Optical components, such as wavelength division multiplexers WDMs and tap monitors, add capacity and increase reliability with minimal installation cost and time.. Wavelength division mu
Trang 1ADC’s Value-Added Module (VAM) System provides the flexibility and functionality to easily
incorporate optical components into the network Optical components, such as wavelength division multiplexers (WDMs) and tap monitors, add capacity and increase reliability with minimal installation cost and time Wavelength division multiplexers enable the service providers to double the capacity
of the existing network without installing new fiber; tap monitors provide easy access to the network for testing and monitoring without interruption of service
While the most common usage of the VAM is in the central office, these same components can be used successfully in the outside plant environment For example, remote locations with minimal fiber capacity can be connected through an OSP VAM application, eliminating the need to dig and install new fiber Below is a sketch of (two) remote locations connected to a central office using ADC’s FSS96 below ground cross-connect enclosure
Provide Faster Service Delivery
Central Office
VAM, in an
FDF, NGF or
OMX ™ Frame
The VAM protects
the WDM devices
required to
mux/demux the
signals to/from the
remote locations
Outside Plant
WDM in an FSS96 Cross-Connect Enclosure muxes the signals for transport
on a single fiber to the CO and demuxes the signals to be routed to the correct location
Remote location
1310 nm Signal
Remote location
1550 nm Signal
1310/1550 combined on existing fiber
Outside Plant
Below Ground or Above Ground Cross-Connect Cabinet Examples:
ACE-200, ACE-400
or BGX cabinets
90%-98% of the signal passed to CO, subscriber, or handoff
2%-10% of the signal available for non-intrusive testing
Signal from CO
or handoff
The VAM housing protects the component from mechanical damage; however, the component itself
is well-suited for the outside plant environment Splitters and WDM components require no
electronics and they are rated for severe environments from -40°C to +85°C with a relative humidity less than 80% Tap monitors have the same environmental rating; however they are suited for environments where network support personnel need easy, non-intrusive access to the network Tap monitors increase the ability to monitor and test the network at the edge of the network or in remote locations The sketch below shows a tap monitor application in an outside plant
environment
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Value-Added Modules in the Outside Plant Environment
FSS Cross-Connect Enclosure
VAMs can be deployed in all ADC outside plant enclosures In the FSS cross-connect enclosure, the
VAM is installed where the splice trays would normally be mounted They can be added
incrementally in the field as additional service is required The FSS cross-connect enclosure houses a combination of splice trays and VAMs and should be ordered as a fully configured system that
includes pigtails, splice trays, VAMs and cable termination/blocking kits per customer specification
Please contact ADC technical support to configure the FSS cross-connect enclosure when optical
components are added to increase the functionality of the enclosure
1
2 4
6
Figure 1 FSS-WH2U2UAA1A Shown with (6) VAMs Note that #2 VAM
is shown without pigtails Pigtails are
numbered on connector boots for easy
identification when optical components
are housed inside.
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Above Ground and Below Ground Cross-Connect Enclosures
The VAM housing is installed in a chassis when used in the above or below ground cabinets The
VAM is available in a “single-high” or “dual-high” housing A single-high VAM has (6) front ports
for easy access to the optical components inside A single-high VAM will house (2) WDM devices, (2) tap monitors or (1) 1x4 splitter A dual-high VAM provides up to (18) ports for a combination of
optical components or a 1x32 splitter Both the single-high and dual-high VAM feature the
removable retainer for easy access to the internal connectors
The outside plant cabinets are designed to house either of the following chassis:
• 4" high x 19" wide chassis, Catalog # OSP-MINSPI (See Figure 2)
• 7" high x 19" wide chassis, Catalog # OSP-STDSPI (See Figure 3 for ACE-200 example)
Figure 3 OSP-STDSPI Chassis Shown in an ACE-200 Above Ground Cross-Connect Enclosure shown with the door open
Figure 2 OSP-MINSPI Chassis Capacity:
(6) – Single-high VAMs (2) – Dual-high VAMs
30"
(76.2 cm)
51"
(129.54 cm)
19.0"
(48.26 cm)
4.0"
(10.16 cm)
Trang 4ADC Telecommunications, Inc., P.O Box 1101, Minneapolis, Minnesota USA 55440-1101
Specifications published here are current as of the date of publication of this document Because we are continuously improving our products, ADC reserves the right to change specifications without prior notice At any time, you may verify product specifications by contacting our headquarters office in Minneapolis ADC Telecommunications, Inc views its patent portfolio as an important corporate asset and vigorously enforces its patents.