Intel incorporated INTEL CORPORATION

INTEL CORPORATION INTEL CORPORATION INTEL CORPORATION INTEL CORPORATION INTEL CORPORATION INTEL CORPORATIONINTEL CORPORATION INTEL CORPORATION INTEL CORPORATIONINTEL CORPORATION INTEL CORPORATION INTEL CORPORATION

The Company’s platforms are used in a range of applications, such as personal computers (PCs) (including Ultrabook systems), data centers, tablets, smartphones, automobiles, automated factory systems and medical devices

The Company also develops and sells software and services primarily focused on security and technology integration

The Company offers platforms that incorporate various components and technologies, including a microprocessor and chipset A microprocessor-the central processing unit (CPU) of a computer system-processes system data and controls other devices in the system It offers microprocessors with one or multiple processor cores Its second and third generation Intel Core processor families integrate graphics functionality onto the processor die In contrast, some of its previous-generation processors incorporated a separate graphics chip inside the processor package

The Company also offers graphics functionality as part of a separate chipset outside the processor package Processor packages may also integrate the memory controller

A chipset sends data between the microprocessor and input, display, and storage devices, such as the keyboard, mouse, monitor, hard drive or solid-state drive, and compact disc (CD), digital versatile disc (DVD) or Blu-ray drive The Company offers and develops System-on-Chip (SoC) products that integrate its core processing functions with other system components, such as graphics, audio, and video, onto a single chip

The Company offers Intel vPro technology, a computer hardware-based security technology for the notebook and desktop market segments During 2011, it introduced the second generation Intel Core vPro processor family

The Company offers components and platforms for mobile phones and connected devices Key mobile phone components include baseband processors, radio frequency transceivers and power management integrated circuits It also offers mobile phone platforms, including Bluetooth wireless technology and global positioning system (GPS) receivers, software solutions, customization, and essential interoperability tests

The Company competes with Taiwan Semiconductor Manufacturing Company, Ltd.,

GlobalFoundries Inc., Advanced Micro Devices, Inc., International Business Machines Corporation, Oracle Corporation, ARM Limited, NVIDIA Corporation, MIPS Technologies, Inc., QUALCOMM Incorporated, Texas Instruments Incorporated and Symantec Corporation

5-Year Financial Results

5-Year Revenue Growth

Per Share Ratios

Dividends Per Share

Share Related Items

Market Cap (Mil) $ 118,945.25

Efficiency

MARKET SHARE OF INTEL IN MOBILE CPU FOR 2013.

The 100 largest companies in the world by market value in 2013 in million U.S dollars

Intel has a market value of 107,995.80 million U.S Dollars

3 MARKET STATUS OF INTEL.

4 EXPERTISE OF COMPANY

Intel was an early developer of SRAM and DRAM memory chips, and this represented the majority

of its business until 1981 Although Intel created the world's first commercial microprocessor chip in

1971, it was not until the success of the personal computer (PC) that this became its primary

business During the 1990s, Intel invested heavily in new microprocessor designs fostering the rapid growth of the computer industry During this period Intel became the dominant supplier of

microprocessors for PCs, and was known for aggressive and sometimes illegal tactics in defense of its market position, particularly against Advanced Micro Devices (AMD), as well as a struggle with Microsoft for control over the direction of the PC industry

5 DESCRIPTION OF EVENTS AND PRODUCTS

Intel was originally founded in Mountain View, California in 1968 by Gordon E Moore (of "Moore's Law" fame, a chemist and physicist), Robert Noyce (a physicist and co-inventor of the integrated circuit), Arthur Rock (investor and venture capitalist), and Max Palevsky

Moore and Noyce came from Fairchild Semiconductor and were Intel's first two employees Rock was not an employee, but he was an investor and Chairman of the Board

The total initial investment in Intel was $2.5 million convertible debentures and $10,000 from Rock Just 2 years later, Intel completed their initial public offering (IPO), raising $6.8 million ($23.50 per share)

Intel's third employee was Andy Grove,a chemical engineer, who later ran the company through much of the 1980s and the high-growth 1990s

Moore and Noyce initially wanted to name the company "Moore Noyce" The name, however, was a partial homophone for "more noise" – an ill-suited name for an electronics company, since noise in electronics is usually very undesirable and typically associated with bad interference Instead they used the name NM Electronics for almost a year, before deciding to call their company Integrated Electronics or "Intel" for short Since "Intel" was already trademarked by the hotel chain Intelco, they had to buy the rights for the name

