Sample Thermal-Stress Analysis of a Thick-walled Cylinder Batch or Command Method .... Sample Electrostatic Actuated Beam Analysis Batch or Command Method .... Sample Miniature Clamped-C
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Trang 51 Coupled-Field Analyses 1–1
1.1 Types of Coupled-Field Analysis 1–11.1.1 Sequential Method 1–21.1.1.1 Sequentially Coupled Analysis - Physics Files 1–21.1.1.2 Sequential Coupled Analysis - ANSYS Multi-field solver 1–21.1.1.3 Sequentially Coupled Analysis - Unidirectional ANSYS to CFX Load Transfer 1–21.1.2 Direct Method 1–31.1.3 When to Use Direct vs Sequential 1–31.1.4 Miscellaneous Analysis Methods 1–31.1.4.1 Reduced Order Modeling 1–31.1.4.2 Coupled Physics Circuit Simulation 1–31.2 System of Units 1–31.3 About GUI Paths and Command Syntax 1–8
2 Sequentially Coupled Physics Analysis 2–1
2.1 What Is a Physics Environment? 2–22.2 General Analysis Procedures 2–22.3 Transferring Loads Between Physics 2–52.3.1 Compatible Element Types 2–52.3.2 Types of Results Files You May Use 2–72.3.3 Transient Fluid-Structural Analyses 2–72.4 Performing a Sequentially Coupled Physics Analysis with Physics Environments 2–82.4.1 Mesh Updating 2–92.4.2 Restarting an Analysis Using a Physics Environment Approach 2–122.5 Example Thermal-Stress Analysis Using the Indirect Method 2–122.5.1 The Problem Described 2–122.6 Example Thermal-Stress Analysis Using Physics Environments 2–142.7 Example Fluid-Structural Analysis Using Physics Environments 2–172.7.1 The Problem Described 2–172.7.2 The Procedure 2–172.7.2.1 Build the Model 2–182.7.2.2 Create Fluid Physics Environment 2–182.7.2.3 Create Structural Physics Environment 2–202.7.2.4 Fluid/Structure Solution Loop 2–212.7.3 Results 2–222.8 Example Induction-heating Analysis Using Physics Environments 2–282.8.1 The Problem Described 2–282.8.2 The Procedure 2–282.8.2.1 Step 1: Develop Attribute Relationship 2–292.8.2.2 Step2: Build the Model 2–302.8.2.3 Step 3: Create Electromagnetic Physics Environment 2–302.8.2.4 Step 4: Create Thermal Physics Environment 2–302.8.2.5 Step 5: Write Thermal Physics Environment 2–312.8.2.6 Step 6: Prepare DO Loop 2–312.8.2.7 Step 7: Repeat Prior Step 2–322.8.2.8 Step 8: Postprocess Results 2–322.8.2.9 Command Input Listing 2–322.8.2.10 Results 2–34
3 The ANSYS Multi-field (TM) Solver - MFS Single-Code Coupling 3–1
3.1 The ANSYS Multi-field solver and Solution Algorithm 3–23.1.1 Load Transfer 3–2
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Trang 63.1.2 Mapping 3–73.1.2.1 Mapping Algorithms 3–73.1.2.2 Mapping Diagnostics 3–93.1.2.3 Mapping Operations 3–103.1.3 Coupled Field Loads 3–103.1.4 Elements Supported 3–123.1.5 Solution Algorithm 3–133.2 ANSYS Multi-field solver Solution Procedure 3–143.2.1 Set up Field Models 3–143.2.2 Flag Field Interface Conditions 3–143.2.3 Set up Field Solutions 3–143.2.3.1 Define Fields and Capture Field Solutions 3–153.2.3.2 Set up Interface Load Transfers 3–163.2.3.3 Set up Global Field Solution 3–173.2.3.4 Set up Stagger Solution 3–183.2.3.5 Set up Time and Frequency Controls 3–193.2.3.6 Set up Morphing (if necessary) 3–203.2.3.7 Clear or List Settings 3–213.2.4 Obtain the solution 3–213.2.5 Postprocess the Results 3–223.3 Sample Thermal-Stress Analysis of a Thick-walled Cylinder (Batch or Command Method) 3–233.3.1 Problem Description 3–233.3.2 Results 3–243.3.3 Command Listing 3–263.4 Sample Electrostatic Actuated Beam Analysis (Batch or Command Method) 3–283.4.1 Problem Description 3–283.4.2 Results 3–293.4.3 Command Listing 3–323.5 Sample Induction-Heating Analysis of a Circular Billet 3–343.5.1 Problem Description 3–343.5.2 Results 3–363.5.3 Command Listing 3–38
