Iec 61191 2 2017

This edition in lu es the f ol owin sig if i ant tec nical c an es with resp ct to the previou edition: a the req irements have b en updated to b compl ant with the ac e tan e criteria i

IEC 61 1 91 - 2

Editio 3.0 2 17-0

Print ed board assembl es –

Part 2: Sect ional specificat ion – R equirement s for sur ace mount soldered

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IEC 61 1 91- 2

Edit io 3.0 2 17-0

Print ed board assembl es –

Part 2: Sect ional specificat ion – R equirement s for sur ace mount soldered

FOREWORD 5

1 Sco e 7

2 Normative ref eren es 7

3 Terms an def i ition 7

4 General req irements 7

5 Surace mou tin of comp nents 7

5.1 General 7

5.2 Al g ment req irements 8

5.3 Proces control 8

5.4 Sur ace mou ted comp nent req irements 8

5.5 Flatp c le d formin 8

5.5.1 General 8

5.5.2 Sur ace mou ted device le d b n s 8

5.5.3 Sur ace mou ted device le d deformation 9

5.5.4 Flat ened le d

9 5.5.5 Dual-in-l ne p c ages (DIPs) 9

5.5.6 Parts not config red for s race mou tin 9

5.6 Smal devices with two termination 9

5.6.1 General 9

5.6.2 Stac mou tin 9

5.6.3 Devices with external de osited elements 9

5.7 L ad comp nent b dy p sitionin 10 5.7.1 General 10 5.7.2 Axial-le ded comp nents 10 5.7.3 Other comp nents 10 5.8 Parts con g red for but le d mou tin 10 5 9 Non-con u tive ad esive coverage lmits 1

0 6 Ac e tan e req irements 10 6.1 General 10 6.2 Control an cor ective action 10 6.3 Sur ace solderin of le d an termination 1

6.3.1 General 1

6.3.2 Solder fi et heig t and he l fi ets 1

6.3.3 Flat rib on L an g l -win le d 12 6.3.4 Rou d or f lat ened (coined) le d 13 6.3.5 J le d 14 6.3.6 Rectan ular or s uare en comp nent 15 6.3.7 Cyl n rical en -ca termination 16 6.3.8 Bot om only termination 17 6.3.9 Castel ated termination 18 6.3.10 But joints 19 6.3.11 Inward L-s a ed rib on le d 2

6.3.12 Flat lu le d 21

6.3.13 Bal grid ar ay 2

6.3.14 Column grid ar ay 2

6.3.16 Comp nents with b t om thermal plane termination (D-Pak) 2

6.3.17 P-style termination 2

6.4 General p st-solderin req irements a plca le to al s race-mou ted as embles 2

6.4.1 Dewet in 2

6.4.2 L ac in 2

6.4.3 Pits, void , blowholes, an cavities 2

6.4.4 Solder wic in 2

6.4.5 Solder we s an s in 2

6.4.6 Brid in 2

6.4.7 Degradation of markin 2

6.4.8 Solder spikes 2

6.4.9 Disturb d joint 2

6.4.10 Comp nent damage 2

6.4.11 Op n circ it, non-wet in 2

6.4.12 Comp nent ti tin 2

6.4.13 Non-con u tin ad esive en ro c ment 2

6.4.14 Op n circ it, no solder avai a le 2

6.4.15 Comp nent on ed e 2

7 Rework an re air 2

An ex A (normative) Placement req irements f or s rf ace mou ted devices 3

A.1 General 3

A.2 Comp nent p sitionin 3

A.3 Smal devices in orp ratin two termination 3

A.3.1 Metal zation coverage over the lan (side-to-side) 3

A.3.2 Metal zation coverage over the lan (en ) 3

A.4 Mou tin of c l n rical en -ca devices (MEL s) 3

A.5 Registration of castel ated c ip car iers 3

A.6 Sur ace mou ted device le d an lan contact 3

A.7 Sur ace mou ted device le d side overhan 3

A.8 Sur ace mou ted device le d to overhan 31

A.9 Sur ace mou ted device le d heig t of lan (prior to solderin ) 31

A.10 Positionin of J le d devices 31

A.1 Positionin g l -win le d devices 31

A.12 External con ection to p c agin an intercon ect stru tures 31

Biblogra h 3

Fig re 1 – L ad f ormation for s rf ace mou ted device 8

Fig re 2 – Fi et heig t 12

Fig re 3 – Flat rib on an g l -win le d 13

Fig re 4 – Rou d or f lat ened (coined) le d joint 14

Fig re 5 – J le d joint 15

Fig re 6 – Rectan ular or s uare en comp nents 16

Fig re 7 – Cyl n rical en -ca termination 17

Fig re 8 – Botom only termination 18

Fig re 9 – L adles c ip car iers with castel ated termination 19

Fig re 1 – Inward L-s a ed rib on le d 21

Fig re 12 – Flat lu le d 2

Fig re 13 – BGA with col a sin b l s 2

Fig re 14 – Botom termination comp nents 2

Fig re 15 – Botom thermal plane termination 2

Fig re 16 – P-style termination 2

Ta le 1 – BGA with non-col a sin b l s 2

Ta le 2 – Column grid ar ay 2

Ta le 3 – Reworka le def ects 2

INTERNATIONAL ELECTROTECHNICAL COMMISSION

_

Part 2: Sectional specification –

Requirements for surface mount soldered assembl es

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cif i atio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cif i atio s (P S) a d Guid s (h re f ter refer e to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n n

-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio f or Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

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intere te IEC Natio al Commite s

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th later

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6) Al u ers s o lde s re th t th y h v th late t e itio of this p blc tio

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Pu lc tio s

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p te t rig ts IEC s al n t b h ld re p n ible f or id ntif yin a y or al s c p te t rig ts

International Stan ard IEC 61 91-2 has b en pre ared by IEC tec nical commit e 91:

Electronic as embly tec nolog

This third edition can els an re laces the secon edition publ s ed in 2 13 This edition

con titutes a tec nical revision

This edition in lu es the f ol owin sig if i ant tec nical c an es with resp ct to the previou

edition:

a) the req irements have b en updated to b compl ant with the ac e tan e criteria in

IPC-A-610 ;

b) some of the terminology u ed in the doc ment has b en updated;

c) ref eren es to IEC stan ard have b en cor ected;

The text of this International Stan ard is b sed on the fol owin doc ments:

Ful inf ormation on the votin for the a proval of this International Stan ard can b fou d in

the re ort on votin in icated in the a ove ta le

This doc ment has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts of IEC 61 91 u der the general title Printed b ard as emblies can b fou d

in the IEC we site

The commite has decided that the contents of this doc ment wi remain u c an ed u ti the

sta i ty date in icated on the IEC we site u der "htp:/ we store.iec.c " in the data related to

the sp cific doc ment At this date, the doc ment wi b

• recon rmed,

• with rawn,

• re laced by a revised edition, or

A bi n ual version of this publcation may b is ued at a later date

IMPORTANT – The 'colour inside' logo on the cov r pa e of this publ c tion in ic te

that it contains colours whic are consid re to be us f ul f or the cor e t

understa din of its conte ts Us rs s ould th ref ore print this doc me t using a

colour printer

PRINTED BOA RD ASSEMBLIES –

Part 2: Sectional specification –

Requirements for surface mount soldered assembl es

This p rt of IEC 61 91 gives the req irements f or s r ace mou t solder con ection The

req irements p rtain to those as embl es that are total y s rf ace mou ted or to the s race

mou ted p rtion of those as embl es that in lu e other related tec nologies (e.g throu h

-hole, c ip mou tin , terminal mou tin , etc.)

The fol owin doc ments are ref er ed to in the text in s c a way that some or al of their

content con titutes req irements of this doc ment For dated referen es, only the edition

cited a ples For u dated ref eren es, the latest edition of the ref eren ed doc ment (in lu in

an amen ments) a pl es

IEC 6 19 , P rinted b ard d esig , ma ufa ture a d as embly – Terms a d d efinit ions

IEC 61 91-1, P rinted b ard as emblies – Part 1: Ge eric sp cific tion – Re uireme ts for

sold ered el ectric l a d ele tro ic as emblies using sura e mo nt a d relat ed as embly

te h ol ogies

IPC-A-610, Ac e ta i ty of Electronic As embl es

3 Terms and def initions

For the purp ses of this doc ment, the terms and def i ition given in IEC 6 19 a ply

ISO an IEC maintain terminological data ases f or u e in stan ardization at the fol owin

ad res es:

• IEC Electro edia: avai a le at ht p:/ www.electro edia.org/

• ISO Onl ne browsin platform: avai a le at htp:/www.iso.org/o p

The req irements of IEC 61 91-1 are a man atory p rt of this sp cification

Workman hip s al me t the req irements of IPC-A-610 in ac ordan e with the clas if i ation

req irements of this doc ment

5 Surf ace mounting of components

This clau e covers as embly of comp nents that are placed on the s r ace to b man al y or

mac ine soldered an in lu es comp nents desig ed f or s race mou ting as wel as

5.2 Al gnme t re uireme ts

Suff i ient proces control at al stages of desig an as embly s al b in place to ena le the

p st-solderin al g ments an solder joint f ilet controls sp cified in 6.3 to b ac ieved

Relevant f actors af fectin the req irements in lu e lan an con u tor desig , comp nent

proximities, comp nent an lan soldera i ty, solder p ste/ad esive q antity an al g ment

an comp nent placement ac urac

If s ita le proces controls are not in place to en ure compl an e with 5.2 an the intent of

An ex A, the detai ed req irements of An ex A s al b man atory

5.4 Surfa e mounte compone t re uireme ts

The le d of le d s race mou ted comp nents s al b formed to their final config ration

prior to mou tin L ad s al b f ormed in s c a man er that the le d-to-b d se l is not

damaged or degraded an that they may b soldered into place by s bseq ent proces es

whic do not res lt in resid al stres es decre sin rel a i ty When the le d of d al-in-l ne

p c ages, flatp c s, an other multi e d devices b come misal g ed d rin proces in or

han l n , they may b straig tened to en ure p ral el sm an al g ment prior to mou tin ,

whi e maintainin the le d-to-b d se l integrity

5.5 Flatpa k le d f orming

L ad on o p site sides of s r ace mou ted flatp c s s al b formed s c that the

non-p ral elsm b twe n the b se s race of the comp nent an the s rf ace of the printed

b ard (i.e comp nent cant is minimal Comp nent cant is p rmis ible provided the final

config ration do s not ex e d the maximum sp cin lmit of 2,0 mm (se Fig re 1)

thic nes ) The an le of that p rt of the le d b twe n the up er an lower b n s in relation to

the mou tin lan s al b 4 ° minimum and 9 ° maximum

5.5.3 Surfa e mou te de ic le d d f ormation

L ad deformation (u intentional b n in ) may b al owed when

a) no eviden e of a s ort circ it or p tential s ort circ it exists,

b) le d-to-b d se l or weld is not damaged by the deformation,

c) do s not violate minimum electrical sp cin req irement,

d) to of le d do s not exten b yon the to of b d ; pref ormed stres lo ps may exten

a ove the to of the b d ; however, stan -of f heig t lmit s al not b ex e ded,

e) to c rl, if present on b n s, s al not ex e d two times the thic nes of the le d (2 T),

f) co lanarity l mits are not ex e ded

5.5.4 Flat e e le ds

Comp nents with axial le d of rou d cros -section may b flat ened (coined) f or p sitive

se tin in s rf ace mou tin If flatenin is u ed, the f latened thic nes s al b not les than

4 % of the original diameter Flatened are s of le d s al b ex lu ed f rom the 10 %

deformation req irement in 6.5.3 of IEC 61 91-1:2 13

Flatened le d on o p site sides of a s rf ace mou t p rt s al b f ormed s c that the non

-p ralel sm b twe n the b se s rf ace of the comp nent an the s r ace of the printed b ard

(e.g comp nent cant is minimal

5.5.5 Dual-in-l ne pa k ge (DIPs)

Dual-in-l ne p c ages may b s rf ace mou ted provided the le d are config red to me t the

mou tin req irements f or s race mou ted lo ded p rts The le d pre aration o eration

s al b p rormed u in die formin /c t in s stems Han formin an trimmin of le d are

prohibited

5.5.6 Parts not conf igure f or s rfa e mounting

Flatp c s of the throu h-hole config ration, tran istors, metal p wer p c ages, an other

non-axial le d comp nents s al not b s race mou ted u les the le d are f ormed to me t

the s r ace mou ted device le d f ormin req irements Su h a pl cation s al b agre d on

b twe n u er an man facturer

5.6 Smal d vic s with two termination

The detai ed req irements for mou tin of smal devices with two le d termination are

defined in 5.6.2 an 5.6.3

5.6.2 Sta k mounting

When p rt stac in is p rmit ed by the as embly drawin , p rts s al not brid e spacin

b twe n other p rts or comp nents s c as terminals or other c ip comp nents

5.6.3 De ic s with e tern l deposite eleme ts

Comp nents with electrical elements de osited on an external s r ace (s c as c ip resistors)

s al b mou ted with that s r ace f acin away f om the printed b ard or s bstrate

5.7 Le d comp ne t body positioning

Parts mou ted over protected s rf aces an in ulated p rts that are p sitioned over circ itry

or p rts mou ted over s races without exp sed circ itry may b flu h mou ted (i.e no stan

-of heig t Parts mou ted over exp sed circ itry s al have their le d f ormed to provide a

minimum of 0,2 mm b twe n the b tom of the comp nent b d an the exposed circ itry

The maximum cle ran e b twe n the b t om of the le ded comp nent b d an the printed

wirin s rf ace s al not ex e d 2,0 mm

5.7.2 Axial-le de compon nts

The b d of a s race-mou ted axial-le ded comp nent s al b sp ced f rom the s rf ace of

the printed b ard at a maximum of 2,0 mm u les the comp nent is mec anical y atac ed to

the s bstrate by ad esive or other me n L ad on o p site sides of s race mou ted

axial-le ded comp nents s al b f ormed s c that comp nent cant (non-p ral el sm b twe n

the b se s rf ace of the mou ted comp nent an the s race of the printed b ard) is minimal

an in no in tan e s al b d cant res lt in non-conforman e with maximum sp cin l mits

5.7.3 Other compone ts

TO-can devices, tal profi e comp nents (i.e over 15 mm), tran formers, an metal p wer

p c ages may b s r ace mou ted provided the p rts are b n ed or otherwise sec red to the

b ard in a man er whic ena les the p rt to with tan the en -item s oc , vibration an

en ironmental stres es

5.8 Parts conf igure f or but le d mounting

Comp nents desig ed for throu h hole (pin-in-hole) a plcation an modified f or but joint

at ac ment, or stif f le ded d al-in-l ne p c ages may b but mou ted on level A an B

prod cts But mou tin is not p rmit ed on level C prod cts u les the comp nent is

desig ed for s r ace mou tin Comp nent s w ith solderc arged terminat ion desig ed for but t

mou tin may b ac e ta le f or al clas es For other but -mou ted termination comp nents

ac e tan e criteria have to b agre d b twe n the man facturer an the u er

5.9 Non-condu tiv a he iv cov ra e l mits

Non-con u tive ad esive materials, when u ed for comp nent mou tin , s al not flow onto,

or o s ure, are s to b soldered or into vias or plated-throu h holes

Materials, proces es, an proced res des rib d an sp cif ied in IEC 61 91-1 provide for

soldered intercon ection that are b ter than the minimum s race mou t ac e tan e

req irements in this clau e Proces es an their control s ould b ca a le of prod cin

prod ct me tin or ex e din the ac e tan e criteria for defined prod ct levels

6.2 Control a d cor e tiv a tions

The detai ed req irements f or ac e tan e, cor ective action l mits, control lmit determination,

an general as embly criteria des rib d in IEC 61 91-1 are a man atory p rt of this stan ard

In ad ition 6.3 s al b met for al s r ace mou t as embly an f or con ection ac e ta i ty

6.3 Surfa e soldering of le ds a d termin tions

Solder joints or termination on comp nents desig ed for s rf ace mou tin s al ex ibit

solder joints that me t the general des ription of Clau e 10 of IEC 61 91-1:2 13 with the

sp cific me s rements defined in 6.3.3 to 6.3.17 of this doc ment Some s rf ace-mou ted

comp nents wi selfal g d rin reflow solderin but a degre of misalg ment is p rmit ed to

the extent sp cified However, minimum desig con u tor sp cin s al not b violated

In 6.3.3 to 6.3.17, certain joint f eatures are u sp cified in size an the only req irement is

that a pro erly weted fi et to b th le d/ermination an lan s b visible Ge metric

dimen ion not cal ed out with an req irements are con idered non-critical to the

p rorman e of the intercon ection

Surace-mou ted joints formed to con ector, soc et, an other le d or termination without

mec anical s p ort, s bjected to stres fom in ertion an with rawal of comp nents or

printed b ard , s al me t the req irements of level C

6.3.2 Solder f il et height a d he l f il ets

The heig t F of solder fi ets, in lu in he l fi ets, as req ired in the fol owin s bclau es

s al b ju ged by the distan e the a pl ed solder has risen up the joined s r ace Fig re 2

i u trates this me s rement f or joints of eq al heig t but havin dif ferent solder volume In

6.3.3 to 6.3.12, for some le d config ration , the minimum ac e ta le f il et heig t criterion is

referen ed to the le d thic nes T, or one half the thic nes (0,5 T) When ref eren ed to T,

the heig t of the he l fi et to a f ormed le d s al b me s red at the lowest p int of the in ide

b n radiu of the le d, as in icated by p int A of Fig re 2 (e.g level C in Fig res 3 to 5)

When ref eren ed to 0,5 T, the fi et may b 0,5 T lower (e.g level B in Fig res 3 to 5)

NOT Su cla s 6.3.3 pro id s a org niz tio th t c mbin s th re uireme t p ra ra h, th a pro riate fig re

a d a dime sio al ta le th t d s rib s th s e ific d tais

6.3.2.2 Solder con e tion contours

A mou tin tec niq e s al b u ed to comp n ate f or the co ff i ient of thermal exp n ion

(CTE) mismatc of the p rt an b ard This mou tin tec niq e s al b l mited to p rt le d ,

sp cial zed mou tin devices, an normal solder con ection The u e of sp cial zed stan

-of fs mou ted b twe n the p rt an the lan is p rmis ible L adles comp nents s al not b

soldered into place u in red n ant intercon ect wirin b twe n the comp nent castel ation

an the lan

Desig s that u e sp cial solder con ection contours as p rt of a CTE mismatc comp n ation

s stem s al b identif ied on the a proval as embly drawin The mou tin tec niq e s al b

ca a le of p rormin with a solder con ection whic me ts the req irements of this

doc ment

6.3.2.3 Surfa e mount d vic le d he l position

The he l of a le ded comp nent s al not overhan the lan

NOT Th h el b gin wh re th le d starts to c rv at th le d b n

Comp nents (e.g con ectors an flexible circ its) whic in orp rate bre k-away tie b rs in

their desig may b in tal ed or soldered in place prior to removal of the tie b r Exp sed

Solder joints b twe n s bstrate lan s an f lat rib on le d f ormed into an L, an g l-win

s a ed comp nent le d of either stif f or flexible materials s al me t the al g ment an

solder fi et req irements of Fig re 3 for e c prod ct level

Dime sion in mil l imet re

L < 3Wd

L a s n t h vin weta le sid s or e d b d sig (s c a le d stamp d or s e re f rom pre are sto k)

are n t re uire to h v sid or e d fi ets, b t sid o erh n is n t p rmite (al le els)

Joints formed to rou d or f latened (coined) le d s al me t the dimen ional an fi et

req irements of Fig re 4 for e c prod ct level

Dime sion in mil l imet re

G + T d

Dime sion in mil l imet re

6.3.6 Re ta g lar or s uare e d compone t

Solder joints to comp nents havin termination of a s uare or rectan ular config ration s al

me t the dimen ional an solder f il et req irements of Fig re 6 f or e c prod ct level

Dime sion in mil l imet re

Figure 6 – Re ta gular or s uare e d compone ts

6.3.7 Cyl ndric l e d-c p terminations

Solder joints to comp nents havin c ln rical en -ca termination (e.g MEL s) s al me t

the dimen ional an solder fi et req irements of Fig re 7 f or e c prod ct level

Dime sion in mil l imet re

6.3.8 Bot om only terminations

Dis rete c ip comp nents, le dles c ip car iers, an other devices havin metal zed

termination on the b tom side only s al me t the dimen ional an solder f ilet req irements