Due to the power semiconductor devices that are avail-able with maximum blocking voltages of 6.5 kV, the drive market with power ratings of up to 25 MW is domi-nated by voltage-source in
Trang 1An overview of the common
converter topologies and power
semiconductor devices
B Y M A R C H I L L E R , R A I N E R S O M M E R ,
& M A X B E U E R M A N N
semiconductor devices used in medium-voltage drive systems This article provides
a general overview of the common converter topologies
available on the market and their corresponding major
characteristics The different topologies are compared and
evaluated with respect to the number of semiconductors
and the complexity
Due to the power semiconductor devices that are
avail-able with maximum blocking voltages of 6.5 kV, the drive
market with power ratings of up to 25 MW is
domi-nated by voltage-source inverters (VSIs) in insulated gate-bipolar transistor (IGBT) and insulated gate-commutated transistor (IGCT) tech-nologies For
high-er powhigh-er
demands and special applications, thyristor converters are still frequently used
Medium-Voltage Drives Over the past few years, a market for medium-voltage drives has developed, which is growing at a rapid pace This market is mainly driven by rising energy costs and by the energy-saving potential offered by variable-speed drives The boom in the raw materials market has resulted
in an increased demand for medium-voltage drives over the entire power and voltage range (drives for rolling mills, gas compressors, extraction pumps, etc.)
The use of medium-voltage converters is not only limited to applications in the high power range Especially
in the American and Asian markets, medium-voltage drives are used in a power range down to several 100 kVA
In the small and medium power range of approximately
300 kVA to 2 MVA, the output voltage is based on the
Digital Object Identifier 10.1109/MIAS.2009.935494
©CREATAS
22
Trang 2standard voltages available throughout the world: 2.3 and
4.16 kV in the North American and 6–6.6 kV in the Asian
and Russian markets Even 10 kV drives are emerging for
applications that have to operate on weak line supplies In
Europe, low-voltage drives up to 690 V have become
prev-alent in this power range
In the case of high rating drives from 2 to 60 MVA, the
output voltage can usually be freely selected and is
deter-mined by cost optimization of the whole drive system,
consisting of line transformer, converter, cables,
switch-gear, and motor
Because of the various applications, the wide voltage and
power range for medium-voltage drives and the rapid
devel-opment of the available power semiconductor devices,
numerous different converter topologies have been
devel-oped for medium-voltage applications in recent decades
Unlike the low-voltage range, where the two-level (2L)
volt-age-source converter has become the dominant solution, a
large number of different converter topologies are available
in the medium-voltage market The spectrum varies from
IGBT converters with low- and high-voltage IGBTs through
IGCT converters to conventional thyristor converters
Converter Topologies
Figure 1 provides a general overview of the converter
top-ologies available on the market for medium-voltage
appli-cations Table 1 shows the essential performance data and
the power semiconductor devices used in the various
top-ologies The data only refer to the basic converter
configu-rations of the converter topologies being presented
Possible parallel or tandem connections of power sections
or step-up transformers at the converter output are not
taken into account because this would give a misleading
impression of the actual performance of each topology in conjunction with the power semiconductors being used Moreover, Table 1 only focuses on load-side inverters Pos-sible configurations for line-side converters have not been taken into consideration
The circuit topologies generally used in medium-voltage industrial converters can be roughly divided into three categories:
These categories not only differ in their actual circuit topology but also by the power semiconductors that are used—an essential difference In VSIs, asymmetrically blocking turn-off devices (IGBTs and IGCTs) with anti-parallel free-wheeling diodes of 1.7–6.5 kV are used, whereas the 1.7-kV IGBTs are only used in cellular con-verters [SC-HB(2L)] For CSIs, symmetrically block-ing, turn-off gate-commutated transistors (GCTs) are employed, whereas for load-commutated inverters (LCIs) and CCs, electrically fired, symmetrically blocking thyris-tors are used
All self-commutated VSIs, CSIs, and all line-commu-tated CCs are basically suitable for feeding induction and synchronous motors In contrast, LCIs can only be operated in conjunction with overexcited synchronous motors since this type of motor is able to provide the reactive power necessary for the commutation of the motor-side thyristors
