Iec 60068-2-69-2017.Pdf

IEC 60068 2 69 Edition 3 0 201 7 03 INTERNATIONAL STANDARD NORME INTERNATIONALE Environmental testing – Part 2 69 Tests – Test Te/Tc Solderability testing of electronic components and printed boards b[.]

Env ironmental testing –

Part 2-69: T ests – Test Te/ T c: Solderabi ity testing of electronic components

Essais d'env ironnement –

Partie 2-69: Essais – Essai T e/ T c: Essai de brasabi ité des composants

électroniques et cartes imprimées par la méthode de la balance de moui lage

(mesure de la for ce)

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Env ironmental testing –

Part 2-69: T ests – T est T e/ T c: Solderabi ity testing of electronic components

Essais d'env ironnement –

Partie 2-69: Essais – Essai T e/ T c: Essai de brasabi ité de composants

électroniques et cartes imprimées par la méthode de la balance de moui age

(mesure de la for ce)

INT ERNAT IONAL

ELECT ROT ECHNICAL

ELECT ROT ECHNIQUE

INT ERNAT IONALE

®

Warnin ! Mak e s re that you obtain d this publc tio from a a th rize distributor

Atte tio ! Ve i ez v u a s rer q e v u a ez obte u c t e publc tio via u distribute r a ré

FOREWORD 5

1 Sco e 7

2 Normative referen es 7

3 Terms an definition 7

4 General des ription of the method 8

4.1 General 8

4.2 Comp nents 8

4.3 Printed b ard 8

4.4 Me s rement 8

5 Des ription of the test a p ratu 8

6 Pre aration of specimen 10 6.1 Cle nin 1

0 6.2 Precon itionin 10 7 Materials 1

7.1 Solder 1

7.1.1 General 1

7.1.2 Solder al oy containin le d 1

7.1.3 L ad- re solder al oy 1

7.1.4 Solder contamination control 1

7.1.5 Solder mas for solder glo ule wet in b lan e method 12 7.2 Flu 13 7.2.1 Rosin b sed flu 13 7.2.2 Flu maintenan e 13 7.2.3 Test flu selection criteria 13 8 Proced re 13 8.1 Test temp rature 13 8.1.1 Solder al oy containin le d 13 8.1.2 L ad- re solder al oy 13 8.2 Test proced re 13 8.2.1 Ap l ca le test proced re 13 8.2.2 Solder b th wet in b lan e proced re 14 8.2.3 Solder glo ule wet in b lan e proced re 17 8.2.4 Proced re for testin printed b ard sp cimen 2

9 Presentation of res lts 21

9.1 Form of force vers s time trace 21

9.2 Test req irements 2

10 Information to b given in the relevant sp cification 2

An ex A (normative) Eq ipment sp cification 2

A.1 Characteristic of the a p ratu 2

A.2 Solder b th 2

A.3 Glo ule s p ort bloc s 2

An ex B (informative) Use of the wetin b lan e for SMD soldera i ty testin 2

B.1 Definition of the me s re of soldera i ty 2

B.2 Gau e R&R – Test protocol for wet ing b lan e gau e re eata i ty an

B.2.1 Test coup n 2

B.2.2 Test p rameters 2

B.2.3 Known go d coup n 2

B.3 Solder glo ule mas an pin size 2

B.4 Sp cimen orientation an immersion de th 2

B.4.1 General 2

B.4.2 Resistors an ca acitors 2

B.4.3 Smal -le ded comp nents 2

B.4.4 Multi-le ded devices 2

B.5 Test flu 3

B.6 Test temp rature 3

B.6.1 Solder al oy containin le d 3

B.6.2 Solder al oy without le d 31

B.7 Characteristic of the test a p ratu 31

B.7.1 Recordin device 31

B.7.2 Balan e s stem 3

B.7.3 Lifin mec anism an controls 3

B.7.4 Parameters to b me s red from the force- ime trace 3

B.7.5 Referen e wet in force 3

B.7.6 Eq ipment location 3

B.7.7 Glo ule pin 3

B.7.8 Glo ule mod les 3

B.8 Test flu – IPC-J-STD-0 2/J-STD-0 3 activated soldera i ty test flu rationale commit e let er 3

B.8.1 General 3

B.8.2 Pro ctive soldera i ty testin a pro c to the implementation of non- in finis es 3

B.8.3 Red ced soldera i ty test varia i ty 3

B.8.4 Stan ardization of soldera i ty test flu comp sition on a glo al s ale 3

An ex C (normative) Test method for SMD comp nents sizes 0 0 M (0 01) or smal er 4

C.1 General 4

C.2 General des ription of the test method 4

C.3 Precon itionin 4

C.3.1 Pre aration of the sp cimen 4

C.3.2 Agein 4

C.4 Materials 4

C.4.1 Solder 4

C.4.2 Flu 41

C.5 Method 1 41

C.5.1 Des ription of the test a p ratu 41

C.5.2 Proced res 41

C.5.3 Presentation of res lts 4

C.5.4 Information to b given in the relevant sp cification 4

C.6 Method 2 4

C.6.1 Test a p ratu 4

C.6.2 Observation eq ipment 4

C.6.3 Test method 2 4

An ex D (informative) Evaluation criteria – Guidan e 4

D.1 General con ideration 4

D.2 Evaluation criteria for comp nents 4

D.3 Evaluation criteria for printed b ard 4

An ex E (informative) Method of calc latin the maximum the retical force an integrated value of the are of the wetin c rve for le ded non-SMD 5

E.1 Method of calc latin the maximum the retical force 5

E.2 Method of calc latin the integrated value of the are of the wet in c rve 5

Biblogra h 5

Fig re 1 – Ar an ement for the test a p ratu (solder b th wetin b lan e method) 9

Fig re 2 – Ar an ement for the test a p ratu (solder glo ule wet in b lan e method) 9

Fig re 3 – Immersion con ition for solder b th method 16 Fig re 4 – Immersion con ition for solder glo ule method 19 Fig re 5 – Su gested wetin b lan e test sp cimen an solderin immersion 2

Fig re 6 – Printed b ard immersion 21

Fig re 7 – Typical wet in b lan e trace 2

Fig re B.1 – Un erstan in wet in c rves 3

Fig re B.2 – Typical wetin c rve 3

Fig re B.3 – Re resentative force- ime c rves 3

Fig re C.1 – Cros -section of aluminium b d 41

Fig re C.2 – Dip in p sition an relative p sition 4

Fig re C.3 – Time an test seq en e 4

Fig re C.4 – Typical wetin b lan e trace 4

Fig re D.1 – Set A wet in c rve 4

Fig re D.2 – Set B wet in c rve 4

Ta le 1 – Precon itionin 10 Ta le 2 – Maximum l mits of solder b th contaminants 12 Ta le 3 – Glo ule an p l et sizes 12 Ta le 4 – Rosin b sed flu comp sition 13 Ta le 5 – Recommen ed solder b th wetin b lan e test con ition 15 Ta le 6 – Time seq en e of the test (solder b th) 17 Ta le 7 – Recommen ed solder glo ule wetin b lan e test con ition 18 Ta le 8 – Time seq en e of the test (solder glo ule) 2

Ta le B.1 – Carb x l c acid b sed flu (water solution) 3

Ta le B.2 – Carb x l c acid b sed flu (alcohol solution) 3

Ta le C.1 – Time seq en e of the test proced re 4

Ta le D.1 – Wetin b lan e p rameter an s g ested evaluation criteria 4

Ta le D.2 – Printed b ard test p rameter an s g ested criteria 4

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International Stan ard IEC 6 0 8-2-6 has b en pre ared by IEC tec nical commite 91:

Electronic as embly tec nolog

This third edition can els an re laces the secon edition publ s ed in 2 0 as wel as the

secon edition of IEC 6 0 8-2-5 publ s ed in 2 0 an con titutes a tec nical revision

This edition in lu es the fol owin sig ificant tec nical c anges with resp ct to the previou

edition:

• integration of IEC 6 0 8-2-5 ;

• in lu ion of tests of printed b ard ;

• in lu ion of new comp nent typ s, an updatin test p rameters for the whole comp nent

• in lu ion of a new gau e R & R test protocol to en ure that the resp ctive wet in b lan e

equipment is cor ectly calbrated

The text of this stan ard is b sed on the fol owin doc ments:

Ful information on the votin for the a proval of this International Stan ard can b fou d in

the re ort on votin in icated in the a ove ta le

This doc ment has b en draf ed in ac ordan e with the ISO/IEC Directives, Part 2

A l st of al p rts in the IEC 6 0 8 series, u der the general title En iro nme tal testng , can b

fou d on the IEC we site

The commite has decided that the contents of this doc ment wi remain u c an ed u ti the

sta i ty date in icated on the IEC we site u der "htp:/ we store.iec.c " in the data related to

the sp cific doc ment At this date, the doc ment wi b

• reconfirmed,

• with rawn,

• re laced by a revised edition, or

ENVIRONMENTAL TESTING –

Part 2-69: Tests – Test Te/Tc: Solderabi ity testing of

electronic components and printed boards

by the wet ing balance (force measurement method

This p rt of IEC 6 0 8 outl nes test Te/Tc, the solder b th wet in b lan e method an the

solder glo ule wetin b lan e method to determine, q antitatively, the soldera i ty of the

termination Data o tained by these method are not inten ed to b u ed as a solute

q antitative data for p s –fai purp ses

The proced res des rib the solder b th wet in b lan e method an the solder glo ule

wet in b lan e method They are a pl ca le to comp nents an printed b ard with metal c

termination an metal zed solder p d

This doc ment provides the me s rement proced res for solder al oy b th with an without

le d (Pb)

The fol owin doc ments are refer ed to in the text in s c a way that some or al of their

content con titutes req irements of this doc ment For dated referen es, only the edition

cited a ples For u dated referen es, the latest edition of the referen ed doc ment (in lu in

an amen ments) a pl es

IEC 6 0 8-1, En iro nme tal te stn – Part 1: Ge e ral and g u idance

IEC 6 0 8-2-2, En iro nme tal te stn – Part 2-2: Tests – Te st B: D ry h at

IEC 6 0 8-2-2 :2 0 , En iro me tal testn – Part 2-2 : Te sts – Te st T: Test meth ds fo r

solderabi ty andre sistance to so lde rin h at of de ic e s wih le ads

IEC 6 0 8-2-6 , En iro me tal te stn − Part 2: Te st meth ds − Te st Cx: Damp h at, steady

state (uns turated p re ssurizedvap ur)

IEC 61 9 -1-3:2 0 , Ata hme t mate rials for ele ctro ic a se mbly – Part 1-3: Requ ire me ts

fo r ele c tro ic g rade solder alo ys and fluxed and n n-fluxed sold solders fo r ele c tro nic

solde rin ap lcato s

IEC 61 9 -1-3:2 0 /AMD1:2 10

ISO 6 3 (al p rts), He attreatab le ste ls, alo y ste ls and fre e-cu ttn ste ls

ISO 6 6 (al p rts), Wro u ght aluminium and aluminiu m alo ys – Extru de d rods/b ars, tu b e s

and p ro fie s

3 Terms and definitions

For the purp ses of this doc ment, the terms an definition given in IEC 6 0 8-1 an

ISO an IEC maintain terminological data ases for u e in stan ardization at the fol owin

ad res es:

• IEC Electro edia: avai a le at htp:/ www.electro edia.org/

• ISO Onl ne browsin plat orm: avai a le at htp:/www.iso.org/o p

4 General description of the method

The u er s ould note that the test method sp cified in this doc ment is inten ed to provide

con istent an dis riminatory data b twe n variou test sites Hen e the c oice of al oy,

temp rature an flu s al b control ed

Usin this test method to control a prod ction proces is en ouraged However, as e c

prod ction proces wi employ dif erent al oy , temp ratures an flu es, s c test res lts

s al b agre d up n b twe n u er an s p ler In case of a dispute, the proced res of this

doc ment s al prevai

NOT Informatio re ardin wetin b la c for SMD s ld ra i ty te tin is d s rib d in An e B

4.2 Compo e ts

The test sp cimen s al b a sample from the inten ed prod ction b tc The test sp cimen

is mou ted into a s ita le holder that is s sp n ed from a sen itive b lan e Liq id flu is

then a pl ed to the sp cimen that is brou ht into contact with the cle ned s rface of the l q id

solder within a solder b th, or the a ex of a solder glo ule The solder in either case is at a

control ed temp rature, an the le d or termination u der test is immersed to the pres rib d

de th

4.3 Printe boards

The test sp cimen s ould b a re resentative test sp cimen, a p rtion of the printed b ard

b in tested, or a whole b ard if within size l mits, s c that an immersion de th defined in

the in ivid al method is p s ible Test sp cimen may b u ed for rigid b ard s rface

soldera i ty an plated- hrou h-hole soldera i ty

Liq id flu is then a pl ed to the sp cimen that is brou ht into contact with the cle ned

s rface of a solder b th, or the a ex of a solder glo ule, that is at a control ed temp rature

an immersed to the pres rib d de th

The res ltant forces, me s red in mN, of buoyan y an s rface ten ion actin up n the

immersed termination are detected by a tran d cer an con erted into a sig al that is

contin ou ly monitored as a fu ction of time, an recorded an displayed on a computer

s re n

The wetin sp ed an the extent of wetin are derived from the force again t time c rve

The trace may b comp red with that derived from a p rfectly wet ed sp cimen of the same

nature an dimen ion

5 Description of the test apparatus

Fig re 1 an Fig re 2 s ow a s ita le ar an ement for the test a p ratu

The sp cimen is s sp nded from a sen itive b lan e an a mec anism u ed to either raise

the solder to me t the sp cimen or lower the sp cimen into the solder Af er con itionin , the

tran d cer sig al is p s ed to a computer, where the force again t time c rve may b

4

6 Preparation of spe ime s

6.1 Cle ning

Unles otherwise sp cified, the sp cimen s al b tested in the as-received con ition an

care s ould b taken to en ure that no p rt of the s rface to b tested b comes contaminated,

p rtic larly by contact with the fin ers, d rin the pre aration an han ln of the sp cimen

If req ired by the comp nent sp cification, the sp cimen may b cle ned by immersion in a

neutral organic solvent at ro m temp rature The sp cimen s ould b alowed to dry in air

b fore testin No other cle ning is p rmit ed

6.2 Pre on itioning

If req ired by the comp nent sp cification, the comp nent may b s bjected to

precon itionin b fore testin This s al b p rformed for 4 h at 15 °C u les otherwise

agre d b twe n u er an s p ler (Ta le 1, con ition F)

In the p st, it had b en practice to u e the term ac elerated agein whic , as given in

IEC 6 0 8-2-2 :2 0 , 4.1.1, has six alternative con ition that may b u ed as an alternative

NOT Th pre e c of siv r in th s ld r re u e th dis olutio efe t o siv r c ntainin metal z tio o

c mp n nts a d th refore c n b u e wh n re uire b th rele a t c mp n nt s e ific tio

7.1.3 Le d-fre s lder al oy

The prefer ed aloy comp sition to b u ed s ould con ist of either a mas fraction of 3,0 %

Ag, 0,5 % Cu, 9 ,5 % Sn (Sn9 ,5Ag3Cu,5) or 0,7 % Cu, 9 ,3 % Sn (Sn9 ,3Cu,7) (Refer to

IEC 61 9 -1-3 for the aloy name.)

NOT Sn 6,5Ag Cu,5 is als k own a SA 3 5

Other le d- re solder al oy may b u ed up n agre ment b twe n u er an s p l er

7.1.4 Solder c ntamination c ntrol

The solder in solder b th u ed for soldera i ty testin s al b c emical y or

sp ctrogra hical y analy ed or re laced e c 3 o eratin day The levels of contamination

an Sn content s al b within those s own in Ta le 2 The intervals b twe n analy es may

b len thened if the test res lts in icate that the contamination l mits are not b in

a pro c ed The comp sition of the le d- re solder, in lu in contamination levels, s al b

maintained d rin testin with the siver an co p r element levels adju ted for al oy

requirements

An o eratin day con ists of an eig t hour p riod, or an p rtion there f, d rin whic the

solder is l q efied an u ed If contamination ex e d the l mits sp cified in Ta le 2, then the

solder s al b c an ed an the intervals b twe n analy is s al b s ortened A sampl n

plan s al b develo ed, implemented, an doc mented It s al also in icate the proces

control of the solder contamination

Th tin c nte t of th s ld r s al b maintain d within ±1 % of th n min l alo b in u e Tin c nte t

s al b te te at th s me fre u n y a te tin for c p er/g ld c ntamin tio Th b la c of th b ths al

b le d a d/or th items lste a o e

b

Th total of c p er, g ld, c dmium, zin , a d aluminium c ntamin nts s al n t e c e 0,4 % Not

a plc ble to le d-re alo s

c

Th tin c nte t of th s ld r s al b maintain d within ±1% of th n min l alo b in u e Tin c nte t

s al b te te at th s me fre u n y a te tin for c p er/siv r c n e tratio Th b la c of th b th

s al b th items lste a o e

d

Ma imum c ntamin tio lmits are a plc ble for Sn 6,5Ag Cu,5 Oth r le d- re s ld r alo c ntamin tio

lmits ma b u e u o a re me t b twe n u er a d v n or

7.1.5 Solder ma s for s lder globule wet ing bala c method

For the solder glo ule wet in b lan e method, the solder s al b in the form of p l ets or c t

wire with a mas of 2 0 mg ± 10 mg for u e on a 4 mm diameter pin glo ule s p ort bloc ,

10 mg ± 10 mg for u e on a 3,2 mm diameter pin s p ort bloc , 2 mg ± 2,5 mg for u e on a

2 mm diameter pin glo ule s p ort bloc , an 5 mg ± 0,5 mg for u e on a 1 mm diameter

A new solder p let s al b u ed for e c test ex e t in the case of a ste an re e t

tec niq e Se arate dedicated glo ule s p ort bloc s s ould b u ed for tin-le d an le d

-fre al oy to avoid cros -contamination Refer to An ex C regardin dimple glo ule

7.2 Flux

7.2.1 Rosin ba e flux

The prefer ed flu es for the test are rosin b sed as s own b low Se Ta le 4 for the detai s

a) Non-activated

The flu to b u ed for testin s ould b taken from the s p l ed container an p ured into a

smal c p (b aker) Flu a pl ed for testin s ould b taken from this c p Af er u e the

u u ed flu lef in the c p s ould b dis arded

7.2.3 Te t flux s le tio criteria

Refer to Clau es B.5 and B.8 for information regardin the adoption an u e of these test

Unles otherwise sp cified in the relevant sp cification, the temp rature of the solder prior to

the test s al b 2 5 °C ± 3 °C for Sn9 ,5 Ag3 Cu,5 an 2 0 °C ± 3 °C for Sn9 ,3 Cu,7 al oy

8.2.2 Solder bath wet ing bala c proc dure

The sp cimen is mou ted in a s ita le holder to give the desired dip in an le an the

termination(s) is/are centred a ove the solder b th Prefer ed dip in an les are given in

Ta le 5

The temp rature of the solder prior to the test s al b as des rib d in 8.1

Prior to testin , a contin ou layer of the a pro riate flu is a pl ed to the p rtion of the

comp nent termination to b tested, u in a coc tai stic , coton bu or simi ar a pl cator,

an ex es flu dro lets are removed by tou hin again t a sorb nt p p r It is very

imp rtant that ex es flu is not alowed to enter the sp cimen holder or remain on the

comp nent The presen e of ex es flu wi cau e explosive b i n as the flu solvent

makes contact with the molten solder

Immediately prior to testin , wip the oxide from the solder b th s rface with a non-wet a le

blade If req ired, the a p ratu s sp n ion an c art recorder are adju ted to the zero

p sition

L aded non-SMD comp nent: Han the sp cimen on the a p ratu so that the lower ed e of

the comp nent is 2 mm ± 5 mm a ove the solder s rface The sp cimen are then brou ht

into contact at a sp ed b twe n 5 mm/s an 2 mm/s so that they are immersed to the

required depth within 0,2 s

SMD comp nents: It is imp rtant to en ure that the test sp cimen, at the start of the test, is

p sitioned on the eq ipment at a distan e not gre ter than 10 mm ± 2 mm an to al ow the

sp cimen to prehe t dry for 3 s ± 15 s prior to immersion into the solder glo ule This p riod

is req ired to remove the solvent from the flu prior to the test an to prevent explosive

b i n when the sp cimen an solder come into contact L adin an u lo din of test

sp cimen may, of course, b at a mu h gre ter distan e, for example gre ter than 2 mm

The sp cimen an solder are brou ht into contact at a sp ed b twe n 1 mm/s an 5 mm/s

The recommen ed immersion de th into the solder of the s rface to b tested s al b as

sp cified in Ta le 5 Se also Fig re 3 Ta le 5 s ows the solder dip in an le for SMD,

le ded SMD comp nents as wel as le ded non-SMD comp nents

Table 5 – Re omme de s lder bath wet ing bala c te t c n itions

Comp nent e ample Dip ing angle

2 ° to 4 °

1A, 1B,1C,

1G d

,1H d

Not re omme d d for siz s b low 16 8M (0 0 )

Th re omme d d dwel time is 5 s, e c pt for SOT 8 a d SOT 2 3 c mp n nts, wh re 10 s is re omme d d

Th re omme d d immersio s e dfor al c mp n nts is b twe n 1 mm/s a d 5 mm/s

Th immersio d pth are re omme d d v lu s Wh n a pro riate, a hig er immersio d pth or lo g r dwel

time c n b c o e , for e ample in c s of in d q ate th rmal h at tra sfer Se B.7.3.1 for pre a tio s

The with rawal rate is not sp cified as the force c rve is not analy ed on e the sp cimen

starts to se arate from the solder

The time seq en e of the test is s own in Ta le 6 To maintain re e ta i ty, the test

The vertical force actin on the sp cimen is recorded d rin the p riod of contact b twe n the

solder an the sp cimen The force d rin with rawal ne d not b recorded, as the

with rawal p rt of the c rve is not analy ed

On e the sp cimen has co led, the flu resid es are was ed from the sp cimen, u in a

neutral organic solvent The sp cimen is vis al y examined u in a mag ification of 10×

Sp cial at ention s ould b p id to de-wet in , as de-wet in do s not ofen oc ur u ti the

sp cimen is with rawn from the solder

Note that de-wetin may b o s ured by the presen e of solder icicles frozen onto the

termination as it is with rawn from the solder

8.2.3 Solder globule wet ing bala c proc dure

Unles otherwise sp cified in An ex C for 0 0 M (0 01) ca acitors/resistors, the folowin

proced re s al b a pl ed

Select the a pro riate glo ule bloc for the comp nent to b tested Recommen ed glo ule

s p ort bloc pin sizes are given in Ta le 7

Set the temp rature of the solder as sp cified in 8.1 Note that the glo ule bloc s s ould

never b he ted without solder coverin the iron pin He tin the u covered pin could cau e

the iron to b come oxidized an dific lt to wet

The sp cimen is mou ted in the a pro riate holder, to give the desired dip in an le, an the

termination to b tested is centred a ove the solder glo ule Recommen ed dip in an les

an immersion de th for a typical ran e of comp nents are given in Ta le 7 an Fig re 4

Prior to testin , a contin ou layer of the a pro riate flu is a pl ed to the portion of the

comp nent termination to b tested, u in a coc tai stic , coton bu or simi ar a pl cator,

an ex es flu dro lets are removed by tou hin again t a sorb nt p p r It is very

imp rtant that ex es flu is not al owed to enter the sp cimen holder or remain on the

comp nent The presen e of ex es flu wi cau e explosive b i n as the flu solvent

makes contact with the molten solder

Immediately b fore the test, the solder from the previou test s ould b removed, by wipin

the glo ule bloc with a coton bu , an re laced by a new p l et of the a pro riate mas

glo ule This maintain a cle n s rface for the d ration of the test, an en ures that the iron

pin is ful y wet ed an the solder formed into a reg lar hemispherical s a e If req ired the

a p ratu s sp n ion an recordin device are adju ted to the zero p sition

Han the sp cimen on the a p ratu so that the lower ed e of the comp nent is

10 mm ± 2 mm a ove the solder glo ule an al ow the sp cimen to prehe tdry

The sp cimen an solder are then brou ht into contact at a sp ed b twe n 0,1 mm/s an

5 mm/s The immersion de th of the s rface to b tested into the solder s al b as sp cified

in Ta le 7, whic gives immersion de th for a typical ran e of comp nents, an Fig re 4

Not re omme d d for siz s b low 0 0 M (0 01).

Bath meth d is prefere for c p citors 3 16M ( 2 6) siz

Th re omme d d dwel time is 5 s, e c pt for SOT 8 a d SOT 2 3 c mp n nts wh re 10 s is re omme d d

For dia ram 2B in Fig re 4, a rig tward ofs t ma b u e Th rig tward ofs t dista c from th cre t of th

s ld r glo ule s al b 0 % to 15 % of th pin diameter a d s al a oid lefward ofs t

This te t is re omme d d o ly for th s b ls a d b mp th t wi n t melt at th re p ctiv temp rature a d

th t are n t d sig e to melt d rin reflow o eratio

Fig re 4 – Immersion c n itions for s lder globule method

The solder an sp cimen are held in this p sition for not les than 5 s an then se arated

The with rawal rate is not sp cified as the force c rve is not analy ed on e the sp cimen

starts to se arate from the solder

The time seq en e of the test is s own in Ta le 8 To maintain re e ta i ty, the test

The v er tical force actin on the sp cimen is r ecorded d rin the p riod of contact b tw een the

sp cimen an solder The force d rin with rawal ne d not b recorded as the with rawal

p rt of the c rve is not analy ed

The flu resid es are was ed from the sp cimen, on e the sp cimen has co led, u in a

neutral organic solvent The sp cimen is vis al y examined u in a mag ification of 10×

Sp cial at ention s ould b p id to de-wet in , as de-wet in do s not ofen oc ur u ti the

sp cimen is with rawn from the solder

Note that de-wetin may b o s ured by the presen e of solder icicles frozen onto the

termination as it is with rawn from the solder

8.2.4 Proc d re for te tin printe board spe ime s

The test sp cimen are to b dip ed in the flu to the ful de th to b soldered for 5 s to 10 s

The flu s al b maintained at the pres rib d comp sition defined in 7.2.3 Af er with rawal

from the flu , the test sp cimen s al b al owed to drain vertical y for a maximum of 6 s

Ex es flu s al b removed by blotin the s rface to b tested with a piece of a sorb nt,

cle n material The soldera i ty test s al then b p rformed in not les than 1 min, an not

Han the sp cimen on to the a p ratu so that its lower ed e is 10 mm ± 1 mm a ove the

solder b th to prehe t it for 2 s ± 1 s as s own in Fig re 6 The test s al b started af er

cle rin the s rface oxide from the molten solder an waitin for a p riod of 5 s ± 5 s for the

b th s rface to setle down

The flu covered s rface s al b immersed only on e in the molten solder to a de th of

0,2 mm ± 0,1 mm The an le of immersion s al b 2 ° to 4 ° An an le of 9 ° may b u ed

only up n agre ment b twe n u er an s p l er on immersion an le selection The immersion

sp ed s al b 1 mm/s to 5 mm/s an the dwel time s al b 5,0

0,50

−

s Al test sp cimen

s al have the flu removed u in a s ita le cle nin agent

Figure 6 – Printe board immersion

The time seq en e of the test is s own in Ta le 6 To maintain re e ta i ty, the test

seq en e time s ould b as s ort as p s ible

9 Presentation of results

9.1 Form of forc v rs s time tra e

The trace may b recorded in two forms, the only diferen e b in the p larity of the force

re din s In this doc ment, forces actin upward on the sp cimen (non-wet in ) are s own

as negative an forces actin downward on the sp cimen (wet in ) are s own as p sitive

A typical wet in b lan e trace is s own in Fig re 7

Figure 7 – Typic l wet ing bala c tra e

Time t

0

is the time at whic the solder s rface an the sp cimen first make contact, as

in icated by a smal downward movement of the trace from the zero l ne

At p int A the solder menis u starts to rise up the sp cimen termination This is normal y

c aracterized by a sig ificant in re se in the wetin force

At p int B the contact an le is 9 ° The me s red force is that d e to the buoyan y of the

comp nent

At p int C the wet in force re c es 2/3 of the maximum value of the res ltant wetin force

an the wet in force s al ex e d a sp cified value within a sp cified time

At p int D the maximum value of the res ltant wet in force is re c ed d rin the sp cified

immersion p riod

Point E is the force re din at the en of the sp cified test p riod

Interpretation of the trace af er E, d rin the with rawal of the sp cimen, is not con idered

The wet in force in Fig re 7 may b me s red from the zero l ne, the buoyan y l ne, or the

minimum forces at p int A ( he force ex ursion)

NOT Certain c mp n nts ma wet s e siy th t th re ma b n d wnward mo eme t of th tra e from th

z ro ln This re re e ts g o s ld ra i ty

A pictorial u derstan in of the wet in c rve ste s 1 throu h 5 may b se n in B.7.3.5

9.2 Te t re uireme ts

The req irements for the soldera i ty of the comp nents s al b expres ed in terms of one

or more of the fol owin p rameters:

Time

Bu y n y lnt

0

A maximum value of the time interval (t

0

to C)

c) For the stabi ty of wetin

A minimum value for the ratio:

Datfor ce

Eatforce

NOT Ex mple of th criteria are d s rib d in B.7.4 a d An e D

10 Information to be give in the releva t specification

The fol owin items s al b sp cified in the relevant sp cification if a pl ca le

Annex A

Equipment specification

A.1 Characteristic of the apparatus

For the purp se of this doc ment the complete a p ratu , in lu in the computer s stem or

the c art recorder, is to b con idered as a sin le piece of eq ipment havin the fol owin

c aracteristic

a) The resp n e time of the recordin device s al b s c that return to centre zero on

removal of the maximum lo d s al b ac ompls ed within 0,3 s, with an overs o t not

c) The deflection of the recording device s al b directly pro ortional to the force a pled

over the entire ran e to an ac urac b t er than ± % of the ful -s ale deflection

d) Electrical an mec anical noise on the force trace s al not ex e d

– 10 % of the sig al level, on the most sen itive ran e for SMD an printed b ard, or

– the eq ivalent 0,0 mN for le ded non-SMD comp nents

e) The stif nes of the sprin s stem of a mec anical b lan e s al b s c that a lo d of

10 mN cau es a vertical displacement of the sp cimen s sp n ion whic do s not ex e d

0,1 mm

f If a c art recorder is u ed, the c art sp ed s al b not les than 10 mm/s

g) The sp ed of immersion an with rawal s al b b twe n

– ± ,2 mm for le ded non-SMD comp nents, or

– ± ,1 mm for printed b ard

i) The solder temp rature s al b maintained at the sp cified temp rature in 8.1, but s ould

b adju ta le b twe n 2 0 °C an 2 0 °C

j) The time at maximum immersion s al b adju ta le from 0 s to 10 s

A.2 Solder bath

The b th s al b of s f icient thermal mas to ena le the test temp rature to b maintained

to the req ired precision No p rt of the sp cimen s al b les than 15 mm from the wal , so

that the wet in forces are not af ected by the c rvature of the solder s rface at the ed es of

the b th The de th of the b th s al not b les than 15 mm

A.3 Globule support blocks

A.3.1 The b d s al b made from a non-he t tre ta le aluminium b r havin a minimum

A.3.2 The 1 mm, 2 mm, 3,2 mm an 4 mm diameter iron pin s al b made of pure iron, or

low carb n ste l havin the folowin comp sition:

A.3.4 The aluminium b d s al b he ted by an electrical he ter an the temp rature

control ed by an me n whic wi en ure a temp rature within ± °C of the sp cified

temp rature in 8.1

A.3.5 The temp rature s al b me s red by in ertin a s ita le pro e, s c as a

thermocouple, thermistor or platin m resistan e wire, into a hole b red into the iron pin

A.3.6 The to s rface of the iron pin s al b tin ed Af er completion of the test, the glo ule

s p ort bloc s al b al owed to co l with a solder glo ule in p sition, to prevent oxidation of

the iron pin an s bseq ent dewet in

A.3.7 The relative p sition of the sp cimen an the solder glo ule s al b adju ta le in

b th horizontal axes

A.3.8 When testin micro-comp nents s c as 0 0 M(0 01) an employin the con ition

of An ex C, the glo ule s p ort bloc s al have a dimpled to s rface as s own in

Fig re C.1

Annex B

(informative)

Use of the wet ing balance for SMD solderabi ity testing

B.1 Definition of the measure of solderabi ity

The wet in b lan e method p rmits the me s rement of the vertical force actin on a

sp cimen as a fu ction of time, when the sp cimen is immersed in a b th of molten solder or

a molten solder glo ule The soldera i ty of the sp cimen is ded ced from these o servation

as the time to re c a given degre of wet in or as the degre of wet in re c ed within a

given time

In general the con tru tion of s rface mou ted devices do s not al ow the ful menis u rise

to develo , where the contact an le red ces to zero, an so the o served wet in force

can ot b comp red to the the retical wet in force

A sp cification for soldera i ty may req ire that several p ints on the force- ime c rve

conform to p rtic lar values An ex B s g ests p ints an values that may b u ed

The test eq ipment s al conform to certain req irements if re rod cible and q antitative

res lts are to b o tained The req irements an method of verifyin that they are compl ed

with are also in lu ed in An ex B

The c oice of method wi de en up n the typ of comp nent to b tested an the level of

information req ired from the test The relevant comp nent sp cification wi in icate whic

method is prefer ed

Importa t information:

To en ure con istent res lts b twe n the u er an ven or, only the flu , aloy, an test

temp ratures stipulated s ould b u ed

In case dif erent flu es, solder al oy an temp ratures are u ed, the criteria for evaluation of

the test res lts s al b set a pro riately an agre d up n

B.2 Ga ge R&R – Test protocol for wet ing balance gauge repeatabi ity a d

reproducibi ity using copper foi coupons

B.2.1 Te t c upon

Al coup n for these tests s al b pre ared in ivid al y ju t prior to testin Do not cle n the

samples in b tc es

A co p r foi of 3 µm nominal thic nes ( 1 oz” co p r) s al b u ed for the test

The co p r foi s al have no s rface tre tment an is exp cted to have an oxidized

a p aran e upon receipt from the s p l er Do not u e the co p r foi if it is brig t an s iny

This is in icative of s rface anti- arnis tre tments b in u ed Surface tre tments/

preservatives can interfere with the a i ty to make a con istent ‘ k own go d coup n’

neces ary for this test

The co p r foi coup n s al b die c t to en ure re e ta i ty of the samples b in tested

a 2 mm b 5 mm c 10 mm

Cre te a fi e for e c foi width an for e c in ivid al p rson in olved that is p rformin the

GR&R

B.2.2 Te t parameters

The solder temp rature s al b as recommen ed for the al oy an the sp cification b in

u ed, i.e for SnPb solder al oy it s al b 2 5 °C For le d- re solder al oy it s al b 2 5 °C,

regardles of the sp cification

• Immersion de th s al b 0,4 mm

• Immersion sp ed s al b 2 mm/s

• Dwel time in the solder s al b 10 s

• Immersion an le s al b 9 ° in ident to the solder

No prehe t s al b u ed

B.2.3 Known g od c upon

Sample pre aration for the ‘ k own go d coup n’ s al b as folows:

a) u e twe zers to immerse a foi sample into a b aker of acetone an gently agitate for

2 s;

b) remove the sample an blot b th sides dry with l nt fre tis ue or other s ita le la tis ue;

c) again u in twe zers, immerse the a ove sample into a 2 % v/v Nitric acid solution an

gently agitate for 2 s;

d) immerse the sample immediately into DI water an gently agitate for 2 s;

e) blot the sample dry as in ste b) a ove;

f dip the sample into the ‘stan ard activated flu ’ normal y u ed for soldera i ty testin for

5 s;

g) holdin the samples vertical y, blot to remove ex es flu ;

h) place the sample into the to l holder;

i) ru the test

Re e t ten times for e c foi width an e c test p rson It is recommen ed that thre

p o le s ould b u ed for the GR&R stu y

For e se of data manipulation it is recommen ed to con ert the wet in forces o tained into

mN/mm of wet a le len th For the 10 mm coup n for example, the weta le len th is 2 times

10 mm plu 2 times 0,0 5 mm for a total len th of 2 ,0 mm

For the ‘stan ard activated’ flu of nominal 0,2 % activation, the wetin force u ed for the

calc lation s al b 0,31 mN/mm for SnPb solder al oy an 0,3 mN/mm for le d fre solder

al oy If a more active flu is b in u ed, a large sample s al b ru to o tain the me n value

an this u ed for the calc lation

Calc late the stan ard deviation for e c of the foi width an the p o le ru nin the test

Multiply the stan ard deviation value by 6 ( his re resents the ± stan ard deviation of a

normal distribution)

Divide this n mb r by the wet in force an multiply by 10 to o tain a p rcentage value

For an ac e ta le GR&R, the values o tained s ould b b low 10 %.

There s ould b ex el ent R&R res lts with the 10 mm coup n the first time this protocol is

p rformed with an in re sin spre d from test p rson to test p rson when u in the smal er

coup n The test may have to b re e ted or the individ als alowed some ‘ practice time’

prior to ru nin the ful GR&R

In ad ition to testin the in ivid al, this protocol also tests the mac ine an wi s ow l ne rity

an an bias if it exists Becau e the wetin forces have b en set to mN/mm, the re din s for

e c coup n width s ould b the same If they are cle rly dif erent but the stan ard

deviation prod ced by the in ivid al test p o le are b low 10 %, then there is a pro lem with

the wetin b lan e an the man facturer s ould b contacted

B.3 Solder globule mass and pin size

The solder glo ule wet in b lan e method is stan ardized u in four sizes, 4 mm, 3,2 mm,

2 mm an 1 mm diameter, for the iron in ert in the aluminium bloc , an five cor esp n in

solder p l et sizes, 2 0 mg, 10 mg, 2 mg, 5 mg an 2,5 mg

In general the smal er solder p l et sizes give improved dis rimination with the smal er SMDs

an faci tate testin of in ivid al le d on fine pitc devices s c as QFPs (q ad flat p c s)

an BGAs (b l grid ar ay ) The 2 0 mg glo ule is req ired for al larger SMD an multi

-le ded SMD, where the 2 mg solder glo ule has in uf icient volume to completely solder the

termination The 10 mg glo ule provides larger wet in force than the 2 0 mg glo ule an

larger thermal inertia than the 2 mg glo ule With the ad ent of even smaler SMD, s c as

0 0 M(0 01), a smaler pin size, 1 mm diameter, an glo ule size 5 mg or 2,5 mg, may b

required to matc these finer SMD sizes

A l st of recommen ed pin sizes an globule mas is given in Ta le 7 an An ex C

The solder glo ule u ed with the solder glo ule wetin b lan e method is a lmited source of

he t an so wi b a le to dis riminate b twe n dif erent thermal req irements on a

comp nent An extreme example of this is the SOT 8 an SOT 2 3 devices where the centre

le d has a mu h hig er thermal req irement than the two outer le d

B.4 Specimen orientation and immersion depth

Surface mou ted devices general y have s ort termination an so it is ad isa le to u e

s al ow immersion de th to le ve the largest are avaia le a ove the solder, to develo the

largest p s ible wet in force The buoyan y forces u der these con ition wi b relatively

smal

However, this s ould b b lan ed again t the thermal ne d of the comp nent The u e of

very s al ow immersion de th may give p or or u predicta le he t tran fer into the

comp nent, givin varia le times b fore the on et of wet in To hig immersion de th wi

give p or wetin force re din s Ta le 5 an Fig re 3 give a l st of recommen ed immersion

de th for a ran e of common comp nents, for the solder b th method, an Ta le 7, Fig re 4

an An ex C give the recommen ed immersion de th for the solder glo ule wetin b lan e

method

As a general g ide, where a termination can b presented as a straig t vertical face, this wi

provide the b st res lts However, it is also neces ary to en ure that solder can flow alon

the face that wi eventual y b soldered to the printed b ard The solder s al also b brou ht

exp sed c t en s The immersion an le s al also al ow s f icient thermal contact to provide

adeq ate he t tran fer into the comp nent

These req irements wi have a dif erent con eq en e for dip in orientation an dip in

de th, for dif erent comp nents

B.4.2 Re istors a d c pa itors

L rge ca acitors can b immersed into the solder with the termination horizontal, but

resistors wi general y give b t er res lts when one termination is tested vertical y, or at an

an le b twe n 2 ° an 4 ° Smal size ca acitors, 16 8M (0 0 ) an smal er, may also give

b ter res lts when dip ed with the termination vertical, or at an an le b twe n 2 ° an 4 °

The smal er p l et size is prefer ed for 10 5M (0 0 ) an 16 8M (0 0 ) sizes It is also

recommen ed that these comp nents b immersed general y to one side of the glo ule as

s own in diagram 2B of Ta le 7 an Fig re 4

NOT Comp n nts n me in p re th s s, dime sio s are e pre s d in Imp rial

B.4.3 Smal -le de c mpon nts

SOT 8 , SOT 2 an SOT 2 3 devices may b dip ed at 4 °, as the en s of the termination

are c t in the man facturin proces exp sin the b re metal whic is general y

non oldera le by con entional test flu es By u in a dip in an le of 4 ° the molten solder

is brou ht into contact with the soldera le p rt of the termination, al owin the solder to

ad an e over the termination b fore the contact an le decre ses to zero

These comp nents are he ted to s c an extent durin the test that adjacent le d are

reflowed Th s, only one le d may b tested on a device In general, gre ter sen itivity is

o tained by u in the smal er solder glo ule to test these comp nents

B.4.4 Multi-le de d vic s

A complete row of le d on a multi-le ded device can b tested u in the solder b th Gre ter

dis rimination may b o tained by removin alternate le d or alternate p irs of le d to

red ce the ef ect of ca i ary action b twe n the le d , or in ivid al le d may b careful y

c t from the comp nent

The solder glo ule wet in b lan e method can b u ed to test in ivid al le d on a

multi e ded device, but may also req ire le d to b removed to prevent solder makin

contact with two le d or with the solder resid e remainin on the previou ly tested le d

A complete row of le d on a multi-le ded device may b tested u in a sin le solder glo ule,

but comp nents with a hig thermal mas may s ow varia le times for the on et of wet in ,

b cau e of the dif erin prehe t times an temp ratures

SOIC, VSO an QFP devices may req ire dip in at an an le of 4 °, sin e these devices

have c t en s whic are non-weta le by con entional test flu es Only by u in a s al ow

dip in an le can the soldera le s rface b brou ht into contact with the solder This pro lem

is common to a large n mb r of devices

PLCC devices s ould b dip ed with the b d horizontal an req ire alternate le d to b

removed, to avoid the solder spike remainin on the previou ly tested le d makin contact

with the solder glo ule

BGA devices s ould be dip ed with the b d horizontal With this ar an ement it is p s ible

to test the outer row of solder b l s Alternate solder b l s s al b tested to avoid pic up of

solder an flu resid e from adjacent solder b l s

B.5 Te t flux

For the solder b th test sp cified in 8.2.1, flu is only a pled to the comp nent termination

an either of the flu es in 7.2 may b sp cified

For the solder glo ule wetin b lan e method, flu is a pl ed to b th the comp nent

termination an the solder glo ule Either of the flu es sp cified in 7.2 may b u ed on the

comp nent termination It has b en fou d that the pure rosin flu , sp cified in 7.2, is not

ca a le of maintainin a cle n solder s rface for the d ration of the test Where a dif erent

flu is u ed on the comp nent termination, it has b en fou d that a l tle intermixin oc urs

If the u er wis es to employ a test flu that is more re resentative of modern flu formulation

(e.g no cle n flu es), then the folowin formulation s own in Ta le B.1 an Ta le B.2, can

b con idered that have simi ar dis riminatin p wers to the rosin test flu es

Alc h l eth x late s rfa ta t (C S No 6 131-3 -5) 0,1

Table B.2 – Carbox l c a id ba e flux (alc hol s lution)

The test temp rature of 2 5 °C ± 3 °C is c osen to b con istent with existin IEC stan ard

If a further en an ement of the dis rimination is req ired, then 215 °C ± 3 °C may b u ed If

req ired by the relevant sp cification, other test temp ratures may b sp cified

The prefer ed test temp ratures are the fol owing:

2 5 °C ± 3 °C

215 °C ± 3 °C

Certain co tin s, for example organic brig tened tin or gold, s ow a sig ificant c an e in

their rate of solution in solder with 6 % tin an 4 % le d b twe n 2 5 °C an 2 5 °C In

s c a situation, the relevant sp cification s ould state whether a solder b th temp rature of

2 5 °C may b u ed for testin

B.6.2 Solder al o with ut le d

The test temp rature of 2 5 °C ± 3 °C was determined from the IPC (As ociation Con ectin

Electronic In u tries) rou d ro in test program that s bstantiated the u e of Sn9 ,5Ag3Cu,5

The JNC (Ja anese National Commite for IEC TC91), however, also in lu es the u e of

Sn9 ,3Cu,7 for whic the test temp rature s al b 2 0 °C ± 3 °C

B.7 Characteristic of the test apparatus

B.7.1 Re ording de ic

B.7.1.1 Zero s t in

Durin the test c cle, the force actin on the sp cimen reverses direction as non-wet in

c an es to a wet ed con ition When testin s rface mou ted devices the buoyan y force wi

general y b negl gible, as the immersion de th are very smal The wetin force- ime trace

wi general y s ow a smal non-wet in force an a relatively larger wetin force The

recordin device s ould b adju ted to a level con istent with ke pin the whole c rve on the

c art or display

B.7.1.2 Re pons time (s e Cla s A.1 a)

The resp n e time of the recordin device s al b smal enou h to en ure that it re rod ces

ac urately the ra id c an es in force that take place, p rtic larly at the commen ement of

wetin Althou h in the ry this s ould b infinitely smal , in practice a maximum resp n e

time of 0,3 s has proved satisfactory

Th s, a c art recorder can b u ed as a recordin device, althou h it is more common to

digitize the force- ime sig al an analy e it by computer

The fol owin proced re may b u ed to test the resp n e time of the recordin device an

the in trument zero sta i ty if this information is not avaia le It req ires the u e of a k own

mas (whic s ould b s f icient to give a ful -s ale deflection of the recordin device from

the mid-p int zero) an a sp cimen holder s ita le for holdin the mas :

• with the sp cimen holder in place, set the recorder to zero;

• start the recordin device at its maximum sp ed;

• place the mas on the sp cimen holder;

• afer 3 s remove the mas , le vin the recorder ru nin ;

• afer 3 s re lace the mas on the sp cimen holder;

• re e t the o eration at le st five times, b fore sto pin the recorder

The force- ime trace wi give the sen itivity an resp n e time of the a p ratu , for the given

set in s an the zero sta i ty

B.7.1.3 Se sitivity s t ings (s e Cla s A.1 b)

The provision of a ran e of sen itivities al ows sp cimen of dif erent sizes to b tested In

general large ran es wi have lower resolution than smal ran es For s rface mou ted

devices it is desira le that a ful -s ale deflection of 2 mN or les is at aina le

B.7.1.4 Chart spe d (s e Cla s A.1 f)

If a c art recorder is u ed to record the force- ime trace it is recommen ed that a minimum

c art sp ed of 10 mm/s b u ed, to al ow s f icient dis rimination of the imp rtant p ints on

the force- ime c rve

B.7.2.1 Stif ne s of the spring (s e Cla s A.1 d)

The b lan e s stem me s res the displacement of ( ypical y) a sprin as embly in u ed by

the a pl ed force actin on the sp cimen Su h a displacement prod ces a c an e in the

de th to whic the sp cimen is immersed in the solder an , in con eq en e, a c an e in the

buoyan y force It is therefore neces ary that the sprin s stem b s f iciently stif so that its

deflection an the con eq ent c an e in buoyan y d rin the course of the test is negl gible

by comp rison with other forces b in me s red

When testin s rface mou ted devices where the immersion de th is general y very smal this

is not a seriou pro lem, but it wi b come a more critical factor if the b lan e is u ed to test

larger sp cimen with larger buoyan y forces

B.7.2.2 Nois le el (s e Cla s A.1 e)

The level of electrical an mec anical noise in the b lan e an ampl fier s stem s al not

ex e d 10 % of the sig al level on the most sen itive ran e

B.7.3 Liftin me h nism a d c ntrols

B.7.3.1 Depth of immersion (s e Cla s A.1 h)

The de th to whic the sp cimen is immersed in the molten solder (whic s al b sp cified)

has to fulfi the folowin con ition :

a) in the wet in proces the solder traverses the region of interest On formed le d it wi

b neces ary to select the cor ect immersion an le to en ure this oc urs;

b) the immersion de th s ould b s f iciently smal to le ve the majority of the termination

fre a ove the solder s rface;

c) the immersion de th s ould b s ficient to provide adeq ate thermal he t tran fer into

the termination;

d) the de th of immersion s al b re e ta le to within 0,01 mm to o tain re e ta le res lts

or 10 % in the worst case

NOT Th d e er th immersio d pth, th more th b o a c ofs ts th z ro forc le el from th c ntre z ro

a d th le s termin tio th re is a aia le for th s ld r to tra ers

The de p r the immersion de th, the gre ter the interface avai a le for he t tran fer from the

solder to the sp cimen, hen e the les the wet in proces is delayed by thermal tran fer

ef ects

B.7.3.2 Spe d of immersio (s e Cla s A.1 g)

Soldera i ty tests on s rface mou ted devices u e very smal immersion de th an hen e

only req ire slow dip in sp ed In most cases slow sp ed ena le gre ter immersion de th

ac urac to b o tained An immersion sp ed b twe n 0,1 mm/s an 5 mm/s s ould en ure

that most sp cimen are ful y immersed b fore solderin commen es

B.7.3.3 Duration of immersion (s e Cla s A.1 j)

A dwel time of 10 s may b neces ary for large comp nents an sp cimen with p rtic larly

hig thermal ca acities

B.7.3.4 Solder globule x/y position

In order to u e the solder glo ule wetin b lan e method, the solder glo ule is req ired to b

p sitioned ac urately b ne th the comp nent termination This is general y ac ieved by a

mec anical ta le ca a le of b in p sitioned in the x (lef to rig t an y (b c an forward)

direction An ac urac of ± ,0 mm is recommen ed, esp cial y if s c es ive comp nent

le d are to b tested on a multi-le ded device, where an p sitional er or wi b

comp u ded as the glo ule ad an es alon the device

Bu y n y

c) – Step 3

d) – Step 4

IE

Time (s)T

e) – Step 5

Figure B.1 – Un ersta ding wet ing c rv s

The net of the p rameters me s red from the progres ion of the five ste s en ou tered

d rin the wet in b lan e testin , as hig l g ted a ove, is s own in Fig re B.2

Figure B.2 – Typic l wet ing c rv

B.7.3.6 Some repre e tativ forc - ime c rv s

In the examples s own in Fig re B.3, the p rt of the c rve re resentin forces actin upward

on the sp cimen, i.e non-wet in state, is s own as negative, the c rve re resentin forces

IE

Time (s) T

The dot ed l ne re resents the con ition at the start of the test c cle, havin can el ed the

weig t of the sp cimen The ful horizontal l ne s ows the buoyan y of set, where the wet in

force is zero

The buoyan y of the sp cimen can b calc lated as the prod ct of immersed volume an the

den ity of the molten solder whic it displaces At the sp cified test temp rature of 2 5 °C the

roun ed-of value of 8 g/cm

3

s ould b u ed for the den ity of molten solder with 6 % tin an

4 % le d For SnAgCu an SnCu solder al oy , the den ity of the molten solder rou ded-of

B.7.4 Parameters to be me s re from th forc - ime tra e

B.7.4.1 Choic of te t criteria

Sin e one of the ad antages of this test method is that the whole of the wet in proces is

examined, it may b a pro riate to u e more than one of the p rameters l sted in 8.2 of this

doc ment when decidin the test req irements to b met

B.7.4.2 Time for the on et of wet ing

At p int B (se Fig re 7), the wet in proces has ad an ed from a non-wet in state to the

p int where the solder menis u is a out to start to rise up the termination The time interval

0

is th s the time for the on et of wet in , an wi b influen ed by the flu

an the thermal c aracteristic of the specimen

B.7.4.3 Progre s of wet ing

The me s red force at a given time, or the time to re c a given force, s ould me t the

sp cified req irement It is recommen ed that a maximum time of 2 s is u ed or that the force

re c es the req ired value within 2 s

The req ired force may b determined by the method pres rib d in B.7.5 or the values may

b u ed as p rt of a statistical proces control regime

B.7.4.4 Stabi ty of wet in

Afer the maximum force value D is at ained, the menis u may remain ste d an the force

value s ow no c an e However, this sta i ty may b disturb d by re ction b twe n the

sp cimen an the solder le din to dis olution of the sp cimen s rface by the solder or the

formation of a layer of re ction prod ct at the interface In ad ition, resid al flu may

eva orate, b decomp sed or migrate over the molten solder s rface The solder co tin of a

dip tin ed comp nent may also melt a ove the ad an in solder menis u Al these efects

may le d to a lowerin of the me s red force s c that the value at the en of the test p riod

E is les than the value recorded at D Su h in ta i ty is u desira le an an in ication of

p s ible pro lems with the comp nent termination

For test p riod of 5 s to 10 s it is recommen ed that the ratio

DatForce

EatForce

ex e d 0,8

B.7.5 Refere c wet ing forc

If the heig t of termination avaia le on s rface mou ted devices is not s f icient to al ow the

ful menis u rise to develo , then a contact an le of zero is not at aina le This me n that it

is not p s ible to u e the mathematical proced re in An ex E to calc late the the retical

maximum force

To o tain a practical referen e force again t whic to comp re exp rimental res lts the

fol owin proced re s al b car ied out, for e c comp nent to b tested

Five samples are taken from the sp cimen to b analy ed an tested u in lq id flu to

ISO 9 5 -1:19 0, clas 2.2.2.A This is a hig ly activated organic flu , whic wi prod ce a

referen e b st case res lt on the comp nent The maximum force o tained on e c of the

A p rcentage of this force may b u ed to set a req ired lmit for the comp nents to b tested

an this s ould b stated in the relevant comp nent sp cification It is recommen ed that this

force b sp cified at 2 s, but other times may b sp cified

The samples s ould b examined vis al y to en ure that they are ful y weted an that there

are no defects in the wetin of the termination

The res lts o tained from this method may also b u ed as p rt of a statistical proces

control regime to prod ce control c arts for the comp nents

B.7.6 Eq ipme t lo atio

The eq ipment s al b located in a vibration an draf fre en ironment, on a sturd

workb n h The ad ition of further eq ipment s al not af ect the in trument b lan e

p rforman e an the level of me s red noise, for example fume extraction eq ipment

B.7.7 Globule pins

The glo ule pin are made of iron so, to avoid oxidation, it is es ential to en ure that the

glo ule pin are alway tin ed (covered with solder)

B.7.8 Globule mod le

To avoid p tential cros -contamination b twe n tin le d an le d- re al oy , it is

recommen ed that se arate glo ule mod les b employed that car y s ita le markin s to

dif erentiate b twe n those u ed for tin le d an those u ed for le d- re al oy

B.8 Te t flux – IPC-J-STD-0 2/J-STD-00 activated s lderabi ity test flux

rationale commit ee let er

NOT Co ie , with p rmis io , from IPC, with min r e itorial ame dme ts for c n iste c with this IEC

Intern tio al Sta d rd

The c r ent IPC J-STD-0 2/J-STD-0 3 sp cification in lu es a de arture in the test flu

methodolog u ed in p st soldera i ty testin

ROL ( ormerly desig ated typ R) would b he vi y s rutinized an would req ire test data

J-STD-0 2/J-STD-0 3 has sp nt sig ificant resources workin this flu c an e is ue,

dis u sin the c emistry detai s an con u tin multi-comp ny desig of exp riment

in estigation The J-STD-0 2 commit e c airmen, Dave Hi man [Roc wel Col n ] Dou

Romm [Texas In truments] Mark Kwoka [Intersi ] Jac McCul en [Intel] fe l that the

commit e has compi ed a sig ificant data set an held throu h to ic dis u sion s p ortin

the pro osed flu mat material c an e The four rationales for pro osin /s p ortin the flu