1. Trang chủ
  2. » Kỹ Thuật - Công Nghệ

Advanced Microwave Circuits and Systems Part 7 docx

35 368 0
Tài liệu đã được kiểm tra trùng lặp

Đang tải... (xem toàn văn)

Tài liệu hạn chế xem trước, để xem đầy đủ mời bạn chọn Tải xuống

THÔNG TIN TÀI LIỆU

Thông tin cơ bản

Tiêu đề Advanced Microwave Circuits and Systems
Trường học University
Chuyên ngành Microwave Circuits and Systems
Thể loại Thesis
Định dạng
Số trang 35
Dung lượng 2,79 MB

Các công cụ chuyển đổi và chỉnh sửa cho tài liệu này

Nội dung

As one of appropriate solving the problem of generation of the high power terahertz radiation we proposed Arzhannikov et al., 2006 to use a two-stage scheme of generation of short wavele

Trang 2

If the transistors size are the same, we can assume that gm1 gm2  gm and CgsCds

for microwave range in simplified calculation with small dimension device [12] The Eq (2)

becomes as following:

2 Z

where, Rais the real part and Cais the imaginary part, respectively And the parameters of

active device are represented in Fig 7

Fig 7 Parallel LC oscillator model

When the parasitic is ignored, the traditional negative resistance of the input port is indicated by -2 /gm Although the complementary topology has more devices than the NMOS pair, the differential voltage swing is larger for the same current consumption resulting in reduce phase noise The M1 ~ M4 transistors of a complementary cross-coupled pair are shown in Fig 4, which yield 2 / / 2

2.3.2 Switching tail current

The circuit with a tail current can improve the effect of various noise sources and supply sensitivity [11], and some researchers discovered that a square wave cycling a MOS transistor from strong inversion to accumulation reduces its intrinsic 1/f noise [14] Therefore, switched biasing can be useful in many circuits to reduce the up-conversion of noise 1/f [15] The flicker noise from tail current source, especially in MOSFET transistors, makes a great deal of phase noise Gradually switching tail transistors can release trapped electrons in FET channel, which results in decreasing flicker noise Moreover, this technique can not only reduce 1/f noise up-conversion but also save power as well The bias of tail current source was replaced by switched bias without extra DC bias [15] [16] Utilizing the output voltage swing V1, V2 control M5, M6 which is switched turn on The output voltage swing is 1.16~1.18V in Fig 8 In order to determine behavior of the switching, the tail current can't too small If it is too large, the power consumption is increased, so we need to tradeoff switching behavior, power consumption and phase noise

Fig 8 The output voltage swing with switching tail transistors

Trang 3

If the transistors size are the same, we can assume that gm1 gm2  gm and CgsCds

for microwave range in simplified calculation with small dimension device [12] The Eq (2)

becomes as following:

2 Z

where, Rais the real part and Cais the imaginary part, respectively And the parameters of

active device are represented in Fig 7

Fig 7 Parallel LC oscillator model

When the parasitic is ignored, the traditional negative resistance of the input port is indicated by -2 /gm Although the complementary topology has more devices than the NMOS pair, the differential voltage swing is larger for the same current consumption resulting in reduce phase noise The M1 ~ M4 transistors of a complementary cross-coupled pair are shown in Fig 4, which yield 2 / / 2

2.3.2 Switching tail current

The circuit with a tail current can improve the effect of various noise sources and supply sensitivity [11], and some researchers discovered that a square wave cycling a MOS transistor from strong inversion to accumulation reduces its intrinsic 1/f noise [14] Therefore, switched biasing can be useful in many circuits to reduce the up-conversion of noise 1/f [15] The flicker noise from tail current source, especially in MOSFET transistors, makes a great deal of phase noise Gradually switching tail transistors can release trapped electrons in FET channel, which results in decreasing flicker noise Moreover, this technique can not only reduce 1/f noise up-conversion but also save power as well The bias of tail current source was replaced by switched bias without extra DC bias [15] [16] Utilizing the output voltage swing V1, V2 control M5, M6 which is switched turn on The output voltage swing is 1.16~1.18V in Fig 8 In order to determine behavior of the switching, the tail current can't too small If it is too large, the power consumption is increased, so we need to tradeoff switching behavior, power consumption and phase noise

Fig 8 The output voltage swing with switching tail transistors

Trang 4

The comparison of simulated phase noise performance between fixed bias and switched bias

of different tail current topology is shown in Fig 9

Fig 9 Phase noise comparison between fixed bias and switched bias at 5 GHz

2.3.3 LC tank

We establish the simulation parameters of Si-substrate and the circuit models of inductors

The resonating tank causes the current in the tank to be Q times larger Hence the metal

lines connecting the LC tank need to be sufficiently large to withstand the large current [17]

In Fig 10, the quality factor of inductor in this chip is approximately 11 over the working

frequency range The capacitance range of MOS varactor is wider than junction varactor and

the equivalent series resistance of the former is smaller than that of the latter Because using

NMOS varactor that drawback is apt to be disturbed in substrate NMOS capacitor could

not implemented in the separate P-well, so NMOS capacitor has high sensitivity of noise

that induced by substrate than PMOS capacitor In view of this, we adopted PMOS varactor

Fig 10 Inductance and quality factor (Q)

2.3.4 Switching capacitor modules

We usually use band switching techniques to expand the tuning range The gain of VCO (KVCO) can be reduced to improve the phase noise performance Making use of switching capacitor modules, eight frequency channels are able to be selected In order to enable eight channels to connect continually, we design the ratio of the capacitance C2, C1, C0 is 4.45:2.09:1 The S2, S1 and S0, digital pads of the chip, connect digital lines so as to switch different channels The logical high is 1.8V and the logic low is 0V The switching has less power dissipation by using NMOSFET within 0.3 mW in our practical work The whole circuit of switching capacitor modules is shown in Fig 11 Furthermore, the MOS varactor pair tunes the wideband operation within continuous frequency in each channel [18]