Voltage-Source Inverters
The VSI can be basically divided into two categories:
converters in a delta connection and converters in a star
Medium-Voltage Drives for Industrial Applications
Voltage-Source
Inverters (VSIs)
Current-Source Inverters (CSIs)
Cycloconverters (CCs)
Delta Circuit
• Load tated Inverter (LCI)
• With Common Star-Point (CC-S)
• Open Circuit (CC-D)
Synchronous Motors (SMs)
• Three-Level
Neutral Point
Clamped
(3L-NPC)
• Four-Level
Flying Capacitor
(4L-FC)
• Series Connected H-Bridge Cells — Two-Level Cells SC-HB (2L) — Three-Level Cells SC-HB (3L)
• Self-Commutated Current Source Inverter (CSI)
Induction Motors (IMs) Synchronous Motors (SMs)
Delta Circuit
∆
Induction Motors (IMs) Synchronous Motors (SMs)
Star CircuitY
1
Main classification of the basic topologies available in the market today for medium-voltage converters in industrial
Trang 3connection The three-level neutral-point-clamped converter (3L-NPC, [4], Figure 2) and the four-level fly-ing-capacitor converter (4L-FC, [1], [5], Figure 3) are typical examples for delta-connected converters Common semiconductor devices used are IGBTs (in a module or press-pack package) and IGCTs for the 3L-NPC converter and IGBT modules for the 4L-FC The blocking voltages of the semiconduc-tors that are used vary from 3.3 to 6.5 kV for both types of converters To enable output voltages of up to 7.2 kV,
a direct series connection of IGBTs is also used for 3L-NPC converters
semiconductors of a valve arm is cal-culated approximately by
2
p
line-to-line motor voltage
Typical star-connected VSIs are the series-connected H-bridge (SC-HB) cellular converter with 2L H-bridges as shown in Figure 4 [SC-HB(2L)] or with three-level H-bridges [SC-HB(3L)] as shown in Figure 5 In this case, the actual drive converter is formed by connecting a number of single convert-ers in series A freely configurable number of n cells are connected to form
a phase, and the three phases are con-nected to a star point Converters of this type available on the market have
IGBT (1.7–3.3 kV-modules) and IGCT (4.5–6 kV) are used as semi-conductor valves The voltage load
arm is approximately calculated by
2
p
4 in Figure 4)
It is a characteristic feature of the delta connection that the blocking voltage rating is higher and the current rating is lower for a given output power compared with the star-con-nected topology Therefore, SC-HB topologies permit the use of low-blocking semiconductors (e.g., 1.7 kV)
in the medium-voltage range with a reduced number of cells nZ
Another major difference between star- and delta-connected circuits are
VSI 3L-NPC
Typically: 0
24
Trang 4the different line infeed configurations In the case of
star-connected converters, a separate three-phase infeed
(indi-vidual transformer secondary winding) is required for each
cell Depending on the number of cells, this can result in
very complex transformers On the other hand, the delta
connection has a concentrated dc link, so that simple diode
rectifiers with standard transformers can be used The
common dc link also permits the implementation of
mul-timotor drives where several motors can be operated from
a single dc link (e.g., in rolling-mill applications)
An important advantage of cellular converters in a star
connection results from the small step sizes in the output
voltage waveform of the converter This allows standard
line motors to be used without any output filter For the
3L-NPC, on the other hand, a reinforced motor insulation
is required or a sine-wave filter in combination with
standard line motors
Further, the dimensioning of the dc-link capacitors is
also influenced by the basic converter topology In
delta-connected, VSIs, relatively small capacitances can be used
in the dc link Assuming full active power at the output,
the amount of energy stored in the dc link would
theoreti-cally permit constant output power—fed just from the
capacitive energy stored in the dc link—for only about
5–10 ms Because the star-connected cellular converters
fea-ture a single-phase cell output, the reactive power pulsating
at twice the output frequency requires a relatively large
dc-link capacitance to limit the dc-link voltage ripple Therefore, the energy storage effort in the dc link of star-connected circuits is four to ten times higher compared with delta-connected circuits This factor depends both on the leakage inductance of the transformer, the resulting coupling of the individual cells, as well as essentially on the capacitor technology being used (e.g., dry film and electro-lytic) In this topology, the dc-link capacitors therefore rep-resent a considerable percentage of the converter costs
Valve Arm
Ud
2
Ud
2
2
The 3L-NPC converter with a 12-pulse diode infeed.
