Iec 60297 3 109 2015

Mechanical st ruct ures for elect rical and elect ronic equipment – Dimensions of mechanical st ruct ures of t he 482,6 mm 19 in series – St ruct ures mécaniques pour équipement s élect

Mechanical st ruct ures for elect rical and elect ronic equipment – Dimensions of

mechanical st ruct ures of t he 482,6 mm (19 in) series –

St ruct ures mécaniques pour équipement s élect riques et élect roniques –

Dimensions des st ruct ures mécaniques de la série 482,6 mm (19 pouces) –

Part ie 3- 109: Dimensions des châssis pour disposit ifs informat iques int égrés

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Mechanical st ruct ures for elect rical and elect ronic equipment – Dimensions of

mechanical st ruct ures of t he 482,6 mm (19 in) series –

St ruct ures mécaniques pour équipement s élect riques et élect roniques –

Dimensions des st ruct ures mécaniques de la série 482,6 mm (19 pouces) –

Part ie 3- 109: Dimensions des châssis pour disposit ifs informat iques int égré

INT ERNAT IONAL

ELECT ROT ECHNICAL

ELECT ROT ECHNIQUE

INT ERNAT IONALE

®

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FOREWORD 4

INTRODUCTION 6

1 Sco e 7

2 Normative ref eren es 7

3 Terms an def i ition 7

4 Ar an ement overview 7

5 Chas is dimen ion 8

An ex A (normative) Printed b ard dimen ion 1

A.1 Il u trative f i ure 1

A.2 Maximum printed b ard dimen ion 1

An ex B (normative) Printed b ard dimen ion in conju ction with f an co l n 13 B.1 Il u trative f i ure 13 B.2 Maximum printed b ard dimen ion in conju ction with fan co l n 13 An ex C (normative) Chas is mou tin o tion 16 C.1 Typ A: Example for 19” ca inet mou tin o tion 1

6 C.2 Typ B: Example for 19” ca inet mou tin o tion 16 C.3 Typ C: Chas is mou tin example 17 C.4 Typ D: Chas is mou tin o tion 17 An ex D (normative) En ironmental tests 19 D.1 Static an d namic lo d test 19 D.2 Seismic test 19 D.3 Electromag etic s ieldin p rorman e test 19 D.4 Degre s of protection 19 An ex E (informative) Exten ed c as is dimen ion 2

E.1 General 2

E.2 Il u trative fig re 2

E.3 Exten ed c as is dimen ion 2

Fig re 1 – Thre dimen ional grid for c as is an as ociated printed b ard 6

Fig re 2 – Chas is ar an ement of an emb d ed a pl cation 8

Fig re 3 – Chas is f ront dimen ion 8

Fig re 4 – Chas is de th dimen ion 8

Fig re A.1 – Chas is with printed b ard 1

Fig re A.2 – Printed b ard dimen ion 1

Fig re B.1 – Chas is with f an co l n 13 Fig re B.2 – Printed b ard dimen ion in conju ction with fan co l n , example (f an de th = 28,0 mm) 14 Fig re C.1 – Typ A: Chas is mou tin in a 19” ca inet 16 Fig re C.2 – Typ B: Chas is mou tin in a 19” ca inet 17 Fig re C.3 – Typ C: Vertical flan e mou tin 17 Fig re C.4 – Typ D: Horizontal flan e mountin 18 Fig re E.1 – Exten ed c as is example 2

Fig re E.3 – Exten ed c as is – de th dimen ion 21

Ta le 1 – Chas is heig t dimen ion 9

Ta le 2 – Chas is width dimen ion 9

Ta le 3 – Chas is de th dimen ion 10

Ta le A.1 – Printed b ard width dimen ion 12

Ta le A.2 – Printed b ard de th dimen ion 12

Ta le B.1 – Printed b ard width dimen ion in conju ction with fan co l n , example

(fan de th= 8,0 mm) 15

INTERNATIONAL ELECTROTECHNICAL COMMISSION

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cif i atio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cif i atio s (P S) a d Guid s (h re f ter refer e to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n n

-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio f or Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

c n e s s of o inio o th rele a t s bje ts sin e e c te h ic l c mmite h s re re e tatio fom al

intere te IEC Natio al Commite s

3) IEC Pu lc tio s h v th form of re omme d tio s for intern tio al u e a d are a c pte b IEC Natio al

Commite s in th t s n e Whie al re s n ble ef forts are ma e to e s re th t th te h ic l c nte t of IEC