Fig 11 A switching capacitor module

2.3.5 Output buffers

The VCO is sensitive to loading effect, and it output oscillation frequency would be changed

by loading variation If we insert the buffer between oscillator and loading, it can isolate between them, and the variation of the loading will not influence oscillator directly

The load of the instrument for measurement is 50Q such as spectrum analyzer Without buffers, the chip cannot directly drive instrument The buffer is shown in Fig 12 [16]

Fig 12 A buffer schematic

Trang 5

Implementation of Low Phase Noise Wide-Band VCO with Digital Switching Capacitors 207

The comparison of simulated phase noise performance between fixed bias and switched bias

of different tail current topology is shown in Fig 9

Fig 9 Phase noise comparison between fixed bias and switched bias at 5 GHz

2.3.3 LC tank

We establish the simulation parameters of Si-substrate and the circuit models of inductors

The resonating tank causes the current in the tank to be Q times larger Hence the metal

lines connecting the LC tank need to be sufficiently large to withstand the large current [17]

In Fig 10, the quality factor of inductor in this chip is approximately 11 over the working

frequency range The capacitance range of MOS varactor is wider than junction varactor and

the equivalent series resistance of the former is smaller than that of the latter Because using

NMOS varactor that drawback is apt to be disturbed in substrate NMOS capacitor could

not implemented in the separate P-well, so NMOS capacitor has high sensitivity of noise

that induced by substrate than PMOS capacitor In view of this, we adopted PMOS varactor

Fig 10 Inductance and quality factor (Q)

2.3.4 Switching capacitor modules

We usually use band switching techniques to expand the tuning range The gain of VCO (KVCO) can be reduced to improve the phase noise performance Making use of switching capacitor modules, eight frequency channels are able to be selected In order to enable eight channels to connect continually, we design the ratio of the capacitance C2, C1, C0 is 4.45:2.09:1 The S2, S1 and S0, digital pads of the chip, connect digital lines so as to switch different channels The logical high is 1.8V and the logic low is 0V The switching has less power dissipation by using NMOSFET within 0.3 mW in our practical work The whole circuit of switching capacitor modules is shown in Fig 11 Furthermore, the MOS varactor pair tunes the wideband operation within continuous frequency in each channel [18]

Fig 11 A switching capacitor module

2.3.5 Output buffers

The VCO is sensitive to loading effect, and it output oscillation frequency would be changed

by loading variation If we insert the buffer between oscillator and loading, it can isolate between them, and the variation of the loading will not influence oscillator directly

The load of the instrument for measurement is 50Q such as spectrum analyzer Without buffers, the chip cannot directly drive instrument The buffer is shown in Fig 12 [16]

Fig 12 A buffer schematic

Trang 6

2.3.6 Devices Size of the Circuit

The devices size of our proposed VCO circuit is shown in Table 1, the devices size that we

take an optimization to achieve maximize quality factor and generate a negative resistance

enough to oscillation, they improve the performance of this proposed VCO

3 Experimental results

3.1 Measurement setup

A.Agilent E3631A is used as a DC source for digital switching High/Low

B Agilent E5052A is used as signal source analyzer and DC sources for DC supply and

tuning voltage

C.The photo of chip with pads is shown in Fig 13(a)

D Above a gold plated FR4 PCB is glued the chip which is bonded aluminum wires, shown

in Fig 13(b)

E The differential outputs of PCB connect a Bias-Tee on each side and then connect two

loads, Agilent E5052A and 50Q, shown in Fig 13(c)

F The wires which connect to instruments are shielded well and properly matched

Fig 13 Measurement setup (a) Die photo (b) Bonding on PCB (c) PCB Measurement

3.2 Measurement result

A When switching channel is set for S SiS  = "100", DC supply at 1.8V, tuning voltage from

-0.5V to 1.8V, Fig 13 shows that the frequency range, the magnitude of carrier and the current from supply in different value of tuning voltage From Fig 14, we know that MOS varactor pair is able to adjust 0.24 GHz and the magnitude of carrier is -5.97 dBm at 1.15V tuning voltage

B Fig 15 shows phase noise, -128 dBc/Hz with 1 MHz offset at 4.13 GHz when switching channel is set for S 2 SiS 0  = "100", DC supply at 1.8V, tuning voltage at 0V

C According to the steps above, the frequency range, phase noise, the magnitude of carrier and the current from supply in different channels are listed in Table 2 Table 2 shows that each channel works well and the current of each channel is almost the same, which means that the circuit operates in high stability within switching operation Therefore, we may well say that the usage of switching capacitor modules is a good way to design the wide-band VCO

Fig 14 S 2 SiS 0  = "100"; Y axes: frequency range, the magnitude of carrier and the current from supply; X axis: tuning voltage

Trang 7

Implementation of Low Phase Noise Wide-Band VCO with Digital Switching Capacitors 209

2.3.6 Devices Size of the Circuit

The devices size of our proposed VCO circuit is shown in Table 1, the devices size that we

take an optimization to achieve maximize quality factor and generate a negative resistance

enough to oscillation, they improve the performance of this proposed VCO

3 Experimental results

3.1 Measurement setup

A.Agilent E3631A is used as a DC source for digital switching High/Low

B Agilent E5052A is used as signal source analyzer and DC sources for DC supply and

tuning voltage

C.The photo of chip with pads is shown in Fig 13(a)

D Above a gold plated FR4 PCB is glued the chip which is bonded aluminum wires, shown

in Fig 13(b)