Valve Arm
Ud
3
The 4L-FC converter with a 12-pulse diode infeed.
M
A1A
1
A2
A3
B1B1
B2
B3
C1C1
C2
C3
D1
D1
A2
B2
C2
D2
B3
C3
D3
D2
D3
Valve Arm
4
A3
SC-HB cellular converter with SC-HB(2L) per cell; four SC
M
A1
A1
A2
C1
C2
B1
B2
A2
B1
B2
C1
C2
Valve Arm
5
SC-HB cellular converter with SC-HB(3L) per cell; one cell
Trang 5Current-Source Inverters
The self-commutated CSI (Figure 6) differs from the LCI
(described below) by the turn-off components that are
used on the motor-side converter This enables the
opera-tion of both synchronous and inducopera-tion motors The
pulsewidth modulation results in almost sinusoidal motor
currents This requires a real dc link with sufficient
magnetically stored energy Because the dc link does not
permanently conduct the peak value of the ac output
cur-rent, the dynamic response of this converter is
compara-tively low The ac filter capacitors must be used at the
output terminals, which are capable of conducting the
dc-link current at any time and therefore permit
commuta-tion of the turn-off power semiconductors [3] These
capacitors also operate as output filters and reduce the
voltage stress on the motor windings
As a turn-off semiconductor, symmetrically blocking
GCTs are generally used The requirement for a
symmetri-cal blocking capability results in a special design of the
GCT Therefore, the range of commercially available
devi-ces is limited The typical power range covers 1–7 MW,
and the input voltage is limited to typically 6.6 kV due to
the magnetic power supply of the gate-control circuits
Thyristor Converters
Basically, two thyristor converter topologies have become
prevalent today
Load-Commutated Inverters
LCIs are suitable for driving synchronous motors with a variable output frequency The line- and motor-side recti-fiers are controlled, so that the same dc-link voltage refer-ence value is obtained Hrefer-ence, two dc voltage systems are coupled by a filter choke (Figure 7) This results in motor currents that are approximately square-wave currents On the other hand, the output voltage waveform is close to sinusoidal Because of the reactive power required for the commutation of the thyristors, LCIs can only be used for operating over-excited synchronous motors
LCIs are primarily used for converters (e.g., gas com-pressors, gas liquefaction applications, and main propul-sion drives for ships) that operate continuously The typical power range of these drives is 10–70 MW (Figure 8)
A further application for LCIs is starting converters for synchronous motors Here, gas turbine generators for power generation represent a special application as the starting power is only a fraction of the full generator power Starting the generator not only requires a step-up transformer to increase the output voltage but also a closed-loop control that permits the high field-weakening ratios With this concept, gas turbine generators with a power of 600 MW can be started with a converter power
of approximately 15 MW
Cycloconverters
The CC is the only medium-voltage converter topology that does not use any kind of energy storage device in the
dc link Using three antiparallel three-phase bridges for the three motor phases, the control always connects the appropriate line-voltage sections to the corresponding motor phase by using the thyristor switch matrix How-ever, because the thyristors have to be commutated by the line, the maximum output frequency is limited to half the line frequency On the other hand, because of the high overload capability of the thyristors and the fact that the motor phases are directly connected to the feeding power system, very high-transient overload currents can occur This feature is also used to implement a fast dynamic response of the drive system
The main advantage of the open connected CC (CC-D
in Figure 9) compared with the star-point-connected CC (CC-S in Figure 10) is that it is possible to use a standard-line transformer with low-leakage inductance
These characteristics have resulted in two main applications:
where the rolling process results in high-surge loads
M dc-Link
6
CSI with six-pulse line- and motor-side converters.