4 Multi-field Analysis Using Code Coupling 4–1
4.1 How MFX Works 4–24.1.1 Synchronization Points and Load Transfer 4–34.1.2 Elements and Load Types Supported 4–34.1.3 Solution Process 4–44.2 MFX Solution Procedure 4–44.2.1 Set Up ANSYS and CFX Models 4–54.2.2 Flag Field Interface Conditions 4–54.2.3 Set Up Master Input 4–54.2.3.1 Set Up Global MFX Controls 4–54.2.3.2 Set Up Interface Load Transfer 4–74.2.3.3 Set Up Time Controls 4–84.2.3.4 Set Up Mapping Operations 4–94.2.3.5 Set Up Stagger Solution 4–94.2.3.6 List or Clear Settings 4–104.2.4 Obtain the Solution 4–114.2.5 Multi-field Commands 4–114.2.6 Postprocess the Results 4–124.3 Starting and Stopping an MFX Analysis 4–124.3.1 Starting an MFX Analysis via the Launcher 4–12
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Trang 74.3.1.1 Other Settings 4–134.3.2 Starting an MFX Analysis via the Command Line 4–144.3.3 Stopping an MFX Run Manually 4–144.4 Example Simulation of a Piezoelectric Actuated Micro-Pump 4–154.4.1 Problem Description 4–154.4.2 Set Up the Piezoelectric and Fluid Inputs 4–164.4.3 Set up the CFX Model and Create the CFX Definition File 4–174.4.4 Set Up the MFX Controls 4–194.4.5 Run the Example from the ANSYS Launcher 4–20
5 Unidirectional ANSYS to CFX Load Transfer 5–1
5.1 The Unidirectional Load Transfer Method 5–15.2 Sample Unidirectional Load Transfer Analysis 5–25.2.1 ANSYS Command Listings 5–25.2.1.1 Solve Solid Analysis and Write Profile File 5–25.2.1.2 Generate and Write Fluid Region Mesh 5–35.2.1.3 Generate and Write Solid Region Mesh 5–55.2.2 CFX Procedure 5–6
6 Reduced Order Modeling 6–1
6.1 Model Preparation 6–26.1.1 Build the Solid Model 6–36.1.2 Mesh the Model 6–36.1.3 Create Structural Physics File 6–36.1.4 Create Electrostatic Physics File 6–46.1.5 Save Model Database 6–46.2 Generation Pass 6–46.2.1 Specify Generation Pass Jobname 6–66.2.2 Assign ROM Features 6–66.2.3 Assign Names for Conductor Pairs 6–66.2.4 Specify ROM Master Nodes 6–66.2.5 Run Static Analysis for Test Load and Extract Neutral Plane Displacements 6–76.2.6 Run Static Analysis for Element Loads and Extract Neutral Plane Displacements 6–76.2.7 Perform Modal Analysis and Extract Neutral Plane Eigenvectors 6–76.2.8 Select Modes for ROM 6–86.2.9 Modify Modes for ROM 6–86.2.10 List Mode Specifications 6–96.2.11 Save ROM Database 6–96.2.12 Run Sample Point Generation 6–96.2.13 Specify Polynomial Order 6–106.2.14 Define ROM Response Surface 6–106.2.15 Perform Fitting Procedure 6–106.2.16 Plot Response Surface 6–116.2.17 List Status of Response Surface 6–116.2.18 Export ROM Model to External System Simulator 6–116.3 Use Pass 6–116.3.1 Clear Database 6–126.3.2 Define a Jobname 6–126.3.3 Resume ROM Database 6–136.3.4 Define Element Type 6–136.3.5 Define Nodes 6–136.3.6 Activate ROM Database 6–146.3.7 Define Node Connectivity 6–146.3.8 Define Other Model Entities 6–14