E The differential outputs of PCB connect a Bias-Tee on each side and then connect two

loads, Agilent E5052A and 50Q, shown in Fig 13(c)

F The wires which connect to instruments are shielded well and properly matched

Fig 13 Measurement setup (a) Die photo (b) Bonding on PCB (c) PCB Measurement

3.2 Measurement result

A When switching channel is set for S SiS  = "100", DC supply at 1.8V, tuning voltage from

-0.5V to 1.8V, Fig 13 shows that the frequency range, the magnitude of carrier and the current from supply in different value of tuning voltage From Fig 14, we know that MOS varactor pair is able to adjust 0.24 GHz and the magnitude of carrier is -5.97 dBm at 1.15V tuning voltage

B Fig 15 shows phase noise, -128 dBc/Hz with 1 MHz offset at 4.13 GHz when switching channel is set for S 2 SiS 0  = "100", DC supply at 1.8V, tuning voltage at 0V

C According to the steps above, the frequency range, phase noise, the magnitude of carrier and the current from supply in different channels are listed in Table 2 Table 2 shows that each channel works well and the current of each channel is almost the same, which means that the circuit operates in high stability within switching operation Therefore, we may well say that the usage of switching capacitor modules is a good way to design the wide-band VCO

Fig 14 S 2 SiS 0  = "100"; Y axes: frequency range, the magnitude of carrier and the current from supply; X axis: tuning voltage

Trang 8

Fig 15 Phase noise when S 2 SiS 0  = "100", tuning voltage = 0V

S 2 S 1 S Frequency (GHz) Phase Noise at 1MHz Offset

(dBc/Hz) Magnitude of carrier (dBm) Current (mA)

Table 2 Performance of eight channels of the proposed VCO

The supply voltage is set at 1.8V and S 2 SiS 0  = "111", we attained 1.8V x 15.8mA = 28.5mW

Disconnecting two loads, we get the core power dissipation 13.7 mW at DC supply 1.8V It is

a well-known that figure of merit (FOM) is an index between different VCOs FOM is

Supply voltage (V) 1.8 1.8 1.8 1.5 0.8 1 1 Core power diss (mW) 13.7 17.7 4.9 4.8 1.2 2.5 14 Phase noise (dBc/Hz) -121.8 -

128.8 -135 -114 -126.5 -109.7 -121.7 -108.5 FOM (dBc/Hz) -183

-189 -188 -181 -184 -183 -189 -171.5 Table 3 Comparison of VCOs performance

4 Conclusion

This VCO presents a technique of operating narrowband into wideband, employs switching tail current technique and maintains the good phase noise performance The switching capacitor modules offered multi-channels can enhance oscillator frequency range and the

KVCO is still small This VCO operated from 3.64 to 5.37 GHz with 38% tuning range The power consumption is 13.7 mW by a 1.8 V supply voltage and measured phase noise in all tuning range is less than -122 dBc/Hz at 1 MHz offset

5 Acknowledgment

This project is support by National Science Council, (NSC 95-2221-E-224-102) We would like to thank the Taiwan Semiconductor Manufacture Company (TSMC) and Chip Implementation Center (CIC) for the wafer fabrications We are grateful to National Nano Device Laboratories (NDL) for on-wafer measurements and National Chung Cheng University for PCB measurements by Dr Ting-Yueh Chih

6 References

[1] Craninckx, Michiel S J Steyaert, "A 1.8-GHz low-phase-noise CMOS VCO using

optimized hollow spiral inductors,"Solid-State Circuits, IEEE Journal of Volume 32, Issue 5, May 1997 Page(s):736 - 744

[2] Frank Ellinger, 2008, Radio Frequency Integrated Circuits and Technologies, Springer [3] Ito, Y.; Yoshihara, Y.; Sugawara, H.; Okada, K.; Masu, K.;"A 1.3-2.8 GHz Wide Range

CMOS LC-VCO Using Variable Inductor" Asian Solid-State Circuits Conference,

2005 Nov 2005 Page(s):265 - 268 [4] Fard, A.; Johnson, T.; Aberg, D.;" A low power wide band CMOS VCO for multi-

standard radios" Radio and Wireless Conference, 2004 IEEE 19-22 Sept 2004 Page(s):79 - 82

Trang 9

Implementation of Low Phase Noise Wide-Band VCO with Digital Switching Capacitors 211

Fig 15 Phase noise when S 2 SiS 0  = "100", tuning voltage = 0V

S 2 S 1 S Frequency (GHz) Phase Noise at 1MHz Offset

(dBc/Hz) Magnitude of carrier (dBm) Current (mA)

Table 2 Performance of eight channels of the proposed VCO

The supply voltage is set at 1.8V and S 2 SiS 0  = "111", we attained 1.8V x 15.8mA = 28.5mW

Disconnecting two loads, we get the core power dissipation 13.7 mW at DC supply 1.8V It is

a well-known that figure of merit (FOM) is an index between different VCOs FOM is

Supply voltage (V) 1.8 1.8 1.8 1.5 0.8 1 1 Core power diss (mW) 13.7 17.7 4.9 4.8 1.2 2.5 14 Phase noise (dBc/Hz) -121.8 -

128.8 -135 -114 -126.5 -109.7 -121.7 -108.5 FOM (dBc/Hz) -183

-189 -188 -181 -184 -183 -189 -171.5 Table 3 Comparison of VCOs performance

4 Conclusion

This VCO presents a technique of operating narrowband into wideband, employs switching tail current technique and maintains the good phase noise performance The switching capacitor modules offered multi-channels can enhance oscillator frequency range and the