EVENTS CHANGING THE COURSE OF INTEL INC

A. CEO’S (Intel has just 6 CEO’s till its inception to 2013)

1. Robert N Noyce

CEO: 1968-1975

CAREER: Noyce first worked at Shockley Semiconductor, but he and seven others left Shockley

to start Fairchild Semiconductor in 1957, the first successful semiconductor company in the region There Noyce invented a process for making integrated circuits In 1968 Noyce and

colleague Gordon Moore formed Intel He was the president and chief executive from 1968 until

1975 At the time of his death Noyce was president of Sematech

EDUCATION: Ph.D in physics, Massachusetts Institute of Technology, 1953; Bachelor's degree

in mathematics, Grinnell College, 1949

AGE: 1927-1990 (died at age 62)

2. Gordon E Moore

CEO, 1975-1987

CAREER: Moore joined Shockley Semiconductor Laboratory in 1956, working on

semiconductor process technology with William Shockley, co-inventor of the transistor He was a co-founder of Fairchild Semiconductor, which produced the world's first commercial integrated circuit In 1968, with the late Dr Robert Noyce, he cofounded Intel He was chief executive from

1979 until 1987, and was chairman of the board from 1979 until 1997

EDUCATION: Ph.D in chemistry and physics, California Institute of Technology., 1954; B.S in chemistry, University of California-Berkeley, 1950

AGE: Born January 3, 1929

3. Andrew S Grove

CEO, 1987-1998

CAREER: Grove originally worked at Fairchild Semiconductor and joined Intel in 1968, creating the company's chip manufacturing operation He was named chief operating officer in 1976 and president in 1979 He became chief executive in 1987 and was chairman of the board from 1997

EDUCATION: Ph.D in materials science, Stanford University, 1964

AGE: Born August 29, 1939

6. Brian M Krzanich

CEO: Will become the chief executive officer on May 16

CAREER: Has been chief operating officer of Intel since January 2012 He previously held senior leadership positions in manufacturing with the company and began his career at Intel in

1982 as a process engineer

EDUCATION: B.A in chemistry, San Jose State University, 1982

AGE: 52

B. PRODUCTS

At its founding, Intel was distinguished by its ability to make semiconductors Its first product, in

1969, was the 3101 Schottky TTL bipolar 64-bit static random-access memory (SRAM), which was nearly twice as fast as earlier Schottky diode implementations by Fairchild and the

Electrotechnical Laboratory in Tsukuba, Japan.In the same year Intel also produced the 3301 Schottky bipolar 1024-bit read-only memory (ROM) and the first commercial metal–oxide–semiconductor field-effect transistor (MOSFET) silicon gate SRAM chip, the 256-bit 1101 Intel's business grew during the 1970s as it expanded and improved its manufacturing processes and produced a wider range of products, still dominated by various memory devices

While Intel created the first commercially available microprocessor (Intel 4004) in 1971 and one

of the first microcomputers in 1972, by the early 1980s its business was dominated by dynamic random-access memory chips However, increased competition from Japanese semiconductor manufacturers had, by 1983, dramatically reduced the profitability of this market, and the sudden success of the IBM personal computer convinced then-CEO Andrew Grove to shift the

company's focus to microprocessors, and to change fundamental aspects of that business model

By the end of the 1980s this decision had proven successful Buoyed by its fortuitous position as microprocessor supplier to IBM and IBM's competitors within the rapidly growing personal computer market, Intel embarked on a 10-year period of unprecedented growth as the primary (and most profitable) hardware supplier to the PC industry By launching its Intel Inside

marketing campaign in 1989, Intel was able to associate brand loyalty with consumer selection,

so that by the end of the 1990s, its line of Pentium processors had become a household name TIMELINE:

6 ORGANIZATION STRUCTURE

Scale: wafer level (~300mm/ 12 inch)

1. Silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called Electronic Grade Silicon

2. Electronic Grade Silicon may only have one alien atom every one billion Silicon atoms

The resulting mono crystal is called Ingot

Mono-crystal Silicon Ingot –

Scale: wafer level (~300mm/ 12 inch)

1. An ingot has been produced from Electronic Grade Silicon

2. One ingot weights about 100 kilograms (=220 pounds) and has a Silicon purity of 99.9999%

Ingot Slicing –

Scale: wafer level (~300mm / 12 inch)

1. The Ingot is cut into individual silicon discs called wafers

Scale: wafer level (~300mm/ 12 inch)

1. The wafers are polished until they have flawless, mirror-smooth surfaces

2. Intel buys those manufacturing ready wafers from third party companies

3. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300

millimeter (~12 inches)

4. When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers

Now the company uses 300mm wafers, resulting in decreased costs per chip

Applying Photo Resist –

Scale: wafer level (~300mm / 12 inch)

