EURASIP Journal on Wireless Communications and NetworkingVolume 2006, Article ID 12945, Pages 1 16 DOI 10.1155/WCN/2006/12945 Parametric Conversion Using Custom MOS Varactors Howard Chan
Trang 1EURASIP Journal on Wireless Communications and Networking
Volume 2006, Article ID 12945, Pages 1 16
DOI 10.1155/WCN/2006/12945
Parametric Conversion Using Custom MOS Varactors
Howard Chan, 1 Zhongbo Chen, 1 Sebastian Magierowski, 1 and Krzysztof (Kris) Iniewski 2
1 Department of Electrical and Computer Engineering, University of Calgary, Calgary, AB, Canada T2N 1N4
2 Department of Electrical and Computer Engineering, University of Alberta, Edmonton, AB, Canada T6G 2V4
Received 14 October 2005; Revised 17 April 2006; Accepted 18 April 2006
The possible role of customized MOS varactors in amplification, mixing, and frequency control of future millimeter wave CMOS RFICs is outlined First, the parametric conversion concept is revisited and discussed in terms of modern RF communications systems Second, the modeling, design, and optimization of MOS varactors are reconsidered in the context of their central role
in parametric circuits Third, a balanced varactor structure is proposed for robust oscillator frequency control in the presence of large extrinsic noise expected in tightly integrated wireless communicators Main points include the proposal of a subharmonic pumping scheme based on the MOS varactor, a nonequilibrium elastance-voltage model, optimal varactor layout suggestions, custom 0.13 μm-CMOS varactor design and measurement, device-level balanced varactor simulations, and parametric circuit
evaluation based on measured device characteristics
Copyright © 2006 Howard Chan et al This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited
1 INTRODUCTION
Variable capacitors can play a very rich role in
radio-fre-quency (RF) transceivers In this paper we examine their use
in two key front-end functions: amplification and frequency
control Parametric amplification, a relatively uncommon
technique, is promoted in this paper Improvements to this
method are proposed by the incorporation of customized
MOS varactors in place of the traditional junction varactor
Also, we discuss modifications to the MOS varactor in the
context of its traditional role as a frequency control element
Anticipating a growing problem with interference between
IC elements sharing one substrate, a four-terminal
differen-tial structure intended to desensitize voltage-controlled
oscil-lators (VCOs) to large extrinsic noise variations is described
The paper is organized as follows First a narrow
out-line of the history and status of parametric amplification is
given inSection 2 A more detailed discussion of
paramet-ric circuit operation, improvements, and possible
incorpo-ration in a front-end transceiver is discussed in Section 3
Since the varactor constitutes the heart of parametric
sys-tems, Section 4 outlines the key integrated varactor
struc-tures, compares them based on two key merit figures, and
in-troduces potential device-level augmentations InSection 5
we return to parametric circuits and, with the results of
Section 4, estimate the performance possibilities for an
inte-grated setting Frequency control, the second key topic of this
report, is discussed inSection 6 This is approached from the
device level, where the advantage and limitations of employ-ing a modified common-mode rejection varactor structure
in a voltage-controlled oscillator (VCO) are discussed
2 PARAMETRIC CONVERSION: HISTORICAL REMARKS
Parametric circuits closely tie frequency conversion to am-plification and therefore can seamlessly account for the mix-ing function of front ends as well We broadly refer to them
as parametric converters in this work They are primarily known for their low-noise behavior and ability to operate at high frequencies
As implied by its name, parametric conversion involves the modulation of a system’s parameters as in the damped oscillatory equation below:
¨x + γ ˙x + ω2
1 +p(t)
Given a pumping disturbance at twice the oscillator’s natural frequency,
p(t) = A psin
2ω0t
A subharmonic (relative to the pump) response
x(t) = A s e αtsinω t (3)
Trang 2can be solicited whereα ranges between positive and
neg-ative values depending on the oscillator damping and the
strength of the pumping signal It is commonly
acknowl-edged that such sustained parametric oscillations were first
observed by Michael Faraday In 1831 he reported the rise of
subharmonic oscillation as part of experiments on
acousti-cally pumped Chladni plates [1] In 1957, following
sugges-tions by Suhl [2] and Weiss [3], he reported the realization
of an experimental solid-state microwave amplifier
exploit-ing the parametric principle Notable among a large
num-ber of intermediate contributions is Hartley’s work on
elec-tromechanical parametric amplifiers [4,5] and Barrow’s fully
active parametric vacuum tube implementation [6] This
space has been a subject of interest in the MEMS arena for
low-frequency, precision sensing applications such as atomic
force microscopy [7,8] where the low-noise properties of
parametric systems are of particular benefit However, the
use of parametric amplification in terrestrial communication
systems is extremely rare Recently, a discrete time
paramet-ric circuit in a 0.25 μm-CMOS technology was reported [9]
The circuit took particular advantage of the three-terminal