KVCO is still small This VCO operated from 3.64 to 5.37 GHz with 38% tuning range The power consumption is 13.7 mW by a 1.8 V supply voltage and measured phase noise in all tuning range is less than -122 dBc/Hz at 1 MHz offset

5 Acknowledgment

This project is support by National Science Council, (NSC 95-2221-E-224-102) We would like to thank the Taiwan Semiconductor Manufacture Company (TSMC) and Chip Implementation Center (CIC) for the wafer fabrications We are grateful to National Nano Device Laboratories (NDL) for on-wafer measurements and National Chung Cheng University for PCB measurements by Dr Ting-Yueh Chih

6 References

[1] Craninckx, Michiel S J Steyaert, "A 1.8-GHz low-phase-noise CMOS VCO using

optimized hollow spiral inductors,"Solid-State Circuits, IEEE Journal of Volume 32, Issue 5, May 1997 Page(s):736 - 744

[2] Frank Ellinger, 2008, Radio Frequency Integrated Circuits and Technologies, Springer [3] Ito, Y.; Yoshihara, Y.; Sugawara, H.; Okada, K.; Masu, K.;"A 1.3-2.8 GHz Wide Range

CMOS LC-VCO Using Variable Inductor" Asian Solid-State Circuits Conference,

2005 Nov 2005 Page(s):265 - 268 [4] Fard, A.; Johnson, T.; Aberg, D.;" A low power wide band CMOS VCO for multi-

standard radios" Radio and Wireless Conference, 2004 IEEE 19-22 Sept 2004 Page(s):79 - 82

Trang 10

[5] Berny, A.D.; Niknejad, A.M.; Meyer, R.G.;" A 1.8-GHz LC VCO with 1.3-GHz tuning

range and digital amplitude calibration" Solid-State Circuits, IEEE Journal of Volume 40, Issue 4, April 2005 Page(s):909 - 917

[6] Chung-Yu Wu; Chi-Yao Yu;" A 0.8 V 5.9 GHz wide tuning range CMOS VCO using

inversion-mode bandswitching varactors" Circuits and Systems, 2005 ISCAS 2005 IEEE International Symposium on 23-26 May 2005 Page(s):5079 - 5082 Vol 5 [7] Neric H W Fong, Jean-Olivier Plouchart, Noah Zamdmer, Duixian Liu, Lawrence F

Wagner, Calvin Plett and N Garry Tarr, "A 1-V 3.8-5.7-GHz Wide-Band VCO with Differentially Tuned Accumulation MOS Varactors for Common-Mode Noise Rejection in CMOS SOI Technology", IEEE Transactions on Microwave Theory And Techniques, Vol 51, No 8, August 2003, pp.1952-1959

[8] Byunghoo Jung; Harjani, R.;" A wide tuning range VCO using capacitive source

degeneration" Circuits and Systems, 2004 ISCAS '04 Proceedings of the 2004 International Symposium on Volume 4, 23-26 May 2004 Page(s):IV - 145-8 Vol.4 [9] Yao-Huang Kao, Meng-Ting Hsu, Min-Chieh Hsu, and Pi-An Wu, "A Systematic

Approach for Low Phase Noise CMOS VCO Design", IEICE Trans Electron., Vol E86-C, No.8, pp.1427-1432, August 2003

[10] Donhee Ham and Ali Hajimiri, "Concepts And Methods in Optimization of Integrated

LC VCOs", IEEE Journal of Solid-State Circuits, Vol.36, Issue.6, Jun 2001,

pp.896-909

[11] A Hajimiri and T H Lee, "Design issues in CMOS differential LC oscillators," IEEE J

Solid-State Circuits, vol 34, no 5, May 1999, pp 717-724

[12] Huang, P.-C.; Tsai, M.-D.; Vendelin, G D.; Wang, H.; Chen, C.-H.; Chang, C.-S., "A

Low-Power 114-GHz Push-Push CMOS VCO Using LC Source Degeneration", Solid-State Circuits, IEEE Journal, Vol.42, Issue 6, June 2007, pp.1230 - 1239

[13] Razavi, Behzad, "Design of Integrated Circuits for Optical Communications"-1st ed [14] Eric A M Klumperink, Sander L J Gierkink, Amoud P van der Wel, Bram Nauta,

"Reducing MOSFET 1/f Noise and Power Consumption by Switch Biasing", IEEE Journal of Solid-State Circuits, Vol.35, Issue 7, July 2000, pp.994-1001

[15] C C Boon, M A Do, K S Yeo, J G Ma, and X L Zhang, "RF CMOS Low-Phase-Noise

LC Oscillator through Memory Reduction Tail Transistor," IEEE Transactions on Circuits and Systems, Vol 51, Feb 2004, pp 85-89

[16] Meng-Ting Hsu, Chung-Yu Chiang, and Ting-Yueh Chih, "Design of Low Power with

Low Phase Noise of VCO by CMOS Process", IEEE International Asia-Pacific Microwave Conference 2005, December 4-7, 2005, pp 880~883

[17] T H Lee, "The Design of CMOS Radio-FrequencyIntegrated Circuits", 2nd ed.,

Cambridge University Press, 2004

[18] Meng-Ting Hsu, Shiao-Hui Chen, Wei-Jhih Li, "Implementation of Low Phase Noise

Wide-Band VCO with Digital Switching Capacitors", Microwave Conference, 2007 APMC 2007 Asia-Pacific 11-14 Dec 2007 Page(s):1 - 4

[19] Soltanian, B.; Ainspan, H.; Woogeun Rhee; Friedman, D.; Kinget, P.R.;" An

Ultra-Compact Differentially Tuned 6-GHz CMOS LC-VCO With Dynamic Mode Feedback", IEEE Journal of Solid-State Circuits, Vol.42, Issue8, Aug 2007, pp.l63S - 16418

