ection of the neces ary input data, nota ly s stem voltage, in ulation a pl cation typ
(l ne, p st, bu hin , etc.);
• col ection of the neces ary en ironmental data, nota ly site p l ution severity
At this stage, a prel minary c oice of pos ible can idate in ulators s ita le for the
a pl cation an en ironment may b made
Then, u in this doc ment for:
• determination of the d.c site severity by a plcation of cor ection factors;
• determination of the referen e d.c USCD (RUSCD);
• cor ection of the RUSCD for e c can idate in ulator;
• c ec in the profi e p rameters;
• verification
It is to b noted that in the fol owin the USCD an the cor ection factors are b sed on a
median b haviour derived from widely spre d res lts (se [1]
1
Despite this, when the
proces is b n hmarked again t service exp rien e the res lts are con istent enou h to give
u eful orientation to identify a ran e of prel minary solution (se [1])
Trang 124.2 Ov ral d sign pro e s
The overal desig proces is s own in the flowc arts in Fig res 1 an 2 From these
flowc arts it can b se n that the cre p ge distan e is only selected af er multiple ste s to
cor ect site p l ution me s rements for the factors whic can influen e d.c p rforman e an
whic of en have a more pronou ced ef ect u der d.c than for a.c The desig proces is
compl cated by several factors:
• d.c energised in ulators ex ibit a gre tly dif erent p l ution ac umulation b haviour
comp red to a.c an u -energised in ulators d e to electrostatic ef ects, this
ac umulation is afected by win , p rticle size etc
• comp sition of the p l ution (low solubi ty or slow-dis olvin salts);
• efect of the amou t of non-soluble de osit;
• CUR “Contamination Uniformity Ratio”;
• efect of diameter on p l ution ac umulation;
• non-u iformity of the p lution layer alon or arou d the in ulator;
• efect of diameter on p l ution p rforman e;
• efect of in ulator material on p l ution p rforman e
These p ints are des rib d in more detai in Fig res 1 an 2
Figure 1 – Ov ral de ign proc s for d.c ins lation –
determination of d.c Site Pol ution Se erity
Core t for d.c p lutio a c mulatio
(Core t for ele tro tatic atra tio ,
ta in into a c u t clmatic d ta:
win , rain) – Se 6.2
d
NSDb
CUb
Trang 13Figure 2 – Ov ral de ig proc s for d.c ins lation –
determin tio of the re uire USCD
dc
for c ndid te ins lating s lutio s
5 Materials
Polymer materials whic ex ibit hy ro ho icity an the ca a i ty to tran fer h dro ho icity to
the layer of p l ution are refer ed to in this Tec nical Sp cification as h dro ho icity tran fer
materials (HTM) Materials whic do not ex ibit hy ro ho icity tran fer are refer ed to as n
on-HTM Hy ro ho icity may be lost in certain con ition (se IEC TS 6 815-3:2 0 , nota ly
Clau e 5), either temp rari y or in some cases p rmanently IEC TS 6 0 3 provides g idan e
on the me s rement of wet a i ty of in ulator s rfaces (se An ex A)
Some other tec nologies exist that are inten ed to improve the p l ution p rforman e of
ty e a d material – Se 8
Core t RUSC
dfor th efe t of
diameter a d altitu e o fla h v r
Trang 14h dro ho ic co tin s At present it is not p s ible to give sp cific information on the d ra i ty
of the improvement given by s c tec nologies The a pl cation of this doc ment to s c
tec nologies is therefore entirely s bject to agre ment
More information on the asp cts of diferent in ulatin materials u der HV d.c is given in [1]
6 Site s verity determination
• Simi ar data from u -energised or a.c energised in ulators of other typ s than the
referen e in ulator, me s red over a s f iciently lon p riod (e.g at le st one ye r);
• Simi ar data from d.c energised in ulators, me s red over a s ficiently long p riod (e.g
at le st two ye rs for sites with K
pfactor >1,2, u les exp rien e al ows this p riod to b
red ced e.g for sites with K
pfactor 1,1)
The neces ary data is:
• Cl matic data;
• The ESDD an NSDD from the SPS, or the SES, from one of the a ove sources (in the
case of Typ A p l ution the ESDD an NSDD s al b me s red se arately on up er an
ave) o er th total me s re s rfa e
(ie To a d Botom c mbin d), s e An e C of IEC T 6 815-1:2 0
6.2 d.c pol ution a c mulatio c r e tion: K
p
d.c energised in ulators may ac umulate more p l ution than do a.c energised or non
-energised in ulators, d e to the p rmanent static electric field s r ou din d.c in ulators The
ratio of d.c to a.c ac umulated p lution (K
pfactor) varies from one site to another an is the
res lt of a complex interaction of a n mb r of p rameters It is therefore not p s ible to
ac urately predict this ratio
The fol owin g idan e is given with regard to the c oice of K
