IEC/TS 62647 1 Edition 1 0 2012 08 TECHNICAL SPECIFICATION Process management for avionics – Aerospace and defence electronic systems containing lead free solder – Part 1 Preparation for a lead free c[.]
General
This document outlines a Lead-Free Control Plan (LFCP) that details the processes for producing, supplying, reworking, repairing, or maintaining ADHP electronic systems The LFCP ensures that the Pb-free solder, components, and printed wiring boards (PWBs) meet the necessary performance, reliability, safety, and certifiability standards throughout the system's intended lifespan Sections 5.2 to 5.6 specify the key objectives to be achieved.
Reliability
To ensure the reliability of products using Pb-free solder and finishes, it is essential to demonstrate the effectiveness of these materials and processes Key methods for mitigating and controlling risks associated with Pb-free tin surface finishes must be identified Additionally, it is crucial to establish reliable techniques for assessing the performance of Pb-free solders and mixed solder alloy interconnects.
Configuration control and product identification
Demonstrate that the configurations of all systems, equipment, assemblies, sub-assemblies, and piece parts are identified and controlled.
COTS assemblies and sub-assemblies
Assure that COTS assemblies and sub-assemblies are identified, marked and controlled, and reliability objectives are met.
Deleterious effects of tin whiskers
Mitigate the deleterious effects of tin whiskers.
Repair, rework, maintenance, and support
Assure that repair, rework, maintenance, and support activities are specified, documented and controlled in a manner that controls the effects of Pb-free solder materials and processes
General
This clause defines the technical requirements for the LFCP
The ADHP system Plan owner shall have a Plan that states clearly, concisely, and unambiguously:
• how the Plan owner intends to accomplish each of the objectives;
• the process by which compliance to the Plan is demonstrated;
• the evidence that shows the objectives have been accomplished
Plan owners shall include within their LFCP a table or matrix (see sample in Annex B) showing compliance to all technical requirements
The Plan owner may modify the objectives of Clause 5 by adding or removing items, provided there is suitable justification Any amendments will result in the Plan being evaluated based on the updated list of requirements.
Plan Tailoring the requirements shall be concurred upon between Plan owner and customer
Annex A provides a tailoring template that can be used in this regard.
Reliability
General
The Plan will outline processes that ensure the reliability of equipment by utilizing appropriate substrate metallization finishes, termination solder materials, assembly solder alloys, fluxes, cleaning agents, PWB materials, and piece parts, as well as effective soldering processes for the specified application.
This requirement also applies to mixed solder alloys or combinations of substrate metallization finish materials, termination solder materials and finishes, and assembly solder alloys used in the given application
This requirement applies to original production, repair, rework and maintenance of systems
Users of this specification should address unique reliability requirements such as long life, rugged operating environments, high consequences of failure, etc
NOTE 1 Materials and assembly processes can be qualified prior to use in the product
NOTE 2 This specification addresses issues that are unique to ADHP products In the case of COTS assemblies, information related to materials and assembly processes possibly will not be available or verifiable Therefore, new or modified verification/qualification processes can be necessary to assure reliability of the products which integrate such COTS assemblies
NOTE 3 COTS assemblies that meet reliability objectives in non-ADHP applications can be verified as acceptable for ADHP applications.
Test and analysis methods
The Plan will outline testing methods for assemblies utilizing Pb-free alloys and finishes, as well as their combinations, to gather data that evaluates their reliability for the specified application.
Test methods must establish specific conditions and durations to assess key potential failure mechanisms in materials and assembly construction For solder joints, this evaluation should focus on crack propagation due to accumulated fatigue damage, as well as the development of brittle intermetallic phases or voids Comprehensive guidelines and examples for planning, conducting tests, and analyzing results are provided in IEC/PAS 62647-22.
(GEIA-HB-0005-2) Failure analysis by metallographic examination and/or composition analysis is critical to interpreting results from these tests
Analysis methods may be used in lieu of testing, provided the analysis methods have been verified by testing.
Environmental and operating conditions
Understanding the life cycle environmental and operating conditions for each individual assembly is crucial for evaluating the reliability of materials and assembly processes in a specific application This essential information must be mutually agreed upon by both the Plan owner and the customer.
When a Pb-free solder alloy or finish demonstrates reliability under specific environmental conditions and service life, it can also be deemed reliable in less severe conditions and shorter service lives.
A Pb-free solder alloy or finish is deemed reliable if its performance matches or exceeds that of a Sn-Pb alloy or finish under similar testing conditions, assuming the Sn-Pb variant meets reliability standards Testing must reflect real-life environmental and operational conditions, incorporating relevant acceleration factors specific to the solder alloy or finish in question.