Filter
M
7
LCI with 12-pulse line- and motor-side converters.
8
Example of a commercial LCI: 12-pulse motor- and line-side bridge with filter choke of a Siemens Sinamics GL150 converter with six thyristors connected in series per valve
26
Trang 6(20 MW for 60 s) The frequencies of the directly
driven rolling stands are typically 10–20 Hz
diame-ter of up to 10 m and can be directly operated with
synchronous motors that are just as large (ring
motors) at typically 6–9 Hz Mills such as these
have a continuous rating of approximately 20 MW
Power Semiconductors
Thyristors
Although the basic converter concept of LCIs and CCs has
not changed over the past 20 years, the components that are
used have undergone an astonishing increase in performance
Thyristors for use in converters were already being used in
commercial applications in the early 1960s The
perform-ance of the thyristors has significantly increased This
devel-opment has been accompanied by increasing wafer size,
mainly driven by telecommunications technology This is
because (unlike the finely structured IGBTs, which are
chip) the thyristor function can be realized on wafers of any
size using simple contact masks The increase in the off-state
voltage also requires doped material that is even more pure
and more homogeneous The precise doping is realized
through neutron conversion of silicon to phosphor
Thyris-tor development often follows silicon development
Based on this dynamic development, the number of
individual semiconductors and therefore the costs of the
overall converter have been significantly reduced One
example of this is a 16-MW LCI: today, only 24 individual
semiconductors are required, whereas 20 years ago, 96
thyristors were needed
With the increased silicon surface areas of the individual
thyristors, LCIs and CCs can also be implemented without
fuses without reducing the short-circuit withstand
capabil-ity If a semiconductor fails, thyristors (which are generally
implemented as press packs) have the advantage that they
form a safe short-circuit path for the subcircuit that is
affected This prevents arcing in the case of a fault
Because of the press-pack structure, thyristors have a
practically unlimited service life Many systems have been in
operation for more than 20 years without any fault, which
clearly indicates the high reliability of these components
With the availability of large individual devices, it is
no longer necessary to connect devices in parallel, which
avoids the known problems of static and dynamic
cur-rent distribution
To enhance the converter output voltage and output
power, thyristors must be directly connected in series
Because of the RC snubber and tight tolerances of the reverse
recovery charges, thyristors can be connected in series
with-out having to use individually matched devices (Figure 11)
However, the modularization regarding the number of
devices connected in series requires a suitable control
method In the past, simple magnetic couplers were
usually used to provide the necessary galvanic isolation
However, this requires individually adapted transformers
that meet the requirements of the insulation system
This is the reason that manufacturers changed over to
module LCI and CC concepts with thyristor control
electronics, including power supplies fed directly from the
M
9
Cycloconverter in an open connection in a six-pulse design.
10
M
Cycloconverter with common star point (CC-S) in a six-pulse design.
TABLE 2 DEVELOPMENT OF THE MAIN THYRISTOR CHARACTERISTIC VALUES [2].
