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Characterization of interfacial mechanical properties using wedge indentation method 6

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If the b onsideration Plane view f 200 nm; fore the crac FESEM pl he curvatur d.. studen energy relea interfacial t ack pattern kness of 500 and toward f wedge inde ack front.. Interf f

Trang 1

t

F

t

t

d

b

f

o

u

s

t

κ

*

induced stre

taken into c

Fig 4.13: P

thickness of

taken as bef

The

determine th

been applied

front of the

of the wedg

used to fit th

shown in F

thickness ca

(

1

f

f

κ =

⎡ +

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Courtesy o

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onsideration

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f 200 nm; (

fore the crac

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d First, a tr

delaminatio

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ig.4.14 Th

an then be d

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''( )

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ck kinks int

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on impressi ation crack

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g Haiyan, M

ccurs, the e culation of i

terfacial cra

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to the film a

mage of a mination cra grid paper i

y defining t ion); then a front with a

e of interfac using Eq.(4

M.Sc studen

energy relea interfacial t

ack pattern kness of 500 and toward f

wedge inde ack front T

s used to ob the origin o

a commercia

a ninth-orde cial crack f 9) and the

nt of Associ

ased due to toughness

by SEM*:

0 nm Interf film surface

entation im The followin btain the co

f the coordi

al software

er polynomi

front, κ, for function f(x

iate Prof Dr

o buckling

(a) BD fi facial crack

e [1]

mpression is

ng approach oordinates a inates at the (Origin Pro ial function

r different B

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(4.9

r Zeng Kai

must be

lm with

k front is

used to hes have along the

e middle

o 7.5) is

n, f(x), as

BD film

)

yang

Trang 2

o

c

F

t

Fig 4.14: F

order polyn

curvature of

Fig 4.15: C

thickness ra

FESEM plan

nomial func

f the crack f

Curvature

anging from

ne-view ima ction is fit front [2]

of interfaci

m 100 to 100

age of delam tted to the

ial crack fr 00nm [2]

minated are crack fron

front determ

a on 500nm

nt in order

mined for t

C

m BD film A

r to determ

the BD film

Chapter 4

A ninth-mine the

ms with

Trang 3

i

B

a

m

1

f

i

t

m

t

r

c

f

Fig 4.16: F

interfacial c

BD film: a

and (d) the

To

measuremen

1000nm) F

film thickne

interfacial c

this suggest

mode, and

thickness is

reaches a pl

circular; thu

film, the cra

ESEM plan

crack front o

slightly cur

1000 nm BD

determine

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ts that the c

the plane

increased t

lateau at ab

us the circul

ack front is

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on (a) the 10 rved crack f

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the curvatu

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ws the relat

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is very stra critical buck strain cond

to about 500

bout 0.51 µm

lar buckling slightly cu

ages of the w

00 nm BD f front; (c) th most circular

ure of the

h BD film tionship bet

in Fig.4.16(

aight and th kling stress dition is fu

0 nm or mor

m-1 (Fig.4.1

g mode sho urved (Fig.4

wedge inden film: a straig

he 500 nm B

r delaminati

delaminati thickness tween the cu (a), for a B

he curvatur should follo ulfilled In

re (Fig.4.16 15), and the uld be adop 4.16(b)); hen

ntation sites ght crack fr

BD film: a ion [2]

ion crack f (100nm, 30 urvature of

BD film ≤

e is closed

ow the stra contrast, w 6(c) and 4.1

e delaminati pted For th nce the crit

C

s and the as ront; (b) the curved crac

front, at le 00nm, 500n

f crack front

100 nm th

to zero (Fi ight-sided b when the B 6(d)), the cu ion shape is

he 300 nm th ical bucklin

Chapter 4

sociated

e 300 nm

ck front,

east five

nm, and

t and the hick, the ig.4.15); buckling

BD film urvature

s almost hick BD

ng stress

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