21st Century Manufacturing Episode 2 Part 12 doc

10.9 LAVER IV: BRIDGING CULTURES TO CREATE LEADING EDGE PRODUCTS Future products will be cross-disciplinary and involve synergy between mechanical, this confluence of different technolog

, 0.1.1Maintaining a System Perspective between QA and

Time-to-Market

As a note concerning "the big picture," there will always be an inherent trade-off between total quality assurance and time-to-market (see Cole, 1991, 1999) This is not

a new phenomenon In Chapter 1, it was mentioned that Eli Whitney was first criti-cized by his customers for slow delivery Later he was congratulated for the quality and repairability ofhisguns But along the way there must have been some tense negotiations!

In today's era of shrinking product cycles in many high-tech markets, the rewards of being first to market are very high in terms of market share and profit Furthermore, the latter provides the source for funds for the next generation of technology This often occurs when a producer such as Intel or Microsoft can make orders of magnitude of improvement over earlier products and versions of the same product If these performance improvements are highly valued by cus-tomers-such as high-speed computing for certain customers-some quality prob-lems will be overlooked Increasingly, this implicit bargain is institutionalized in beta testing

The most dramatic example is Microsoft 2000, which had 500,000 prerelease customers participating in its beta testing This broader view of customer awareness shows that if the right bargain is struck between supplier and consumer, then the best possible product can be delivered at the right time

10.8 LAYER III: AESTHETICS IN DESIGN

Engineers and technologists tend -to be a little disparaging toward discussions that involve art and aesthetics But a question worth pondering is: if miniaturized elec-tronics are destined to be a part of our everyday life, much like clothing and housing, fine design?

One major way to maintain a competitive advantage over the next few years will be to acknowledge the importance of artistry and design aesthetics in con-sumer products This may seem a rash prediction; however, it is supported by an examination of the following three companies that have pulled ahead of their respective competition by devoting more attention to the artistic aspects of common products:

• Ford has reintroduced some of the excitement seen in its older designs to the new car business Perhaps the Mustang is a good example The seminal Amer-ican sports car has returned to the sculpted look of the 1900s rather than the needs of today's consumer markets with its Explorer

• Motorola and Nokia have continued to miniaturize and stylize the cellular phone The Nokia exchangeable face plate in different jazzy colors is aimed at

fashion victims, the Motorola StarTAC can conveniently be worn under a Georgia Armani suit and not ruin the line Even with jeans, Motorola products aim to be worn with style and not just provide communication ability The StarTAC's size and elegance appeal to the fashion sensibilities of Wall Street investors and Silicon Valley computer programmers alike

• Nike and, more recently, Hilfiger, continue to entice a huge number of people

to buy $10()+ running shoes because their designs have an "edge" that stands out "Edge" does not get measured by one obvious factor It is a combination

of shape, material, color, and feel, backed up by effective advertising and sports-hero endorsement Nevertheless it is a property that teenagers sense tapped into it and Levi's has lost it But again, things change quickly These are intuitive issues that are best discussed informally in the classroom For further reading, a charming monograph by Jim Adams called Conceptual Blockbusting (1974) is a good place to start In addition, most large cities have a museum of modern art where inspirations for the shape of future products can often be found

10.9 LAVER IV: BRIDGING CULTURES TO CREATE LEADING EDGE

PRODUCTS

Future products will be cross-disciplinary and involve synergy between mechanical,

this confluence of different technologies creates a spiral of increasing capability

tainly continue to be a central aspect of 21st century manufacturing

The reader is first invited to study Taniguchi's Table 10.1 grouped under the headings of(m)mechanical,(e)electrical, and(0)optical

• Normal manufacturing delivers the precision needed for (m) automobile

man-ufacturing,(e)switches, and(0)camera bodies

• Precision manufacturing delivers the precision needed for (m) bearings and

gears,(e)electrical relays, and(0)optical connectors

• Ultraprecision manufacturing delivers the precision needs for (m)

u1trapreci-sianx-ytables,(e)VLSl manufacturing support, and(0)lenses, diffraction gratings, and video discs

The data emphasize that the precision at any level has been more easily achieved as the last few decades have gone by The greatest benefit has probably come from CNC control, where the axes of factory-floor machines have been driven by servo-mechanisms consisting of appropriate transducers, servomotors, and amplifiers with increasing sophistication of control (Bollinger and Duffie, 1988) This closed loop control of the machinery motions has probably bad the

TABLE 10.1 Products Manufactured with Different levels of Precision tccurtesv of Taniguchi, 1994).

Examples of Precision Manufactured Products

Tolerance

200j,l-m Normal domestic General purpose Camera, telescope,

appliances, electricalparts.e.g., binocular bodies automotive fittings, switches, motors, and

Normal 50f.l.m General purpose Transistors, diodes, Camera shutters, manufacturing mechanical parts for magnetic heads for lens holders for

typewriters, engines, tapereoorders cameras and

S.m Mechanical watch Electrical relays, Lenses, prism, parts, machine tool condensers, silicon optical fiber and bearings, gears, wafers, TV color connectors

compressor parts

Precision O.Sj.l.m Ball and roller Magnetic scales, Precisionlenses, manufacturing bearings.precision CCD,quartz optical scales, IC

drawn wire, hydraulic oscillatorsmagnetic exposure masks servo-valves, memory bubbles, (phoro.Xcray), aerostatic gyro magnetron, IC line laser mirrors, bearings width, thin film X-ray mirrors,

pressure elastic deflection transducers, thermal mirrors,monomode printer heads, thin optical fiber and film head discs connectors O.OS",m Gauge blocks, ICmemories, Optical flats, diamond indentor top electronic video discs, precision Fresnel radius, microtome LSI lenses.optical cutting edge radius, diffraction gratings,

X-Ytables

Ultraprecislon O.OO5Ilm Vl.Sf super-lattice Ultraprecision

Notes:

CCD charge couple device

IC-integratedcircuit

LSI-largescale integration

VLSI-very large scale integration

years (Figure 10.2) Important advances in machine tool stiffness have also occurred Advances in this field have especially been the focus of the research work by TIusty and colleagues (1999)

It is valuable to compare Figure 10.2 with Figure 10.3 In semiconductor manu-facturing, the minimum line widths in today's semiconductor logic devices are typically

accuracy

urn 100

111,000' or I "thou"-,

10

1 micron

0]

1

microinch 0.01

manufacturing 0.3nm t ~boEk~~~~~

-0.0001

Achievable "machining" accuracy with year (after Nerio Taniguchi) Figure10.2 Variations over time in machining accuracy

introduction of the integrated circuit around 1960 A large number of technological improvements in VLSI design, lithography techniques, deposition methods, and clean roompractices have maintained the size reduction shown in Figure 10.3 overtime The semiconductor industry is concerned that today's optical lithography tech-niques are not accurate enough to maintain the trend in Figure 10.3 Chapter 5 shows

a diagram of the projection printing technique used during lithography The UV light source is focused through a series of lenses Any distortions in these lenses might cause aberrations in the lighting paths Furthermore, when the minimum feature size

is comparable with the wavelength of the light used in the exposure system, some dif-fraction of the UV rays limits the attainable resolution.'The dilemma being faced is clear: designers are demanding smaller transistors andcircuits, butUV lithography

is reaching its limits

The natural limit of UV-lithography semiconductor manufacturing today is generally cited to be line widths of 0.13 to 0.18micron (see Madden and Moore, 1998) This has prompted major research programs in advanced lithography, spon-sored byalliances of semiconductor manufacturing companies (see Chapter 5) Intel, Lucent, and "IBM each have their own alliance, each with its own preferred solution

For reference: 0.35 down to 0.25 micron lines make use of UV systems witb wavelengths of 365

INormal

jmanufacturing

Precision manufactu

•••

••

• ••

•

•-0.25-0.35

•

-0.15-0.18

-0.03

F1pre 10.3 Trends in theprecision ofsemiconductor transistorlogic devices. Today typical values are 0.25 to 0.35 micron falling to 0.13 to 0.18 micron as the book goes to press Research projects are aiming for below 0.1 micron and possibly 0.03 micron by the year 2010 More information on such research is given in the Semiconductor Association Roadmap (see SIA Semiconductor Industry

Association <http://www.llemkbips.orp)

to the lithography challenge One example is the alliance between Intel, three national laboratories, and semiconductor equipment suppliers (Peterson, 1997) Using extreme ultraviolet (EUV) lithography and magnetically levitated stages, the project has the goal of achieving line widths below 0.1 micron, perhaps eventually reaching 0.03 micron While such technologies are not expected to be commercially

to be satisfied

In general, as might be expected, cost increases with desired accuracy and pre-cision ForIewafer fabrication, the ion implantation devices cost $1 to $2 million Step-and-repeat lithography systems are several million dollars The equipment for

costs of $2.5 billion fabs for the 3OO-mmwafers and 0.13 to 0.18 micron feature sizes The fabrication of such machines in tum demands highly accurate machine tools and metrology equipment Thus, while a standard Scaxis CNC milling machine might cost only $60,000 to $150,000 depending on size and performance, the machine tools for

an order of magnitude more, requiring air-conditioned rooms and frequent calibra-tion by skilled technicians

As mentioned in Chapter 2,Ayres and Miller (1983) provides the succinct def-inition of computer integrated manufacturing (CIM) as "the confluence of the supply elements (such as new computer technologies) and the demand elements (the consumer requirements of flexibility, quality, and variety)."

Many examples of this confluence are shown in Table 10.1 Improvements in

one technology can be the suppliers to the demands of another complementary

tech-nology In particular, the pressing demands of the semiconductor industry for nar-rower line widths spur all sorts of innovations in the machining of magnetically levitated tables (see Trumper et al., 1996), precision lenses, optical scales, and dif-fraction gratings shown on the bottom right of Table 10.1 Likewise, the complement

is true: improved microprocessors have created vastly more precise factory-floor robots and machine tools

In summary, the precision mechanical equipment allows the precision VLSI and optical equipment to be made, which in tum allows the mechanical equipment

to be better controlled and even more precise This is a spiral of increasing capability where all technologies drive each other to higher achievements

How might this spiral be extended to a broader set of disciplines, especially biotechnology? Predicting the future is a dangerous game, especially in a textbook, but some synergies might include the following topics:

• The use of computers to decode the human genome and participate in biotechnology is a safe bet for an important area of synergy, where the "needs"

of genetic discovery make "demands" on the computer techniques

• Another safe bet for predicting important synergies is the creation of biosen-sors for monitoring and diagnosis Such senbiosen-sors combine biology, IC design, and IC microfabrication technologies, with a biological element inside a sensor Biosensors work via (1) a biological molecular recognition element and (2) physical detectors such as optical devices, quartz crystals, and electrodes

• Specifically, biosensors may well find their most successful applications in the synergy between silicon-based chips and molecular devices Such a device embedded in the skin could monitor chromosome and cell health Then, if small deleterious changes were detected, the sensor could essentially prompt the wearer to go to a doctor for some kind of health booster or medicine To some extent, the wristwatch-like devices that contain insulin and an epidermal patch for penetration through the skin are examples of devices that are a ergy between mechanical design, electronics, and biotech In principle, this syn-ergy is an extension of wearable computing to biological implants and

10.10 CONCLUSIONS TO THE LAYERING PRINCIPLE

1 In any company, sustained growth will depend on the day-to-day

implementa-tion of quality assurance, time-to- market, design aesthetics, and an awareness

of new cross-disciplinary opportunities

2 In idle moments, everyone dreams that he or she can invent and develop a fan-tastically new product and become "filthy rich." Nevertheless, the story behind before the product becomes an apparent "overnight success.v'Ihe Palm Pilot is such a story And even when a product is a clear market leader, such as Apple's original iconic desktop for the Macintosh, there is no guarantee that the product can stay ahead without attention to all the issues listed here