Pu lc tio s is a c rate, IEC c n ot b h ld re p n ible for th wa in whic th y are u e or for a y

misinterpretatio b a y e d u er

4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra s are tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

b twe n a y IEC Pu lc tio a d th c re p n in n tio al or re io al p blc tio s al b cle rly in ic te in

th later

5) IEC its lf d e n t pro id a y ate tatio of c nf ormity In e e d nt c rtific tio b die pro id c nformity

a s s me t s rvic s a d, in s me are s, a c s to IEC mark of c nf ormity IEC is n t re p n ible f or a y

s rvic s c rie o t b in e e d nt c rtif i atio b die

6) Al u ers s o lde s re th t th y h v th late t e itio of this p blc tio

7) No la i ty s al ata h to IEC or its dire tors, emplo e s, s rv nts or a e ts in lu in in ivid al e p rts a d

memb rs of its te h ic l c mmite s a d IEC Natio al Commite s f or a y p rs n l injury, pro erty d ma e or

oth r d ma e of a y n ture wh ts e er, wh th r dire t or in ire t, or for c sts (in lu in le al f ee ) a d

e p n e arisin o t of th p blc tio , u e of, or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Us of th refere c d p blc tio s is

in is e s ble for th c r e t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t s me of th eleme ts of this IEC Pu lc tio ma b th s bje t of

p te t rig ts IEC s al n t b h ld re p n ible for id ntif yin a y or al s c p te t rig ts

Mec anical stru tures for electrical an electronic eq ipment, of IEC tec nical commite 4 :

Electrical con ectors an mec anical stru tures for electrical an electronic eq ipment

The text of this stan ard is b sed on the f ol owin doc ments:

Ful inf ormation on the votin f or the a proval of this stan ard can b fou d in the re ort on

votin in icated in the a ove ta le

This publ cation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

A lst of al p rts in the IEC 6 2 7-3 series, publ s ed u der the general title Mec a ic l

stru tures for electric l a d ele tro ic e uipme t – Dime sions of me h nic l stru tures of

th 4 2,6 mm (19 in) series, can b fou d on the IEC we site

Future stan ard in this series wi car y the new general title as cited a ove Titles of existin

stan ard in this series wi b updated at the time of the next edition

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• recon rmed,

• with rawn,

• re laced by a revised edition, or

The main a plcation for emb d ed computin devices are in mac ine control, medical,

tran p rtation, a rosp ce an commu ication en ironments For s c a pl cation sin le

b ard computers are typicaly u ed

In order to me t the dif ferent en ironmental con ition an han ln req irements, sin le

b ard computers req ire f or mec anical, thermal an en ironmental protection by me n of

a pro riate c as is desig s These devices c r ently ref lect a very f ragmented situation in

the view of an existin mec anical stru tures dimen ional standard Due to the lac of

stan ardization the in ivid al solution are re l zed with pro rietary dimen ion

The ra idly growin market f or sin le b ard computin devices cals f or dimen ional

co rdination of c as is an as ociated printed b ard , in order to re lace pro rietary

solution This stan ard wi esta ls a thre dimen ional grid of 4 ,4 mm (1,7 in) for

c as is an the as ociated printed b ard , whic me ts b st the most f req ent dimen ional

en ironment of the IEC 6 2 7 series On e this stan ard is esta l s ed, the desig an

man facturin of emb d ed computin solution wi gain sig ificant cost effi ien y

Fig re 1 – Thre dime sional grid f or c a sis a d a sociate printe board

MECHA NICA L STRUCTURES FOR ELECTRICA L A ND

ELECTRONIC EQUIPMENT – DIMENSIONS OF MECHA NICAL

Part 3-109: Dimensions of chassis f or embedded computing devices

This p rt of IEC 6 2 7 sp cifies dimen ion an ph sical pro erties of c as is an

as ociated printed b ard in order to provide mec anical an en ironmental integrity for

emb d ed computin devices They are u ed in variou a pl cation s c as mac ine control,

medical, tran p rtation, a rosp ce an telecommu ication, typical y b sed on sin le b ard

computers

For the e s definition of the s ita le c as is an as ociated sin le b ard dimen ion , this

stan ard is b sed on a stru tural grid of 4 ,4 mm (1,7 in)