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Trang 86.3.9 Using Gap Elements with ROM144 6–156.3.10 Apply Loads 6–156.3.11 Specify Solution Options 6–166.3.12 Run ROM Use Pass 6–166.3.13 Review Results 6–166.4 Expansion Pass 6–166.4.1 Clear Database 6–186.4.2 Define a Jobname 6–186.4.3 Resume ROM 6–186.4.4 Resume Model Database 6–186.4.5 Activate ROM Database 6–186.4.6 Perform Expansion Pass 6–196.4.7 Review Results 6–196.5 Sample Miniature Clamped-Clamped Beam Analysis (Batch or Command Method) 6–196.5.1 Problem Description 6–196.5.2 Program Listings 6–206.6 Sample Micro Mirror Analysis (Batch or Command Method) 6–256.6.1 Problem Description 6–256.6.2 Program Listings 6–26
7 Direct Coupled-Field Analysis 7–1
7.1 Lumped Electric Elements 7–37.2 Thermal-Electric Analysis 7–47.2.1 Elements Used in a Thermal-Electric Analysis 7–47.2.2 Performing a Thermal-Electric Analysis 7–57.3 Piezoelectric Analysis 7–57.3.1 Points to Remember 7–67.3.2 Material Properties 7–77.3.2.1 Permittivity Matrix (Dielectric Constants) 7–77.3.2.2 Piezoelectric Matrix 7–77.3.2.3 Elastic Coefficient Matrix 7–87.4 Piezoresistive Analysis 7–97.4.1 Points to Remember 7–97.4.2 Material Properties 7–107.4.2.1 Electrical Resistivity 7–107.4.2.2 Elastic Coefficient Matrix 7–107.4.2.3 Piezoresistive Matrix 7–107.5 Structural-Thermal Analysis 7–117.5.1 Elements Used in a Structural-Thermal Analysis 7–117.5.2 Performing a Structural-Thermal Analysis 7–127.6 Structural-Thermal-Electric Analyses 7–137.6.1 Structural-Thermoelectric Analysis 7–147.6.2 Thermal-Piezoelectric Analysis 7–147.7 Magneto-Structural Analysis 7–147.7.1 Points to Remember 7–157.8 Electromechanical Analysis 7–157.8.1 The 1-D Transducer Element 7–157.8.1.1 Element Physics 7–167.8.1.2 A Reduced Order Model 7–167.8.1.3 Static Analysis 7–177.8.1.4 Modal Analysis 7–197.8.1.5 Harmonic Analysis 7–207.8.1.6 Transient Analysis 7–20
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Trang 97.8.1.7 Electromechanical Circuit Simulation 7–207.8.2 The 2-D Transducer Element 7–207.8.2.1 Element Physics 7–217.8.2.2 Static Analysis 7–227.8.2.3 Transient Analysis 7–227.8.2.4 Problem Analysis 7–227.8.2.4.1 Under-Constrained Model 7–237.8.2.4.2 Bifurcation, Buckling, or Pulling In 7–237.8.2.4.3 Post-Buckling or Release 7–237.8.2.4.4 Dynamic Pull-in and Release or Hysteresis 7–237.8.2.4.5 Unconverged Solution with Decreasing Convergence Norm 7–237.8.2.4.6 Coarse Mesh and Convergence Norm Diverges 7–237.9 Sample Thermoelectric Cooler Analysis (Batch or Command Method) 7–247.9.1 Problem Description 7–247.9.2 Expected Results 7–267.9.3 Command Listing 7–277.10 Sample Thermoelectric Generator Analysis (Batch or Command Method) 7–297.10.1 Problem Description 7–297.10.2 Expected Results 7–327.10.3 Command Listing 7–327.11 Sample Structural-Thermal Harmonic Analysis (Batch or Command Method) 7–357.11.1 Problem Description 7–367.11.2 Expected Results 7–367.11.3 Command Listing 7–377.12 Sample Electro-Thermal Microactuator Analysis (Batch or Command Method) 7–397.12.1 Problem Description 7–397.12.2 Results 7–407.12.3 Command Listing 7–427.13 Sample Piezoelectric Analysis (Batch or Command Method) 7–447.13.1 Problem Description 7–447.13.2 Problem Specifications 7–457.13.3 Results 7–457.13.4 Command Listing 7–467.14 Sample Piezoresistive Analysis (Batch or Command Method) 7–487.14.1 Problem Description 7–487.14.2 Problem Specification 7–497.14.3 Results 7–507.14.4 Command Listing 7–507.15 Sample Electromechanical Analysis (Batch or Command Method) 7–527.15.1 Problem Description 7–537.15.2 Expected Results 7–537.15.2.1 Static Analysis 7–537.15.2.2 Modal Analysis 7–537.15.2.3 Harmonic Analysis 7–547.15.2.4 Displays 7–547.15.3 Building and Solving the Model 7–557.16 Sample Electromechanical Transient Analysis (Batch or Command Method) 7–567.16.1 Results 7–577.16.2 Command Listing 7–577.17 Sample Electromechanical Hysteresis Analysis (Batch or Command Method) 7–587.17.1 Problem Specifications 7–587.17.2 Results 7–58