3 The principle of layering has thus been advocated in this book so that today's students, destined to be the technology managers of the future, do not graduate

10.11 REFERENCES

Adams.J L 1974 Conceptual hlockhusting:A guide to better ideas San Francisco and London: Freeman

Ayres, R.u.,and S M Miller 1983 Robotics: Applications and social implications. Cambridge, MA: Ballinger Press

Berners-Lee, T 1997 World-wide computer Communications oftheACM 40 (2): 57-58 Black, 1.T.1991 The design of a factory with a future New York: McGraw-Hill.

Bollinger, J 0., and N A Duffie 1988 Computer control of machines and processes.Reading, MA: Addison Wesley

Borrus, M., and 1 Zysman, 1997 Globalization with borders: The rise of Wintelism as the future of industrial competition Industry and Innovation 4 (2) Also see Wintelism and the changing terms global competition: Prototype of the future Work in progress from Berkeley Roundtable on International Economy (BRIE)

Cohen, S., and J Zysman 1987 Manufacturing matters: The myth of the post industrial economy. New York: Basic Books

Cole, R E 1991 Thequality revolution Production and Operations Management 1 (1): 118-120

Cole, R E 1999 Managing quality fads Huw American business learned to play the quality game New York and Oxford:Oxford University Press

Curry, 1., and M Kenney 1999 Beating the clock: Corporate responses to rapid changes in the

PC industry.California Management Review 42 (I): 8-36.

Handfield, R B., G L Ragatz, K 1 Petersen, and R M Monczka 1999 Involving suppliers in new product development California Management Review 42 (1): 59-82

Koenig, D T 1997 Introducing new products Mechanical Engineering Magazine. August, 70-72

Leachman, R C, and D.A Hodges 19% Benchmarking semiconductor manufacturing IEEE Transactions on Semiconductor ManUfacturing 9 (2): 158-169

Madden,A P., and G Moore.1998 The lawgiver-An interview with Gordon Moore Red

Her-Peterson, I 1997 Pine lines for chips Science News 152 (November 8): 302-303 Plumb, J H.1905 England in the eighreenrh century Middlesex, UK.: Penguin Becks, Rosenberg, N.1967 Perspectives on technology. UK.:Cambridge, England: Cambridge Uni-versity Press

Shapiro,c.,and H R Varian 1999.tnformouon rules:Boston: Harvard Business School Spear, S., and H K Bowen 1999 Decoding the DNA of the Toyota production system

Har-vard Business Review, September/October, 97-106

Symonds, M.1999 The Net imperative Economist, 26 June

Taniguchi,N.1994 Precision in manufacturing Precision Engineering 16 (1): 5-12 Tanzer,A Warehouses that fly Forbes October 18, 120-124

Taylor, F W 1911 Principles of scientific management. New York: Harper & Bros

Tlusty, G 1999 Manufacturing processes and equipment. Upper Saddle River, NJ: Prentice Hall

Trurnper.D, L., W Kim, and M E Williams 1996 Design and analysisframework for linear permanent-magnet machines IEEE Transactions on Industry Applications 32 (2): 371-379 Waldo, J 1999 The Jini architecture for network-centric computing Communication of the ACM 42 (7): 76-82.

Wang, F-C, B Richards, and P K Wright 1996 A multidisciplinary concurrent design envi-ronment for consumer electronic product design Journal ofConcurrent Engineering: Research and Applications 4 (4): 347-359

10.12 BIBLIOGRAPHY

Bessant.L 1991 MafUlging advanced manufacturing technology: The challenge of the fifth wave.