Trang 11

Intercavity Stimulated Scattering in Planar FEM as a Base for Two-Stage Generation of Submillimeter Radiation

Andrey Arzhannikov

x

Intercavity Stimulated Scattering in Planar

FEM as a Base for Two-Stage Generation

Far infrared and submillimeter radiation with wavelength from 30 m up to 300 m reveals

possibilities for new technologies and registration methods inaccessible earlier One can use

this terahertz radiation (THR) to investigate properties of substances and materials such as

semiconductors, paper, plastics, which are opaque in the visible range The other important

moment is that the eigenfrequencies of characteristic vibrations of complex molecules

belong to the terahertz region It means that application of THR opens up possibilities of

purposive influence upon organic molecules including DNA and RNA In medicine the

terahertz radiation can be used for visualization of healthy and defective tissues, as well as

an instrument of therapy and surgery

There are various methods of generation of the terahertz radiation in the pointed

wavelength band and a choice of one of them strongly depends on requirements of users for

parameters of the radiation From one hand, for the case of small generated power it can be

done by solid structure lasers (Kohler et al., 2002) or by back wave oscillators (Dobroiu et al.,

2004) From other hand, to generate the terahertz radiation of high level power one has to

create very huge installations with multi-megavolt electron accelerators (Minehara et al.,

2005) and (Vinokurov et al., 2006) As one of appropriate solving the problem of generation

of the high power terahertz radiation we proposed (Arzhannikov et al., 2006) to use a

two-stage scheme of generation of short wavelength radiation by scattering an EM-wave on a

beam of relativistic electrons for the case when at the first stage a high current sheet beam

drives a free electron maser of planar geometry operated with two-dimensional distributed

feedback at 4-mm wavelength (Arzhannikov et al., 1992, 1995, 2003) Theoretical analysis

(Ginzburg et al., 1999) and experimental investigations (Arzhannikov et al., 2008) clear

demonstrated that the free electron maser of planar geometry is truly appropriate oscillator

for 4-mm radiation band The key feature of our proposal on two-stage generation is to use

two planar generators pumped by sheet beams with a few kAmps currents which plane

resonators are combined as it was described for a multichannel generator of mm-wave

radiation (Ginzburg et al., 2001)

11

Trang 12

2 Proposed process and main experimental parameters

2.1 Wavelength bands of generated radiation

To start our analysis of opportunity of the proposed two-stage scheme we need to outline

the wavelength bands that can be covered by the two-stage generation at the experimental

conditions of the ELMI-device At the first stage of the two-stage process a free electron

maser has to be used at the parameters of recent experiments at the ELMI-device to generate

the radiation with the wavelength 0= 4 mm (Arzhannikov et al., 2008) If one assumes that

this radiation will be scattered on the electrons with kinetic energy about of 1 MeV, one can

estimate the output radiation wavelength at the second stage of generation

For the double Doppler Effect the wavelength conversion is expressed by the following

formula:

) cos 1 /(

) cos 1 (

0   s   i

 , (1) where =v/c , v - velocity of the beam electrons, c – velocity of light, is a -factor of the

beam electrons, i, s – angles of incident and scattered radiation respectively counted off

from the direction of the electron velocity vector (see Fig.1) For the special cases of

backscattering and 900-scattering the Doppler formula can be written

of the radiation at output of the second stage as the function of the -factor is presented in

Fig.1

Fig 1 Conversed wavelength due to scattering of 4-mm radiation by E-beam as the function

of -factor of the beam electrons

It is clear that one can obtain radiation in the band of 0.10.3 mm by scattering the incident radiation in the direction opposite to the beam electron velocity at various values of the electron relativistic factor If the incident radiation is scattered in the transverse direction to the beam electron velocity the radiation wavelength should be shifted to the band of

~0.20.5 mm

2.2 Schematic of the proposed experiments

Schematic drawings of experimental realization of submm generation for these two wavelength bands are presented in Fig.2 and Fig.3, respectively The Fig.2 illustrates the variant of two-stage generation for the band of 0.10.3 mm using backscattering of 4-mm radiation

Fig 2 Scheme of two-stage generation for the band of 0.10.3 mm

6

Scatteredsubmm radiation

Channel #1Channel #2

Fig 3 Scheme of two-stage generation for the band of 0.20.5 mm:

1) sheet REB for driving the planar FEM-generator; 2) sheet REB for mm-wave scattering; 3) 2-D Bragg reflector; 4) 1-D Bragg reflector; 5) feedback circuit; 6) place of scattering

Trang 13

2 Proposed process and main experimental parameters

2.1 Wavelength bands of generated radiation

To start our analysis of opportunity of the proposed two-stage scheme we need to outline

the wavelength bands that can be covered by the two-stage generation at the experimental

conditions of the ELMI-device At the first stage of the two-stage process a free electron

maser has to be used at the parameters of recent experiments at the ELMI-device to generate

the radiation with the wavelength 0= 4 mm (Arzhannikov et al., 2008) If one assumes that

this radiation will be scattered on the electrons with kinetic energy about of 1 MeV, one can

estimate the output radiation wavelength at the second stage of generation

For the double Doppler Effect the wavelength conversion is expressed by the following

formula:

) cos

1 /(

) cos

1 (

0   s   i

 , (1) where =v/c , v - velocity of the beam electrons, c – velocity of light, is a -factor of the

beam electrons, i, s – angles of incident and scattered radiation respectively counted off

from the direction of the electron velocity vector (see Fig.1) For the special cases of

backscattering and 900-scattering the Doppler formula can be written

of the radiation at output of the second stage as the function of the -factor is presented in