The f ol owin doc ments, in whole or in p rt, are normatively ref eren ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 2 7-3-10 , Mec a ic l stru tures for ele tro ic e uipme t – Dime sio s of me h nic l

stru tures of the 4 2,6 mm (19 in) series – P art 3-10 : Basic d ime sio s of fo t p n ls,

su ra ks, c as is, ra ks a d c bin ts

IEC 6 5 9, De re s of prot ection pro id ed b e closures (IP Cod e)

IEC 615 7-1, Mec a ic l stru t ures for ele tro ic e uipme t – Tests for IEC 6 917 a d IEC

6 2 7 series – P art 1: Enviro me tal re uireme ts, test set-u a d safety asp cts for

c binets, ra ks, su ra ks a d c as is u der ind oor c ndit io s

IEC 615 7-3, Mec a ic l stru t ures for ele tro ic e uipme t – Tests for IEC 6 917 a d IEC

6 2 7 – P art 3: Electroma n tic shield in p rorma c t ests for c bin ts a d su ra ks

IEC 615 7-5, Mec a ic l stru t ures for ele tro ic e uipme t – Tests for IEC 6 917 a d IEC

6 2 7 – P art 5: Seismic tests for c as is, su ra k s a d plu -in u its

Annex A

(nor mative)

Printed board dimensions

A 1 Il ustrative f igure

Fig re A.1 i u trates the c as is with the as ociated printed b ard

Figure A.1 – Cha sis with printe b ard

A 2 Ma imum printed board dimensions

Fig re A.2 i u trates the maximum width an de th of printed b ard dimen ion , de en in

on the defined c as is dimen ion Se also Ta les A.1 an A.2

Figure A.2 – Printe board dime sions

IE C

Cros -section A-A

Printe b ard

Table A.1 – Printe board width dime sions

B.2 Ma imum printed board dimensions in conjunction with f an cool ng

Fig re B.2 i u trates an example calc lation f or the maximum printed b ard dimen ion ,

de en in on the defined c as is an typical he t dis ip tion with fan Se also Ta le B.1

IE C W1

Dime si on in mil l imet re

Figure B.2 – Printe b ard dime sions in conjun tion with fa cool ng,

Table B.1 – Printe board width dime sions

in conju ction with fa cool ng, e ample ( a depth= 8,0 mm)

Annex C

(nor mative)

Chassis mounting options

C.1 Type A : Example f or 19” c binet mounting option

Fig re C.1 i u trates a c as is with o tional 19” flan es

Figure C.1 – Type A: Cha sis mounting in a 19” c binet

C.2 Type B: Example f or 19” c binet mounting option

Fig re C.2 i u trates two c as is within a s brac typ mou tin s p ort

W5

Figure C.2 – Type B: Cha sis mountin in a 19” c binet

C.3 Type C: Chassis mounting e ample

Fig re C.3 i u trates a c as is with a vertical mou tin f lan e (for example 19 in h

comp tible or pro rietary)

Figure C.3 – Type C: Vertic l f la ge mounting

C.4 Type D: Chassis mounting option

Fig re C.4 i u trates a c as is with horizontal mou tin f lan es (u er sp cific)

IE C W1

W4

W5

Figure C.4 – Type D: Horizontal f la ge mou ting

Annex D

(nor mative)

Environmental tests

D.1 Static a d dy amic load test

For the pro f of mec anical integrity the c as is s al b tested on the b sis of IEC 615 7-1

(static lo d, vibration an s oc )

D.2 Seismic test

In case of seismic req irements the c as is lo ded with b ard s al b tested on the b sis of

IEC 615 7-5 (resistan e of the mec anical stru ture again t seismic imp ct

D.3 Electromagnetic shielding perf ormance test

In case of EMC req irements (electromag etic comp tibi ty) the c as is s al b tested in

ac ordan e with IEC 615 7-3 (s ieldin p rorman e level of the mec anical desig )

D.4 Degrees of protection

In case of protection of the eq ipment req irements the c as is s al b tested in ac ordan e

with IEC 6 5 9

Annex E

(inf or mative)

Extended chassis dimensions

The definition of the exten ed c as is are s is provided to at ac mis el ane u comp nents

s c as e.g fe t, han les, he t management comp nents The exten ed c as is dimen ion

are b sed on the stru tural grid of 4 ,4 mm (1,7 in)

E.2 Il ustrative f igure

Fig re E.1 i u trates a c as is with o tional ac es ories

Fig re E.1 – Exte de c a sis e ample

Figure E.3 – Exte de c a sis – depth dime sions