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Trang 107.17.3 Command Listing 7–597.18 Sample Electromechanical Comb Finger Analysis (Batch or Command Method) 7–637.18.1 Problem Specifications 7–637.18.2 Results 7–637.18.3 Command Listing 7–647.19 Sample Force Calculation of Two Opposite Electrodes (Batch or Command Method) 7–677.19.1 Problem Specifications 7–677.19.2 Results 7–677.19.3 Command Listing 7–687.20 Where to Find Other Examples 7–70
8 Coupled Physics Circuit Simulation 8–1
8.1 Electromagnetic-Circuit Simulation 8–18.1.1 2-D Circuit Coupled Stranded Coil 8–28.1.2 2-D Circuit Coupled Massive Conductor 8–38.1.3 3-D Circuit Coupled Stranded Coil 8–38.1.4 3-D Circuit Coupled Massive Conductor 8–48.1.5 3-D Circuit Coupled Solid Source Conductor 8–68.1.6 Taking Advantage of Symmetry 8–78.1.7 Series Connected Conductors 8–88.2 Electromechanical-Circuit Simulation 8–98.3 Piezoelectric-Circuit Simulation 8–108.4 Sample Electromechanical-Circuit Analysis 8–138.4.1 Problem Description 8–138.4.2 Results 8–158.4.3 Command Listing 8–158.5 Sample Piezoelectric-Circuit Analysis (Batch or Command Method) 8–168.5.1 Problem Description 8–168.5.2 Problem Specifications 8–178.5.3 Equivalent Electric Circuits (Reduced Order Model) 8–188.5.4 Results 8–198.5.5 Command Listing 8–20Index Index–1
List of Figures
2.1 Data Flow for a Sequential Coupled-Field Analysis 2–32.2 Data Flow for a Sequentially Coupled Physics Analysis (Using Physics Environments) 2–42.3 Beam Above Ground Plane 2–92.4 Area Model of Beam and Air Region 2–112.5 Area Model of Beam and Multiple Air Regions 2–112.6 Stress Profile Across Material Discontinuity 2–162.7 Radial Stress Displayed on Geometry 2–172.8 Diagram of a Channel Obstruction Analysis 2–182.9 Nominal Fluid Physics Boundary Conditions 2–192.10 Nominal Structural Physics Boundary Conditions 2–202.11 Streamlines Near Gasket 2–222.12 Pressure Contours 2–232.13 von Mises Stress in Gasket 2–232.14 Axisymmetric 1-D Slice of the Induction Heating Domain 2–282.15 Solution Flow Diagram 2–292.16 Nominal Electromagnetic Physics Boundary Conditions 2–30
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Trang 112.17 Nominal Thermal Physics Boundary Conditions 2–312.18 Temperature Response of Solid Cylinder Billet 2–353.1 Profile Preserving Interpolation 3–33.2 Globally Conservative Interpolation 3–33.3 Profile Preserving Interpolation - Load Imbalances 3–43.4 Globally Conservative Interpolation - Load Balance 3–43.5 Profile Preserving Interpolation - Coarse Mesh on the Sending Side 3–53.6 Profile Preserving Interpolation - Coarse Mesh on the Receiver Side 3–53.7 Globally Conservative Interpolation - Fine Mesh on Sending Side 3–63.8 Globally Conservative Interpolation - Fine Mesh on Receiver Side 3–63.9 Three Lower Order Elements 3–63.10 Six Lower Order Elements 3–73.11 Fluid-Solid Interaction Load Transfer 3–73.12 Node Mapped