inversion mode MOS varactor, but focused on low-frequency
applications in the 100 kHz range
The absence of parametric converters from the
commu-nications mainstream is mainly due to the superior utility
of transistor-based circuits for “low-” frequency commercial
applications Since the performance of parametric circuits
is less dependent on the lateral dimensions (and hence
de-lay) of their components, a key advantage of this approach is
its ability to operate at higher frequencies early in the
nology life cycle However, improvements in transistor
tech-nology steadily encroached on the high-frequency reserve of
parametric circuits thus marginalizing this advantage Since
more remote regions of the spectrum were better
accommo-dated by maser and laser amplifiers, a loss of interest in the
parametric circuit approach followed
Today, as personal commercial communications
applica-tions migrate to more exotic frequency domains, a niche for
the parametric circuit may resurface This may especially be
the case for low-profile millimeter wave electronics intended
for dense sensor or distributed network applications Size
and power constraints exclude many of today’s molecular
amplifiers (although integration progress has been
substan-tial [10]) from consideration while performance, power, and
approaching physical limits have relegated millimeter wave
applications to the domain of expensive IC technologies
3 PARAMETRIC CONVERSION: TECHNICAL REMARKS
Conventional electronic transistor amplifiers operate by
us-ing a small signal to modulate the resistance of a switch that,
in turn, mediates the coupling between a large DC supply
and a load Amplification is achieved because the coupling
is proportional to the small input signal and is efficient
be-cause, ideally, the supply does not influence the modulated
resistance Alternatively, parametric amplifiers utilize a
non-linear reactance (in this paper we consider only capacitive
re-actances) through which an AC supply “energizes” a small
signal More specifically, a small signal deposits charge on a capacitor An AC “pump” increases the potential energy of this charge by increasing the capacitance, the pumped charge
is then siphoned off to a load
Immediately it is apparent that by foregoing resistive cou-pling such an amplification principle sidesteps, at least in part, thermal fluctuations and holds inherent noise behavior advantages A handy “existance theorem” of sorts for para-metric converters is available in the form of the Manley-Rowe relations [11]
∞
m =0
∞
n =−∞
mP m,n
m f s+n f p =0,
∞
n =0
∞
m =−∞
nP m,n
m f s+n f p =0
(4)
The ideal circuit used to derive the Manley-Rowe relations is shown inFigure 1 These relations constrain the power,P m,n, absorbed by a nonlinear capacitor at frequenciesm f s+n f p
that is driven by two sources operating at frequencies f s(the signal source) and f p (the pump source) The relations are fundamental in that they are based on the principle of en-ergy conservation (zero total average power flowing into the capacitor) and are independent of the capacitance-voltage (CV) characteristics (aside from assuming no hysteresis in the voltage); the relations are limited in that they do not ac-count for losses in the varactor which have a substantial im-pact on practical implementations
The raw circuit performance encapsulated by Manley-Rowe relations needs to be constrained in order to realize practical functions like upconversion (signal at f samplified and mixed to higher frequencies) or downconversion (sig-nal atf samplified and mixed to lower frequencies) or simply straight amplifiers (signal atf samplified atf s) The common way of doing this is to encase the capacitance in a multimode cavity From a lumped circuit perspective, this means con-necting the capacitance to some assembly of resonators
3.1 Upper-sideband upconverter
We imagine the nonlinear capacitor locked in a resonant con-figuration that allows power to flow only at frequencies f s,f p, and f u = f s+f p For this scenario equation (4) is simplified to
P1,0
f s + P1,1
f s+f p = P s
f s +P u
P0,1
f p
+ P1,1
f s+ f p = P p
f p
+P u
As stated earlier the pump is our energy source in this circuit,
it is responsible for a positive power flow,P p, into the capaci-tor According to (6) this means that the power,P u, at f umust
be negative, hence flowing out of the capacitor and available
Trang 3E s
Figure 1: The ideal parametric converter used to derive the Manley-Rowe relations Ideal impedance filters allow only a single tone to flow through any one branch
to a load From (5) the circuit has the operating power gain
Gup= P u
P s = f u
A more physical description of USBUC operation may
shed more light on its behavior The potential energy of the
charge that a small signal deposits on a capacitor can be
in-creased by separating that charge Work is needed to do this
and this work is periodically supplied from a pump circuit
Under this condition, when a load extracts this charge from
the capacitor, it will have access to higher energy carriers
Gain is achieved However, the work used to energize the
mediating capacitor increases the energy needed by the
in-put signal to charge it again Thus, the circuit is naturally at
an advantage when pumping and energy extraction are done
quickly compared to the dynamics of the signal input (i.e.,
when the capacitor signal is oversampled)
Thus the higher the output frequency (hence pump),
the greater the circuit gain This configuration, the
upper-sideband upconverter (USBUC), is well suited for
high-frequency transmission For instance, under ideal conditions,
converting a 6 MHz signal to a 60 GHz carrier promises a
40 dB operating power gain making the circuit more
attrac-tive for millimeter wave applications Note that, under the
ideal described by (5) and (6) (i.e., lossless varactor and
perfect resonator), the gain is completely independent of
the pumping power Analysis and simulations of the impact
wrought by varactor losses on circuit gain are presented in
Section 5 Of course the maximum available output power is
limited by the size of the input and pump signals For a small
input signal and f u f swe have a maximum output power
of approximatelyP p /2 hence an efficiency of 50% As f s
in-creases the efficiency improves, but the gain drops
Accounting for losses in the surrounding filter (cavity)
network by itself does not directly influence the ideal gain
prediction Rather, as highlighted by Rowe [12], the
band-width of the converter is compromised Assuming that the
pump’s action on the nonlinear varactor introduces a
time-varying incremental capacitance between the USBUC’s f s
and f uports of
Cpump(t)=
∞
n =−∞
C n e j2πn f p t (8)
the bandwidth to signal-frequency ratio (γup/ f s) becomes [12]
γup
f s = C1
C0
2f u
Returning to the previous example, to accommodate a signal
of 10 MHz bandwidth converted from a 6 MHz to a 60 GHz center frequency requires aC1/C0ratio of less than 1/80 This bodes extremely well for the pump For a well-designed MOS varactor it is not unreasonable to expect a 50% variation aroundC0, that is, assuming the common empirical MOS model we expect
CMOS= C0+C0
2 tanh
3
2vpump
≈ C0+3C0
4 vpump, (10) where the latter approximation is based on the assumption of
a small pump voltage This is confirmed by the smallC1/C0
requirements of our example From (9) and (10), a peak-to-peak pump voltage of only 16 mV is needed to sufficiently perturb the varactor so that a 10 MHz bandwidth is estab-lished This must be tempered with the fact that in this case the pump needs to operate at 60 GHz which is not out of the question for production level technologies (albeit a sig-nificant stretch for CMOS) exploiting distributed operation [13], frequency doubling [14], or second-harmonic gener-ation [15] Further, it is possible to redesign the pumping scheme of the parametric converter to continue meeting the Manley-Rowe predictions while operating with a pump at lower frequencies This is discussed inSection 3.3
The benefits available to the USBUC become serious im-pairments when considering this topology for a receiver’s downconversion block The substantial gain available to the upconverter (7) becomes a tremendous loss as, naturally,
f u f sfor downconverters Fortunately, a large variety in parametric conversion topologies exists, some of which do allow for gain in the downconversion arrangement One such topology is discussed presently
3.2 Lower-sideband downconverter
The lower-sideband downconverter (LSBDC) is one para-metric topology capable of amplifying a signal mixed down
to the intermediate frequency (IF) or baseband (BB) In this
Trang 4case, the converter’s cavity is aligned such that power only
at f s (the RF signal), f p, and f d = f p − f s (the
down-converter signal) can flow through the circuit To obtain a
low-frequency output, the constraints f p > f s (otherwise
an upper-sideband downconverter is realized) and f p < 2 f s
(otherwise a lower-sideband upconverter (LSBUC) is
real-ized) must hold Returning to the Manley-Rowe relations we
get
P1,0
f s
+ P1,−1
f s − f p = P s
f s − P d
f d =0, (11)
P0,1
f p
+ P −1,1
− f s+ f p = P p
f p
+P d
f d =0 (12) Adding (11) and (12) results in
P p
f p
+P s
which, given that the pump power flows into the circuit,
im-plies that power emerges from the converter’s input (signal)
port despite an input signal being fed into the receiver (e.g.,
from an antenna) Hence, the impedance of the LSBDC’s
sig-nal port is negative Similarly, (12) states that the pump
en-ergy causes power to emerge from the downconversion port
as well Being related to the power emerging from the
sig-nal port (see (11)) this implies that the downconversion port
impedance is also negative The LSBDC doubles as a
reflec-tion amplifier
The operation of this circuit can be summarized as
fol-lows The pump generates the highest frequency “signal” in
the circuit Thus, unlike the USBUC, on average it can couple
power from the signal port (RF) to the downconversion port
(IF) and vice versa As with the USBUC, the power coupling
and amplification is mitigated by work done by the pump in
changing the varactor capacitance Since the pump switches
only slightly faster than the signal, it transfers a relatively
small amount of the input power into the downconversion
port’s IF frequency However, being much higher than IF, the
pump taps, amplifies, and converts a great deal of the IF back
to RF (as predicted by (11)) Part of the larger input signal is
then tapped once again by the pump and fed into the
down-conversion port A positive feedback is established and the
circuit functions as a regenerative amplifier Thus the pump
power emerges as RF and IF frequencies from the
respec-tive ports which now have a negarespec-tive input resistance The
