Iec ts 62861 2017

The tests des rib d in this Tec nical Sp cification are divided into: initial q al fication tests IQT givin confiden e of b sic comp nent ro u tnes , but not l n ed to an sp cific l feti

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INT ERNAT IONAL

ELECT ROT ECHNICAL

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FOREWORD 6

INTRODUCTION 8

1 Sco e 9

2 Normative referen es 9

3 Terms an definition 10 4 Comp nent test con ition 13 5 LED p c age an intercon ects 14 5.1 General 14 5.2 Sampl n req irements 14 5.3 Prod ction req irements 14 5.4 As embly of LED p c ages on test b ard 15 5.5 Moisture precon itionin 15 5.6 Thermal c aracteristic 15 5.7 Pre- an p st stres electrical an photometric req irements 15 5.8 Pre- an p st stres vis al in p ction 15 5.9 Soldera i ty an resistan e to solderin he t 15 5.9.1 Soldera i ty 15 5.9.2 Resistan e to solderin he t (RSH-reflow) test 15 5.1 0 Fai ure criteria 1

6 5.1 Initial q al fication tests for LED p c ages 16 5.1 1 General 16 5.1 2 Temp rature an o eration stres 17 5.1 3 Thermo-mec anical stres 18 5.1 4 Temp rature an h midity stres 18 5.1 5 Electrical stres – ESD-HBM 19 5.1 6 En ironmental stres 19 5.12 Initial q al fication test for LED p c age intercon ects – VVF 2

5.13 Ac elerated stres tests for LED p c age intercon ects 2

5.13.1 General 2

5.13.2 Intercon ect temp rature c cln (TMCL) 21

6 Optical materials 21

6.1 General 21

6.2 Optical material test samples 2

6.3 Moisture precon itionin 2

6.4 Pre- an p st stres photometric me s rements 2

6.5 Ad esion test 2

6.6 Pre- an p st stres vis al in p ction 2

6.7 Fai ure criteria 2

6.8 Initial q al fication tests 2

6.8.1 Relative h midity (RH) 2

6.8.2 Boi n water (BW) 2

6.8.3 Oven water (OW) 2

6.8.4 Hig temperature exp s re (HTE) 2

6.9 Ac elerated stres tests 2

6.9.1 Prediction models 2

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6.9.3 Temp rature an lg t exp s re (TL) 2

6.10 Lig t tran mit in materials 2

6.1 Lig t reflectin materials 2

6.1 1 Dic roic-co ted glas an aluminium-co ted glas 2

6.1 2 Aluminium-co ted plastic 2

6.1 3 White plastic/non-co ted plastic 2

6.12 Optical con erters 2

7 Electronic s b s embl es 2

7.1 General 2

7.2 Sampl n req irements 2

7.3 Prod ction req irements 2

7.4 Pre- an p st stres electrical req irements 2

7.7.1 Temp rature an o eration stres (PTC) 2

7.7.2 Humidity an o eration stres (HOT) 2

7.8.1 Prediction models 2

7.8.2 Temp rature, h midity an o eration stres (seq ential ALT) 2

8 Active an p s ive co lng s stems 3

8.1 General 3

8.2 Co l n s stem test samples 31

8.3 Moisture precon itionin 3

8.4 Thermal resistan e test 3

8.5 Performan e p rameter test 3

8.6 Pre- an p st stres co l n p rforman e req irements 3

8.9.1 General 3

8.9.2 Du t 3

8.10.1 General 3

8.10.2 Cy l c temp rature test (CT) with h midity an with/without o erational stres 3

8.10.3 Temp rature l fe test (TLT) p s ive co l n s stem 3

8.10.4 Temp rature l fe test (TLT) active co l n s stem 3

9 Con tru tion materials 3

9.1 General 3

9.2 Mec anical comp nents an intercon ects 3

9.3 Mec anical interfaces b twe n dif erent comp nents 3

9.4 Chemical interaction 3

10 Final prod ct testin 3

10.1 General 3

10.2 Prin ip l comp nent rel a i ty in the final prod ct 3

10.3 Minimum val dated AST time 3

10.4 Final prod ct q alfication for rel a i ty 4

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(informative) Ap l cation profi es 4

An ex A (informative) Ac eleration models 4

An ex B General 4

B.1 Ar heniu model 4

B.2 Eyrin model 4

B.3 Cof in-Man on model 4

B.4 Nor is-L n zb rg model 4

B.5 (In erse) p wer law 4

B.6 Pec model 4

B.7 General zed Eyrin model 4

B.8 Sample size calc lation 4

B.9 Basic g idel nes 4

B.10 Example 4

B.1 (informative) Sy tem rel a i ty 4

An ex C General 4

C.1 Basic prin iples 4

C.2 Testin on the s stem level 4

C.3 Sy tem rela i ty prediction 5

C.4 C.4.1 General 5

C.4.2 Bloc diagrams 5

C.4.3 Fault tre 51

C.4.4 Markov c ain 51

C.4.5 Bayesian network 51

C.4.6 Chi-s uare 5

(informative) Qual fication flowc arts 5

An ex D General 5

D.1 Qualfication flowc arts of prin ip l comp nents 5

D.2 (informative) Ph sical analy is for prin ip l comp nents 5

An ex E General 5

E.1 DPA for LED p c ages an intercon ects 5

E.2 DPA for o tical materials 6

E.3 PA for electronic 6

E.4 PA for active an p s ive co l n s stems 61

E.5 DPA for mec anical 61

E.6 (normative) Prin ip l comp nent test re ort 6

An ex F Biblogra h 6

Fig re D.1 – Qualfication flowc art for LED p c age an intercon ects 5

Fig re D.2 – Qualfication flowc art for o tical materials 5

Fig re D.3 – Qualfication flowc art for electronic s b s embl es 5

Fig re D.4 – Qualfication flowc art for active an p s ive co l n s stems 5

Fig re D.5 – Qualfication flowc art for con tru tion materials 5

Ta le 1 – Ma pin the LED p c age intercon ects q alfication tests to the u e ble ac eleration model with typical range of the ac eleration factor 2

Ta le 2 – Duration (c cles) of temp rature a plcation 21

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Ta le 4 – Ma pin the electronic s b s embly q al fication tests to the u e ble

ac eleration model with typical ran e of the ac eleration factor 2

Ta le 5 – Example ALT profi e for an electronic s b s embly 3

Ta le 6 – Examples of stres ors, af ected p rt of the co l n s stems an its rel a i ty ef ect 31

Ta le 7 – Ma pin the co ln s stem q alfication tests to the u e ble ac eleration model with typical ran e of the ac eleration factor 3

Ta le 8 – List of u desired c emicals in LED prod cts for general l g tin 3

Ta le 9 – Influen e of the prin ip l comp nents on the final prod ct 3

Ta le 10 – Example l st of val dated AST times 4

Ta le 1 – Minor an major c an e l st p r prin ip l comp nent 41

Ta le A.1 – Example of two a plcation profi es 4

Ta le B.1 – Sample sizes vers s confiden e an rel a i ty level as umin L = T × AF 4

Ta le B.2 – Example of calc lated ac eleration factors 4

Ta le C.1 – Example test s heme an res lts for Chi-s uare 5

Ta le F.1 – Example overview re ortin format 6

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY

1) Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

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this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cific tio s,

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-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio for Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th formal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

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th later

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p te t rig ts IEC s al n t b h ld re p n ible for id ntifyin a y or al s c p te t rig ts

The main tas of IEC tec nical commite s is to pre are International Stan ard In

ex e tional circ mstan es, a tec nical commit e may pro ose the publ cation of a tec nical

sp cification when

• the req ired s p ort can ot b o tained for the publ cation of an International Stan ard,

despite re e ted ef orts, or

• the s bject is sti u der tec nical develo ment or where, for any other re son, there is the

future but no immediate p s ibi ty of an agre ment on an International Stan ard

Tec nical sp cification are s bject to review within thre ye rs of publ cation to decide

whether they can b tran formed into International Stan ard

IEC TS 6 8 1, whic is a Tec nical Sp cification, has b en pre ared by s bcommite 3 A:

L mps, of IEC tec nical commit e 3 : L mps an related eq ipment

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The text of this Tec nical Sp cification is b sed on the fol owin doc ments:

Ful information on the votin for the a proval of this tec nical sp cification can b fou d in

the re ort on votin in icated in the a ove ta le

This doc ment has b en draf ed in ac ordan e with the ISO/IEC Directives, Part 2

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "htp:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• tran formed into an International stan ard,

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LED prod cts de en general y on how b lan ed its prin ip l comp nents are in terms of

their rel a i ty It is not only the LED comp nents that determine prod ct p rforman e, but

also other p rts of the LED prod ct play an eq al y imp rtant role For in tan e, electronic

s b s embl es, o tic , mec anic an the in olved co l n method play s c a role

This Tec nical Sp cification en ision a methodolog , whic ad res es se arate

s bcomp nent rela i ty data, to provide a b sis for statistical s stem rel a i ty desig

Stan ardized re ortin formats an flowc arts are presented

Next, protocols b sed on ac elerated method are given to estimate s stem rela i ty of the

final prod ct u in s bcomp nent data

Verification of LED prod ct l fetime is b sed on a ‘test to p s ’ prin iple, whic me n the

comp nents of the prod ct u der test are evaluated to give eq ivalent rel a i ty confiden e to

that whic would b ac ieved by re l- ime lfe testin of the complete LED prod ct The tests

des rib d in this Tec nical Sp cification are divided into: initial q al fication tests (IQT) givin

confiden e of b sic comp nent ro u tnes , but not l n ed to an sp cific l fetime projection,

an ac elerated stres tests (AST) givin confiden e of rel a i ty to a sp cific l fetime (within

the sp cified con traints of the test

Sin e the a pro c forese n in this Tec nical Sp cification covers a generic methodolog , it

can b se n as g idan e related to relevant prod ct p rforman e stan ard , s c as the LED

lamp p rforman e stan ard IEC 6 612, the LED mod le p rforman e stan ard IEC 6 717

an LED luminaire p rforman e stan ard IEC 6 7 2-2-1 This Tec nical Sp cification is not

recommen ed for u e as a normative referen e to the LED prod ct p rforman e stan ard

This Tec nical Sp cification ad res es the ne d for a doc ment givin g idan e that is

develo ed ac ordin to con en u proced res an in itself is normative in nature, whi e at the

same time recog izin that LED tec nolog for l g tin prod cts is sti in an emergin phase

This Tec nical Sp cification a pro c es an International stan ard in terms of detai an

completenes

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GUIDELINES FOR PRINCIPAL COMPONENT RELIABILITY

This Tec nical Sp cification provides g idel nes for esta l s in confiden e in prod ct

rela i ty u in prin ip l comp nent testin for LED l g t sources an LED luminaires for

general lghtin It in lu es method an criteria u in initial q al fication tests an

ac elerated stres tests of the prin ip l comp nents The p rforman e of any prin ip l

comp nent wi influen e the p rforman e of the final prod ct

Tec niq es to val date ful l fetime claims an lumen maintenan e projection are outside the

s o e of this Tec nical Sp cification

The fol owin prin ip l comp nents are in lu ed in the testin if they are u ed as an integral

p rt for the LED l g t source or LED luminaire:

• LED p c age an intercon ects;

• o tical materials;

• electronic s b s embles;

• co ln s stems, b th active (e.g fan ) an p s ive (e.g thermal interface material);

• con tru tion materials

This Tec nical Sp cification is not recommen ed for u e as a normative referen e to the LED

prod ct p rforman e stan ard

2 Normative refere ces

The fol owin doc ments are refer ed to in the text in s c a way that some or al of their

content con titutes req irements of this doc ment For dated referen es, only the edition

cited a ples For u dated referen es, the latest edition of the referen ed doc ment (in lu in

an amen ments) a pl es

IEC 6 0 8-2-2 :2 0 , En iro me tal te stn – Part 2-2 : Te sts – Te st T: Te st meth ds fo r

solde rab il y and re sistance to so lde rin h at of de ices wih le ads

IEC 6 0 8-2-2 :2 0 , Basic e viro me tal te stn p rocedures – Part 2: Tests – Te st Ea and

gu idanc e : Shock

IEC 6 0 8-2-3 :2 0 , En iro me tal testn – Part 2-30 : Tests – Te st D b : Damp h at, cyclic

( 2 h + 12 h cycle )

IEC 6 0 8-2-4 :2 0 , En iro me tal testn – Part 2-4 : Te sts – Te st Kc: Su lp hur dio xide

test for c o ntac ts and con e c tio s

IEC 6 0 8-2-4 :2 0 , En iro me talte stn – Part 2-4 : Te sts – Te st Kd: Hydrogen su lp ide

te st fo r contacts and c o nn ctio s

IEC 6 0 8-2-5 :2 15, En iro me tal te stn – Part 2-5 : Te sts – Te st Td: Te st me tho ds fo r

solde rab il y, re sistance to dis olutio n of me tal z to and to so lde rin h at of surfac e

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IEC 6 0 8-2-6 :2 15, En iro me taltestn – Part 2-6 : Te sts – Test Ke: Flo win mix d ga

coro sio te st

IEC 6 5 9:2 13, D egre es of p rote cto n p ro ided b e c losure s (IP C o de )

IEC 6 9 9:2 1 , AC and/o r D C-su p ple d ele c tro nic co trol ge ar fo r tu bu lar flu o resc ent lamp s

– Pe rfo rmanc e requireme ts

IEC 6 9 9:2 1 /AMD1:2 15

IEC 6 5 4, Ge eral lg tn – Light emi in diode (LED ) p ro ducts and relate d e u ipme t –

Te rms and defini o s

ANSI/ESDA/JEDEC JS-0 1-2 14, Ele ctro statc dis harge se si viy te stn hu man b o dy

m odel (HBM) – Comp on nt le vel

ASTM D5 7 – 12, Standard te st meth d fo r the rmal transmis io p rop e rte s o f th rmaly

co nductv electric alinsu lato mate rials

ASTM D7 2 – 13, Standard te st meth d fo r e alu ato of s ratch re sistance of p olyme ric

co atn s and pla tc usin an instru me te d s ratch ma hin

ASTM E5 5 – 0 , Standard test me th d for total ma s lo ss and c ole c te d v lat e co de s ble

m aterials from o u tga sin in a vac uu m en iro me t

IPC-9 91, Perfo rmanc e parame te rs (mechanical, e le c tric al, e nviro nme ntal and

qu al y/relab il y) for air mo vin de vic e s

J-STD-0 2D, Solde rab il y te sts fo r c omp one nt le ads, te rminato s, lu gs, te rminals and wire s

J-STD-0 0E, Moisture/reflow se si viy c la sific ato fo r no nhe rmetc surfac e mo u nt de ic e s

JESD2 -A101C, Steady-state tempe rature humidiy b ia lfe te st

JESD2 -A10 D, Temp e rature cyclin

JESD2 -A10 D, Temp e rature, bia , and op e ratn lfe

JESD2 -A1 3F, Preco di o in o f p la tc surface mount de vic e s p riorto relab il y te stn

JESD2 -B10 B, Vibrato , variable fre u ency

JESD51-51, Impleme tato of th ele c tric l test me tho d (statc te st meth d) for th

m ea ure me t o f th real the rmal re sistance and imp edanc e o f lght e mi in dio des wih

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• IEC Electro edia: avai a le at ht p:/ www.electro edia.org/

• ISO Onl ne browsin plat orm: avai a le at htp:/ www.iso.org/o p

3.1

a c leration fa tor

AF

ratio of the time it takes for a certain fraction of the p pulation to fai , fol owin a plcation of

one stres or u e con ition, to the cor esp n in time at a more severe stres or u e

con ition

Note 1 to e try: Th faiure mo e a d th ty e of th faiure distrib tio (lo n rmal Weib l e p n ntial or alk )

within th two stre s c n itio s s o ld b id ntic l

Note 2 to e try: Ac eleratio fa tors c n b c lc late for s v ral stre s s th t c n afe t th rela i ty of th u it

u d r te t, s c a temp rature, ele tric l me h nic l lo d , lg t e p s re, c emic l moisture or oth r stre s s

An e B pre e ts c mmo ly k own a c leratio mo els

Note 1 to e try: A faiure mo e ma b d fin d b th fu ctio lo t or oth r state tra sitio th t o c re

[SOURCE: IEC 6 0 0-19 :2 15, 19 -0 -17, modified – do not u e the wordin

“DEPRECATED: fault mode”

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3.7

appl c tion profi e

mis ion profi e

u er profie

profi e des ribin the en ironmental lo d that are imp sed up n the prod ct u der normal

o eration con ition

Note 1 to e try: An e A pre e ts two e ample a plc tio profie

Note 1 to e try: Th time interv l d ratio ma b e pre s d in u its a pro riate to th item c n ern d (e.g

c le d r time, o eratin c cle , dista c ru ) a d th u its s o ld alwa s b cle rly state

Note 2 to e try: Giv n c n itio s in lu e a p cts th t afe t rela i ty, s c a : mo e of o eratio , stre s le els,

e viro me tal c n itio s, a d mainte a c

Note 3 to e try: Rela i ty ma b q a tifie u in me s re d fin d in Se tio 19 -0 , Rela i ty relate

s stem rel abi ty

pro a i ty that a s stem, in lu in al hardware, firmware, an sof ware, wi satisfactori y

p rform the tas for whic it was desig ed or inten ed, for a sp cified time an in a sp cified

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test for whic a rela i ty model exists for as es in rel a i ty over a s orter time p riod than

a test u der normal a pl cation con ition by a plyin an ac eleratin stres factor

Note 1 to e try: Th rela i ty mo el c n a ply to c mp n nts a d materials

3.18

initial qual fic tion te t

IQT

test to demon trate a b sic level of ro u tnes by a plyin a non-ac eleratin stres factor

Note 1 to e try: An IQT is emplo e wh n a a c lerate rela i ty mo el is n t a pro riate

3.19

v l date AST time

mathematical prod ct of the AST d ration u ed for val dation an the ac eleration factor

4 Component test conditions

Clau es 5, 6, 7, 8 an 9 sp cify minimum stres - est driven q al fication an rel a i ty

req irements for the prin ip l comp nents of LED prod cts It in lu es referen es to test

con ition for e c comp nent The purp se is to give g idan e for esta l s in a level of

rela i ty for whic a prod ct is sp cified What the exact level is de en s on the prod ct

sp cification an de en s on the a pl cation profi e Stres test q alfication of the prin ip l

comp nents is defined as s c es ful completion of the test req irements outlned in e c

clau e for e c prin ip l comp nent Eac clau e sp cifies a set of q alfication tests that

s al b con idered for new LED prod ct q al fication In case of req al fication as ociated

with a desig or proces c an e, a l mited set of q al fication tests may b con idered

This Tec nical Sp cification des ribes two typ s of q al fication tests A test for whic a

rela i ty model exists is caled an ac elerated stres test (AST) for as es in rel a i ty

res lts over a mu h s orter test time p riod When a rel a i ty model is not a pro riate, then

the test is termed an initial q al fication test (IQT) an u ed to demon trate a b sic level of

ro u tnes Tests in this Tec nical Sp cification are clas ified as either IQT or AST The

stres ors or lo d that are imp sed up n LED prod cts in two example en ironmental

con ition are des rib d in An ex A These stres ors also a ply to the prin ip l comp nents

NOT In g n ral it is a s me th t p s in th h rs er te t c n itio s imple th t th more rela e c n itio s

wo ld als b p s e

For prin ip l comp nents that have fai ed the ac e tan e criteria of tests req ired by this

Tec nical Sp cification, it is recommen ed to u derstan the fai ure mec anism, determine

the ro t cau e an take cor ective action To confirm that the fai ure mec anism is

u dersto d an contained, an a pro riate cor ective an preventive action are efective, it

is recommen ed to re e t the a plca le q al fication test s) s c es ful y

This Tec nical Sp cification makes referen e to other IEC stan ard or stan ard from other

organization Where relevant, further detai s on the tests can b fou d in these doc ments

Test con ition in this doc ment may deviate from test con ition in the referen e doc ments

In s c a case, further sp cification in the referen e doc ment s ould sti b a pl ed as

a pro riate

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5 LED packa e and interconnects

The purp se of Clau e 5 is to determine that an LED p c age is ca a le of p s in the

sp cified stres tests an th s can b exp cted to give a certain level of rela i ty in general

l g ting a pl cation LED p c ages an intercon ects of diferent typ s exist There is

c r ently no of icial LED clas ification; they can b clas ified by colour (red, oran e, blue,

green), mec anical outl ne (rou d, s uare, rectan ular, s rface), by materials u ed ( ul e ox

resin p c agin , metal b se, ceramic b se e ox resin p c agin an glas p c agin )

an /or by luminou inten ity (general, hig -brig tnes , ultra-hig brig tnes ) Whie it is not

the intention of this Tec nical Sp cification to sp cify an LED clas ification, the fol owin are

dif erent common typ s of LED p c ages:

• hig -p wer LEDs (in lu es hig -brig tnes ):

– c ip-on-b ard typ s (u ual y not reflow or wave solderin but mec anical y mou ted)

• lower-p wer LEDs:

– mainly wire-b n ed typ s

Subclau es 5.1 , 5.12 an 5.13 sp cify a set of q al fication tests that s al b con idered for

new LED p c age an intercon ects q al fication Where a pro riate, fami y q al fication

can b done, ac ordin to:

• same c ip tec nolog in diferent LED p c ages;

• same phosphor s stems in dif erent LED p c ages;

• same p c age fo tprint in dif erent LED p c ages

An example q al fication flowc art is de icted in Fig re D.1

5.2 Sampl ng re uireme ts

Unles sp cified otherwise, a total of at le st 3 LED p c ages taken from thre diferent

b tc es of 10 e c s al b u ed For fami y q al fication, the thre dif erent b tc es s al b

con idered to re resent the variety of the q al fication fami y

Ex e tion to the sp cified sample size s al b noted with the re sonin that ju tifies

eq ivalent rel a i ty sti b in demon trated This may b a pro riate where multiple

LED dies are in orp rated in the p c age, for example c ip-on-b ard devices

5.3 Prod ction re uireme ts

Al q al fication LED p c ages s al b prod ced on to l n an proces es re resentative for

those that wi b u ed to s p ort LED p c age del veries at projected prod ction volumes

Sample detai s s al b re orted in the prin ip l comp nent test re ort (An ex F)

_ _ _ _ _ _

1

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5.4 As embly of LED pa k g s on te t boards

LED p c ages may ne d to b as embled on test b ard An a pro riate c oice of test

b ard, intercon ect material an proces s al b made by the man facturer The c oice of

test b ard, intercon ect material an proces s al b doc mented for e c in ivid al test in

the prin ip l comp nent test re ort (An ex F)

5.5 Moisture pre onditioning

Moisture precon itionin is a pl ca le to s rface-mou ta le devices desig ed for reflow

solderin LED p c ages s al b s bjected to moisture precon itionin ac ordin to J-S

TD-0 0E for tests sp cified in 5.11.2.1, 5.1 2.2, 5.1 2.3, 5.1 3.1, 5.1 4.1 an 5.1 4.2 The

c oice of the precon itionin level s al b doc mented for e c in ivid al test in the

prin ip l comp nent test re ort (se An ex F) The initial electrical an photometric test (se

5.7) s al b exec ted afer the moisture precon itionin

5.6 Thermal c ara teristic

The value of either the solder p int temp rature (t

s), ju ction temp rature (t

j) or thermal

resistan e (R ) s al b determined ac ordin to JESD51-51

5.7 Pre- a d post stre s ele tric l a d photometric re uireme ts

Electrical an photometric values s al b me s red at the test con ition as sp cified in the

prod ct sp cification b fore an afer stres testin Intermediate me s rements (re d p ints)

are p rmit ed an may b u ed for diag ostic purp ses Al LED p c ages u ed for

q al fication s al me t the prod ct sp cification p rameters me s red at the test con ition

b fore stres testin LED p c ages s al b tested at the o eratin c r ent sp cified in the

a pro riate LED p c age sp cification (man facturer datas e t prior to an afer the

q al fication tests The fol owin p rameters s al b me s red:

• luminou flu or radiant p wer (whic ever is a pro riate);

• forward voltage;

• colour co rdinates or dominantp ak wave len th (whic ever is a pro riate)

5.8 Pre- a d post stre s vis al inspe tion

The con tru tion, markin and finis in of the LED p c age s ould b in p cted ac ordin to

JESD2 -B101B prior to an afer the q al fication tests

5.9 Solderabi ty a d re ista c to s ldering he t

5.9.1 Solderabi ity

The o jective of the soldera i ty test is to verify the soldera i ty of the devices This

verification is made on the a i ty of the pin to b weted or co ted by solder The

soldera i ty of the LED p c age s al b tested an me tin the compl an e criteria

ac ordin to IEC 6 0 8-2-5 The soldera i ty of the LED p c age with le d s al b tested

an me t the compl an e criteria ac ordin to IEC 6 0 8-2-2 Alternatively J-STD-0 2D may

b a pled

5.9.2 Re ista c to s ldering h at (RSH-reflow) te t

The o jective of the resistan e to solderin he t test is to evaluate the p rforman e of the

LED p c age u der stres d e to solderin he t The LED p c age s al b tested an me t

the compl an e criteria ac ordin to J-STD-0 0E This test a pl es only to LED p c ages that

are sp cified for reflow solderin

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5.10 Fai ure criteria

The LED p c age an intercon ects prin ip l comp nents are con idered to have fai ed if any

of the fol owin criteria a pl es for e c item in the test

a) Forward voltage V

f

at the sp cified o eratin c r ent I

f

deviates by more than ±15 % from

the initial value Radiant p wer or luminou flu or inten ity at the sp cified o eratin

c r ent I

f

deviates by more than ±2 % from the initial value

b) Chromaticity (u’v’) at the sp cified o eratin c r ent I

)

NOT ∆u’ a d ∆v’ are d fin d in ISO 1 6 4-5:2 0

c) The LED p c age ex ibits external y visible ph sical damage atributa le to the

q al fication test However, if the cau e of fai ure is agre d to b d e to mis an l n or

electrostatic dis harge (ESD), the fai ure s al not b cou ted, but re orted as p rt of the

prin ip l comp nent test re ort

d) The LED p c age intercon ects to the test b ard fai ed, vis al y o served with zero l g t

output Perform cros -sectional analy is on fai ed samples in order to dis riminate other

fai ure modes from solder joint faiures (An ex E)

For LED p c ages a destru tive ph sical analy is (DPA) s ould b p rformed ac ordin to

An ex E on two ran om samples of s rvivin u its afer completion of the fol owin tests

where a plca le ac ordin to the a pl cation profi e: TMCL test, WHTOL test an H2S test

For LED p c age intercon ects a destru tive ph sical analy is (DPA) s ould b p rformed

ac ordin to An ex E on two ran om samples of s rvivin u its af er completion of the

fol owin tests where a plca le ac ordin to the a pl cation profie: TMCL test an VVF test

The p st electrical an photometric test of these samples s al b exec ted b fore the

destru tive ph sical analy is

It is recommen ed that faiures fou d d rin the q al fication test b ful y in estigated u ti

the ro t cau e is fou d

5.1 Initial qual fic tion tests for LED pa k ge

The initial q alfication tests for LED p c ages are group d as fol ows:

• temp rature an o eration stres :

– L w temp rature o eratin l fe (LTOL);

– Hig temp rature o eratin l fe (HTOL);

– Pulsed o eratin l fe (PLT)

• thermo-mec anical stres :

– Temp rature c cl n (TMCL);

– Vibration varia le freq en y (VVF)

• temp rature an h midity stres :

– Wet hig temp rature o eratin l fe (WHTOL);

– Damp he t c cl n (DHC)

• electrical stres :

– Electrical stres – ESD-HBM

• en ironmental stres :

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– Flowin mixed gas cor osion (FMGC);

– SO2 test (SO2)

5.1 2 Temperature a d operation stre s

5.1 2.1 Low temperature operatin l fe (LTOL)

The purp se of this IQT is to evaluate the p rforman e of the LED p c age u der stres d e

to low ambient temp rature (t

amb) o eration The test s al b con u ted ac ordin to

JESD2 -A10 D; the fol owin test con ition a ply:

Complan e is c ec ed by a plyin the fai ure criteria of 5.10 to the test res lts o tained from

the pre- an p st stres tests ac ordin to 5.7 an 5.8

5.1 2.2 High temperature operating l fe (HTOL)

to hig temp rature o eration The test s al b con u ted ac ordin to JESD2 -A10 D; the

fol owin test con ition a ply

For e c test con ition, a minimum total of 7 LED p c ages taken from 3 diferent b tc es of

the pre- an p st stres tests ac ording to 5.7 an 5.8

5.1 2.3 Puls d operatin l fe (PLT)

to pulsed o eration, for example for pulsed width mod lation The LED p c age s al b

tested ac ordin to JESD2 -A10 D, the fol owin test con ition a ply:

The LED p c age s al be o erated at the cor esp n in maximum rated o eratin c r ent

Compl an e is c ec ed by a plyin the fai ure criteria of 5.10 to the test res lts o tained from

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5.1 3 Thermo-me ha ic l stre s

5.1 3.1 Temperature c cl ng (TMCL)

The purp se of this IQT is to evaluate the p rforman e of the LED p c age, c ip an

wire/c ip b n integrity u der mec anical stres d e to extreme temp rature c cles without

JESD2 -A10 D A minimum total of 7 LED p c ages taken from thre dif erent b tc es of 2

e c s al b u ed The fol owin test con ition a ply:

The TMCL con ition closest to the man facturer’s o eratin temp rature ran e ac ordin to

the a pro riate LED p c age sp cification (a pl cation profi e, man facturer datas e t s al

b c osen u les the man facturer wis es to test complan e with a more severe c cle

con ition The c oice of the TMCL c cle con ition an the tran fer time s al b re orted

5.1 3.2 Vibratio s v riable fre ue c (VVF)

Testin the LED p c ages u der varia le freq en y vibration is in general exec ted when

mou ted on a printed circ it b ard Subclau e 5.12 des rib s the test p rameters

ac ordin ly

Precon itionin ac ordin to 5.5 is not req ired

Compl an e is c ec ed by a plyin the fai ure criteria of 5.10 to the test res lts obtained from

5.1 4 Temperature a d humidity stres

5.1 4.1 Wet high temperature operating l fe (WHTOL)

to temp rature an h midity d rin o eration Temp rature, h midity an o eratin c r ent

are u ed to ac elerate the p netration of moisture throu h an protective material to reve l

cor osion or migration mec anisms cau ed by material in omp tibi ty, misproces in or

mis an l n whic may le d to red ced rel a i ty The LED p c age s al b tested ac ordin

to JESD2 -A101C A minimum total of 7 LED p c ages taken from 3 dif erent b tc es of 2

e c s al b u ed The fol owin test con ition a ply:

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5.1 4.2 Damp he t c cl ng (DHC)

to temp rature an h midity c cl n The LED p c age s al b tested ac ordin to

IEC 6 06 -2-3 , the fol owin test con ition a ply:

• −10 °C/2 °C dry;

• 2 °C/6 °C, 9 % relative h midity;

• 10 c cles;

• 2 h/c cle

5.1 5 Ele tric l stre s – ESD-HBM

Electrical stres is tested by an electrostatic dis harge, h man b dy model test (ESD-HBM)

The o jective of this IQT is to verify that the prod ct is ro u t again t electrostatic dis harge

as sp cified The HBM simulates the electrostatic dis harge whic is typical y o served d rin

man al han l n of devices by a p rson without an ESD protection The LED p c age s al

b tested ac ordin to ANSI/ESDA/JEDEC JS-0 1, u in the h man b d model The HBM

ESD comp nent clas ification level (voltage level) s al b re orted in the prin ip l

comp nent test re ort, se An ex F

5.1 6 En ironme tal stre s

5.1 6.1 Ge eral

Precon itionin ac ordin to 5.5 is not req ired

The fai ure criterion in 5.10 a) for radiant p wer or luminou flu or inten ity at the sp cified

o eratin c r ent do s not a ply In te d, the radiant p wer or luminou flu or inten ity s al

not decre se by more than 3 % from the initial value

5.1 6.2 Hy roge s lphide (H2S)

The o jective of this IQT is to determine the cor osive influen e of typical o eratin an

storage en ironments

The resistan e to h drogen s lphide s al b tested ac ordin to IEC 6 0 8-2-4 ; the

fol owin test con ition a ply:

• air temp rature 2 °C;

• 7 % relative h midity;

5.1 6.3 Flowing mix d ga c r osion (FMGC)

The resistan e to cor osive gas atmosphere s al b tested ac ordin to IEC 6 0 8-2-6 ; the

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fol owin IQT con ition a ply:

vol/vol (p rts p r mi ion), b lan e air

Complan e is c ec ed by a plying the fai ure criteria of 5.10 to the test res lts o tained from

5.12 Initial qual fic tion te t for LED pa k ge interc nn cts – VVF

LED p c age intercon ects are tested by a vibration varia le freq en y test (VVF) The

o jective of this IQT is to determine the ef ect of vibration on comp nent p rts in the sp cified

freq en y ran e The LED p c age s al b tested ac ordin to JESD2 -B10 B; the fol owin

Prediction models are ne ded to project the ac elerated test condition to the a plcation

profi es (An ex A) The avai a le ac eleration models are des rib d in An ex B Ta le 1

ma s the q al fication test for the LED p c age intercon ects with the ac eleration model that

is a plca le for this test

Table 1 – Mappin th LED pa k ge interc n e ts qual fic tion te ts to the

us able a c leratio model with typic l ra ge of the a c leratio fa tor

Qualfic tio te t Ac eleratio mo el Typic l rang of a c leratio fa tor

Interc n e t temp rature c cln

(TMCL)

Cofin-Ma s n or Noris-L n z erg 5 to 15

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5.13.2 Interc nne t temperature c cl ng (TMCL)

The o jective of this AST is to demon trate that the solder joints' integrity is sta le again t

mec anical stres cau ed by extreme temp rature variation The TMCL con ition closest to

the man facturer’s o eratin temp rature ran e ac ordin to the a pro riate LED p c age

sp cification (a pl cation profi e, man facturer datas e t s al b c osen u les the

man facturer wis es to test compl an e with a more severe c cle con ition The temp rature

c an e rate s al b b twe n 10 °C/min an 15 °C/min The c oice of the TMCL c cle

con ition an in lu in c an e rate s al b re orted The LED p c age intercon ects s al

b tested ac ordin to JESD2 -A10 D; the fol owin test con ition a ply:

• d ration: ac ordin to Ta le 2;

Table 2 – Duration (c cle ) of temperature appl c tion

Ma imum solder p int temperature

8 °C

Compl an e is c ec ed by a plyin the fai ure criteria of 5.10 c) an 5.10 d) to the test res lts

o tained from the pre- an p st stres tests ac ordin to 5.7 an 5.8

6 Optical materials

The purp se of Clau e 6 is to determine that an o tical material is ca a le of p s in the

sp cified stres tests an th s can b exp cted to give a certain level of rela i ty in general

l g ting a pl cation Primary o tic are an integral p rt of the LED p c age Secon ary

o tic are al other o tical p rts remote from the LED p c age Al secon ary o tical p rts

an comp nents are con idered, in lu in :

• lg t tran mit in p rts (e.g len es, dif u ors):

– aluminium-co ted glas ;

– aluminium-co ted plastic;

– white plastic/non-co ted material;

– metal c reflectors;

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• o tical con erters (e.g remote phosphor an colour fi ters).

Ex lu ed from this prin ip l comp nent are the o tical comp nents directly mou ted to the

LED p c age (primary o tic ); they are p rt of Clau e 5 Main stres ors for o tical materials

are: proces -in u ed; temp rature; h midity; l g t inten ity; c emical at ac an /or

mec anical (se also An ex A) Subclau es 6.8 an 6.9 sp cify a set of q alfication tests

An example q al fication flowc art is de icted in Fig re D.2

6.2 Optic l material te t s mple

A minimum of thre o tical material samples from diferent b tc es s al b u ed for e c

q al fication test Optical test samples may have an ge metrical size, but this s al b

re orted in the prin ip l comp nent test re ort (An ex F) The prefer ed sample ge metry is a

flat plate, with a 2,0 mm thic nes

Al q al fication o tical materials s al b prod ced on to l n an proces es re resentative

for those that wi b u ed to s p ort LED prod ct del veries at projected prod ction volumes

The proces con ition for the o tical materials from s p l ers s al b recorded Deviation

s al b re orted in the prin ip l comp nent test re ort (An ex F)

Test oven /ca inets s al b cle n to avoid contamination of the samples d rin q al fication

testin

6.3 Moisture pre on itionin

Moisture precon itionin s al b exec ted ac ordin to JESD2 -A1 3F The initial

photometric tests ac ordin to 6.4 s al b exec ted b fore an afer the moisture

precon itionin

6.4 Pre- a d post stre s photometric me s reme ts

At re d p ints 0 h, 5 0 h an 1 0 0 h, the sp ctral tran mit an e an reflectan e s al b

me s red These me s rements are a to l for evaluating the degradation of o tical pro erties

d rin the prod ct agin proces

The tran mit an e of the samples is me s red u in a UV-Vis sp ctral photometer 10 %

tran mis ion is cal brated with no sample in the b am (only air in the l g t p th), 0 %

tran mis ion is cal brated by ful y bloc in the b am Me s rement ac ordin to ISO 13 6 -1

is al owed The me s rement ac urac of the tran mitan e in the ran e from 3 0 nm to

8 0 nm s al b within 0,2 %

The reflectan e of the samples is me s red u in a difu e reflection sp ctrometer 0 %

reflection is cal brated with no sample in the b am (only air in the l g t p th), 10 % reflection

is cal brated by ful y bloc in the b am The me s rement ac urac of the reflectan e in the

ran e from 3 0 nm to 8 0 nm s al b within ±0,2 %

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6.5 Adhe ion te t

The ad esion of co tin s on the samples s al b me s red ac ordin to MIL-C-4 4 7A

u in an ad esive ta e or eq ivalent (ad ised is Scotc Sup r 3 +

2

ta e, for co tin s

s owin hy ro ho ic s rface, it is prefera le to u e a hy ro ho ic typ of ad esive ta e)

This ta e is a pl ed to the co ted s rface an removed with a s a action; no visible p rtion

of the co tin s al b removed, disregardin pin oles

NOT Dig a c rdin to MIL-C-4 4 7A are c n id re pin ole

The con tru tion an finis in of the optical material s ould b in p cted prior to an af er

the q al fication tests in order to ju ge the vis al state of the samples

The o tical material prin ip l comp nents are con idered to have fai ed if an of the fol owin

criteria a pl es for e c item in the test

• Maximum 10 % red ction in tran mitan e/reflectan e at an wavelen th (in 5 nm

intervals) over the ran e 3 0 nm to 7 0 nm (comp red to 0 h value)

• The o tical material ex ibits external y visible ph sical damage atributa le to the

q al fication test No vis al or mec anical defects are al owed This in lu es deformation

an /or delamination, me nin that co tin s s al s ow no eviden e of flakin , p el n ,

crac in or bl sterin

• The o tical material ex ibits an external y visible colour c an e (e.g yel owin or

brownin )

Destru tive ph sical analy is (DPA) s ould b p rformed for o tical materials ac ordin to

An ex E on two ran omly selected samples of go d u its af er completion of e c test

sp cified in 6.10, 6.1 an 6.12 The p st photometric test of these samples s al b

exec ted b fore the destru tive ph sical analy is

6.8 Initial qual fic tion tests

6.8.1 Relativ humidity (RH)

The purp se of this IQT is to evaluate the p rforman e of co ted glas material u der stres

d e to relative h midity The test s al b con u ted ac ordin to the fol owin test

proced re:

• exp s re to a temp rature of 4 °C an > 9 % relative h midity;

• d ration: 2 0 h;

• air dry an p rform the ad esion test ac ordin to 6.5

Compl an e is c ec ed by a plyin the faiure criteria of 6.7 to the test res lts o tained from

the pre- an p st stres tests ac ordin to 6.6

2

Sc tc ® Su er 3 + is a e ample of a s ita le pro u t a aia le c mmercialy This informatio is giv n for th

c n e ie c of u ers of this d c me t a d d e n t c n titute a e d rs me t b IEC of this pro u t

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6.8.2 Boi ing water (BW)

The purp se of this IQT is to evaluate the p rforman e of co ted glas material u der stres

d e to b i n The test s al b con u ted ac ordin to the folowin proced re:

• exp s re to b i n water for 10 min;

6.8.3 Ov n water (OW)

The purp se of this IQT is to evaluate the p rforman e of co ted material u der stres d e to

water in res The test s al b con u ted ac ordin to the fol owin proced re:

• samples are s bmerged for 15 min in deionized water;

• he ted in an oven to 3 0 °C for 3 min;

• co l down to ro m temp rature;

6.8.4 High temperature e pos re (HTE)

The purp se of this IQT is to evaluate the p rforman e of co ted material u der stres d e to

hig temp ratures The test s al b con u ted ac ordin to the fol owin proced re:

• samples are s bjected to a temp rature of 2 0 °C;

• d ration: 1 0 0 h;

6.9 Ac elerate stre s te ts

6.9.1 Pre ictio mod ls

Prediction models are ne ded to project the ac elerated test con ition to the a plcation

profi es (An ex A) Some of the avai a le ac eleration models are des rib d in An ex B

Ta le 3 ma s the q al fication tests for the o tical materials with s ita le models from

An ex B for these tests

Table 3 – Mappin of the optic l-material relate a c lerate stre s te ts

Ac elerated st e s te t Ac eleratio mo el Typic l rang of a c leratio fa tor

Temp rature a d h midity (TH) Pe k mo el or g n ralz d Eyrin

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6.9.2 Temperature a d humidity (TH)

The o jective of this AST is to evaluate the p rforman e of the o tical material u der stres

d e to moisture an temp rature The Pec model is one of the models that can b u ed for

ac elerated testin , se B.7

6.9.2.2 Model parameters

If the p rameters of the Pec model (E

a, q) are avai a le then this model may b a pl ed over

the val dated ran e of con ition for relative h midity an temp rature (RH

a

an h midity exp nent q are determined by

exp rimental testin The analy is o tainin E

a

an q is outside the s o e of this Tec nical

Sp cification If these p rameters are not avai a le, this model can ot b a pl ed an testin

for the ful val dation time of the prod ct or comp nent is req ired

NOT Th mo el p rameters c uld c me from th c mp n nt s p ler

are the test values u ed in the ac elerated

stres test Ap lcation an test stres levels s al b selected within the val dated ran e:

The ac eleration factor is calc lated by a plyin Eq ation (B.7) with the model p rameters

mentioned in 6.9.2.2 an a plcation varia les mentioned in 6.9.2.3 The red ced testin time

is calc lated by the desired comp nent val dation time, for example 6 0 0 h or 2 % of rated

l fe of the prod ct, divided by the ac eleration factor The testin time, t

te t

hours

6.9.2.5 Compl a c criteria

6.9.3 Temperature a d l ght e pos re (TL)

The o jective of this AST is to evaluate the p rforman e of the o tical material u der stres

d e to temp rature an exp s re to lg t The fol owin test con ition a ply:

• Ir adiation with wave len th: 4 5 nm (±5 nm) from a source whose infrared comp nent has

b en fi tered out Alternatively ex itation wavelen th in ap l cation ±5 nm

• Ir adian e level: maximum ir adian e level in a pl cation of the prod ct declared by the

man facturer sets the test level as fol ows The test ir adian e s al b twice the maximum

a plcation ir adian e This is typical y b twe n 3 0 mW/cm

2

to 1 0 0 mW/cm

2

The

ir adian e level s al b me s red b fore startin the test an recorded in the prin ipal

comp nent test re ort (An ex F)

• Duration: 1 0 0 h

• Maximum a pl cation temp rature of the prod ct declared by the man facturer sets the

test temp rature as fol ows The test temp rature s al b the temp rature of the

comp nent when o eratin at the maximum a pl cation temp rature plu 2 °C

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• Usin a stan ard temp rature-control ed ca inet with an o tical win ow to s p ly the l g t

exp s re The o tical win ow s ould b c osen s c that it do s not c an e the inten ity

an wavelen th of the l g t exp s re The wavelen th distribution an inten ity s al be

me s red afer the l g t has p s ed the win ow

• Usin a temp rature-controled hotplate for the o tical material samples an the l g t

exp sed to it from the to , either with or without a len or dif u er s stem

6.10 Light tra smit ing materials

For l g t tran mit in materials, a precon itionin s al b p rformed ac ordin to J-S

TD-0 0E with 8 °C an 8 % relative h midity con ition

Afer precon itionin , the AST of 6.9.2 an 6.9.3 s al b con u ted

Complan e is c ec ed by a plyin the faiure criteria of 6.7 to the test res lts o tained from

6.1 Light refle ting materials

6.1 1 Dic roic-c ate gla s a d aluminium-c ate gla s

For dic roic-co ted glas an aluminium-co ted glas the IQT of 6.8.1, 6.8.2, 6.8.3 an 6.8.4

s al b con u ted

In order to ju ge the d ra i ty of the co tin , the samples s al b s bjected to the ad esion

test ac ordin to 6.5 af er e c IQT as sp cified in 6.8 Pres the ad esive s rface of the

ta e firmly again t the co ted s rface an q ic ly remove it at an an le normal to the co ted

s rface

6.1 2 Aluminium-c ate pla tic

For aluminium-co ted plastic a precon itionin s al b p rformed ac ordin to J-STD-0 0E

with 4 °C an 9 % relative h midity con ition

Afer the precon itionin the AST of 6.9.2 s al b con u ted

To ju ge the dura i ty of the co tin , the samples s al b s bjected to the ad esion test

ac ordin to 6.5

6.1 3 White pla tic/non-c ate pla tic

For white (non-co ted) plastic , a precon itionin s al b p rformed ac ordin to J-STD-2 E

with 8 °C an 8 % relative h midity con ition

Afer the precon itionin , the AST of 6.9.2 an 6.9.3 s al b con u ted

Compl an e is c ec ed by a plyin the faiure criteria of

6.7 to the test res lts o tained from

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6.12 Optic l c nv rters

Optical con erters con ist either of a phosphor layer de osited onto car ier material, or of

phosphor p rticles disp rsed within the bulk of a car ier material, or a colour fi ter The car ier

material can either b plastic comp u d (e g p ly arb nate or si cone) or a typ of glas or

ceramic

In the case of a plastic comp u d car ier, with or without phosphor layer, the o tical material

can b regarded as a l g t tran mit in material an the q alfication tests as denoted in 6.10

a ply

In the case of a glas car ier, the o tical material can b regarded as a dic roic-co ted

material The tests ac ordin to 6.9.2 an 6.9.3 s al b p rformed an in b th cases folowed

by a s ratc test ac ordin to ASTM D7 2

7 Ele tronic s bas embl es

The purp se of Clau e 7 is to determine that the electronic s b s embly is ca a le of

p s in the sp cified stres tests, an th s can b exp cted to give a certain level of

rela i ty in general l g tin a pl cation

Main stres ors for electronic eq ipment are: temp rature, main voltage variation an

h midity Subclau es 7.7 an 7.8 sp cify a set of q al fication tests that s al b con idered:

• when a new circ it desig is selected;

• when a new s p l er is selected;

• when in an existin circ it desig the fol owin is c an ed:

– a comp nent;

– a smal ada tation of the PCB layout;

– the intercon ect tec nology (b it proces , material an /or mec anical)

Where a pro riate fami y q al fication can b done, ac ordin to:

• same to olog or circ it layout;

• same comp nent set or comp nent fami y

The q al fication flowc art is de icted in Fig re D.3

7.2 Sampl ng re uireme ts

Unles otherwise sp cified, a minimum of 3 electronic s b s embl es p r test s al b u ed

In order to in lu e the ef ects of comp nent variation, the sample set s al b evenly selected

from at le st thre diferent comp nent b tc es when s c exist For example, if a 3 -sample

set is selected, then 10 samples from e c of thre diferent comp nent b tc es would b

selected For fami y q al fication, the u its s al b selected to re resent the whole variety of

the q al fication fami y

7.3 Prod ction re uireme ts

Al electronic s b s embl es for q al fication purp ses s al b prod ced on to l n an

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del veries at projected prod ction volumes Deviation s al b re orted in the prin ip l

7.4 Pre- a d post stre s ele tric l re uireme ts

The electrical values b low s al b me s red at the test con ition as sp cified in the

prod ct sp cification b fore an afer stres testin Intermediate me s rements (re d p ints)

mig t b u eful Al electronic s b s embl es u ed for q al fication s al me t the prod ct

sp cification p rameters b fore testin :

• prod ct input an output p wer;

• prod ct output voltage an c r ent;

• p wer factor an harmonic distortion of the main c r ent input;

• relevant output c r ent p rameters for example rip le c r ent or p ak c r ent

The con tru tion, markin an finis in of the electronic s b s embl es s ould b in p cted

prior to an afer the q al fication tests in order to ju ge the vis al state of the u its

This prin ip l comp nent is con idered to have faied if an of the fol owin criteria a pl es for

e c item in the test

• An deviation from rated electrical p rameters comp red to 0 h values, in p rtic lar:

– an deviation in p wer factor by more than 15 %;

– an deviation in the harmonic distortion of the c r ent main input by more than 15 %

• The electronic s b s embly ex ibits an external y visible eviden e of external crac s,

mec anical damage an /or cor osion

There are comp nents in electronic s b s embl es that can ot o erate without fai ure in hig

temp ratures or h midity These typ s of fai ures wi no lon er fol ow an ac eleration model

They wi in fact b sp cial cau e fai ures for whic no ac eleration can b calc lated

Ph sical analy is (PA) s ould b p rformed for electronic s b s embles ac ordin to

Clau e E.4 on al u its af er completion of al tests The p st electrical test of al samples

s al be exec ted b fore any destru tive ph sical analy is

It is recommen ed that fai ures fou d d rin the q al fication test b ful y in estigated u ti

the ro t cau e is foun

7.7 Initial qual fic tion te ts

7.7.1 Temperature a d operation stre s (PTC)

The o jective of this IQT is to verify that the prod ct wi o erate for a sp cified n mb r of

c cles u der p wered con ition in a temp rature c cln en ironment The test is refer ed to

as p wer thermal c cl n (PTC) an in lu es fast p wer c cl n of the electronic

s b s embly The test s al b con u ted ac ordin to 15.2 of IEC 6 9 9:2 1 ; the fol owin

modified test con ition a ply

• Temp rature c cl n ran e: − 0 °C to the hig est sp cified temp rature with a minimum of

5 °C with dT/dt > 10 K/min The temp rature refers to the ambient temp rature (t

amb) in

the test ca inet

• Powered: yes, test voltage is rated voltage ±10 %

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7.7.2 Humidity a d operation stre s (HOT)

The o jective of this IQT is to verify that the prod ct wi o erate for a sp cified time u der

p wered con ition in a h midity en ironment The test is refer ed to as hig h midity

o eration (HOT), with no c cln The h midity con ition s al b con u ted ac ordin to

JESD2 -A1 3F; the fol owin general test con ition a ply:

• d ration: 2 0 h;

• h midity con ition: 8 % relative h midity at 8 °C;

• p wered: yes, test voltage is rated voltage ±10 %

7.8 Ac elerate stre s te ts

7.8.1 Pre iction models

Prediction models are ne ded to project the ac elerated test con ition to the a plcation

profi es (An ex A) Some of the avai a le ac eleration models are des rib d in An ex B

Ta le 4 ma s the q al fication test for electronic s b s embl es with s ita le models from

• multipl cative factors for dif erent en ironmental parameters to calc late the o eratin or

non-o erative con tant fai ure rate;

• multipl cative factors that are a pl ed to a b se o eratin con tant fai ure rate to o tain

non-o eratin con tant fai ure rate

This proces is wel des rib d in several stan ard , amon whic are IPC-9 9 B an

Telcordia Tec nologies SR-3 2 Bein a pure ad up of comp nent FIT rates, the

ac eleration tests in 7.8.2 serve as an exp rimental c ec The overal electronic

s b s embly FIT rate s al b s p l ed b sed on the combination of either of the two

predictive method an the exp rimental res lts

Table 4 – Mapping the ele tronic s ba s mbly qual fic tio te ts to the us able

a c leration mod l with typic l ra ge of th a c leration fa tor

Qualfic tio te t Ac eleratio mo el Typic l rang of a c leratio fa tor

Temp rature, h midity a d o eratio

stre s

Ge eralz d Eyrin mo el or

Noris-L n z erg mo el

2 to 6

7.8.2 Temperature, humidity a d operation stre s (s qu ntial ALT)

The o jective of this ALT is to verify that the electronic s b s embly wi o erate for a

sp cified lfetime u der p wered con ition in a c cl c temp rature an h midity en ironment

The test is refer ed to as ac elerated l fe test (ALT) In an ALT, the p wer, temp rature an

h midity con ition may vary ac ordin to:

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• h midity: b twe n 2 % relative h midity an 8 % relative h midity;

• temp rature: b twe n 0 °C an 10 °C

De en in on the ac eleration factor (An ex B an 7.8.1), one s al u e the ALT profi e that

matc es the prod ct an a pl cation b in tested An example profi e is l sted in Ta le 5 The

ac eleration factor for this ALT profie can b calc lated u in the Nor is-L n zb rg model

(An ex B) It is prefera le that several ALT profi es are u ed in order to q alfy the electronic

s b s embl es

Table 5 – Ex mple ALT profi e for a ele tronic s ba s mbly

The purp se of Clau e 8 is to determine that a co l n s stem is ca a le of p s in the

sp cified stres tests, an th s can b exp cted to give a certain level of rel a i ty in general

l g tin a pl cation Co l n s stems in l g tin a pl cation can b either p s ive or active

Pas ive cool n s stems tran p rt he t throu h natural ph sical me n of con u tion,

con ection (buoyan y) an /or radiation without a plcation of a se arate p wer source or

active elements

Examples are thermal interface materials (TIM, s c as p stes, phase-c an e materials,

p tin materials), he t sin s from diferent materials (aluminium, co p r, thermo-con u tive

plastic , he t pip s), dif erent finis in (material p intin , s rface finis ), solder joints on

PCBs an dif erent s bstrates

Active co l n s stems u e a p wer source or active element to in re se the he t tran fer

rate, of en by in re sin mas flow or air velocity or raisin temp rature gradients Active

s stems can b divided further into the folowin thre categories:

• forced air or fluid circ lation (e.g fan , pumps);

