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Tiêu đề IEC 60424-8:2015-08
Chuyên ngành Electrical Engineering
Thể loại Standards Document
Năm xuất bản 2015
Thành phố Geneva
Định dạng
Số trang 30
Dung lượng 1,26 MB

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Cấu trúc

  • 4.1 Chips and ragged edges (8)
  • 4.2 Cracks (11)
  • 4.3 Pull-out ................................................................................................................. 1 0 (12)
  • 4.4 Crystallites ............................................................................................................ 1 0 (12)
  • 4.5 Flash .................................................................................................................... 1 1 (13)
  • 4.6 Pores .................................................................................................................... 1 1 (13)
  • 4.2 Fissures (23)
  • 4.3 Collage (24)
  • 4.4 Cristallites (24)
  • 4.5 Bavures (25)
  • 4.6 Pores (25)

Nội dung

International Stan ard IEC 6 4 4-8 has b en pre ared by tec nical commite 51: Mag etic comp nents an fer ite materials.. The text of this standard is b sed on the f ol owin doc ments: Fu

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THIS PUBLICATION IS COPYRIGHT PROTECTED

Copyr ight © 2 15 IEC, Ge e a, Switzer la d

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L Commis io Ele trote h iq e Inter natio ale (IEC) e t la premièr e orga is tio mo diale q i éla or e et p ble d s

Norme internatio ale p ur to t c q i a trait à léle tri ité,à léle tr oniq e et a x te h olo ie a p re té s

A pro os de p blc t i ns IEC

L c nte u te h iq e d s p blc tio s IEC e t c n tamme t rev Ve i e v u a s r er q e v u p s é e lé itio la

plu r éc nte, u c r rig n um o ame d me t p ut a oir été p blé

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biblo ra hiq e s r le Norme intern t io ale ,

Sp cific t io s t ec niq e , R ap ort s te h iq e et a tre

d c me ts d l EC Dis o ible p ur P , Ma OS, t ablett es

A ndroid et iPa

Recherche de p blc t i ns IEC - w ww ie ch/ se rch u

L re h rc e avan é p rmet d t ro ver d s p blc tio s IEC

e uti s nt difére t s crit ère (n méro d référe c , t exte,

c mit é d’ét ud s,…) Ele d n e a s i d s informatio s s r le

projets et le p blc t io s remplac ée o retiré s

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Ele t ro edia - www.ele t ro edia.org

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Plu d 6 0 0 e t ré s t ermin lo iq e élec t rot ec niq e , e

a glais et e fa ç is, e traite d s art icle Terme et

Définit io s d s p blc tio s IEC p ru s d p is 2 0 Plu

c rt ain s e tré s a t érie re e traite d s p blc t io s d s

CE 3 , 7 , 8 et CISPR d l EC

Serv ic Clent s - w ebst ore.e c h/ cs

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W arnin ! Mak e s re that you o tain d this publc tion from a a t horize distributor

At te tion! V eui ez vou a s rer q e vou a ez o te u c t te publc tion via u distribut eur a ré

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FOREWORD 3

1 Sco e 5

2 Normative ref eren es 5

3 Terms an def i ition 5

4 Limits of s rf ace ir eg larities 6

4.1 Chips an rag ed ed es 6

4.1.1 Chips an rag ed ed es located on the matin s race

6 4.1.2 Chips located on other s races 6

4.2 Crac s 9

4.3 Pul -out 10 4.4 Cry tal tes 10 4.5 Flas 1

4.6 Pores 1

Biblogra h 13 Fig re 1 – Examples of s r ace ir eg larities 5

Fig re 2 – Chips an rag ed ed es location 6

Fig re 3 – Crac s location 9

Fig re 4 – Ref eren e dimen ion f or PQ-cores 9

Fig re 5 – Pul -out location 10 Fig re 6 – Cry tal tes location 1

Fig re 7 – Flas location 1

Fig re 8 – Pores location 12 Ta le 1 – Limits f or al owa le c ip in are s 7

Ta le 2 – Are an len th referen e of ir eg larities for vis al in p ction 8

Ta le 3 – Limits f or crac s 10

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INTERNATIONAL ELECTROTECHNICAL COMMISSION

1 Th Intern tio al Ele trote h ic l Commis io (IEC) is a worldwid org niz tio for sta d rdiz tio c mprisin

al n tio al ele trote h ic l c mmite s (IEC Natio al Commite s) Th o je t of IEC is to promote

intern tio al c -o eratio o al q e tio s c n ernin sta d rdiz tio in th ele tric l a d ele tro ic f i ld To

this e d a d in a ditio to oth r a tivitie , IEC p bls e Intern tio al Sta d rd , Te h ic l Sp cific tio s,