more power that is pumped into the circuit is, the higher the
quality factor,Q, of the RF and IF modes is Thinking of the
input as a forcing signal on these modes we can
automati-cally see that the higher theQ, the higher the signal gain, but
the lower the bandwidth Nonetheless, for signals centered
around millimeterwave carriers, the LSBDC topology has a
lot of relative bandwidth performance to sacrifice What is a
drawback to this circuit, however, is that an excess of pump
power leads to instabilities (overcompensation of loss) and,
simultaneously, a greater sensitivity to component variations
(thus increasing the likelihood of instability) However, the
advantage remains the potentially low-noise behavior about
which the Manley-Rowe relations say nothing We return to
this inSection 5
BB
USBUC
RF
Figure 2: A simple transmit chain employing the USBUC
3.3 Parametric transmit and receive chains
How can parametric converters be assembled into the transceiver chain? Since they combine oscillator, mixer, and amplifier functions under essentially one circuit, they hold the potential to form the basis for a diverse set of radio sys-tems
Perhaps the most straightforward application is the use of
an USBUC as a low-voltage upconverter of BB or IF signals to millimeter RF For minimal complexity and power consump-tion, the design inFigure 2can be used This diagram sug-gests interfacing the USBUC directly to the antenna which,
if the antenna is sufficiently narrowband, can serve as the upper-sideband bandpass filter Employing a standard two-terminal varactor structure in this topology will impose ex-tra gain limiting—significant upconverted signal amplitudes can induce lower-sideband signals to flow (i.e.,ω p − ω s) thus returning power back to the input source A simple alterna-tive is to use the USBUC as an upconverting mixer and pre-amplifier and leave the final millimeter wave amplification to
a dedicated high-frequency (and high-cost) power amplifier Alternatively, a double-balanced varactor structure (as de-scribed inSection 4.3in the context of VCO frequency con-trol) can be used in an attempt to desensitize the varactor ca-pacitance to variations in the upconverted signal frequency Another transmitter topology shown inFigure 3 incor-porates a degenerate local oscillator (LO) in a heterodyne US-BUC architecture In this case, the gain of the USUS-BUC is dis-tributed over several stages The benefit of such a partition
is reaped by the pump which can potentially be generated
in a staged fashion as well InFigure 3the staged pump is built out of degenerate parametric converters In degenerate converters, the signal (i.e., the LO) acts simultaneously as the input and the pump A self-mixing occurs which naturally results in a signal at twice the input frequency As shown, two such stages attached back-to-back can produce a signal
at four times the driving pump frequency (with the need of a high power output atω p) and be combined with a multistage USBUC to gradually upconvert a signal fromω sto 7ωp+ω s Since parametric circuits couple power from low to high frequencies, the receiver’s downconversion function obvi-ously poses a problem As already described, the LSBDC gets around this by employing positive feedback which can give substantial gain at the expense of sensitivity A possible re-ceiver topology employing a LSBDC is shown in Figure 4 Since the circuit functions as a reflection amplifier for both
RF and IF frequencies, a circulator is included to prevent
Trang 5BB ω s
USBUC
RF
LO
Degenerate
Figure 3: Multistage USBUC transmitter with degenerate pump
RF
LSBDC
IF
ADC
ADC
Figure 4: Receive chain using a LSBDC as a mixer and amplifier
re-radiation and help maintain stability A number of
op-tions are available even within the basic LSBDC receiver
Most simply it can be treated as a low-noise amplifier (LNA)
and the amplified RF signal tapped out of the circulator to the
remainder of the radio In this case we benefit simply from
the large gain and low-noise performance of the
paramet-ric converter Any standard downconversion architecture or
subsampling techniques can be employed afterwards
Com-pared to integrated transistor LNAs operating in the
mi-crowave region this benefit is marginal at best However, at
millimeter wave frequencies the improvements for
amplifica-tion, noise, and power consumption become marked (at least
compared to production-level CMOS technology) Using the
downconversion port is another possibility, in this case
tak-ing advantage of the LSBDC’s conversion properties
along-side its low-noise performance The difficulty in this case is
gain, as the downconversion gain is increased, the
regenera-tive design becomes difficult to stabilize under practical
con-ditions
An obvious issue with parametric converters is the high
pump frequency needed to transfer power As a result, a
number of high-frequency pump generation and conversion
techniques have already been mentioned Another approach
is to reconfigure the varactor structure for subharmonic
pumping Subharmonic pumping refers to an arrangement
in which a certain pumping frequency transfers energy at the
same rate as would a higher pumping frequency
The subharmonic pumping suggestion does not pose an
immediate violation of the Manley-Rowe relations Rather,
one means of its realization is to simply utilize one of the