p(se [1] for more detais):
is typical y 1,1, with a ran e of 1 to 1,2 in are s where maximum site severities
con ition are re c ed in s ort time fol owin sp cific events Typical cases are those
where the win sp ed is the dominant factor that determines the amou t of p l ution
car ied in the air or are s where hig win sp ed prevai A typical example is Typ B
p lution close to the se ;
p
is typical y 1,6, with a ran e of 1,3 to 1,9 in are s where the maximum site severities
con ition are re c ed in times of the order of a few month These are s may b
c aracterised by p l ution either of typ A or B (e.g at some distan e from the co st or
from p lution sources as ociated with h man activity) with moderate win con ition ;
p
is typical y 2,5 with a ran e of 2 to 3 in are s with a p l ution proces in re sin slowly
in time (e.g s owin an in re sin tren in a 1-2 ye r p riod), e.g are s with Typ A
p l ution, c aracterised by h man activity s c as minin , in u try, ro d etc with
Trang 15It s ould b noted that K
p
can b hig er than the values given a ove when the site location is
c aracterised with exten ed dry p riod an can b lower when there is freq ent natural
cle nin events s c as rain Ta le 1 s mmarises an exten s the information a ove
d.c site p l ution severity by me s rements made on d.c energised in ulators, for as lon a
p riod as p s ible an in lu in an se son l kely to res lt in hig er ac umulation, in order
to get a more precise estimation of the d.c ESDD
K
p
may b af ected by in ulator orientation either red cin or in re sin self cle nin ef ects
6.3 Chemic l c mpo ition of the pol ution la er (Type A pol ution)
It is k own that the presen e of slow-dis olvin or low solubi ty salts in the natural p l ution
layer can red ce the severity of the p l ution with resp ct to sodium eq ivalent salts Also
stu ies have b en made on the ef ect of a pro ortion of calcium salts in the p l ution layer
If volume con u tivity me s rements made d rin site severity evaluation ac ordin to
IEC TS 6 815-1:2 0 , An ex C, s ow a distin t ten en y to in re se with time, then this is an
in ication that slow-dis olvin or low solubi ty salts are present In s c cases, it is ad ised
to stu y the exact c emical comp sition of the p l ution layer, an then to refer to the
information given in [1] an [2]
푁푁푁푁
0
�0,3
Trang 166.5 Cor e ting for CUR (Type A pol utio , c p a d pin ins lators)
CUR is the ratio of the Typ A p l ution de osit den ity (se IEC TS 6 815-1) on the lower
s rface of in ulators to that of the up er s rface This can also b expres ed as the in erse,
where it is cal ed T/B (To /Botom Ratio)
Sin e CUR for o en profi es is u ual y l mited to low values, this cor ection is general y only
a pl ed to me s rements from ca an pin in ulators Me s rements from other in ulators
with complex or de p u der-rib profi es may also req ire cor ection, but at present there is
in uf icient data on the neces ary cor ection
The me s red overal ESDD (non-u iform) s al b cor ected to an eq ivalent ESDD (u iform
p l ution) u in :
퐾
CU
=�1,6×퐶퐶퐶
0,6+퐶퐶퐶
�×�1−0,4×lo
1
�1
This cor ection is a pl ed when me s rements from ca an pin or smal er diameter
in ulators are b in u ed to determine the eq ivalent p l ution severity for larger diameter
No cor ection is neces ary for s sp n ion or l ne p st in ulators
NOT Av ra e diameter c lc latio is s own in IEC T 6 815-2 a d – 3
If the site severity me s rements are made on an in ulator of same diameter as the can idate
in ulator, then K
d
= 1
Further detai s on the influen e of diameter on p l ution ac umulation can b fou d in [1]
6.7 Cor e tion for th number of simi ar in ulators in paral el: K
s
In order to take into ac ou t the in re sed ris of flas over d e to havin man simi ar
in ulators in p ral el, a cor ection is a pl ed as fol ows:
• Man in ulators in p ral el (e.g tran mis ion lne section with more than 10 strin s,
as umed to b p l uted to the same degre an s bmited to the same en ironmental
Trang 17This cor ection only covers the in re sed ris of flas over d e to man o jects b in
s bmit ed to the same stres (i.e al the in ulators in the same p l ution en ironment It do s
not cover the red ction of flas over voltage that can arise from the proximity of in ulator
strin s in multiple strin sets
Cor ection is val d for sites with a moderate n mb r of critical wetin events, e.g 10 p r
ye r For hig er n mb rs of events a further cor ection may b neces ary Further detais can
b fou d in [1]
7 Determination of the reference d.c site severity
For typ A p l ution, the average ESDD (ESDD
a e) from the SPS is cor ected to the referen e
d.c ESDD (ESDD
d) by: