Iec 61189 5 4 2015

Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion st ruct ures and assembl es – Part 5- 4: General t est met hods for mat erials and assembl es – Sol

Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion

st ruct ures and assembl es –

Part 5- 4: General t est met hods for mat erials and assembl es – Solder al oys and

fluxed and non- fluxed sol d w ire for print ed board assembl es

Mét hodes d'essai pour les mat ériaux électriques, les cart es imprimées et aut re

st ruct ures d'int erconnex ion et ensembles –

Part ie 5- 4: Mét hodes d'essai générales pour les mat ériaux et les assemblages –

Al iages à braser et brasages sol des fluxés et non fluxés pour les assemblages

THIS PUBLICATION IS COPYRIGHT PROTECTED

Copyr ight © 2 15 IEC, Ge e a, Switzer la d

Al rig ts r es r ve Unle s oth rwis s e ifi d, n p rt of this p blc tio ma b r epr od c d or uti z d in a y form

or b a y me n , ele tr onic or me h nic l in lu in p oto o yin a d microfim, with ut p rmis io in wr itin from

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c p r i ht or h v a e q ir y a o t o tainin a ditio al ri hts to this p blc tio , ple s c nta t th a dr es b low or

y ur lo al IEC memb r Natio al Commite for ur th r informatio

Dr oits d r eprod ctio ré er vé Sa f in ic tio c ntraire, a c n p rtie d c te p blc tio n p ut êtr e repro uite

ni uti s e s u q elq e forme q e c s it et p r a c n pro é é, éle troniq e o mé a iq e, y c mp s la p oto o ie

et le micr ofilms, s n la c rd é rit d l EC o d Comité n tio al d l EC d p y d d ma d ur Si v u a e d s

q e tio s s r le c p r i ht d l EC o si v u d sire o te ir d s droits s p léme tair es s r c te p blc tio , uti s z

le c ord n é s ci-a r ès o c nta te le Comité n tio al d l EC d v tr ep y d résid n e

Th Intern tio al Ele trote h ic l Commis io (IEC) is th le din glo al org niz tio th t pr ep res a d p bls e

Internatio al Sta d r ds for al ele tri al ele tr onic a d relate te h olo ie

Abo t IEC p blc tio s

Th te h ic l c nte t of IEC p blc tio s is k pt u d r c n ta t r eview b th IEC Ple s ma e s re th t y u h v th

late t e itio ,a c rrig n a or a ame dme t mig t h v b e p bls e

IEC Cat alo ue - webst ore.e ch/ cat alo ue

Th st an -alo e a plc t io for c n ultin th e tire

biblo ra hic l informat io o IEC Intern tio al Sta d rd ,

Te h ic l Sp cific tio s, Te h ic l R ep rts a d oth r

d c me ts A v aia le for P , Ma OS, A ndroid Ta let s a d

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IEC p blc t i ns s arch - www ie ch/ se rch u

Th a v an e s arc e a le to fin IEC p blc t io s b a

variety of crit eria (efere c n mb r, t ext, t ec nic l

c mmitt e,…) It als gives informatio o projec t s, re la e

a d wit hdrawn p blc tio s

IEC Just P blshed - webst ore.e ch/ just pu lshed

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d t ais al n w p blc t io s rele s d A v aia le o ln a d

als o c a mo t h b emai

Ele t ro edia - www ele t ro edia.org

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a ditio al la g a e Als k nown a t he Int ern t io al

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More t ha 6 0 0 ele t rot ec nic l termin lo y e t rie in

En ls a d Fre c e tra t ed fom t he Terms a d Definitio s

cla s of IEC p blc t io s is u d sin e 2 0 Some e t rie

h v e b e c le t ed fom e rler p blc tio s of IEC TC 3 ,

7 ,8 a d CISPR

IEC Cust omer Servic Cent re - webst ore.ec ch/ csc

If y ou wis to giv e u your fe d a k o t his p blc tio or

n e furt her a sist an e, ple s c nt act h Cu t omer Serv ic

Ce t re:c c@ie c

A pro os de l'IEC

L Commis io Ele trote h iq e Inter natio ale (IEC) e t la premièr e orga is tio mo diale q i éla or e et p ble d s

Norme internatio ale p ur to t c q i a trait à léle tri ité,à léle tr oniq e et a x te h olo ie a p re té s

A pro os de p blc t i ns IEC

L c nte u te h iq e d s p blc tio s IEC e t c n tamme t rev Ve i e v u a s r er q e v u p s é e lé itio la

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Applc t io a t on me p ur c n ult er t ou le re s ig eme t s

biblo ra hiq e s r le Norme intern t io ale ,

Sp cific t io s t ec niq e , R ap ort s te h iq e et a tre

d c me ts d l EC Dis o ible p ur P , Ma OS, t ablett es

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Recherche de p blc t i ns IEC - w ww ie ch/ se rch u

L re h rc e avan é p rmet d t ro ver d s p blc tio s IEC

e uti s nt difére t s crit ère (n méro d référe c , t exte,

c mit é d’ét ud s,…) Ele d n e a s i d s informatio s s r le

projets et le p blc t io s remplac ée o retiré s

IEC Just P blshed - webst ore.e ch/ just pu lshed

R este informé s r le n uvele p blc t io s IEC Ju t

Pu ls e d tai e le n uv ele p blc t io s p ru s

Dis o ible e lg e et a s i u e fois p r mois p r emai

Ele t ro edia - www.ele t ro edia.org

L premier dic t io n ire e lg e d t erme éle tro iq e et

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Plu d 6 0 0 e t ré s t ermin lo iq e élec t rot ec niq e , e

a glais et e fa ç is, e traite d s art icle Terme et

Définit io s d s p blc tio s IEC p ru s d p is 2 0 Plu

c rt ain s e tré s a t érie re e traite d s p blc t io s d s

CE 3 , 7 , 8 et CISPR d l EC

Serv ic Clent s - w ebst ore.e c h/ cs

Si vou d sire n u d n er d s c mme taire s r c tt e

p blc t io o si v ou av ez d s q e t io s c nt ac t ez-n u :

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Test met hods for elect rical mat erials, print ed boards and ot her int erconnect ion

st ruct ures and assembl es –

Part 5- 4: General t est met hods for mat erials and assembl es – Solder aloys and

flux ed and non- flux ed sol d wire for print ed board assembl es

Mét hodes d'es ai pour les mat ériaux électriques, les cart es imprimées et aut res

st ruct ures d'int erconnex ion et ensembles –

Part ie 5- 4: Mét hodes d'essai générales pour les mat ériaux et les assemblages –

Al iages à braser et brasages sol des flux és et non flux és pour les a semblages

W arnin ! Mak e s re that you o tain d this publc tion from a a t horize distributor

At te tion! V eui ez vou a s rer q e vou a ez o te u c t te publc t ion via u distribute r a ré

FOREWORD 4

INTRODUCTION 6

1 Sco e 7

2 Normative ref eren es 7

3 Ac urac , precision an resolution 7

3.1 General 7

3 2 Ac urac

8 3.3 Precision 8

3.4 Resolution 9

3.5 Re ort 9

3.6 Stu ent’s t distribution 9

3.7 Su gested u certainty l mits 10 4 C: Chemical test method 1

4.1 Test 5-4C01: Determination of the p rcentage of flu on/in f l x-co ted and/or flu -cored solder 1

Object 1

4.1.1 Test sp cimen 1

4.1.2 Ap aratu 1

4.1.3 Test proced re 1

4.1.4 4.2 Test 5-4CXX 12 5 X: Mis el ane u test method 12 5.1 Test 5-4X01: Spre d test, extracted cored wires or pref orms 12 Object 12 5.1.1 Method A 12 5.1.2 Method B 13 5.1.3 Ad itional information 15 5.1.4 5.2 Test 5-4X0 : Spitin test of f l x-cored wire solder 15 Object 15 5.2.1 Method A 15 5.2.2 Method B 16 5.2.3 Ad itional information 19 5.2.4 5.3 Test 5-4X0 : Solder p ol test 2

Object 2

5.3.1 Test sp cimen 2

5.3.2 Ap aratu an re gents 2

5.3.3 Test proced re 2

5.3.4 Evaluation 21

5.3.5 Ad itional information 21

5.3.6 Bibl ogra h 2

Fig re 1 – Test a p ratu for spitin test 16

Fig re 2 – Test a p ratu for spitin test, method B 18

Fig re 3 – Col ectin p p r with printed con entric circles with 1 cm pitc 19

Ta le 1 – Stu ent’s t distribution 10

Ta le 2 – Typical spre d are s defined in mm

2

13

Ta le 3 – Example of a test re ort – Spit in of flu -cored wire 19

INTERNATIONAL ELECTROTECHNICAL COMMISSION

_

Part 5-4: General test methods for materials and assembl es –

Solder al oys and fluxed and non-fluxed sol d wire for

printed board assembl es

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cific tio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cif i atio s (P S) a d Guid s (h re f ter refer e to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n n

-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio f or Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

c n e s s of o inio o th rele a t s bje ts sin e e c te h ic l c mmite h s re re e tatio fom al

intere te IEC Natio al Commite s

3) IEC Pu lc tio s h v th form of re omme d tio s f or intern tio al u e a d are a c pte b IEC Natio al

Commite s in th t s n e Whie al re s n ble ef forts are ma e to e s re th t th te h ic l c nte t of IEC

Pu lc tio s is a c rate, IEC c n ot b h ld re p n ible for th wa in whic th y are u e or f or a y

misinterpretatio b a y e d u er

4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra s are tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

b twe n a y IEC Pu lc tio a d th c re p n in n tio al or re io al p blc tio s al b cle rly in ic te in

th later

5) IEC its lf d e n t pro id a y ate tatio of c nf ormity In e e d nt c rtific tio b die pro id c nf ormity

a s s me t s rvic s a d, in s me are s, a c s to IEC mark of c nformity IEC is n t re p n ible for a y

s rvic s c rie o t b in e e d nt c rtif i atio b die

6) Al u ers s o lde s re th t th y h v th late t e itio of this p blc tio

7) No la i ty s al ata h to IEC or its dire tors, emplo e s, s rv nts or a e ts in lu in in ivid al e p rts a d

memb rs of its te h ic l c mmite s a d IEC Natio al Commite s f or a y p rs n l injury, pro erty d ma e or

oth r d ma e of a y n ture wh ts e er, wh th r dire t or in ire t, or for c sts (in lu in le al f ee ) a d

e p n e arisin o t of th p blc tio , u e of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Us of th refere c d p blc tio s is

in is e s ble f or th c r e t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t s me of th eleme ts of this IEC Pu lc tio ma b th s bje t of

p te t rig ts IEC s al n t b h ld re p n ible for id ntif yin a y or al s c p te t rig ts

International Stan ard IEC 61 8 -5-4 has b en pre ared by IEC tec nical commite 91:

Electronic as embly tec nolog

The text of this standard is b sed on the fol owin doc ments:

Ful inf ormation on the votin for the a proval of this stan ard can b f ou d in the re ort on

votin in icated in the a ove ta le

This publ cation has b en drafted in ac ordan e with the ISO/IEC Directives, Part 2.

This International Stan ard is u ed in conju ction with IEC 61 8 -1:19 7, IEC 61 8 -2:2 0 ,

IEC 61 8 -3:2 0

A lst of al p rts in the IEC 61 8 series, publ s ed u der the general title Test methods for

ele tric l materials, print ed b ards a d oth r interc n e tion stru t ures a d as emb es, can

b f ou d on the IEC we site

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cif i publ cation At this date, the publ cation wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

IEC 61 8 relates to test method for materials or comp nent ro u tnes for printed b ard

as embl es, ir esp ctive of their method of man f acture

The stan ard is divided into se arate p rts, coverin information f or the desig er an the test

methodolog en ine r or tec nician Eac p rt has a sp cif i foc s; method are group d

ac ordin to their a plcation an n mb red seq ential y as they are develo ed an rele sed

In some in tan es test method develo ed by other TCs (for example, TC 10 ) have b en

re rod ced fom existin IEC stan ard in order to provide the re der with a comprehen ive

set of test method When this situation oc urs, it wi b noted on the sp cific test method; if

the test method is re rod ced with minor revision, those p ragra h that are dif ferent are

identified

This p rt of IEC 61 8 contain test method for evaluatin ro u tnes of materials or

comp nent f or printed b ard as embl es The method are selfcontained, with s f ficient

detai an des ription so as to ac ieve u iformity an re rod cibi ty in the proced res an

test methodologies

The tests s own in this stan ard are group d ac ordin to the fol owin prin iples:

P: pre aration/con itionin method

V: vis al test method

D: dimen ional test method

C: c emical test method

M: mec anical test method

E: electrical test method

N: en ironmental test method

X: mis el ane u test method

To faci tate referen e to the tests, to retain con isten y of presentation, an to provide for

f uture exp n ion, e c test is identified by a n mb r (as ig ed seq ential y) ad ed to the

prefix (group code) leter s owin the group to whic the test method b lon s

The test method n mb rs have no sig ifican e with resp ct to a p s ible test seq en e; that

resp n ibi ty rests with the relevant sp cification that cal s for the method b in p r ormed

The relevant sp cification, in most in tan es, also des rib s p s /f ai criteria

The let er an n mb r combination are f or referen e purp ses to b u ed by the relevant

sp cif i ation Th s "5-4C01" re resents the f irst c emical test method des rib d in

IEC 61 8 -5-4

In s ort, in this example, 5-4 is the n mb r of the p rt of IEC 61 8 , C is the group of

method , an 01 is the test n mb r

TEST METHODS FOR ELECTRICAL MATERIALS,

Part 5-4: General test methods for materials and assembl es –

Solder al oys and fluxed and non-fluxed sol d wire for

printed board assembl es

This p rt of IEC 61 8 is a catalog e of test method re resentin methodologies an

proced res that can b a pl ed to test printed b ard as embl es

This p rt of IEC 61 8 foc ses on test method for solder al oy , flu ed an non-lu ed sol d

wire, b sed on existin IEC 61 8 -5 an IEC 61 8 -6 In ad ition, it in lu es test method f or

solder al oy , f l xed an non-f l xed sold wire, an f or le d f re solderin

The f ol owin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in any

amen ments) a pl es

IEC 61 8 -5, Test methods for ele tric l materials, interc n e tion st ru tures a d as emblies

– Part 5: Test met hods for print ed b ard as emblies

IEC 61 8 -6, Test methods for ele tric l mat erials, interc n e tion stru tures a d as emblies

– Part 6: Test methods for mat erials used in ma ufa t urin el ectro ic as embl ies

IEC 61 9 -1-3, At tac me t mat erials for el ectro ic as embly – Part 1-3: Re uireme ts for

ele tro ic grad e sold er a o s a d flu ed a d n n-fl ux d sol id sol ders for ele tro ic sold ering

a p c t io s

3 A ccura y, precision and resolution

Er ors an u certainties are in erent in al me s rement proces es The information given

b low ena les vald estimates of the amou t of er or an u certainty to b taken into ac ou t

Test data serve a n mb r of purp ses whic in lu e

– monitorin of a proces ;

– enhan in of con den e in q al ty conf orman e;

– arbitration b twe n c stomer an s p l er

In an of these circ mstan es, it is es ential that confiden e can b placed up n the test data

in terms of

– ac urac : cal bration of the test in truments an /or s stem;

– precision: the re e ta i ty an u certainty of the me s rement;

– resolution: the s ita i ty of the test in trument an /or s stem

3.2 Ac ura y

The regime by whic routine cal bration of the test eq ipment is u dertaken s al b cle rly

stated in the q al ty doc mentation of the s p l er or agen y con u tin the test an s ould

me t the req irements of ISO 9 01

The cal bration s al b con u ted by an agen y havin ac reditation to a national or

international me s rement stan ard in titute There s ould b an u inter upted c ain of

cal bration to a national or international stan ard

Where cal bration to a national or international stan ard is not p s ible, rou d- o in

tec niq es may b u ed an doc mented to en an e confiden e in me s rement ac urac

The cal bration interval s al normal y b one ye r Eq ipment con istently f ou d to b

outside ac e ta le lmits of ac urac s al b s bject to s ortened cal bration intervals

Eq ipment con istently fou d to b wel within ac e ta le l mits may b s bject to relaxed

cal bration intervals

A record of the cal bration an maintenan e history s al b maintained for e c in trument

These record s ould state the u certainty of the cal bration tec niq e (in ± % deviation) in

order that u certainties of me s rement can b ag regated an determined

A proced re s al b implemented to resolve an situation where an in trument is fou d to b

outside cal bration l mits

3.3 Pre ision

The u certainty bu get of an me s rement tec niq e is made up of b th s stematic an

ran om u certainties Al estimates s al b b sed up n a sin le confiden e level, the

minimum b in 9 %

Sy tematic u certainties are u ual y the predominant contributor an wi in lu e al

u certainties not s bject to ran om f l ctuation These in lu e

– calbration u certainties,

– er ors d e to the u e of an in trument u der con ition whic diff er f rom those u der

whic it was cal brated,

– er ors in the grad ation of a s ale of an analog e meter (s ale s a e er or)

Ran om u certainties res lt f rom n merou sources but can b ded ced f om a re e ted

me s rement of a stan ard item Theref ore, it is not neces ary to isolate the in ivid al

contribution These may in lu e

– ran om flu tuation s c as those d e to the variation of an influen e p rameter

Typical y, c an es in atmospheric con ition red ce the re e ta i ty of a me s rement,

– u certainty in dis rimination, s c as setin a p inter to a f i u ial mark or interp latin

b twe n graduation on an analog e s ale

Ag regation of u certainties: Ge metric ad ition (ro t-s m-s uare) of u certainties may b

u ed in most cases Interp lation er or is normal y ad ed se arately an may b ac e ted as

b in 2 % of the diff eren e b twe n the finest grad ation of the s ale of the in trument

is the interp lation er or.

Determination of ran om u certainties: Ran om u certainty can b determined by re e ted

me s rement of a p rameter an s bseq ent statistical manipulation of the me s red data

The tec niq e as umes that the data ex ibits a normal (Gau sian) distribution

nt

Uσ

t is the p rcentage p int of the t distribution as s own in Ta le 1;

σ is the stan ard deviation (σ

n–1

3.4 Re olution

It is p ramou t that the test eq ipment u ed is ca a le of s f ficient resolution Me s rement

s stems u ed s ould b ca a le of resolvin 10 % (or b t er) of the test l mit toleran e

It is ac e ted that some tec nologies wi place a ph sical l mitation up n resolution (for

example, o tical resolution)

e) an estimate of me s rement u certainty an res ltant workin l mit s) for the test;

f) the detai ed test res lts;

g) the test date an o erators’ sig ature

3.6 Stude t’s t distribution

Ta le 1 gives values of the factor t f or 9 % an 9 % con den e levels, as a f un tion of the

n mb r of me s rements

i2

r2

st

+)+(

Table 1 – Stud nt’s t distribution

t Microsection: ± μm

u) Ionic contamination: ±10 %

4 C: Chemical test methods

4.1 Te t 5-4C01: Determination of the perc nta e of f lux on/in flux-coate a d/or

f lux-core solder

Obje t

4 1.1

This test method provides a proced re for determinin the flu p rcentage on flu -co ted

an /or in flu -cored solder

Te t spe ime4.1.2

For test A, u e a proximately 2 0 g of flu -co ted an /or flu -cored solder; f or test B, u e

a proximately 3 g of f l x-co ted an /or f l x-cored solder F r solders whose flu p rcentage

is exp cted to b 1 % or more, the test sp cimen may b a proximately 10 g For solders

whose flu p rcentage is exp cted to b 2 % or more, the test sp cimen may b

a proximately 5 g

Apparatu4.1.3

a) One hot plate ca a le of b in set to (

5

05+

a) Determine the l q id s temp rature of the solder al oy fom IEC 61 9 -1-3

b) Weig the solder sp cimen to the ne rest 0,01 g (W1)

c) Caref ul y p c the solder sp cimen as tig tly as p s ible in the b t om of the b aker

Weig the b aker an solder sp cimen to the ne rest 0,01 g (W2)

d) Prehe t the hot plate to (

5

05+

) °C a ove the l q id s temp rature of the solder sp cimen

aloy

e) Place the b aker with the solder sp cimen on the hot plate Remove the b aker as so n

as al of the solder has melted an alow it to co l at ro m temp rature f or a out 3 min

f ) Usin hig ly pure pro an-2-ol, or other s ita le solvent recommen ed by the solder

man f acturer, some sl g t agitation, an gentle he t, thorou hly extract the f l x resid es

f rom the b aker Decant the extraction solution throu h co rse fi ter p p r, taking care

that no solder es a es the b aker Re e t the extraction proced re as neces ary to

remove al traces of flu resid e Eva orate the remainin solvent f om the b aker by

warmin u der a gentle stre m of air u ti the resid e in the b aker is completely dry

g) Weig the b aker an melted solder metal to the ne rest 0,01 g (W3)

h) Re e t the f l x resid e extraction proced re u ti a con tant final weig t W3 is o tained

Te t proc d re B 4.1.4.2

a) Clean the sp cimen of the flu cored solder wire u der test with a tis ue so ked in the

degre sin solvent

b) Usin the b lan e weig 3 g of the cle ned wire to the ne rest 0,01 g Place the

sp cimen into the gly erine He t to (5 ± 5) °C a ove the l q id s temp rature of the wire

u der test

c) Remove the flu f om the resin flu cored wire completely Al ow the flu to co l an

sol dify

d) Remove the sol dified solder p l et an was it in water Immerse the p l et in alcohol for

a proximately 5 min Re-was the p let in water an al ow it to dry at ro m temp rature

e) Usin the b lan e, me s re the mas of the p l et to con tant weig t, to the ne rest

0,01 g

Ev luation4.1.4.3

Calc late the flu content F

A

of the sp cimen as p rcentage by mas for proced re A fom

the fol owin f ormula:

F

A(%) = 10 × (W3 – W2) / W1

Calc late the flu content F

B

of the sp cimen as p rcentage by mas for proced re B fom

the fol owin f ormula

F

B (%) =

1

21

5 X: Miscel aneous test methods

5.1 Te t 5-4X01: Spre d te t, e tra te core wire or pref orms

Obje t

5.1.1

This test method gives an in ication of activity of cored solder or pref orm f l xes The test

method of fers two method

Method A me s res the solder spre d are

Method B me s res the solder spre d ratio

Method A

5.1.2

Te t spe ime5.1.2.1

a) 10 ml of the extracted material

b) Vacant

5.1.2.2

a) Five re l cates 0,2 mm thic 7 /3 bras of a size of a proximately 4 mm × 7 mm

b) Degre sed very fine ste l wo l (f or example, # 0)

c) Solder wire f rom Sn6 Pb 7A, or Sn9 5Ag3Cu0.5, or an other solder al oy wire agre d

b twe n u er an s p l er ac ordin to IEC 61 9 -1-3 with a diameter with 1,5 mm

d) A solder p t not les than 2 mm in de th containin at le st 2 k solder

Te t spe ime preparation

5.1.2.3

a) Cle n f i e bras coup n with ste l wo l

b) Flaten the bras coup n by b n in the o p site sides of the coup n The two b n s

s ould b p ral el to the c rve of the metal coi in whic the bras was provided in order

to stif fen an flaten the test sp cimen

c) Cut a 3 mm len th of sol d wire solder

d) Wra the c t len th of solder arou d a 3 mm man rel

e) Cut the coi into in ivid al rin s to make a preform of the solder

f ) Adju t 2 mas % test solution with pro an-2-ol or s ita le solvent an me s re an take

(0,0 ± 0,0 5) ml by u in micro s rin e or micro pip t

Te t 5.1.2.4

a) Maintain the solder b th at (2 0 ± 3) °C for Sn6 Pb 0, or at (2 5 ± 3) °C for

Sn9 5Ag3Cu0.5, or at (3 ± 3) °C hig er than the l q id s temp rature for any other

solder al oy agre d b twe n the u er an the s p l er

b) Place the preformed solder in the centre of the test sp cimen

c) Place one dro (0,0 ml) of flu in the centre of the preform of the test sp cimen

d) Caref ul y place the coup n on the s rf ace of the solder b th for 15 s

e) Remove the coup n in a horizontal p sition an place on a flat s r ace al owin the

ad ered solder to soldify u disturb d

f ) Remove al flu resid e with a s ita le solvent

Ev luation5.1.2.5

Me s re the solder spre d are by comp rin to circles (pre-drawn) with are s simiar to

those l sted in Ta le 2 The me n of the spre d of al five sp cimen tested s al b re orted

Ta le 2 is inten ed as an aid in definin are s in mm

Method B 5.1.3

Te t spe ime5.1.3.1

a) Extracted f l x fom cored wire or preforms

b) For sol d flu , 2 mas % pro an-2-ol or other a pro riate solvent solution

c) Solder wire of Sn6 Pb 7, or Sn9 5Ag3Cu0.5, or an other solder al oy agre d b twe n

more in width an len th, provided with a temp rature control er up to (5 ± 2) °C a ove

the l q id s temp rature of the tested solder

b) Dryer: An air con ection oven with a temp rature control er up to (15 ± 3) °C an

ca a le of maintainin the temp rature

c) Ton ue of other pro er to l s ita le to lf t up the test piece f rom the solder b th.

d) Scrub er: Suita le to remove e si y the oxidized f ilm of solder in the b th

k) Alcohol: Eth l alcohol (re gent grade)

l) Pro an-2-ol (re gent grade)

m) Was in solvent: Pro er solvent to remove the flu resid e af ter solderin

n) Co p r plate: A plate of 5 mm × 5 mm × 0,5 mm dimen ion of de hosphate co p r ( o

prevent s rf ace oxidation)

o) Solder: Sn6 Pb 7, or Sn9 5Ag3Cu0.5, or an other solder al oy agre d b twe n the u er

an the s p l er sp cif ied in IEC 61 9 -1-3 as referen e sp cimen

Te t spe ime preparation5.1.3.3

5.1.3.3.1 Proc dure of te t

a) Pre aration of an oxidated co p r plate: The s rf ace s al b cle ned with alcohol One

side of the plate s al b p l s ed by a rasive p p r, cle ned with alcohol, an dried

thorou hly at ro m temp rature Put this plate into a dryer set at (15 ± 3) °C for 1 h an

oxidate the plate Four corners of the plate could b b nt for e s a pl cation of a ton ue

b) Test sp cimen s al b one b r of 3,2 mm diameter on whic wire solder of Sn6 Pb 7, or

Sn9 5Ag3Cu0.5, or an other solder al oy agre d b twe n the u er an the s p l er with

1,6 mm diameter is wou d

c) Resin/rosin flu cored solder The prod ct itself s al b u ed

5.1.3.3.2 Preparation of te t pie e

a) Resin/rosin flu cored solder: Af ter was in the face with acetone an rin in with

deionized water an then with pro an-2-ol, me s re an c t of f (0,3 ± 0,0 ) g of

sp cimen, swirl it, an place it at the centre of the co p r plate Five test sp cimen s al

b pre ared

b) Extracted f l x f rom cored solder or pref orms: Adju t 25 mas % test solution with pro an

-2-ol or s ita le solvent an me s re an take (0,0 ± 0,0 5) ml by u in a micro s rin e

or micro pip t, an dro it into the centre of the co p r plate Place the solder piece on it

Five test sp cimen s al b pre ared

Te t 5.1.3.4

a) The test piece s al b heated whi e f lo tin on a solder b th ke t at (2 3 ± 3) °C f or

Sn6 Pb 7, or at (2 5 ± 3) °C f or Sn9 5Ag3Cu0.5, or at (3 ± 3) °C hig er than the

l q id s temp rature for an other solder al oy agre d b twe n the u er an the s p l er,

an ke t at this temp rature for 3 s af ter havin fu ed

b) Lift the test piece f rom the b th an co l it down

c) Remove the f l x resid e by pro er solvent

Ev luation5.1.3.5

The heig t of the spre d solder fu ed s al b me s red by a micrometer or other pro er

eq ipment From this heig t, the spre din ratio s al b calc lated fom the formula s own

b low

This proced re s al b re e ted on five of the test pieces an a me n value s al b

o tained, givin this as the spre din ratio of the flu re resentin solder u der test

In the case of resin flu cored solder an solder p ste, the mas of solder u ed for the test

s al b the mas of the sp cimen s btractin the f l x contained

Additional inf ormation5.1.4

Saf ety: Observe al a pro riate precaution on material safety data s eets (MSDS) for

c emicals in olved in this test method

ASTM B-3 bras plate, s e t, strip, an rol ed b r (ac ordin to ASTM-B-3 C2 0 HO2) [3]

5.2 Te t 5-4X0 : Spit ing te t of flux-core wire solder

The test sp cimen s al con ist of a 5 m len th of f l x-cored wire or rib on solder (may b c t

into several smal er len th for con enient han l n )

Apparatu

5.2.2.2

a) One la oratory stan with a solderin iron s p ort clamp an metal s p ort rin or tray

with a s ita le hole in its centre

b) One 2 cm × 2 cm piece of aluminium foi with a (1 ± 0,5) mm diameter hole in its

centre

c) One smal metal tray with a s ita le hole in its centre, to catc molten solder ru nin

down f rom the solderin iron tip

d) One solderin iron with a cle n c isel p int whic has b en co ted with solder an wip d

cle n

Te t proc d re 5.2.2.3

5.2.2.3.1 Preparation of te t

a) Usin ad itional pieces of solder identical to the test sp cimen, determine the flu content

of the flu cored solder in ac ordan e with IEC 61 8 -5-4, Test 5-4C01, an expres ed in

p rcentage u its (F, se 4.1.4.3)

b) Set up test con g ration as s own in Fig re 1 The solderin iron s ould b p sitioned so

that its tip exten s a proximately 6 mm throu h the aluminium foi

c) Weig the aluminium f oi (P1) an place it on the la oratory stan tray/rin so that the

1 mm hole is centred arou d the tip of the solderin iron

d) Weig the solder sample (W1)

e) Turn on the solderin iron an al ow the tip temp rature to sta i ze.

Ap ly the solder sample to the he ted solderin iron tip at an even rate, a proximately 1 cm

at a time, ke pin the solderin iron tip temp rature ste d

5.2.2.3.3 Ev luation

a) Weig the stub(s) of the solder sp cimen not melted in the test (W2)

b) Weig the alumin m foi containin the sp tered flu (P2)

c) Calc late the weig t in p rcentage of the sp tered flu as f olows:

Percent by weig t of the sp t ered flu =

)21(

)12(

WWF

PP

−

×

−

Method B 5.2.3

Te t spe ime

5.2.3.1

Thre len th of 5 cm of the flu cored solder wire or rib on solder (may b c t into several

smal er len th f or con enient han l n )

5.2.3.2

a) One la oratory stan with a solderin iron s p ort clamp an a metal s p ort tray with a

s ita le hole in its centre

b) One A4 or leter size col ectin p p r with a (9,5 ± 0,5) mm diameter hole in its centre an

printed con entric circles with 1 cm pitc (Se Fig re 3)

c) One smal metal tray u der the metal tray to catc molten solder ru nin down f rom the

solderin iron tip

d) One solderin iron with a cle n c isel p int whic has b en co ted with solder an wip d

cle n

Preparation for te t 5.2.3.3

a) Usin ad itional pieces of solder identical to the test sp cimen, determine the f l x content

of the flu cored solder in ac ordan e with IEC 61 8 -5-4, Test 5-4C01 an expres ed in

p rcentage u its (%F)

b) Set up test con g ration as s own in Fig re 2

c) The solderin iron s ould b p sitioned so that the flu cored solder wire is f ed to it at

a proximately 7 mm hig er than the col ectin p p r An le of solderin iron an /or f l x

cored solder wire again t the colectin p p r can b c an ed if the c stomer an s p l er

agre

d) Place the col ectin p p r on the metal tray

e) Turn on the solderin iron an al ow the tip temp rature to sta i ze The test temp rature

s al b at 3 0 °C, or at an other temp rature as agre d up n b twe n the c stomer an

the s p l er

Figure 2 – Te t apparatus for spit ing te t, method B

NOT Se Ta le 1,

Figure 3 – Col e ting paper with printe conc ntric circle with 1 cm pitc

Te t

5.2.3.4

Ap ly 3 cm of the solder sample to the he ted solderin iron tip a proximately at an even

rate, 1 cm at a time, ke pin the solderin iron tip temp rature ste d

Saf ety: Observe al a pro riate saf ety precaution

Table 3 – Ex mple of a te t rep rt – Spit in of f lux-core wire

5.3 Te t 5-4X0 : Solder pool te t

Obje t 5.3.1

This solder p ol test method provides a me s rement of wet in c aracteristic of f l x on/in

f l x-co ted an /or flu -cored solder

Te t spe ime5.3.2

a) Thre pieces of f l x-cored wire solder, a proximately 3 mm in len th an 1,5 mm in

diameter, thre pieces of flu -co ted, flu -cored, or flu -co ted an flu -cored rib on

solder, weig in a proximately 2 g e c , or thre f l x-co ted, flu -cored, or flu -co ted

an f l x-cored solder preforms, also weig in a proximately 2 g e c

b) Ap roximately 10 ml of f l x extracted an pre ared in ac ordan e with IEC 61 9 -1-3,

an thre pieces of 1,5 mm, non- lu ed wire solder p r IEC 61 9 -1-3

5.3.3

a) Thre f lat pieces of 0,2 mm thic 7 /3 bras a proximately 7 mm × 4 mm

b) Degre sed fine ste l wo l, for example, # 0

c) Solder p t containin not les than 4 k of molten solder at a sta i zed temp rature of

(6 ± 10) °C a ove the l q id s temp rature of the al oy u ed in the solder sp cimen ,

an havin a solder s r ace diameter of not les than 8 mm an a solder de th of not

les than 2 mm

d) Man rel havin a diameter of (3 ± 0,5) mm

e) One p ir la oratory force s s ita le for u e in han l n hot bras coup n

f ) Timer with a secon s display

Te t proc d re 5.3.4

Preparation for te t 5.3.4.1

Thorou hly cle n thre bras coup n with ste l wo l an b n one corner of e c coup n

up at an an le of a proximately 6 º to f aci tate the han ln of the coup n with f orce s

Preparation of te t spe ime5.3.4.2

a) When u in flu ed wire or rib on solder specimen , in ivid al y coi e c piece of the

solder sp cimen arou d man rel an place one coi ed piece in the a proximate center of

e c bras test sp cimen

b) When u in f l xed solder pre-f orm sp cimen , de osit one a out 2 g in the a proximate

centre of e c bras test sp cimen

c) When u in extracted flu an non-lu ed wire solder, in ivid al y coi e c piece of the

non- lu ed solder sp cimen arou d the man rel, place one dro of flu (a proximately

0,0 ml) a proximately in the centre of e c bras test sp cimen, an place one coied

piece of non- lu ed solder in the centre of the flu drop on e c bras test sp cimen

Te t 5.3.4.3

CAUTION: When movin the bras test sp cimen , take extreme care to move coup n

slowly an ke p their test s race horizontal, so that the tests are not preju iced by

movement of f l x or solder u related to the flu in action

a) Scra e the s race of the molten solder in the solder p t to remove an dros

b) Caref ul y place one test sp cimen on the s rf ace of the molten solder, le ve f or (15 ± 1) s,

an remove it to a flat, level s rf ace alowin the solder p ol to sol dify u disturb d

c) Re e t ste s a) an b) with the remainin two test sp cimen

Ev luation

5.3.5

a) Vis al y examine the s rf ace of the test sp cimen for an eviden e of f l x sp t erin as

eviden ed by sp ts of f l x an /or flu resid e outside of the main p ol of solder an f l x

resid e

b) Usin a s ita le solvent, remove the flu resid es fom the thre coup n s ff i iently to

cle rly se the sol dif ied solder p ol an the remainin bras coup n s rf ace

c) Vis al y examine the thic nes of the solder p ol ed e on the s r ace test sp cimen for

an eviden e of non-wet in or de-wetin

d) The flu ed solder an /or the solder f rom whic the flu was extracted s al fai this solder

p ol test if there is an eviden e of non-wet in , de-wet in , or flu sp terin or if the

solder p ol do s not f eather out to a thin ed e Ir eg larly s a ed solder p ols do not

neces ari y in icate de-wet in or non-wet in

Addition l information

5.3.6

Saf ety: Observe al a pro riate safety precaution Con ult material saf ety data s e ts

(MSDS) f or safety precaution f or c emicals in olved in this test method

ASTM B-3 Bras Plate, She t, Strip, an Rol ed Bar (se Bibl ogra h )

Bibl ogr aphy

IEC 6 0 8-2-2 , Basic e viro me tal t est ing pro ed ures – Part 2: Tests – Test T: Sold ering

IEC 61 8 -1, Test meth ds for ele tric l mat erials, interc n e tion stru tures a d as emblies

– Part 1: Ge eral t est meth ds a d methodology

IEC 61 8 -2:2 0 , Test methods for electric l mat erials, printed b ards a d other

interc n e t ion stru tures a d as embl ies – Part 2: Test met hod s for mat erials for

interc n e t ion stru t ures

IEC 61 8 -3:2 0 , Test methods for electric l mat erials, printed b ards a d other

interc n e t ion stru t ures a d as embl ies – Part 3: Test methods for interc n e tion

stru tures (printed b ard s)

IEC 61 9 -1-1, At tac me t mat erials for el ectro ic as embly – Part 1-1: Re uireme ts for

sold ering fl ux es for high-q a ty interc n e tio s in ele tro ics as embly

IEC 61 9 -1-2, Att ac me t mat erials for el ectro ic as embly – Part 1-2: Re uireme ts for

sold er p stes for hig -q ality int erc n e tions in ele tro ics as embly

IEC 612 9-2-7, Mat erials for printed b ards a d other interc n e t in stru t ures – Part 2-7 :

Reinforc d b se materials clad a d u cl ad – Epo id e woven E-gl as laminated sh et of

defin d flamma ility (v rt ic l b rning t est), c p er-clad

IEC 6 13 :2 0 , Enviro me t al a d e dura c test ing – Test method s for sura e-mo nt

b ards of are ara typ p ck ag s FBGA, BGA, FLGA, LGA, SON a d QFN

ISO 5 2 -2, Ac ura y (tru n s a d pre isio ) of me sureme t methods a d resul ts – Part 2:

Basic method for t he determinat ion of re e t abil ity a d re roducibil ity of a standard

me sureme t method

ISO 9 01, Qu l ity ma a eme t systems – Re uireme ts

ISO 9 5 -1, Soft soldering flux es – Test methods – Part 1: Determinat ion of n n-volatile

matt er, gra imetric meth d

ISO 9 5 -2, Soft sold ering flu es –Test method s – Part 2: Det ermin tion of n n-volatil e

matt er, e ul l iometric method

ASTM B-3 Bras Plate, She t, Strip, an Rol ed Bar

IPC-9 01:19 6, Sura e Insul at ion Resistan e H and bo k

IPC-TR-4 7:19 6, Su p rting Data a d N umeric l Ex mpl es for ANSI/J -STD-0 1B (Co trol of

Fl uxes)

_ _