27
Trang 7RC circuit This technique has been
used in high-voltage dc transmission
systems for a long time Because of the
progress made in digital electronics,
state-of-the-art gate drivers are able to
transmit additional information about
the state of the thyristor to the higher
level control Using a complex
program-mable logic device (CPLD), numerous
coded feedback signals (thyristor
volt-age, correct firing) can be signaled back
to the control electronics
Communica-tion is implemented using standard
du-plex fiber-optic cables This allows
individual thyristors to be monitored
using the control electronics
This technique allows simple
mod-ular structures to be realized up to very high power ratings
Taking everything into account, this explains why the
thyr-istors still play a significant role in medium-voltage power
electronics even after 45 years of industrial use Of course,
the lower and medium power range is now addressed using
components that can be turned off (IGBTs) At higher
power ratings, a special thyristor version is used: the IGCT
In the highest power range, the thyristor still remains
unbeatable when it comes to performance, reliability, and
low equipment costs
IGCTs
The IGCT is a further development of the gate turn-off thyristor (GTO) The fine structure of the silicon pellet with more than ten single thyristors per square centimeter allows the anode– cathode current to be commutated into
an anode-gate current This means that, for several microseconds, the complete load current has to be conducted by the gate However, as a result of the progress made in MOS power transistors and electrolytic capacitor technology, today, this is possible up to currents of 6,000 A The only disadvantage today
is the relatively high power require-ment of the gate-control circuit Figure 12 shows an example of a typical IGCT power electronic building block (PEBB) for a 3L-NPC converter
It consists of four IGCTs, including gate drivers and the cor-responding free-wheeling diodes, the water cooling system, RCD snubbers, and di/dt-chokes Using 4 kA/4.5 kV IGCT devices, the maximum converter power in a 3L-NPC topol-ogy is 9–10 MVA
IGBTs
IGBTs now completely dominate the low-voltage converter sector and are also being increasingly used for medium-voltage converters Because of the low cell size of the MOS structure, only relatively small chip sizes of maximum 15
are currently in industrial production Because each of these chips has to be capable of blocking the maxi-mum device voltage, an individual edge termination has to
be integrated However, the edge width on the chip increases nearly linearly with the required blocking capa-bility and results in a significant reduction of the active semiconductor surface While a 1,700-V chip still has approximately 75% active surface, for a 6,500-V chip, the active surface is reduced to 50%
The main advantages of IGBTs, especially for small and medium power ratings, are the controllability of the switching behavior as well as the short-circuit capability
L1 L2 L3
P
N
11
Siemens LCI thyristor module with 18 thyristors, including drivers
and RC snubbers and the corresponding circuit arrangement.
12
MULTILEVEL CONVERTERS ARE FORMED BY CONNECTING
A NUMBER OF SINGLE CONVERTERS
IN SERIES.
NPC-Diode Powercard
IGBT-Powercard
T1
2
T3
T4
T ′1
D′1
D2 D′2
T ′2
T ′3
T ′4
13
Siemens Sinamics GM150 IGBT 3L-NPC phase design with IGBT- and NPC-Diode-Powercards for 3.3–7.2 kV converters 28
Trang 8of the components This makes it
pos-sible to operate the IGBTs without a
snubber, enabling a simple, low-cost
converter design A further advantage
results from the simple series
connect-ability of the IGBTs, which now
per-mits converters with output voltages
up to 7.2 kV rms to be implemented
in 3L-NPC technology
The design of 3L-NPC phase of the
converter is shown in Figure 13 The
modular phase design consists of four
identical IGBT-Powercards and one
NPC-Diode-Powercard Each
IGBT-Powercard comprises two IGBT
mod-ules (including gate drivers), whereas
two SC IGBTs are located on
neigh-boring Powercards The
NPC-Diode-Powercard consists of two double-diode modules and the
corresponding RC snubbers for passive voltage balancing
in the series connection This design is used for all
Sie-mens Sinamics GM150 IGBT converters with output
vol-tages from 3.3 to 7.2 kV using either 3.3 or 6.5
kV-IGBTs A simplified structure without SC
semiconduc-tors is used for the 2.3-kV inverter
The converter cabinet design of a Siemens Sinamics
GM150 IGBT converter using the phase design in Figure
13 is shown in Figure 14 It consists of a standard 12-pulse
diode rectifier, the three-phase 3L-NPC-inverter, and the
control cabinet The output voltage range of this design is
3.3–7.2 kV The maximum output power is 5.8 MVA for
a single water-cooled unit or 4.3 MVA for the air-cooled
version The output power can be extended up to 10 MVA
for the water-cooled version when units are connected in
parallel
Load-Cycling Capability
While the load-cycling capability of
the press-pack components currently
used for all applications offers a
suffi-cient margin, IGBT modules with
their soldering and bonding
techni-ques require a precise analysis of the
load-cycling requirements and the
resulting temperature changes that
occur in the application The
load-cycling capability of the connection
bond wire/chip can be significantly
increased by applying an additional
polyimide coating to the bond wires
For the necessary resistance to cyclic
temperature stress, which determines
the reliability at low operating
fre-quencies (typically <15 Hz) or
tempo-rary overload conditions (in rolling
mills typically 60 s load, 300 s no
load), further measures have to be
taken in the module structure The
aim is to adapt the thermal and
mechanical expansion coefficients to
those of silicon to avoid cracks in the
soldered joints This adaptation is achieved using Al-N ceramic substrates and a base plate made of Al-SiC (alumi-num-filled Si-C)
Diodes
Diodes are used in all of the VSIs For IGBT modules, diode chips with the same production technique are used However, in this case, developers have
no possibility of selecting a specific silicon surface of the diode chips The diode surface is usually about half that
of the IGBT surface This limits the converter design regarding the regen-erative power capability and the short-circuit protection
Rectifier 12-Pulse
Inverter (3L-NPC)
Control Cabinet
NPC-Diode Powercard
IGBT-Powercard
2.4 m
1.2 m 2.2 m
14
Air-cooled Sinamics GM150 IGBT converter (Siemens).
THYRISTORS ARE STILL IMPORTANT DEVICES FOR HIGH-POWER AND LOW-FREQUENCY DRIVES IN SPECIAL APPLICATIONS.
1 10 100
2.3 kV 3.3 kV4.16 kV 7.2 kV
Siemens Perfect Harmony SC-HB (2L) 1.7 kV-IGBT
Siemens Perfect Harmony SC-HB (2L) 3.3 kV-IGBT
Simovert GL1503 LCI Thyristor
1 Up to 2 × Parallel Connection
2 Up to 3 × Parallel Connection
3 Output Six-Pulse for Starting Converter or 12-Pulse for Continuous-Duty Converter
4 Implemented Drive with Four Motor Winding Systems
VA
[kVeff ]
SA
15
Sinamics SM1502 3L-NPC 4.5 kV-IGCT
Sinamics GM150 1
3L-NPC 3.3 kV-IGBT
Perfect Harmony4 SC-HB (2L) 1.7 kV-IGBT
Trang 9A greater degree of freedom is offered by converters
with press-pack components in which the diode function
is implemented in separate components In this case, the
diode area can be adapted to the specific requirements of
the application
Summary
The typical converter topologies over the power and output
voltage range are shown in Figure 15 using examples from
the Siemens product spectrum in the medium-voltage
range CCs have been omitted Voltage-source converters
(3L-NPC and SC-HB) cover the complete power range up
to 25 MVA and motor voltages up to 7.2 kV In some cases,
converters with a voltage dc link (SC-HB) up to 60 MW
have already been implemented by connecting single
con-verters in parallel In the power range up to approximately
20 MW, IGBTs (off-state voltage between 1.7 and 6.5 kV)
and IGCTs (off-state voltage 4.5 kV) are used
IGCTs (and IGBTs in a press-pack package) are preferred
wherever the application demands a very high load-cycling
capability, e.g., in rolling mills A further advantage when
using IGCTs is the fact that the actual semiconductor
switches are separated from the free-wheeling diode so that
the diode surface and the diode properties can be adapted to
the requirements of the application Examples are an
improved regenerative feedback capability or a higher surge
current capability when compared with a module diode
Despite the wide overlap between the different converter
systems (Figure 15), each topology has its own preferred
fields of application The selection of a converter concept
that is suitable for a specific application largely depends on
the drive system costs The semiconductors make up a
considerable portion of the costs, especially for VSIs The silicon area used per megawatt of output power is therefore
an indicator of the costs of each converter concept Figure 16 shows the silicon area per megavoltampere of converter output power for the various converter concepts explained earlier For comparison, the corresponding silicon area for a 690-V motor-side converter in 2L technology (pink bar) is also shown
It is clearly apparent that by using high-voltage IGBT
the silicon area and therefore the semiconductor costs are considerably higher This is because of the higher switch-ing and on-state losses of the high-voltage IGBTs requiring a larger silicon area per megavolt ampere compared with IGCT or thyristor-based solutions However, the higher semiconductor costs are nearly com-pensated by the simpler mechanical design and the consid-erably lower snubber costs compared with the drives using press-pack technology A comparably small semicon-ductor surface can be achieved in the SC-HB(2L) topol-ogy using 1.7-kV components The smaller nonactive edge termination area in 1.7 kV devices enables a higher utilization of the installed silicon area In conjunction with the relatively small switching and on-state losses of low-voltage IGBTs, this leads to a substantially lower silicon area per megavoltampere compared with topologies requiring high-voltage IGBT devices (e.g., 3L-NPC) However, in the SC-HB topology, the very high costs of passive components (dc-link capacitors and line transform-ers) also have to be taken into account
LCIs have clearly the smallest silicon surface of all the concepts The LCI will therefore remain an important drive technology, especially for high power applications and because of its high reliability (lower number of switching components and control electronics) Comparing the CC with the VSC topologies, the silicon area is comparable Therefore, the CC will remain an attractive solution for special applications (e.g., rolling and ball mills)
In the future, the drive market up to 30 MW will be dominated by VSIs with IGBTs and IGCTs At higher powers and for special applications, thyristor converters will still be important
References
[1] S S Fazel, D Krug, T Taleb, and S Bernet, ‘‘Comparison of power semiconductor utilization, losses and harmonic spectra of state-of-the-art 4.16 kV multi-level voltage source converters,’’ in Proc 2005 Euro-pean Conf on Power Electronics and Applications (EPE’05), Dresden, Germany.
[2] A Hoffmann and K Stocker, ‘‘Thyristor-Handbuch,’’ 4 Auflage, 1976.
[3] B Wu, High-Power Converters and AC Drives New York: Wiley, 2006 [4] M Ruff, R Sommer, and G Zaiser, ‘‘Spannungszwischenkreisum-richter im Mittelspannungsbereich,’’ ETG-Fachtagung Bauelemente der Leistungs elektronik und ihre Anwendungen, Bad Nauheim, Ger-many, 2002.
[5] C Keller, ‘‘Low power converters for high output voltages,’’ in Proc.
2005 European Conf on Power Electronics and Applications (EPE’05), Dresden, Germany, 2005.
Marc Hiller (marc.hiller@siemens.com), Rainer Sommer, and Max Beuermann are with Siemens AG in Nuremberg, Germany This article first appeared as ‘‘Converter Topologies and Power Semiconductors for Industrial Medium Voltage Converters’’ at the
2008 IEEE Industry Applications Society Annual Meeting
0 50
100
150
200
250
300
350
400
-Module 3L-NPC
-Module 3L-NPC
1) CC All Semiconductors Considered Because Line Side and Motor Side Are Not Separable
2) Converters with High Load Cycle Capability
16
Silicon surface for various topologies and semiconductors
with reference to the output apparent power (motor-side
converters only).
30