Fig.1

Fig 1 Conversed wavelength due to scattering of 4-mm radiation by E-beam as the function

of -factor of the beam electrons

It is clear that one can obtain radiation in the band of 0.10.3 mm by scattering the incident radiation in the direction opposite to the beam electron velocity at various values of the electron relativistic factor If the incident radiation is scattered in the transverse direction to the beam electron velocity the radiation wavelength should be shifted to the band of

~0.20.5 mm

2.2 Schematic of the proposed experiments

Schematic drawings of experimental realization of submm generation for these two wavelength bands are presented in Fig.2 and Fig.3, respectively The Fig.2 illustrates the variant of two-stage generation for the band of 0.10.3 mm using backscattering of 4-mm radiation

Fig 2 Scheme of two-stage generation for the band of 0.10.3 mm

6

Scatteredsubmm radiation

Channel #1Channel #2

Fig 3 Scheme of two-stage generation for the band of 0.20.5 mm:

1) sheet REB for driving the planar FEM-generator; 2) sheet REB for mm-wave scattering; 3) 2-D Bragg reflector; 4) 1-D Bragg reflector; 5) feedback circuit; 6) place of scattering

Trang 14

Fig 3 presents the variant of generation for the band of 0.20.5 mm where the radiation is

scattered at the angle 90

For both variants we suppose to use sheet beams with 34 mm thickness and 1020 cm

width and a current density more than 1 kA/cm2 The E-beams pass the slit channels at

presence of longitudinal guiding magnetic field with the strength greater than 1.0T In the

channel #1 of both variants there is an undulator transverse component of the magnetic field

that allows one to generate mm radiation with efficiency 1015% The energy density of

4-mm radiation inside the resonator of these FEM generators has a level which corresponds to

the electric field strength 105106 V/cm (Arzhannikov et al., 2003) and the same value of the

strength must be in the channels #2 of both variants

In further analysis we shall concentrate our attention on using backscattering of 4-mm

radiation that schematic is presented by Fig 2 Main feature of the electrodynamics system

for our two-stage experiments is to use Bragg reflectors in a resonator for 4-mm wave

generation Geometrical parameters of these 4-mm radiation reflectors constructed of the

pair of Bragg gratings were chosen through computer simulations and their frequency

selecting properties were measured on a special tested bench Widths and lengths of the

vacuum channels for passing the electron beams in were also chosen on the base of

computer simulations and experimental tests

2.3 Computer simulations and experiments on simultaneous generation and transport

of two sheet beams

Before the investigations of two-stage generation by using the backscattering process, we

have to design and to construct the accelerating diode suitable for simultaneous generation

of two high-current sheet beams and to determine conditions for stable equilibrium

transport of intense sheet electron REBs in the moderate magnetic fields inside the slit

vacuum channels Solving these two problems is described here

2.3.1 Computer simulations

One of the key problems in generation of high power REBs suitable to produce

THz-radiation in frame of the two-stage scheme is to achieve limit brightness of the beam that is

proportional to the current density of the beam j and inversely proportional to the square

of electron angular divergence2 Simple estimations have shown that the level of the beam

density j~ 3 кА/сm2 at the spread of longitudinal velocities of the beam electrons

3 2

V has to be achieved for acceptable efficiency of the wave energy

transfer from the beam to the THz band radiation (Arzhannikov et al., 2006) It should be

noted that to generate mm-wave radiation the value of this spread about 510-2 is sufficient

Previous analytical consideration and computer simulations (Arzhannikov & Sinitsky, 1996)

showed that it was possible to reduce the angular divergence below the value  ~ 210-2 in

case of the electron beam generated in the magnetically insulated diode with ribbon

geometry at the diode voltage 1 MV and relatively low electron current density 150 A/cm2

in the magnetic field 0.6 T inside the slit channel It was achieved by proper choice of the

diode geometry and configuration of the magnetic field which set conditions for subtraction

of contributions to the angular electron divergence from the electric and magnetic fields

inhomogeneities In the case of four beams generated simultaneously in a single uniform accelerating diode in the results of computer simulations we have demonstrated the possibility to reach sufficiently high brightness of the beams adequate for generating mm-wave radiation To investigate the prospects of such beams application for two-stage scheme

of THz - wave generation we have performed computer modelling of simultaneous generation of two sheet beams in the magnetically insulated diode and the output of these beams in narrow slit channels Obtained results confirmed the possibility to achieve the level of the angular divergence ~ 510-2 ( V||/V||~ 10-3) at a considerably high current density about 1 kA/cm2 in the magnetic field 1.7 T (Arzhannikov et al., 2007) Another important problem that has to be solved is the transport of the sheet beam in the slit channel

at a stable equilibrium It was a subject of theoretical and experimental investigations described in (Arzhannikov et al., 1990, 2007) and (Sinitsky et al., 2008) For our case we simulated the beam transport by solving 2-D Poisson equation for homogeneous current and space charge densities of the beam with sharp borders inside the rectangular liner with perfectly conducting walls When self electric and magnetic fields are small in comparison with the external guiding magnetic field directed along the channel axis, the current and charge densities remain homogeneous along the beam pass but the beam border is deformed by the drift motion of the electrons and the displacement by self magnetic field of the beam :

H v H

H E c

0

0 0

||

2 0

f=0.5f=1

Trang 15

Fig 3 presents the variant of generation for the band of 0.20.5 mm where the radiation is

scattered at the angle 90

For both variants we suppose to use sheet beams with 34 mm thickness and 1020 cm

width and a current density more than 1 kA/cm2 The E-beams pass the slit channels at

presence of longitudinal guiding magnetic field with the strength greater than 1.0T In the

channel #1 of both variants there is an undulator transverse component of the magnetic field

that allows one to generate mm radiation with efficiency 1015% The energy density of