higher pumped capacitance harmonics [16] Herein, the
more abrupt MOS CV characteristics (compared to the junc-tion varactor) can be of substantial benefit For example, imagine a varactor pumped such that part of its Fourier se-ries expansion from (8) is
C A(t)= · · ·+C −2 e − j2ω p t+C −1 e − jω p t+C0+C1e jω p t
+C2e j2ω p t+· · ·
(14) Another varactor,C B, pumped 180◦ out of phase relative to
C Acan be described with
C B(t)= · · ·+C −2 e − j2(ω p t+π)+C −1 e − j(ω p t+π)+C0
+C1e j(ω p t+π)+C2e j2(ω p t+π)+· · · (15)
CombiningC AandC B,
C A(t) + CB(t)= · · ·+C −2 e − j2ω p t+ 2C0+C2e j2ω p t+· · ·,
(16) leads to a net capacitance variation occurring at twice the actual pump rate The schematic of a differentially driven subharmonic scheme based on this approach is shown in
Figure 5 For subharmonic pumping to actually work here the varactors,C AandC B, must both have the same terminal (either gate or source) connected to the circuit proper Aside from exciting the second harmonic, the differential pump-ing scheme allows the circuit to operate without a dedicated pump filter despite the use of two-terminal varactors Al-ternatively, if the orientation of one varactor is flipped (i.e., terminal connections reversed or a complementary structure used) the subharmonic pumping effect is removed The ben-efit of this connection, however, is the isolation of any pump frequencies from the signal and output ports allowing the fil-tering at these terminals to be significantly relaxed
A more extreme attempt at subharmonic pumping em-ploying a four-phase excitation scheme is sketched inFigure
6 In this case a ring oscillator (an injection locked oscillator can be used for better purity) generates differential in-phase and quadrature signals Altogether four pump signals offset
by 90◦are available Each pumping signal is sent to a separate varactor with CV characteristics identical to the other three Given sufficiently nonlinear (i.e., abrupt) CV characteristics
Trang 6Di fferential pump
+
+
+
Signal source
Figure 5: A differential subharmonic pumping scheme
0 Æ
180 Æ
90 Æ
270 Æ
Figure 6: A possible four-phase subharmonic pumping scheme
the net capacitance seen between the signal (ωs) and
upcon-version (ωu) terminals of the varactor will vary at four times
the injected pumping frequency Of course, at this harmonic,
a large degradation in capacitance can be expected
compro-mising the benefit of low pumping frequencies
4 VARACTOR STRUCTURES
Since the late 1950’s the junction diode has served as the de
facto standard for all electronic parametric amplifiers
How-ever, in parametric structures, and for oscillator frequency
control, the junction diode is generally inferior to MOS
var-actor structures Since the most vigorous research on
elec-tronic parametric circuits predates the rise of MOS
technol-ogy, they have only sporadically been considered in the
con-text of modern electronic technologies (and their
applica-tions); [9] is a rare example In this section we look closer
at the key varactor characteristics and design options for RF
frequency control and parametric conversion
4.1 Elastance model
An important advance in customized MOS varactor
technol-ogy for RF applications was taken when CMOS processes
n-well
Figure 7: A sketch of an n-type (referring to the body doping)
accumulation-mode varactor’s cross-section
began to accommodate the accumulation-mode varactor [17,18] (Figure 7) This simplified the device bias scheme
as compared to the more common inversion-mode varac-tor and simultaneously lowered its resistive losses and para-sitic contributions As a frequency tuning element the advan-tages of the accumulation-mode varactor compared to the junction diode were clear, a largeCmax/Cminratio, an abrupt capacitive transition implying only the need for low tuning voltages, an isolated bias scheme, and acceptable Q
Opti-mization of these characteristics for LC-VCOs are straight-forward: one must increase the Cmax/Cmin, and reduce re-sistive losses For parametric circuits a more detailed assess-ment is necessary
First, unlike Manley-Rowe, a more accurate analysis of parametric circuit behavior must account for losses in the varactor To this end a rough but physically realistic pumped varactor model employs a nonlinear capacitance in series with a resistance,R s As emphasized by Penfield and Rafuse [19] this varactor model sidesteps the difficulties and inac-curacies that emerge when a parallel RC equivalent is used
or when the series resistance is incorporated into source and load impedances The terminal characteristics of this physi-cally motivated model are best described with the relation
v(t) =
S(t)i(t)dt + R s(t)i(t) (17) This equation directly catalogues the influence of the pump voltage on the varactor as a whole However, it contains a rel-atively obscure varactor measure, the incremental elastance,
S(t).1 A rough approximation of a MOS varactor elastance per unit area is given by
S
V GS
= Q sd
V GS
e s N d + 1
whereC oxis the oxide capacitance,e is the electronic charge,
sis the permittivity of the semiconductor,N d is the donor
1 For the remainder of the paper we refer toS(t) as simply the elastance,
with the incremental properties of this value remaining implicit As with the capacitance of nonlinear devices, practical measurement techniques allow the extraction of only incremental properties.