Data
The Plan must outline methods for utilizing archived and retrievable reliability data, which can be sourced from either in-service data of similar systems operating under comparable conditions or test data from studies on the solder or finish compositions relevant to the system design This data should accurately represent parts and materials that have undergone assembly, rework, or repair processes similar to those being evaluated.
NOTE 1 Example sources of test data include:
– University-led consortia including the Computer-Aided Life Cycle Engineering Electronics Packaging and
Systems Center, University of Maryland and the Center for Advanced Vehicle Electronics, Auburn
UniversityIndustrial consortia including Universal Instruments Corporation’s Area Array Consortium
– IPC – Association Connecting Electronics Industries
– JEDEC – Global Standards for the Microelectronics Industry
– Japan Engineering and Information Technology Association (JEITA)
– Joint Council on Aging Aircraft Joint Group on Pollution Prevention (JCAA/JG-PP)
– NASA/DOD Pb-free Electronics Project
NOTE 2 Guidelines for planning and conducting tests and for analyzing and using results thereof, are included in
Conversion of results from available data to applicable conditions
The Plan will outline the processes and methods for identifying and quantifying the relevant environmental use conditions and reliability requirements for specific products If the data is collected under service or test conditions that differ from the anticipated use conditions, the documented processes will adjust the results to reflect equivalent use conditions for the system, utilizing appropriate acceleration factors.
NOTE The purpose of this requirement is to ensure that the actual use conditions of the given product are considered in the application of data.
Configuration control and product identification
General
6.3 defines the configuration control and product identification requirements for the Plan A
Plan meeting the requirements of this subclause will ensure that users and maintainers of
ADHP systems will ensure comprehensive traceability throughout their designated performance lifespan The Plan will clearly outline the authority for design and changes.
Annex C offers essential guidance for Plan owners to fulfill the configuration control and product identification requirements outlined in this subclause It emphasizes the importance of effectively managing configuration control and product identification for components and soldered assemblies as they transition to Pb-free technology.
Certain COTS assemblies utilizing Pb-free materials may not meet the requirements outlined in section 6.3, especially if they do not disclose relevant information With a variety of Pb-free solder alloys and materials available, and the expectation of new introductions to the market, it is crucial to understand the specific materials and assembly processes involved Consequently, if this information is necessary to fulfill requirements, such COTS assemblies may be deemed unsuitable for their intended applications.
Termination materials and finishes
The Plan will outline processes for identifying all termination materials and finishes, such as PCBs and piece parts, to address potential issues related to reliability, compatibility, and processing, while utilizing controlled documents for effective configuration identification and control.
NOTE 1 Examples of finishes that could be problematic are: solder alloys with high melting temperatures (e.g
The article discusses components that can withstand temperatures exceeding 250 °C, including those utilizing solder ball technology, bismuth-containing solder alloys, lead-free tin termination materials, and various PCB finishes It is important to note that this list is not exhaustive and may evolve as new information becomes available.
NOTE 2 To accomplish this, the Plan owner can contact piece part manufacturers and suppliers, consult data sheets, or use external resources including databases (e.g Q-STAR, Part Miner) At the time of publication of this specification, it is not clear whether or not this will be adequate, or whether additional testing or analysis of the piece parts will be required
NOTE 3 One purpose of this requirement is to ensure that the information necessary for reliable repair and rework of the equipment is available to the repair and rework facilities, so that the repair and rework materials and processes can be appropriate for the given piece part termination or finish alloy
It is recommended that Plan owners subscribe to a part change notice (PCN) service, (e.g
PCN Alert, Part Miner, Total Parts Plus, Arrow Risk Manager, Avnet Pomiere, and Gidep are essential tools that facilitate communication with piece part manufacturers, representatives, and distributors Any changes in termination finish necessitate a thorough re-evaluation of the piece part to ensure its compatibility with other materials and assembly processes.
Solder alloys used in the assembly process
The Plan will systematically document the processes for identifying and recording solder alloys, fluxes, cleaning agents, and soldering methods utilized in the assembly process by both in-house and contract manufacturers, covering both original and repaired hardware.
NOTE IPC/JEDEC J-STD-609 provides information that can assist in this
6.3.3.2 Assemblies containing a single solder alloy
Solder alloys, fluxes, cleaning agents, and assembly processes, including time-temperature reflow profiles, must be documented in a controlled document system This information can be displayed on labels or included in maintenance manuals Assemblies made with Pb-free solders should be identified according to industry standards like IPC/JEDEC J-STD-609 or as specified by the customer.