Te h ic l Re orts, Pu lcly Av ia le Sp cif i atio s (P S) a d Guid s (h re f ter refer e to a “IEC

Pu lc tio (s)”) Th ir pre aratio is e tru te to te h ic l c mmite s; a y IEC Natio al Commite intere te

in th s bje t d alt with ma p rticip te in this pre aratory work Intern tio al g v rnme tal a d n n

-g v rnme tal org niz tio s laisin with th IEC als p rticip te in this pre aratio IEC c la orate clo ely

with th Intern tio al Org niz tio f or Sta d rdiz tio (ISO) in a c rd n e with c n itio s d termin d b

a re me t b twe n th two org niz tio s

2) Th f ormal d cisio s or a re me ts of IEC o te h ic l maters e pre s, a n arly a p s ible, a intern tio al

c n e s s of o inio o th rele a t s bje ts sin e e c te h ic l c mmite h s re re e tatio fom al

intere te IEC Natio al Commite s

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Commite s in th t s n e Whie al re s n ble ef forts are ma e to e s re th t th te h ic l c nte t of IEC

Pu lc tio s is a c rate, IEC c n ot b h ld re p n ible f or th wa in whic th y are u e or for a y

misinterpretatio b a y e d u er

4) In ord r to promote intern tio al u if ormity, IEC Natio al Commite s u d rta e to a ply IEC Pu lc tio s

tra s are tly to th ma imum e te t p s ible in th ir n tio al a d re io al p blc tio s An div rg n e

b twe n a y IEC Pu lc tio a d th c re p n in n tio al or re io al p blc tio s al b cle rly in ic te in

th later

5) IEC its lf d e n t pro id a y ate tatio of c nf ormity In e e d nt c rtific tio b die pro id c nf ormity

a s s me t s rvic s a d, in s me are s, a c s to IEC mark of c nf ormity IEC is n t re p n ible f or a y

s rvic s c rie o t b in e e d nt c rtif i atio b die

6) Al u ers s o ld e s re th t th y h v th late t e itio of this p blc tio

7) No la i ty s al ata h to IEC or its dire tors, emplo e s, s rv nts or a e ts in lu in in ivid al e p rts a d

memb rs of its te h ic l c mmite s a d IEC Natio al Commite s for a y p rs n l injury, pro erty d ma e or

oth r d ma e of a y n ture wh ts e er, wh th r dire t or in ire t, or f or c sts (in lu in le al fe s) a d

e p n e arisin o t of th p blc tio , u e o or rela c u o , this IEC Pu lc tio or a y oth r IEC

Pu lc tio s

8) Ate tio is drawn to th Normativ refere c s cite in this p blc tio Us of th refere c d p blc tio s is

in is e s ble for th c r e t a plc tio of this p blc tio

9) Ate tio is drawn to th p s ibi ty th t s me of th eleme ts of this IEC Pu lc tio ma b th s bje t of

p te t rig ts IEC s al n t b h ld re p n ible f or id ntifyin a y or al s c p te t rig ts

International Stan ard IEC 6 4 4-8 has b en pre ared by tec nical commite 51: Mag etic

comp nents an fer ite materials

The text of this standard is b sed on the f ol owin doc ments:

Ful inf ormation on the votin f or the a proval of this stan ard can b foun in the re ort on

votin in icated in the a ove ta le

This publ cation has b en draf ted in ac ordan e with the ISO/IEC Directives, Part 2

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A lst of al p rts in the IEC 6 4 4 series, publ s ed u der the general title Ferite c res –

Guid el i es o t he limits of sura e ire ul arities, can b f ou d on the IEC we site

Future stan ard in this series wi car y the new general title as cited a ove Titles of existin

stan ard in this series wi b updated at the time of the next edition

The commit e has decided that the contents of this publ cation wi remain u c an ed u ti

the sta i ty date in icated on the IEC we site u der "ht p:/we store.iec.c " in the data

related to the sp cific publ cation At this date, the publ cation wi b

• re laced by a revised edition, or

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FERRITE CORES –

This p rt of IEC 6 4 4 gives g idan e on al owa le l mits of s rf ace ir eg larities a pl ca le

to PQ-cores in ac ordan e with the relevant generic sp cif i ation

This stan ard is con idered as a sectional sp cif i ation u eful in the negotiation b twe n

f er ite core man facturers an u ers a out s r ace ir eg larities

The f ol owin doc ments, in whole or in p rt, are normatively referen ed in this doc ment an

are in isp n a le f or its a pl cation For dated ref eren es, only the edition cited a ples For

u dated referen es, the latest edition of the referen ed doc ment (in lu in an

amen ments) a pl es

IEC 6 4 1-1, Terms a d n me clature for c res mad e of ma n tic ll soft fer ites – Part 1:

Terms used for p ysic l irre ul arities

IEC 6 4 4-1, F er ite c res – Guid e o th limits of sura e ire ul arities – Part 1: Ge eral

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4 Limits of surf ace ir egularities

4.1.1 Chips a d ra ge e g s loc te on the mating s rfa e

The are s of the c ips located on the matin s r ace (se C1 an C1’ ir eg larities in Fig re 2)

s al not ex e d the fol owin l mits:

– the c mulative are of the c ips located on the matin s r ace s al b les than 4 % of

the total matin s race;

– the c mulative are of the c ips located on the centre p st matin s r ace s al b les

than 2 % of the total matin s race;

– the c mulative are of the c ips located on the matin s race of one outer leg s al b

les than 1 % of the total matin s rf ace;

The total len th of the rag ed ed es s al b les than 2 % of the p rimeter of the relevant

– the rule for the rag ed ed es is the same as f or the matin s rf aces;

– c ips an rag ed ed es are not ac e ta le on the in er ed es of the wire slot are

Figure 2 – Chips a d ra ge e ge loc tion

The l mits of al owa le c ip in are s s al b in ac ordan e with Ta le 1

IE C

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Table 1 – Limits for al owable c ipping are s

NOT For th rele a t c re siz s ref er to IEC 6 317- 3

The are an len th ref eren e of ir eg larities for vis al in p ction are given in Ta le 2

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Table 2 – Are a d le gth refere c of ir e ularitie f or vis al inspe tion

IE C

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4.2 Cra k

Fig re 3 s ows examples of crac s location on PQ-cores:

– a sin le crac whic intersects the p rimeter of the relevant s rf ace at two p ints is not

ac e ta le (se S1 in Fig re 3);

– the n mb r of the crac s located on the same s rf ace s al not ex e d 3

The l mits of crac s at variou location s own in Fig re 3 are given in Ta le 3

F Ce tre p st diameter

Fig re 4 – Ref ere c dime sions for PQ-core

IEC

IE C

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Table 3 – Limits for cra ks

T pea

Fig re 5 s ows an example of a pul -out location on the PQ-core

The c mulative are of the pul -out located on the b tom s r ace s al b les than 2 % of

the total resp ctive s race are

Figure 5 – Pul -out loc tion

Fig re 6 s ows an example of cry tal tes location on the PQ-core:

– the sin le are of the cry tal tes located on an s r ace s al b les than 2 % of the

resp ctive s race are ;

– the c mulative are of the cry tal tes located on an s r ace s al b les than 4 % of the

resp ctive s r ace are

IE C

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Figure 6 – Cry tal te loc tion

Fig re 7 s ows an example of flas location on the PQ-core:

– with c amferin arou d the b c s r ace, the f las heig t s al not ex e d the b c

s race of the core;

– without c amferin arou d the b c s r ace, the flas is not ac e ta le

Figure 7 – Fla h loc tion

Fig re 8 s ows an example of p res location on the PQ-core:

– the n mb r of p res located on the same s rf ace s al not ex e d 2; the total n mb r of

p res located on al s rf aces s al not ex e d 5;

– a hole with an are larger than 1 mm

2

on an s race is not ac e ta le

IEC IEC

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Figure 8 – Pore loc tion

IE C

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Bibl ogr aphy

IEC 6 4 1-2, Terms a d n me cl at ure for c res mad e of ma n tic l l soft ferit es – Part 2:

IEC 6 317-13, Fer it e c res – Dime sions – Part 13: P Q-c res for use in p wer su ply

a p c t io s

_ _ _ _ _ _

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1 Domaine d'a pl cation 17

2 Réf éren es normatives 17

3 Termes et déf i ition 17

4 Limites des ir ég larités de s rf ace 18

4.1 Eclats et an les é réc és 18

4.1.1 Eclats et an les é réc és situés s r la s race de contact 1

8 4.1.2 Eclats situés s r d'autres s races 18 4.2 Fis ures 21

4.3 Col age 2

4.4 Cristal tes 2

4.5 Bav res 2

4.6 Pores 2

Biblogra hie 2

Fig re 1 – Exemples d'r ég larités de s race 18 Fig re 2 – Emplacements des éclats et des an les é réc és 19 Fig re 3 – Emplacements des fis ures 21

Fig re 4 – Dimen ion de référen e des noyau PQ 21

Fig re 5 – Emplacements des col ages 2

Fig re 6 – Emplacements des cristal tes 2

Fig re 7 – Emplacements des b v res 2

Fig re 8 – Emplacements des p res 2

Ta le u 1 – Limites des s races admis ibles des éclats 19 Ta le u 2 – Surf aces et lon ueurs de réf éren e des ir ég larités p ur l n p ction vis el e 2

Ta le u 3 – Limites p ur les fis ures 2

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