1. The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography

2. The wafer spins during this step to allow very thin and even application of this photo resist layer

Exposure–

Scale: wafer level (~300mm / 12 inch)

1. The photo resist finish is exposed to ultra violet (UV) light The chemical reaction triggered by that process step is similar to what happens to film material in a film camera the moment you press the shutter button The photo resist finish that’s exposed to UV light will become soluble The exposure

is done using masks that act like stencils in this process step When used with UV light, masks create the various circuit patterns on each layer of the microprocessor A lens (middle) reduces the mask’s image

2. So what gets printed on the wafer is typically four times smaller linearly than the mask’s pattern

Exposure–

Scale: transistor level (~50-200nm)

1. Although usually hundreds of microprocessors are built on a single wafer, this picture story will only focus on a small piece of a microprocessor from now on –on a transistor or parts thereof

2. A transistor acts as a switch, controlling the flow of electrical current in a computer chip

Intel researchers have developed transistors so small that about 30 million of them could fit on

the head of a pin

Washing off of Photo Resist –

Scale: transistor level (~50-200nm)

1. The gooey photo resist is completely dissolved by a solvent

2. This reveals a pattern of photo resist made by the mask

Etching–

Scale: transistor level (~50-200nm)

1. The photo resist is protecting material that should not be etched away

2. Revealed material will be etched away with chemicals

Removing Photo Resist –

Scale: transistor level (~50-200nm)

1. After the etching the photo resist is removed and the desired shape becomes visible

Applying Photo Resist –

Scale: transistor level (~50-200nm)

1. There’s photo resist (blue color) applied, exposed and exposed photo resist is being washed off before the next step

2. The photo resist will protect material that should not get ions implanted

Ion Implantation –

Scale: transistor level (~50-200nm)

1. Through a process called ion implantation (one form of a process called doping), the exposed areas

of the silicon wafer are bombarded with various chemical impurities called Ions

2. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity

3. Ions are shot onto the surface of the wafer at very high speed An electrical field accelerates the ions

to a speed of over 300,000 km/h (~185,000 mph)

Removing Photo Resist –

Scale: transistor level (~50-200nm)

1. After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color).

Ready Transistor –

Scale: transistor level (~50-200nm)

1. This transistor is close to being finished

2. Three holes have been etched into the insulation layer (magenta color) above the transistor

3. These three holes will be filled with copper which will make up the connections to other transistors.Electroplating–

Scale: transistor level (~50-200nm)

1. The wafers are put into a copper sulphate solution as this stage

2. The copper ions are deposited onto the transistor thru a process called electroplating

3. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer

After Electroplating –

Scale: transistor level (~50-200nm)

1. On the wafer surface the copper ions settle as a thin layer of copper

The Tick-Tock Model Through the Years

Intel’s “tick-tock” model inspires confidence in the future of microprocessors and the devices that depend on them Following this model, Intel commits to—and has successfully delivered—continued innovations in manufacturing process technology and processor microarchitecture in alternating “tick” and “tock” cycles

Architectures releases until now:

15. Silvermont(Tock).

16. Airmont(Tock)

The number and variety of devices connected to the Internet are growing, and computing is becoming

an increasingly personal experience

End users value consistency across devices that connect seamlessly and effortlessly to the Internet and

to each other Intel helps to enable this experience by innovating around three pillars of computing: energy-efficient performance, connectivity, and security To meet these objectives, we are using our core assets: our silicon and process technology, our architecture and platforms, our global presence,our strong relationships across the industry, and our brand recognition

1. Grow the PC and data center business with new users and uses

2. Extend Intel’s PC platform leadership and develop exciting innovations to deliver new user experiences; and lead the transformation to open data centers and cloud computing

3. Extend Intel solutions into adjacent markets Transform the embedded industry with Intel® architecture (IA) in new market segments; and launch and ramp IA solutions in smartphones, tablets, smart TVs, and vehicles

4. Create a continuum of personal computing Expand IA differentiation with new capabilities across devices; excite leading software developers to create the best user experiences and

applications on IA; and deliver new usage models with multi-communications connectivity

5. Intel as an organization is extremely aware that the demand for its own main product, the

microprocessor, is crucially dependent upon the continuous supply of complementary

products by other firms

6. Intel’s philosophy is that achieving platform leadership requires that a firm continuously

innovate through internal processes on its own core product and successfully encourage

complementors not only to supply but to keep innovating on complementary products

7. The analysis of the data suggests that the strategic goal of Intel is to obtain consensus in

the industry while maintaining some degree of directional control over interfaces,

affecting a large number of third-parties’ design decisions