4-mm radiation inside the resonator of these FEM generators has a level which corresponds to

the electric field strength 105106 V/cm (Arzhannikov et al., 2003) and the same value of the

strength must be in the channels #2 of both variants

In further analysis we shall concentrate our attention on using backscattering of 4-mm

radiation that schematic is presented by Fig 2 Main feature of the electrodynamics system

for our two-stage experiments is to use Bragg reflectors in a resonator for 4-mm wave

generation Geometrical parameters of these 4-mm radiation reflectors constructed of the

pair of Bragg gratings were chosen through computer simulations and their frequency

selecting properties were measured on a special tested bench Widths and lengths of the

vacuum channels for passing the electron beams in were also chosen on the base of

computer simulations and experimental tests

2.3 Computer simulations and experiments on simultaneous generation and transport

of two sheet beams

Before the investigations of two-stage generation by using the backscattering process, we

have to design and to construct the accelerating diode suitable for simultaneous generation

of two high-current sheet beams and to determine conditions for stable equilibrium

transport of intense sheet electron REBs in the moderate magnetic fields inside the slit

vacuum channels Solving these two problems is described here

2.3.1 Computer simulations

One of the key problems in generation of high power REBs suitable to produce

THz-radiation in frame of the two-stage scheme is to achieve limit brightness of the beam that is

proportional to the current density of the beam j and inversely proportional to the square

of electron angular divergence2 Simple estimations have shown that the level of the beam

density j~ 3 кА/сm2 at the spread of longitudinal velocities of the beam electrons

3 2

V has to be achieved for acceptable efficiency of the wave energy

transfer from the beam to the THz band radiation (Arzhannikov et al., 2006) It should be

noted that to generate mm-wave radiation the value of this spread about 510-2 is sufficient

Previous analytical consideration and computer simulations (Arzhannikov & Sinitsky, 1996)

showed that it was possible to reduce the angular divergence below the value  ~ 210-2 in

case of the electron beam generated in the magnetically insulated diode with ribbon

geometry at the diode voltage 1 MV and relatively low electron current density 150 A/cm2

in the magnetic field 0.6 T inside the slit channel It was achieved by proper choice of the

diode geometry and configuration of the magnetic field which set conditions for subtraction

of contributions to the angular electron divergence from the electric and magnetic fields

inhomogeneities In the case of four beams generated simultaneously in a single uniform accelerating diode in the results of computer simulations we have demonstrated the possibility to reach sufficiently high brightness of the beams adequate for generating mm-wave radiation To investigate the prospects of such beams application for two-stage scheme

of THz - wave generation we have performed computer modelling of simultaneous generation of two sheet beams in the magnetically insulated diode and the output of these beams in narrow slit channels Obtained results confirmed the possibility to achieve the level of the angular divergence ~ 510-2 ( V||/V||~ 10-3) at a considerably high current density about 1 kA/cm2 in the magnetic field 1.7 T (Arzhannikov et al., 2007) Another important problem that has to be solved is the transport of the sheet beam in the slit channel

at a stable equilibrium It was a subject of theoretical and experimental investigations described in (Arzhannikov et al., 1990, 2007) and (Sinitsky et al., 2008) For our case we simulated the beam transport by solving 2-D Poisson equation for homogeneous current and space charge densities of the beam with sharp borders inside the rectangular liner with perfectly conducting walls When self electric and magnetic fields are small in comparison with the external guiding magnetic field directed along the channel axis, the current and charge densities remain homogeneous along the beam pass but the beam border is deformed by the drift motion of the electrons and the displacement by self magnetic field of the beam :

H v H

H E c

0

0 0

||

2 0

f=0.5f=1

Trang 16

As it is seen the substantial shape deformations for f 0and f 0.5are expected only at

the end of the channel (Z=140cm) while for f 1 they occur just at Z=50cm It should be

noted that to keep the beam shape unchangeable it is necessary to have beam thickness

equal to ¾ of the channel gap Unfortunately we can not satisfy this requirement because in

the case of the FEM application the beam border should oscillate in the undulator field with

the amplitude ~0.1cm and the electrons should have perpendicular Larmor radius ~0.1cm

while the channel gap should not exceed 2-3 wavelength of the generated radiation (4mm)

Thus we have advisedly chosen nonequilibrium shape of the beam assuming its

deformations on the length of the FEM resonator (70cm) would be acceptable

2.3.2 Experiments on simultaneous generation and transport of two beams

The experiments on the simultaneous generation of two sheet beams and their transport in

drawing of these experiments is presented in Fig 5 (Arzhannikov et al., 2007 and Sinitsky et

al., 2008) Two sheet beams are generated by two vertically elongated cathodes placed one

over another (see side view) These cathodes are made of a fibrous graphite material to

ensure homogeneous emission from their surfaces The guiding magnetic field has adiabatic

growth from 0.35 T in the diode up to 1.7 T in the channel that provides magnetic

compression of the beam and rise of its current density up to 1–1.5 kA/cm2 According to

simulations for such magnetic field growth the pitch angle of a main part of the beam

electrons should not exceed a few degrees The outer areas of the beam cross sections are cut

off in special graphite formers at the beam entrances into the slit channels Then just central

part of the beam cross sections with sizes 0.47 cm having minimal pitch angles of the

electrons, enters the channels (see Fig 5) The sheet beam thickness was 0.4 cm and the

distance between the channel walls was 0.9 cm

Fig 5 Schematic drawing of the experiments on simultaneous generation of two sheet

beams

Gap between the beam bounds and the channel walls should provide possibility of the beam

oscillations under the transverse undulator field without contact of electrons with the

channel walls After transport through the 140 cm long channels with the magnetic field

