IEC PAS 6301 5 Edition 1 0 201 6 06 PUBLICLY AVAILABLE SPECIFICATION PRE STANDARD Definition of “Low Halogen” for electronic products IE C P A S 6 3 0 1 5 2 0 1 6 0 6 (e n ) ® THIS PUBLICATION IS COPY[.]
Trang 1IEC PAS 6301 5
Editio 1.0 2 16-0
Definition of “Low-Halogen” for electronic products
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Trang 3IEC PAS 6301 5
Editio 1.0 2 16-0
Definition of “Low-Halogen” for electronic products
INT R A TIONAL
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Warnin ! Mak e s r e th t y ou o tain d this publ c tion from a a thorize distributor
Trang 4CONTENTS
FOREWORD 3
INTRODUCTION 5
1 Sco e 6
2 Normative referen es 6
3 Terms, definition an a breviated terms 7
4 Req irements for low-halogen electronic prod cts 8
5 Complan e proces for low-halogen electronic materials an comp nents 9
6 Markin an la el n for “low-halogen” electronic prod cts 9
6.1 Markin of printed b ard 9
6.2 Markin of mec anical plastic 9
6.3 Markin of p s ive an sol d-state devices, ca les, an other comp nents of an electronic prod ct 9
6.4 Markin of electronic prod cts 10 An ex A (informative) Where BFRs, CFRs, an PVC are u ed in electronic or electrical prod cts 1
An ex B (informative) Su gested test protocols – L w-halogen proces flow 12 B.1 L w halogen proces flow 12 B.2 L w halogen proces flow verbiage 13 An ex C (informative) Clarification for in lu in only bromine an c lorine in the definition of low-halogen materials 14 An ex D (informative) Diferen es b twe n JS7 9B an JS7 9A 15 Bibl ogra h 16 Ta le A.1 – General presen e of bromine an c lorine in BFRs, CFRs, an PVC in electronic an electrical prod cts 1
Trang 5INTERNATIONAL ELECTROTECHNICAL COMMISSION
DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS
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A PAS is a tec nical sp cification not fulfi in the req irements for a stan ard, but made
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IEC PAS 6 015, s bmit ed by JEDEC/ECA has b en proces ed by IEC tec nical
commit e 1 1: En ironmental stan ardization for electrical an electronic prod cts an
s stems It is b sed on Joint JEDEC/ECA Stan ard No 7 9B The stru ture an editorial
rules u ed in this PAS reflect the practice of the organization whic s bmited it
Th te t of this PAS is b se o th
folowin d c me t
This PAS was a pro e for
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Fol owin publ cation of this PAS, the tec nical commit e or s bcommit e con erned may
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Trang 63 ye rs, at the en of whic it s al b publ s ed as another typ of normative doc ment, or
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Trang 7Halogenated p lymeric materials an comp u d are u ed in variou en ine rin
a pl cation , in lu in flame retardation Several decades of u e have proven these materials
an comp u d to b rel a le an cost ef ective The electronic in u try se ks to red ce the
overal en ironmental imp ct of our prod cts by workin to develo rel a le an cost ef ective
alternatives to these materials an comp u d However, the timeta le for bro d-s ale
ado tion of low-halogen materials is dif ic lt to predict, b cau e a plcation s c as complex
multi ayer PCBs an large molded integrated circ its wi req ire further in estigation an
q al fication of new materials
The halogen group contain fluorine, c lorine, bromine, iodine, an astatine; however, this
doc ment wi u e the term “low-halogen” to refer only to bromine an c lorine to b
con istent with the International Electrotec nical Commis ion (IEC) an IPC definition of
“halogen- re ” (se Clau e 2) Refer to An ex C for further explanation for ex lu ion of
astatine, iodine an fluorine In this doc ment, the term “low-halogen” is u ed to identify a
material that contain low con entration of bromine an c lorine from brominated an
c lorinated flame retardants (BFRs, CFRs) an p ly in l c loride (PVC)
Trang 8DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS
This doc ment provides terms an definition for “low-halogen” electronic prod cts that have
the p tential to contain the halogen bromine (Br) an c lorine (Cl) from the u e of BFRs,
CFRs, an PVC, an recommen s method for markin an la el n This stan ard may b
a pl ed to al nonmetal c an non eramic materials within electronic prod cts in lu in , but
not l mited to, materials in the fol owin comp nents commonly fou d in electronic prod cts:
1) tran istors, integrated circ its, mod les con istin mainly of integrated circ its (e.g
multic ip, h brid), an memory mod les;
2) resistors, ca acitors, relay , in u tors, an con ectors;
3) printed circ it b ard as embl es (PCBAs) in lu in comp nents;
4) plastic in ca les, sock ts, switc es an external wirin ;
5) mec anical plastic (en los res, fan , etc.);
6) fi ms, ta es, inks, an ad esives;
7) solderin flu resid es (when present ;
8) sou d, s ock, an vibration damp ners ( o ms, resin , etc.)