Trang 7doping in the semiconductor (a uniformly doped n-type
accumulation-mode varactor is assumed), andQ sdis the
de-pletion charge in the semiconductor body The dede-pletion
charge itself is modeled semi-empirically with
Q sd = e s
C ox N d
1 +4VMOS
γ2 −1
whereγ is the device body factor and
VMOS=1
2
V GS − V FB
2
+δ −V GS − V FB
. (20) The above follows a modeling technique reported in [20]
and, as in that work, incorporates a small smoothing factor,
δ This correction is used since the transition from full
accu-mulation to flat-band is not rigorously accounted for here
With such factors present it is best to consider this model as
a rough design guide A detailed account of the varactor
de-vice physics in compact model form is described in [21] for
example The value of the simple model described here lies in
its direct exposure of the relations between performance and
device characteristics.Section 4.2discusses this, along with
device losses, in detail
A comparison of this approximation to the normalized
CV and SV characteristics extracted from a full charge-based
analysis [22] as well as a simple tanh curve fit is presented
inFigure 8 As shown, the tanh curve, a popular approach in
empirical compact CV models, underestimates the elastance
in depletion We return to this point inSection 4.2
4.2 Figures of merit
The elastance characteristics must be considered along with
device losses in estimating the impact of integrated MOS
technology on parametric performance Penfiled and Rafuse
[19] highlighted two figures of merit, the cutoff frequency
f c = Smax− Smin
and the modulation ratio
m n = | S n |
Smax− Smin. (22) The cutoff frequency, which we can express in more familiar
varactor measures as
f c = Cmax− Cmin
2πRs CmaxCmin
reflects only the influence that device properties bear on the
circuit Ideally, f c marks the maximum frequency at which
it is worth pumping the capacitor Conversely, the
modula-tion ratio encompasses several contribumodula-tions The
numera-tor,| S n |, indicates the size of the elastance harmonic at the
pumping frequencyn · f p That is, assuming small-signal
con-ditions, we can treat the elastance as a linear time-varying
component controlled by the pump
S(t) =
∞
n =−∞
S n e j2πn f p t (24)
This is the elastance analog to (8) The elastance harmonics are influenced by three things: the bias of the pumping sig-nal, the amplitude of the pumping sigsig-nal, and the steepness
of the varactor’s elastance characteristics The steeper the SV curve is, the more efficient the pump is in relaying its energy
to the varactor As shown in (18) and (19) a large impact on the abruptness of the elastance characteristic can be made by reducing the channel doping This necessarily increases the series losses, but at a rate proportional toN d, while the SV slope increases withN2
d Similarly, we can see from (19) that
a decrease in the gate capacitance per unit area,C ox, also con-tributes to an improvement in the SV slope This also comes with the benefit of allowing larger pumping signals to be ap-plied across the gate oxide
These relationships run in a direction counter to the changes employed in scaling MOS devices Nonetheless the variety present in most modern MOS technologies presents some room for optimization For instance, many CMOS pro-cesses offer devices of various oxide thickness and channel doping A plot of the SV characteristics extracted from S-parameter measurements on accumulation-mode devices in
a 0.13 μm-CMOS technology with varying channel doping and oxide thickness is shown inFigure 9 In this case only devices with a marginal difference in oxide thickness were examined As expected, a lower channel doping results in a steeper SV characteristic The measured 4-to-1 ratio between
Smax andSmin is about 2.5 times greater than that available from a junction diode The two channel doping levels (nom-inal and high) are obtained by employing threshold adjust implants intended for the variety of NMOS and PMOS de-vices offered in the technology Unfortunately, a fourth ex-periment employing one of the available counterdoping im-plants and intended to have the lowest channel doping was not correctly processed at the foundry This, correctly com-bined with the thick-oxide option available in most CMOS technologies, constitutes the most direct approach to device customization for parametric circuit applications
Of note in the measurement results is the manner in which the elastance characteristic saturates in the depletion region This is a characteristic encompassed by the tanh fit example included in Figure 8 but not the basic model of (18) The disparity between the predicted and measured elas-tance characteristics at large depletion bias can be traced
to the fact that the varactor measurements were done with
a small-signal, high-frequency (5 GHz) perturbation atop a slowly stepped bias—a common high-frequency CV extrac-tion technique [23] Such a set-up allows minority charge
to respond to the bias settings thus preventing the onset
of deep depletion as naturally included by the basic model However, in parametric circuit applications we can expect a large-signal, high-frequency pump voltage to continuously excite the MOS varactor Thus, the equilibrium bias condi-tions present during measurement hardly apply for pumped varactors This supports the elastance predictions of the basic varactor model, but a convincing answer requires an analysis beyond the scope of this paper