6.3.3.3 Assemblies containing more than one solder alloy
Solder alloys, fluxes, cleaning agents, and assembly processes (including time-temperature reflow profiles) shall be documented in the appropriate controlled document system
The controlled document system must include a detailed description or visual layout of the CCA, pinpointing the locations of each solder alloy Additionally, a comprehensive parts list should be provided, specifying the finishes and solders used, along with an assembly specification that outlines the necessary materials.
(e.g solder wire, solder paste or bulk solder from wave-soldering or solder fountain processes) may satisfy this requirement
Important information can be found on labels, in maintenance manuals, or through similar resources It is advisable to avoid using multiple solder alloys in a single assembly.
Wiring and connector assemblies
When applicable, the processes described above shall be documented in the Plan for wiring and similar applications.
Changes in solder alloys
The Plan shall document processes to assure that no changes to the solder alloys or finishes are made without prior written authorization and approval by the Plan owner.
Identification
Where required by contract, all Pb-free sub-assemblies, assemblies, and equipment shall be identified appropriately
NOTE An industry standard that contains marking requirements is the IPC/JEDEC J-STD-609.
Part number changes
Part number modifications due to alterations in solders and finishes will be dictated by the specific program's requirements, with examples of such changes outlined in Annex C.
COTS assemblies and sub-assemblies
General
All of the technical requirements and associated objectives of this specification shall apply to
COTS assemblies and sub-assemblies containing Pb-free materials when selected for use in
ADHP electronic systems During the selection of COTS assemblies and sub-assemblies it shall be assumed that COTS assemblies and sub-assemblies contain some Pb-free content
COTS assemblies are easily accessible in the commercial market, but they may not be specifically designed or manufactured to fulfill the requirements of ADHP electronic systems It is important to acknowledge this distinction.
– COTS assemblies are readily available through one or more suppliers Many are purchased through vendors or brokers and not directly from the COTS assembly manufacturer
– COTS assemblies represent a risk in tin whisker formation due to a lack of visibility of the part selection process at the COTS assembly manufacturer
– COTS assembly manufacturers may make changes in components, finishes and solders without notification to their customers
– COTS assemblies may not have been qualified to ADHP electronics standards for reliability.
COTS assembly and sub-assembly configuration control and product
All the requirements of 6.3 of this specification shall apply to COTS assemblies If the COTS assembly is repairable, then the requirements of 6.3.3 that pertain to assemblies shall apply
If not repairable, then the requirements of 6.3.2 that pertain to components shall apply.
Deleterious effects of tin whiskers
The Plan must address the harmful impacts of tin whiskers while adhering to the relevant standards of IEC/PAS 62647-2 (GEIA-STD-0005-2) or the forthcoming IEC/TS 62647-2, which will replace IEC/PAS 62647-2.
Repair, rework, maintenance, and support
The Plan shall apply to original equipment manufacturing and repair, rework, maintenance and support activities IEC/PAS 62647-23 (GEIA-HB-0005-3) provides guidance for compliance with this subclause
The Plan shall document the processes to:
• ensure that all data and information required to comply with the requirements of this specification are available to those responsible for repair, rework, maintenance, and support;
• ensure that repair, rework, and maintenance documents issued by the design authority are consistent with the design authority’s Plan;
To facilitate effective repairs and rework, it is essential to provide comprehensive information regarding the alloys, materials, finishes, and processes that are compatible with the item in question.
• ensure that all repair, rework, maintenance, and support processes are documented, including limitations/ exceptions, and are in compliance with the requirements called out in the Plan
The Plan should facilitate awareness and identify necessary mitigation practices of changing termination finishes in components that may be available at the time of repair
Plan organization
The Plan must be structured to clearly, concisely, and unambiguously address all requirements outlined in Clause 6, ensuring that it is verifiable by the customer or their representative.
Terms and definitions
The terms and definitions used in the Plan shall be those contained in Clause 3 of this specification, unless they are clearly defined otherwise in the Plan.
Plan point of contact
The Plan will designate a primary point of contact responsible for liaising between the Plan owner and external parties, overseeing necessary reviews and updates, and ensuring timely resolution of all technical and administrative issues.
Requirements for suppliers and sub-contractors
The Plan owner must ensure that suppliers and sub-contractors possess a LFCP that meets the requirements of this specification, or that the applicable requirements are communicated effectively to achieve the Plan owner’s objectives.