to Minimize Gap 3–83.13 Node Mapped to Closest Node 3–83.14 Node in Box 3 with Three Elements 3–93.15 Nine boxes and Node in Empty Box 3–93.16 Improperly Mapped Nodes 3–103.17 ANSYS Multi-field solver Algorithm 3–133.18 Time Steps 3–203.19 Thermal and Structural Model Mesh 3–243.20 Temperature Profile and Axial Stress 3–253.21 Structural and Electrostatic Field Mesh 3–293.22 Beam Displacement for 120 Volt Load 3–303.23 Electrostatic Field 3–313.24 Mid-span Beam Deflection vs Voltage 3–323.25 Axisymmetric 1-D Slice of the Induction Heating Domain 3–353.26 Nominal Electromagnetic Physics Boundary Conditions 3–353.27 Nominal Thermal Physics Boundary Conditions 3–353.28 ANSYS Multi-field solver Flow Chart for Induction Heating 3–363.29 Centerline and Surface Temperature 3–373.30 Temperature Profile at 3 Seconds 3–384.1 MFX Method Data Communication 4–34.2 ANSYS Multi-field solver Process 4–44.3 ANSYS and CFX Fields Solved Simultaneously 4–64.4 ANSYS and CFX Fields Solved Sequentially, ANSYS First 4–74.5 Piezoelectric Micropump Description 4–154.6 Model Dimensions 4–164.7 Model Boundary Conditions 4–164.8 Vertical Displacement of the Silicon Membrane's Center Point 4–214.9 von Mises Stress Distribution 4–224.10 Air Streamline Velocity 4–236.1 ROM Flowchart 6–16.2 Model Preparation Flowchart 6–26.3 Generation Pass Flowchart 6–56.4 Use Pass Flowchart 6–126.5 ROM144 and Attached Elements 6–146.6 Data Flow 6–176.7 Expansion Pass Flowchart 6–186.8 Clamped-Clamped Beam with Fixed Ground Conductor 6–196.9 Finite Element Model of the Structural and Electrostatic Domains 6–206.10 Schematic View of a Micro Mirror Array and a Single Mirror Cell 6–25
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Trang 126.11 Parameter Set for Geometrical Dimensions of the Mirror Cell 6–266.12 Modal Amplitudes vs Voltage 6–326.13 Master Displacements vs Voltage 6–326.14 Modal Amplitude of Mode 1 vs High Polarization Voltage 6–346.15 Modal Amplitude of Mode 3 vs High Polarization Voltage 6–356.16 Capacitances CAP12 and CAP13 vs High Polarization Voltage 6–366.17 Capacitance CAP23 vs High Polarization Voltage 6–376.18 Expanded Displacements for Acceleration Load 6–396.19 Expanded Displacements for Pressure Load 6–406.20 Harmonic Transfer Function Amplitude for 800 V Polarization Voltage 6–416.21 Harmonic Transfer Function Phase Angle for 800 V Polarization Voltage 6–426.22 Modal Amplitudes vs Time at Saw Tooth Like Voltage Function 6–447.1 Procedure for Extracting Capacitance 7–167.2 Reduced Order Model 7–177.3 Micromirror Model 7–177.4 Electromechanical Hysteresis 7–187.5 Static Stability Characteristics 7–197.6 Thermoelectric Cooler 7–247.7 Finite Element Model 7–267.8 Temperature Distribution 7–277.9 Thermoelectric Generator 7–297.10 Temperature Dependent Material Properties 7–317.11 Clamped-clamped Beam 7–367.12 Frequency Dependence of Thermoelastic Damping in a Silicon Beam 7–377.13 Microactuator Model 7–407.14 Microactuator Displacements 7–417.15 Microactuator Temperatures 7–417.16 Piezoelectric Bimorph Beam 7–457.17 Four-Terminal Sensor 7–497.18 Finite Element Model 7–507.19 Electrostatic Parallel Plate Drive Connected to a Silicon Beam 7–537.20 Elements of MEMS Example Problem 7–547.21 Lowest Eigenvalue Mode Shape for MEMS Example Problem 7–547.22 Mid Span Beam Deflection for MEMS Example Problem 7–557.23 Potential