As highlighted by the merit relations, SV performance alone is not a sufficient device selection criterion Careful
Trang 8tanh fit
Full charge model
Approximate model
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
C ox
(a) Capacitance-voltage characteristics
tanh fit Full charge model Approximate model
1
1.5
2
2.5
3
3.5
4
4.5
5
(b) Elastance-voltage characteristics
Figure 8: Comparing the rough semi-empirical model to a complete charge-based description and a tanh fit
High doping, nominalt ox
Nominal doping, lowt ox
Nominal doping andt ox
0.4
0.6
0.8
1
1.2
1.4
1.6
Figure 9: Elastance measurements for accumulation-mode
varac-tors with varying degrees of channel doping in a 0.13 μm-CMOS
technology
consideration must be given to the reduction of series
losses as attested by (23) For designers, with little control
over the varactor’s physical characteristics, layout becomes
paramount here Without considering special layout
tech-niques (such as differential excitation [24]), four controls are
available: gate length (Lg), gate width (Wg), finger number
(Nf), and number of stripes/segments (Ns) These combine
to give an active varactor area ofL g · W g · N f · N s To clarify, a varactor consists ofN sstripes in parallel, each containingN f
fingers, in turn, each finger has dimensionsW g andL g We must consider what arrangement of these terms maximizes
f c This requires finding the right balance between layout in-fluence on series resistance and capacitance properties The series resistance can be divided into two main con-tributors, one is a constant value and is associated with the silicided poly gate, contacts, and via resistance on the ter-minals The other contributor is associated with the channel material and is bias, doping, and frequency dependent For the accumulation-mode varactor with one finger, its series RC components can be modeled as inFigure 10, where
R cg andR csd are the contact and via resistances on the poly gate and n+ diffusion pickups (source/drain), respectively, andR gis the gate polysilicon resistance Underneath the gate, the channel resistance is denoted byRch, whileR wis the resis-tance of then+diffusion bulk pickups and the well Cvaris the equivalent series capacitance of each finger The model of the varactor with multiple fingers is shown inFigure 11, where
R s f gandR s f sdare the series resistance between two fingers For the gate resistance, if the gate poly of each finger is joined from both sides of source/drain, the equivalent poly resistance of one finger is
R g = 1
12· W g
L g · R g −sh, (25) whereR g −shis the gate’s sheet resistance On the other hand, for the channel and well resistance we have
Rch,R w∝ L g
W · Rch,w −sh (26)
Trang 9Gate R cg R g Cvar
Figure 10: Model of a single-finger varactor
R s f g R cg R g Cvar
R csd R s f sd
R s f g R cg R g Cvar
R csd R s f sd
.
.
.
Figure 11: Model of a parallel multiple-finger varactor
Being lower doped and unsilicided, the sheet resistance of the
well and bulk, Rch,w −sh, is greater than that of the
polysili-con This suggests that one would use the minimum
chan-nel length to reduce the body contribution to the series
re-sistance However, due to their inverse dependence on finger
dimensions some tradeoff between the influence of (25) and
(26) on the series resistance is present This tradeoff affects
the setting forW g andL g, but it is not the only
considera-tion
As shown in (23) we want to maximizeCmax, minimize
Cmin, and minimize R s Somewhat arbitrarily choosing a
minimum practical value ofCmin=100 fF (in anticipation of
parasitic effects and process variations) we are left to consider
howL g,W g,N f, andN sinfluence the remaining two
charac-teristics, obviously this complicates selection based purely on
anR g-Rchtradeoff For instance, minimizing L g · W g
maxi-mizes theN f · N sproduct and therefore reducesR s, but at the
cost of increasing the relative parasitic capacitance
contribu-tion and hence a reduccontribu-tion inCmax− Cmin
Another important consideration is the contact and
in-terconnect resistance introduced between fingers (Rs f g and
R s f sd in Figure 11) and stripes This is often ignored when
assessing device resistance, but can certainly be influential
WithR s f g andR s f sdthe equivalent resistance will not be
re-duced simply as a function of 1/Nf AsN f is increased the
series resistance will eventually saturate due to the
contribu-tions of the interfinger conneccontribu-tions,R s f gandR s f sd
Getting a sense of how the characteristicsL g, W g,N f,
andN sinfluence f cis greatly aided by the availability of
ver-ilogA based compact models such as the one described in
[21] Since these models account for both physical and
lay-out characteristics a broad comparison between designs can
Table 1: Cutoff frequencies for varactor with Wg = 1μm, L g =
0.24 μm, and area=43.2 μm2
N f N s Cmax(f F) Cmin(f F) R s(Ω) f c(GHz)
Table 2: Cutoff frequencies for varactor with Wg =1.41 μm, L g =
0.34 μm, and area=43.2 μm2
N f N s Cmax(f F) Cmin(f F) R s(Ω) f c(GHz)
Table 3: Cutoff frequencies for varactor with Wg = 2μm, L g =
0.48 μm, and area=43.2 μm2
N f N s Cmax(f F) Cmin(f F) R s(Ω) f c(GHz)
be made Employing empirically based compact models the
f cfor a variety of accumulation-moden-type varactors