1.7 T the beams are dumped in the graphite collectors placed in the decreased magnetic field

in the described experiments

Typical traces of the diode voltage and the beam currents measured on the collectors are presented in Fig 6 It is clearly seen that the time dependences of the beams currents are practically the same but the values have some difference To understand this difference and

to discover possible deformation of the beams cross sections the registration of the beam cross section profile on a thin (1 mm thickness) stainless steel plates have been used These plates were mounted on special holders inside the channels Due to the beam exposure the material of the plate heated up to evaporation creating the trace close to the beam cross section Really this trace was slightly large than the beam size due to the trace edges melting The reason of the beams currents difference in the shot presented in Fig 6, was explored by analysis of the beams traces As a result it was discovered that this difference was caused by tilt of the guiding magnetic field lines about the direction of the channel axis

at the angle ~ 0.01 rad

0.0 0.2 0.4 0.6 0.8 1.0

0 1 2 3 4

5

#6733

t,Fig 6 Traces of the diode voltage and currents of two beams at the exit of the channels

To eliminate this defect in the magnetic field geometry, concerned with inaccuracy in winding of magnetic coil, the special correcting coil was installed This coil eliminated the tilt of the magnetic field without any damage in the beam cross section shape

After that good coincidence of the beams currents has been achieved Taking into account the results of computer simulations the analysis of drift displacements of the ends of the beams cross sections and their shape deformations (see imprints of the beam in the Fig.7)

has shown that the beam space charge neutralization f is larger than 1/2 but far from unity Since the initial thickness of the sheet beams was not equal to equilibrium quantity, some deformations of the beam cross sections at the transport length 140 cm have been observed in accordance with the simulation results At the same time for the transport length 50 cm the ribbon shape of the beam cross section was good enough, and the gap

Trang 17

As it is seen the substantial shape deformations for f 0and f 0.5are expected only at

the end of the channel (Z=140cm) while for f 1 they occur just at Z=50cm It should be

noted that to keep the beam shape unchangeable it is necessary to have beam thickness

equal to ¾ of the channel gap Unfortunately we can not satisfy this requirement because in

the case of the FEM application the beam border should oscillate in the undulator field with

the amplitude ~0.1cm and the electrons should have perpendicular Larmor radius ~0.1cm

while the channel gap should not exceed 2-3 wavelength of the generated radiation (4mm)

Thus we have advisedly chosen nonequilibrium shape of the beam assuming its

deformations on the length of the FEM resonator (70cm) would be acceptable

2.3.2 Experiments on simultaneous generation and transport of two beams

The experiments on the simultaneous generation of two sheet beams and their transport in

drawing of these experiments is presented in Fig 5 (Arzhannikov et al., 2007 and Sinitsky et

al., 2008) Two sheet beams are generated by two vertically elongated cathodes placed one

over another (see side view) These cathodes are made of a fibrous graphite material to

ensure homogeneous emission from their surfaces The guiding magnetic field has adiabatic

growth from 0.35 T in the diode up to 1.7 T in the channel that provides magnetic

compression of the beam and rise of its current density up to 1–1.5 kA/cm2 According to

simulations for such magnetic field growth the pitch angle of a main part of the beam

electrons should not exceed a few degrees The outer areas of the beam cross sections are cut

off in special graphite formers at the beam entrances into the slit channels Then just central

part of the beam cross sections with sizes 0.47 cm having minimal pitch angles of the

electrons, enters the channels (see Fig 5) The sheet beam thickness was 0.4 cm and the

distance between the channel walls was 0.9 cm

Fig 5 Schematic drawing of the experiments on simultaneous generation of two sheet

beams

Gap between the beam bounds and the channel walls should provide possibility of the beam

oscillations under the transverse undulator field without contact of electrons with the

channel walls After transport through the 140 cm long channels with the magnetic field

1.7 T the beams are dumped in the graphite collectors placed in the decreased magnetic field

in the described experiments

Typical traces of the diode voltage and the beam currents measured on the collectors are presented in Fig 6 It is clearly seen that the time dependences of the beams currents are practically the same but the values have some difference To understand this difference and

to discover possible deformation of the beams cross sections the registration of the beam cross section profile on a thin (1 mm thickness) stainless steel plates have been used These plates were mounted on special holders inside the channels Due to the beam exposure the material of the plate heated up to evaporation creating the trace close to the beam cross section Really this trace was slightly large than the beam size due to the trace edges melting The reason of the beams currents difference in the shot presented in Fig 6, was explored by analysis of the beams traces As a result it was discovered that this difference was caused by tilt of the guiding magnetic field lines about the direction of the channel axis

at the angle ~ 0.01 rad

0.0 0.2 0.4 0.6 0.8 1.0

0 1 2 3 4

5

#6733

t,Fig 6 Traces of the diode voltage and currents of two beams at the exit of the channels

To eliminate this defect in the magnetic field geometry, concerned with inaccuracy in winding of magnetic coil, the special correcting coil was installed This coil eliminated the tilt of the magnetic field without any damage in the beam cross section shape

After that good coincidence of the beams currents has been achieved Taking into account the results of computer simulations the analysis of drift displacements of the ends of the beams cross sections and their shape deformations (see imprints of the beam in the Fig.7)

has shown that the beam space charge neutralization f is larger than 1/2 but far from unity Since the initial thickness of the sheet beams was not equal to equilibrium quantity, some deformations of the beam cross sections at the transport length 140 cm have been observed in accordance with the simulation results At the same time for the transport length 50 cm the ribbon shape of the beam cross section was good enough, and the gap

Ngày đăng: 20/06/2014, 11:20

TỪ KHÓA LIÊN QUAN