Distribution on Deformed Comb Drive 7–647.24 Potential Distribution of Overlapping Electrodes 7–688.1 2-D Circuit Coupled Stranded Coil 8–28.2 2-D Circuit Coupled Massive Conductor 8–38.3 3-D Circuit Coupled Stranded Coil 8–48.4 3-D Circuit Coupled Massive Conductor 8–58.5 3-D Circuit Coupled Solid Source Conductor 8–68.6 Circuit for Go and Return Conductors 8–78.7 Series Wound Stranded Conductor 8–88.8 CIRCU94 Components 8–118.9 Electrical Circuit Connections 8–128.10 Electrostatic Transducer - Resonator Model 8–138.11 Excitation Voltages 8–148.12 Mechanical Resonator Displacement (at Node 2) 8–158.13 Piezoelectric Circuit 8–178.14 Equivalent Circuit -Transient Analysis 8–188.15 Equivalent Circuit - Harmonic Analysis at ith Piezoelectric Resonance 8–198.16 Equivalent Circuit - Harmonic Analysis Near the 3rd Piezoelectric Resonance 8–19
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Trang 138.17 Harmonic Analysis Results 8–20
List of Tables
1.1 Mechanical Conversion Factors for MKS to µMKSV 1–41.2 Thermal Conversion Factors for MKS to µMKSV 1–41.3 Electrical Conversion Factors for MKS to µMKSV 1–41.4 Magnetic Conversion Factors for MKS to µMKSV 1–51.5 Piezoelectric Conversion Factors for MKS to µMKSV 1–51.6 Piezoresistive Conversion Factors for MKS to µMKSV 1–51.7 Thermoelectric Conversion Factors for MKS to µMKSV 1–61.8 Mechanical Conversion Factors for MKS to µMSVfA 1–61.9 Thermal Conversion Factors for MKS to µMSVfA 1–61.10 Electrical Conversion Factors for MKS to µMSVfA 1–71.11 Magnetic Conversion Factors for MKS to µMKSVfA 1–71.12 Piezoelectric Conversion Factors for MKS to µMKSVfA 1–71.13 Piezoresistive Conversion Factors for MKS to µMKSVfA 1–81.14 Thermoelectric Conversion Factors for MKS to µMKSVfA 1–82.1 How Results Transferred by LDREAD Become Loads 2–52.2 Compatible Element Types Across Physics Environments 2–62.3 Physics Environment Attributes 2–182.4 Fluid Physics Environment 2–192.5 Structural Physics Environment 2–202.6 Physics Environment Attributes 2–292.7 Electromagnetic Physics Environment 2–302.8 Thermal Physics Environment 2–303.1 Load Transfer Between Fields 3–103.2 Structural and Thermal Elements 3–123.3 Electromagnetic, Fluid, and Coupled-Field Elements 3–123.4 Hoop and Axial Stress Variation 3–266.1 ROM144 Loads 6–157.1 Coupled-Field Elements 7–17.2 Coupling Methods Used in Direct Coupled-Field Analyses 7–27.3 Elements Used in Thermal-Electric Analyses 7–47.4 Elements Used in Structural-Thermal Analyses 7–117.5 Units for Thermal Quantities 7–137.6 Elements Used in a Structural-Thermal-Electric Analyses 7–137.7 Methods of Analyzing Electromechanical Coupling 7–207.8 Material Properties 7–257.9 Thermoelectric Cooler Results 7–267.10 Semiconductor Element Dimensions 7–297.11 Material Properties 7–307.12 Results Using Material Properties at Average Temperature 7–327.13 Results Considering Material Temperature Dependence 7–327.14 Material Properties 7–367.15 Electrode 1-5 Voltages 7–467.16 Electrode 6-10 Voltages 7–467.17 Sensing Element Output Voltage 7–507.18 Initial Values and Expected Results 7–577.19 Initial Values 7–587.20 Expected Results 7–59
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Trang 147.21 Initial Values 7–638.1 Piezoelectric Circuit Element Output Data 8–128.2 Transient Analysis Results 8–19
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