• two-phase co l n s stem (e.g air-con itionin );

• thermo lectric co l n (e.g Peltier elements/he t pumps)

Ex lu ed from this prin ip l comp nent are the LED p c age solder joints on PCBs They are

p rt of Clau e 5 (LED p c age an intercon ects) Main stres ors an their ef ects on co l n

s stems are noted in Ta le 6 The most common ef ect is the degradation of the co ln

p rforman e d e to several cau es, s c as material degradation, crac s, or delamination

an /or los of rotational sp ed Th s, it is vital that this degradation is ca tured by the

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materials More ad an ed co l n s stems are s stems with pulsated air-jet tec nolog an

air-co led fan Ac eleration tests for p s ive co ln s stems s ould foc s on the in re se

of the thermal interface resistan e Ac eleration tests for active co l n s stems s ould foc s

on the degradation of p rforman e p rameters s c as rotational sp ed Subclau es 8.9 an

8.10 sp cify a set of q alfication tests that s al b con idered for new co l n s stems

Where a pro riate, fami y q al fication can b done ac ordin to:

• same p s ive co l n type of material but dif erent ge metry (size or thic nes );

• same active co l n tec nolog but dif erent p rforman e

Care s ould b taken to en ure that thermal stres introd ced by the co l n s stem do s not

cau e the prod ct to fai

The q al fication flowc art is de icted in Fig re D.4

Table 6 – Ex mple of stre s rs, af e te part

of the c ol n s stems a d its rel abi ty ef e t

St e sors Which par of the co l ng

– In g n ral me h nic l fra ture , cra k , th rmal

te sio , d gra atio of interfa e c nta ts,

d lamin tio , etc c n b o s rv d

– Outg s in a d /or oth r c emic l re ctio s

– TIM d gra atio re ultin in lower material

pro ertie

– De ra atio of b arin s a d ele tro ic

fa s, p ls te air-jets

Ab orptio of moisture th t re ults inc a g of

materialc ara teristic , d lamin tio , c ro io

Lig t ra iatio Th rmo la tic , s b trate Ch n e in material c ara teristic (cra k ,

Co l n s stem test samples s ould b taken if re resentative of the actual a plcation Al

q al fication co l n samples s al b prod ced on to l n an proces es that wi eventual y

b u ed to man facture the LED prod ct Deviation s al b re orted in the prin ip l

When analy in a p s ive co l n comp nent l ke a TIM, the PCB with LEDs s ould b

mou ted to a he tsin with the c osen TIM material in b twe n A thermocouple s ould b

atac ed u derne th the TIM on the to side of the he tsin plate in order to me s re the

degradation of the material For p s ive co l n comp nents lke TIMs, an PCB size or LED

cou t may b u ed but this s al b re orted in the prin ip l comp nent test re ort (An ex F)

2

Trang 34

When analy in an active co l n s stem l ke a pulsated air jet or a fan, the co ln s stem

itself may b degraded se arately (e g by placin it into a d st c amb r) but the thermal

ef ect of this degradation s al b analy ed on the LED prod ct The c an e in p rforman e

p rameters may b me s red on the tested u it itself A minimum of 2 active co l n

samples s al b u ed for e c q al fication test

8.3 Moisture pre onditio ing

Moisture precon itionin s al b exec ted ac ordin to JESD2 -A1 3F The initial thermal

resistan e ( or p s ive co l n s stems) or p rforman e p rameter ( or active co l n

s stems) tests sp cified in 8.4 an 8.5 s al b exec ted b fore an afer the moisture

For active co l n s stems u in lq id , the p rforman e p rameters s al b tested

ac ordin to the g idel nes from the man facturer

8.6 Pre- a d post stre s c ol ng performa c re uireme ts

Thermal resistan e an p rforman e p rameters of the co l n s stem s al b me s red

b fore an af er stres testin Intermediate me s rements (re d p ints) mig t b u eful Al

tested u its u ed for q al fication s al me t the prod ct sp cification p rameters b fore

testin Al tested u its s al b tested for deviation in the folowin way from the rated

p rforman e sp cification prior to an af er the q al fication tests:

• acou tic emis ion ;

• p wer con umption

The con tru tion, markin an finis in of the co ln u its s ould b in p cted prior to an

af er the q al fication tests in order to ju ge the vis al state of the u its

This prin ip l comp nent is con idered to have fai ed if an of the fol owin criteria a pl es for

e c item in the test

• L s of co l n p rforman e over 10 %

• Notice bly in re sed acou tic emis ion , more than 3 dB

• Power con umption ex e din the initial me s red value by more than 2 %

• The co l n u it ex ibits external y visible ph sical damage (crac s, deformation ) d e to

the q al fication test

• The thermal interface ex ibits an interface delaminated s rface are larger than 2 % of

the total interface are

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• Visible le kage of co l n l q id s c as oi , gre se an /or water

An active co l n s stem, s c as a pulsated air-jet or a fan, may b degraded se arately

(e.g by placin it into a d st c amb r), but the thermal ef ect of this degradation s al b

analy ed on the LED prod ct

Ph sical analy is (PA) s ould b p rformed for the tested u its ac ordin to An ex E on al

u its af er completion of al tests The p st thermal an p rforman e p rameter tests

ac ordin to 8.4 an 8.5 resp ctively s al b exec ted b fore an destru tive phy ical

analy is

8.9 Initial qual fic tion te ts

Qual fication tests for co lng s stems ad res the fol owin stres ors (se Ta le 6)

a) Elevated temp rature in the temp rature lfe test (TLT) sp cified in 8.10.3 For e c

sp cific co l n tec niq e, the maximum an minimum al owa le temp rature is dif erent

an s ould b taken into ac ou t This test mainly a ples to co l n s stems l ke p t in ,

Peltier elements, pulsated air jet, fan , he t pip s an thermo lastic

b) Cy lc temp rature in the p wer temp rature c cln test (CT) sp cified in 8.10.2 For

e c sp cific co l n tec nique the maximum an minimum al owa le temp rature an the

al owa le c cl n time is diferent an s ould b taken into ac ou t

c) Exp s re to moisture, whic is taken as a precon itionin ste prior to the p wer

temp rature c cl n test (CT)

d) Exp s re to l g t (TL) This mainly hold for thermo lastic an the test as des rib d

u der 6.9.3 ( emp rature an l g t exp s re) a pl es

e) Exp s re to d st p rticles, in the d st test sp cified in 8.9.2 This test only a pl es to

active co l n comp nents s c as fan , pulsated air jets an p s ive co l n comp nents

s c as he tsin fin

f Exp s re to vibration stres Durin normal o eration, as wel as in s ip in , active

co l n s stems s c as fan an pulsated air jets may exp rien e mec anical vibration

Verification of vibration stres s al b car ied out ac ordin to IEC 6 0 8-2-2 It is not

further des rib d in Clau e 8

g) Exp s re to electrical stres , whic can b ca tured by p werin the u its as is

pres rib d in the p wer temp rature c cln test of 8.10.2

h) Exp s re to c emical stres Testin in c emical en ironments is p rt of the verification

on a s stem level, se Clau e 10 It is not further des rib d in Clau e 8

The o jective of this IQT is to evaluate the p rforman e of the active co l n s stem when

s bjected to d st p rticles Sin e d st an contamination he vi y af ect the rel a i ty of

co l n prod cts, in lu in fan , the u its s ould b tested in hars d st en ironments Du t

testin s al b con u ted ac ordin to IP5X in IEC 6 5 9 The fol owin test con ition

a ply:

• d st typ : talc m p wder;

• p rticle size: <7 µm; ide l y distributed within 1 µm to 10 µm;

• d ration: 8 h;

• o eratin con ition: contin ou on

Tiêu đề	Guidelines for principal component reliability testing for LED lights and LED luminaires
Chuyên ngành	Electrical and Electronics
Thể loại	technical specification
Năm xuất bản	2017
Thành phố	Geneva

Định dạng
Số trang	70
Dung lượng	1,74 MB