Manchester, UK.: NCC Blackwell

Betz, F 1993 Strategic technology management. New York: McGraw-Hill

Busby,1 S.1992 The value of advanced manufacturing technology: How to assess the worth of computers in industry Oxford, UK.: Butterworth-Heinemann

Chacko, G K 1988 Technology management: Applications to corporate markets and military missions, New York: Praeger

Compton,W D.1997 Engineering management. Upper Saddle River, NJ: Prentice Hall Dussauge, P., D Hart, and B Ramanantsoa 1987 Strategic technology management. Chich-ester, UK.: John Wiley & Sons

Edosomwan, 1 A., ed 1989 People and product management in manufacturing. Amsterdam: Elsevier

Edosomwan, 1 A 1990 Integrating innovation and technology management. New York: John Wlley&Sons

GaUiker,U E.1990 Technology management in organizations. Newbury Park, CA: Sage Pub-lications

Gattiker, U E., and L Larwood, eds 1998 Managing technological development: Strategic and human resource issues Berlin: Walter deGruyter.

Gaynor, G H 1991 Achieving the competitive edge through integrated technology manage-ment New York: McGraw-Hili.

Gerelle, E G R., and 1 Stark.1988 Integrated manufacturing: Strategy, planning, and

imple-Lee, E A., and D G Messerschmitt 1999 A highesteducation in the year 2049.Proceedings

of the IEEE 87 (9): 1685-1691.

Martin, M 1 C 1994 MaTIQging innovation and entrepreneurship in technology-based firms.

New York: John Wiley & Sons

Monger, R F 1988 Mastering technology: A management framework for getting results New

York: Macmillan

Parsaei.H R.,andA Mital, eds.1992 Economics of advanced manufacturing systems London:

Chapman & Hall

Parsaei, H R., W G Sullivan, and T R Hanley, eds 1992 Economic and financial justification

of advanced manufacturing technologies. Amsterdam: Elsevier Science

Paterson, M L., and S Lightman 1993 Accelerating innovation: Improving the process of product development. New York: Van Nostrand Reinhold

Rubenstein,A H.1989 Managing technology in the decentralizedflrm. New York: John Wiley

& Sons

Shapiro, H 1., and T Cosenza 1987 Reviving industry in America: Japanese influences on man-ufacturing and the service sector Cambridge, MA: Ballinger

Souder, W E 1987 Managing new product innovations. Lexington, MA: D.C Heath and Com-pany, Lexington Books

Susman,G L, ed 1992 Integrating design and manufacturing for competitive advantage. New York: OxfordUniversity Press

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New York: Macmillan

Association

Szakonyi,R., ed 1992 Technology management: Case studies in innovation. Boston:Auerbach Warner, M., W Wobbe, and P Bradner, eds 1990 New technology and manufacturing man-agement: Strategic choices for flexible production systems Chichester, UK.; John Wiley & Sons

A.I WHO WANTS TO BE AN ENTREPRENEUR]

A.1.1 Essential Attitudes: The Creative and Strategic Sid.

Thekey characteristics of a successful entrepreneur include:

• An ability to read market trends and consumers' wants, needs, or desires

• A blend of creativity in both product design and business operation

• The willingness to take financial risks while remaining emotionally balanced

• A passion for success combined with an overwhelming drive to succeed

• The desire to "change the world" rather than-in a blatant sense-"get rich" A.1.2 Essential Attitudes: The Mundane Side

Also, there are mundane, day-to-day activities that any entrepreneur should consider:

• Mission statements

• Retreats that build communication and integrity while instilling a sense of urgency to satisfy the mission statement

• Performance parameters that are clear to all personnel

• Display boards to keep the organization focused on the mission and sales record

• Daily meetings as a "learning organization" to track deadlines

• Interactions between subproject groups via time lines and formal PERT charts

• Market scanning methods to track competitors

• The ability to circulate and share ideas without criticism

• Rewards for theknow-how andproblem-solving ability of people, acknowl-edging that no amount of expensive equipment and software can substitute for creativity

• Integrating knowledge on "downstream" manufacturing (internal and outsourced)

• Openness to outside ideas and emerging technologies

•••

A "WORKBOOK" OF IDEAS FOR PROJECTS, TOURS,

MHO B"S1t'p'-;pLANS