(ex-cited in a single-ended manner) is shown in Tables1 3 The total active area (Lg · W g · N f · N s =43.2 μm2) is the only value that all designs have in common It is chosen such thatCmin remains above 100 fF over the relevant region of operation (VGS ranges from−1 V to 1 V).Table 1 summa-rizes the results for varactors consisting of minimum unit area (i.e.,W g · L g) elements,Table 2shows the results for de-vices composed of twice the minimum unit area, andTable 3
summarizes the characteristics of varactors composed of four times minimum unit area elements Note that all R s have been calculated for 5 GHz excitations A layout dependent self-resonance frequency could not be extracted as the model did not account for inductive parasitics although it should be noted that self-resonant frequencies do not necessarily pose a problem for parametric circuits The self-resonant frequency can be exploited as one of the modes of interest in the para-metric circuit
The f cvalues shown are certainly optimistic as the com-pact models do not account for the effects that would limit device performance at such frequencies, nevertheless they are useful as a relative measure of the best device type Judging
by thef cresults, it is best to use an intermediate unit area that ably juggles two conflicting characteristics: parasitic capaci-tance and series resiscapaci-tance For a given total area, as the unit
Trang 10W g =2μm, L g =0.48 μm
0
200
400
600
800
1000
1200
f c
Figure 12: Plot of varactor cutoff frequencies versus number of
stripes for a 43.2 μm2(total active area) varactor
area shrinks, more devices in parallel imply a smaller total
resistance As can be seen in all cases, this is best achieved
by keeping N f and N s on the same order Unfortunately,
the capacitance of small unit areas contains a higher relative
proportion of parasitic capacitance This lowersCmax− Cmin
which ends up hurting the f c Attempts to get around this by
increasing the unit area will be frustrated by an increase in
series resistance simply due to a decrease in the parallel
con-nection count The simulated cutoff frequencies associated
with these varactors are plotted inFigure 12as a function of
stripe count As can be seen, f cis relatively forgiving of unit
size, but quite sensitive toN f andN sdistributions
Measured results are available to double-check the CV
characteristics of the scalable varactor model The
experi-mental varactor design has unit widths and lengths of 5μm
and 0.42μm, respectively, which are arranged into N s = 5
parallel stripes ofN f = 20 gate fingers each InFigure 13,
the CV curve obtained from the model is plotted
along-side the CV data obtained from a high-frequency (5 GHz)
S-parameter characterization of the varactor It is observed
that the CV characteristic of the fabricated device matches
very closely with the scalable model (at the frequency of
ex-traction)
We will attempt to tailor this varactor design for
para-metric circuits by changing the number of stripes from 5 to 1
The implications of this change on the device characteristics
and USBUC and LSBDC are explored in detail inSection 5
Even though reducingN swill shift the CV curve down and
decrease theCmax− Cmin (as shown inFigure 13),Cminhas
also been reduced thus increasing f c The large change in
ca-pacitance characteristics fromN s = 5 toN s =1 affects the
performance quality of the parametric converter but not the
substance of its operation, unlike, for example, that of a VCO,
whose center frequency and tuning range would be severely
N s =1: model
N s =5: measurement
N s =5: model
0
0.5
1
1.5
2
2.5
Figure 13: Comparison of measurement results to compact model predictions
+
+
Figure 14: Schematic of common-mode cancellation varactor
impacted The only requirement imposed in this work is that
Cminexceed 100 fF, which has been satisfied
4.3 Composite structures
Besides refining layout, useful varactor customization can be achieved by connecting devices for optimal excitation An example of this is the work reported in [24] where varac-tors subject to differential excitation (e.g., in a differential VCO) profit from a virtual ground connection which re-duces the effective series losses Another possibility is the common-mode rejection architecture [25] In this case, var-actors are arranged such that they respond symmetrically to differential excitations, but in an antisymmetrical manner to common-mode excitations thus damping the latter’s influ-ence This can be useful for both parametric converters (al-lowing large signal operation) and VCOs (removal of supply disturbances) A discussion of the latter is given inSection 6
A schematic of the proposed varactor circuit is shown
inFigure 14 In effect, this arrangement resembles the basic
... the changes employed in scaling MOS devices Nonetheless the variety present in most modern MOS technologies presents some room for optimization For instance, many CMOS pro-cesses offer devices of... correctly com-bined with the thick-oxide option available in most CMOS technologies, constitutes the most direct approach to device customization for parametric circuit applicationsOf... and high) are obtained by employing threshold adjust implants intended for the variety of NMOS and PMOS de-vices offered in the technology Unfortunately, a fourth ex-periment employing one of