Plan acceptance
The Plan will be deemed accepted when both the Plan owner and the customer reach a mutual agreement, provided the customer decides to exercise their right of acceptance.
Plan modifications
In the event that a Plan is changed, a process shall be in place to notify all entities that are affected by the change
Template for tailoring requirements of IEC/TS 62647-1
Table A.1 provides a template for tailoring the requirements for IEC/TS 62647-1
Table A.1 – Template for tailoring requirements
No Clause / subclause Requirement description Tailored requirement Plan user sign-off Customer representative sign-off
Add additional lines as needed
The informative requirements matrix for IEC/TS 62647-1 is detailed in Table B.1, which outlines the specific requirements and corresponding clauses or subclauses within the standard This matrix serves as a comprehensive reference for understanding the obligations set forth in IEC/TS 62647-1.
R eq ui rem en t LFC P cr os s ref er en ce cl au se
D em ons tr at ed by (s uppor ti ng doc um ent ref er en ce s an d br ie f de sc ri pt ions )
R eco rd o f co m pl ian ce (e vi den ce do cu m en ts ar e fol low ed) 1 6 1
The A D H P system plan owner must have a clear, concise, and unambiguous plan that outlines how each objective will be accomplished, the process for demonstrating compliance, and the evidence showing that objectives have been met Plan owners are required to include a compliance matrix within their LFC plan, detailing adherence to all technical requirements Tailoring of requirements should be agreed upon between the plan owner and the customer, with a template provided in Annex A The plan must document processes ensuring the reliability of equipment using various materials and finishes, as well as methods for testing assemblies made with lead-free alloys to assess their reliability Additionally, the lifecycle environmental and operating conditions for each assembly must be understood and utilized in evaluating the reliability of materials and processes in the specific application.
R eq ui rem en t N o C lau se / su bcl au se in IE C /T S 6 264 7- 1
R eq ui rem en t LFC P cr os s ref er en ce cl au se
D em ons tr at ed by (s uppor ti ng doc um ent ref er en ce s an d br ie f de sc ri pt ions )
R eco rd o f co m pl ian ce (e vi den ce do cu m en ts ar e fol low ed) 7 6 2 4
The plan must outline methods for utilizing archived and retrievable reliability data from at least one of the following sources: (a) in-service data from similar systems in comparable applications and environmental conditions, or (b) test data from studies conducted on the solder or finish compositions used in the given system design, or a comparable one, under similar conditions The data should represent parts and materials processed by assembly, rework, or repair processes comparable to the construction being assessed Additionally, the plan must document processes and methods to determine and quantify the relevant environmental use conditions and reliability requirements for specific products.
In cases where data is obtained from service or test environmental conditions that differ from the expected usage conditions of a system, documented processes and methods will convert results to equivalent usage conditions using appropriate identified acceleration factors The Plan will define design and change authority, ensuring configuration identification and control through controlled documents It will also document processes to identify all termination materials and finishes, such as PCB and piece parts, that may have reliability, compatibility, processing, or other issues Additionally, the Plan will record solder alloys, fluxes, cleaning agents, and soldering processes used in assembly, both by in-house and contract manufacturers, in a controlled manner All relevant solder materials and assembly processes, including time-temperature reflow profiles, will be documented in the appropriate controlled document system, which will also include a description or pictorial layout identifying the locations of each solder alloy When applicable, these processes will be documented in the Plan for wiring and similar applications.
R eq ui rem en t N o C lau se / su bcl au se in IE C /T S 6 264 7- 1
R eq ui rem en t LFC P cr os s ref er en ce cl au se
D em ons tr at ed by (s uppor ti ng doc um ent ref er en ce s an d br ie f de sc ri pt ions )
The Plan must document processes to ensure that no changes to solder alloys or finishes occur without prior written authorization from the Plan owner All Pb-free sub-assemblies, assemblies, and equipment must be appropriately identified as required by contract Changes in part numbers related to solder and finish modifications will be determined by the specific program's requirements, with examples provided in Annex C All technical requirements and objectives of this specification apply to COTS assemblies containing Pb-free materials when selected for use in ADHP electronic systems If a COTS assembly is repairable, the relevant requirements for assemblies will apply; if not repairable, the requirements for components will apply The Plan must include mitigation of the deleterious effects of tin whiskers in compliance with IEC/PAS 62647-2 or IEC/TS 62647-2, which supersedes IEC/PAS 62647-2 This Plan applies to original equipment manufacturing, repair, rework, maintenance, and support activities, with IEC/PAS 62647-23 providing guidance for compliance.