This doc ment esta l s es the maximum con entration level for the halogen bromine (Br)
an c lorine (Cl) from the u e of BFRs, CFRs, an PVC Whi e the halogen group contain
fluorine, c lorine, bromine, iodine, an astatine, this doc ment wi u e the term “low-halogen”
to refer only to bromine an c lorine Refer to An ex C for further explanation for ex lu ion of
astatine, iodine an fluorine
NOT Th d finitio of “low-h lo e ” is difere t from th term “h lo e - re ” as d scrib d in IEC 612 9-2
se tio al sta d rd relate to n n-h lo e ate b se material a d as d fin d in th J-S D-6 9A markin a d
la eln sta d rd; sta d rds th t p rtain o ly to printe b ards a d are c re tly in use in th ele tro ics a d
sold-state in ustries
BFRs, CFRs, an PVC in materials that may b u ed d rin proces in , in prod ct del very
s stems, or in p ck gin , but do not remain within the final prod ct are not in lu ed in the
s o e of this doc ment
The folowin doc ments are refer ed to in the text in s c a way that some or al of their
content con titutes req irements of this doc ment For dated referen es, only the edition
cited a pl es For u dated referen es, the latest edition of the referen ed doc ment (in lu in
an amen ments) a pl es
IEC 6 3 1: 2 0 , Electrote ch ical p roducts – D ete rmin to of le vels of six re u late d
sub sta ce s (le ad, mercury, cadmiu m, h x v le t chromium, p lyb romin te d b ip he yls,
p lyb romin ted dip he nyl ethe rs)
EN 14 8 :2 0 -0 , Characterizato of waste – Halo e a d sulp hu r co te t – Ox ge n
comb usto in close dsystems a d determin to meth ds
IEC 612 9-2 (al p rts), Materials for p rinted b oards a d oth rinterco n ctn structures
IPC-T-5 , Terms a d Defini o s for Interco ne ctn a d Pack gin Electro ic Circuits
Trang 9IPC/JEDEC J-STD-6 9, Markin a d Lab eln ofComp on nts, PCBs a d PCBAs to Ide tfy
Le d (Pb ), Pb -fre a d Oth rAtrib u tes
ISO 1 4 9:2 0 , Plastc – Gene ric ide ntficato a d markin of plastc products
ISO 10 3-4:19 8, Plastc – Symb ols a d ab b re viated terms – Part 4: Flame retarda ts
JESD8 , JED EC D icto ary of Te rm s for Sold-state Tech olo y
JPCA–ES– 1, Test Meth d forHalogen Fre e Materials
3 Terms, definitions and a bre iated terms
For the purp ses of this doc ment, the terms, definition an a breviated terms given in
JESD8 an /or IPC-T-5 an the folowin a ply
ISO an IEC maintain terminological data ases for u e in stan ardization at the folowin
ad res es:
• IEC Electro edia: avai a le at ht p:/ www.electro edia.org/
• ISO Onl ne browsin plat orm: avai a le at htp:/ www.iso.org/o p
BFR brominated flame retardant
CFR c lorinated flame retardant
FR flame retardant
IEC International Electrotec nical Commis ion
ISO International Organization for Stan ardization
PBDE p lybrominated diphen l ether
PCB printed circ it b ard
PCBA printed circ it b ard as embly
PPM p rts p r mi ion
PTF p lytetrafluoro th lene
PVC p ly in l c loride
TBBPA tetra romo isphenol-A
XRF X-ray fluores en e
3.1
bloc polymer
s bstan e comp sed of block macromolec les
Trang 103.2
brominate /c lorinate flame retarda ts
BFR/CFR
flame retardants that contain bromine an /or c lorine
Note 1 to e try: Th se c mp u ds are ty ic ly a d d to or re cte into p lymers su h as c rtain e o y resins
a d th rmo lastics to re u e th ir flamma i ty Ex mples in lu e, b t are n t lmite to, tetra romo isp e ol-A
(T B A), bromin te e o y resins, a d p ly romin te dip e yl eth rs (P DEs)
3.3
conge er
memb r of the same kin , clas or group of comp u d with simi ar stru tures an simi ar
c emical pro erties
3.4
copolymer
p lymer derived from more than one sp cies of monomer
[SOURCE: IUPAC]
3.5
ele tronic de ic
device whose o eration de en s on the con u tion of electron an /or holes in vac um, gas,
or semicon u tor
Note 1 to e try: Ex mples of ele tro ic d vic s in lu e tra sistors, inte rate circ its, h brid inte rate circ its,
a d mo ules c ntainin a tiv ele tro ic c mp n nts
3.6
ele tronic produ t
item containin one or more electronic devices p rformin major fu ction
3.7
low-h loge
me tin the criteria esta l s ed in Clau e 4 of this doc ment
Note 1 to e try: L w h lo e ele tro ic pro u ts ma sti c ntain some h lo e s, pro idin , of c urse, th t e c
material in th m me ts th re uireme ts in Cla se 4
3.8
pla tic
an of a group of s nthetic or natural organic comp u d prod ced by p lymerization,
o tional y combined with ad itives (organic or inorganic fi ers, modifiers, etc.) into a
homogene u material ca a le of b in molded, extru ed, or cast into variou s a es an
fi ms
3.9
polymer al oy
p lymer blen (con idered to b an al oy) that contain either a cry tal za le comp nent or
two relatively rigid or amorphou p lymers
4 Re uirements for low-halogen electronic products
The halogen fluorine (F), iodine (I), an astatine (At are not covered by this doc ment (se
an ex C) Bromine (Br) an c lorine (Cl) refer to al oxidation states of these elements
Bromine (Br) an c lorine (Cl) in materials that may b u ed d rin proces in but do not
remain within the final prod ct are not in lu ed in this definition
For an electronic prod ct to b defined as “low-halogen”, e c material within the prod ct