R eq ui rem en t N o C lau se / su bcl au se in IE C /T S 6 264 7- 1
R eq ui rem en t LFC P cr os s ref er en ce cl au se
D em ons tr at ed by (s uppor ti ng doc um ent ref er en ce s an d br ie f de sc ri pt ions )
R eco rd o f co m pl ian ce (e vi den ce do cu m en ts ar e fol low ed) 27 6 6
The Plan must document processes to ensure that all necessary data and information for compliance are accessible to those responsible for repair, rework, maintenance, and support It should guarantee that repair, rework, and maintenance documents issued by the design authority align with the authority's Plan Additionally, the Plan must provide sufficient information to enable the repair and rework facility to utilize compatible alloys, materials, finishes, and processes All repair, rework, maintenance, and support processes must be documented, including any limitations or exceptions, and comply with the requirements outlined in the Plan The organization of the Plan should clearly, concisely, and unambiguously address each requirement of Clause 6, ensuring verifiability by the customer or their representative The terms and definitions used in the Plan should align with those in Clause 3 of this specification unless otherwise defined.
The Plan will designate a primary point of contact responsible for acting as the main interface between the Plan owner and external parties regarding Plan-related matters, ensuring timely review and updates as necessary, and resolving all technical and administrative issues promptly It will include or reference applicable process documentation The Plan owner must ensure that suppliers and subcontractors comply with the requirements of this specification, ensuring that the objectives of the Plan owner are met The Plan will be accepted when both the Plan owner and the customer agree on its acceptability, should the customer choose to exercise their right of acceptance In the event of any changes to the Plan, a process will be established to notify all affected entities.
Guidance on configuration control and product identification
The global transition to Pb-free solder has a significant impact on the electronics industry
The transition is disruptive to the aerospace industry, which requires products with continued high performance and maintainability
A strong configuration management process is essential for maintaining the consistency and traceability of a product's performance, functional, and physical attributes in relation to its requirements, design, and operational information throughout its lifecycle.
Transitioning from Pb-based solders presents challenges due to limited experience with alternatives and potential incompatibility between existing and new solder configurations Effective configuration management is essential to address these issues, ensuring the correct application of product identification principles to facilitate appropriate manufacturing and maintenance processes.
This annex outlines the circumstances under which a new part number, or dash number, is necessary This ensures that customers, including manufacturing shops, airlines, government entities, and maintenance facilities, are informed of any changes to a configuration's lead (Pb) content.
A list of definitions and terms used throughout this document is contained in Clause 3 of this specification
This annex provides guidance to industry for meeting the configuration control and product identification requirements of IEC/TS 62647-1 (GEIA-STD-0005-1) The IEC/TS 62647-1
The GEIA-STD-0005-1 standard outlines the goals and requirements for documenting processes that ensure ADHP electronic systems with Pb-free solder, components, and boards meet essential criteria for performance, reliability, airworthiness, safety, and certifiability throughout their intended lifespan.
Adhering to these guidelines ensures that the needs of the customer, the OEM, and their supply chains are met at the most fundamental level This guidance will consider all relevant factors.
• the complexity of the change to Pb-free and current understanding of the risk, based on industry research and best practices at the time of the change;
• the knowledge that, at the component level, the aerospace industry may not have a great influence over those suppliers’ configuration control methodologies;
• industry standards (e.g ASME Y14.100, ANSI/GEIA-649-A) and best practices
This annex provides essential guidance for the industry to effectively manage configuration control and product identification of components and soldered assemblies during the transition to Pb-free technology The terms Pb-based and Pb-free specifically refer to the termination finishes on components and the solder alloys utilized in soldered assemblies.
This guidance aims to assist electronic systems manufacturers in applying consistent rigor when determining whether a change to Pb-free technology necessitates a new company part number for components and soldered assemblies.
This annex should be used in conjunction with the relevant industry standards, the most recent Pb-free technical knowledge, and other best practices in the field, as it is not a standalone document.
ANSI/GEIA-649-A: National Consensus Standard for Configuration Management
GEIA-HB-649, Implementation Guide for Configuration Management
IEC/PAS 62647-2 (GEIA-STD-0005-2), Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IEC/TS 62647-2, Process management for avionics – Aerospace and defence electronic systems containing lead-free solder – Part 2: Mitigation of the deleterious effects of tin
IPC/JEDEC J-STD-609, Marking and Labeling of Components, PCBs and PCBAs to Identify
Lead (Pb), Pb-Free and Other Attributes
C.4 Configuration control and product identification
The Pb content of an item may change at the component, board, or equipment level