Bsi bs en 60191 6 18 2010

raising standards worldwide™NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BSI Standards Publication Mechanical standardization of semiconductor devices Part 6-18

raising standards worldwide™

NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW

BSI Standards Publication

Mechanical standardization of semiconductor devices

Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages — Design guide for ball grid array (BGA)

BS EN 60191-6-18:2010

Incorporating corrigendum May 2010

Compliance with a British Standard cannot confer immunity from legal obligations.

This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 April 2010

Date Text affected

BRITISH STANDARD

BS EN 60191-6-18:2010

corrigendum incorporating

The start and finish of introduced or altered by corrigendum is indicated

in the by tags altered by is indicated in

Implementation of IEC corrigendum May 2010

IEC corrigendum May 2010 text

text Text

May 2010

Central Secretariat: Avenue Marnix 17, B - 1000 Brussels

© 2010 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members

Ref No EN 60191-6-18:2010 E

ICS 31.080.01

English version

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings

of surface mounted semiconductor device packages -

Design guide for ball grid array (BGA)

(IEC 60191-6-18:2010)

Normalisation mécanique

des dispositifs à semiconducteurs -

Partie 6-18: Règles générales

pour la préparation des dessins

d'encombrement des dispositifs

à semiconducteurs

pour montage en surface -

Guide de conception pour les boîtiers

matriciels à billes (BGA)

(CEI 60191-6-18:2010)

Mechanische Normung von Halbleiterbauelementen - Teil 6-18: Allgemeine Regeln für die Erstellung

von Gehäusezeichnungen von SMD-Halbleitergehäusen - Konstruktionsleitfaden

für Ball-Grid-Array (BGA) (IEC 60191-6-18:2010)

This European Standard was approved by CENELEC on 2010-02-01 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member

This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom

- 2 -

Foreword

The text of document 47D/753A/FDIS, future edition 1 of IEC 60191-6-18, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-18 on 2010-02-01

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CEN and CENELEC shall not be held responsible for identifying any or all such patent rights

The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical national standard or by endorsement (dop) 2010-11-01 – latest date by which the national standards conflicting

with the EN have to be withdrawn (dow) 2013-02-01 Annex ZA has been added by CENELEC

Endorsement notice

The text of the International Standard IEC 60191-9-18:2010 was approved by CENELEC as a European Standard without any modification

In the official version, for Bibliography, the following notes have to be added for the standards indicated:

IEC 60191-6-2 NOTE Harmonized as EN 60191-6-2

IEC 60191-6-4 NOTE Harmonized as EN 60191-6-4

IEC 60191-6-5 NOTE Harmonized as EN 60191-6-5

- 3 -

Annex ZA

(normative)

Normative references to international publications with their corresponding European publications

The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies

of outline drawings of surface mounted semiconductor device packages

– 4 –

CONTENTS

1 Scope 5

2 Normative references 5

3 Terms and definitions 5

4 Terminal position numbering 6

5 Nominal package dimension 6

6 Symbols and drawings 7

7 Dimensions 10

8 Recommended BGA variations 16

Bibliography 20

Figure 1 – Cavity down type 7

Figure 2 – Cavity up type 8

Figure 3 – Pattern of terminal position areas 9

Figure 4 – Example of the terminal depopulations 15

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability 10

Table 2 – Group 2: Dimensions appropriate to mounting and gauging 13

Table 3 – Combinations of D, E, e, MD, ME, and n 14

Table 4 – P-BGA (Cavity up) 1,27 mm pitch 16

Table 5 – P-BGA (Cavity up) 1,0 mm pitch 16

Table 6 – P-BGA (Cavity down) 1,27 mm pitch 18

Table 7 – T-BGA 1,27 mm pitch 18

Table 8 – T-BGA 1,0 mm pitch 19

Table 9 – P-BGA and C-BGA (Flip-chip interconnection) 1,0 mm pitch 19

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

– 5 –

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-18: General rules for the preparation of outline drawings

of surface mounted semiconductor device packages –

Design guide for ball grid array (BGA)

1 Scope

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger

2 Normative references

The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition

of the referenced document applies

IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for

the preparation of outline drawings of surface mounted semiconductor device packages

3 Terms and definitions

For the purposes of this document, the terms and definitions given IEC 60191 (series) and the following apply

P-BGA (Flip chip interconnection)

BGA with an organic substrate and a die bonded to a substrate through metal bumps

– 6 –

3.6

recommended BGA variation

BGA variation with the specific dimensions and ball counts as the first choice for production packages other than recommended BGA variations are the least choice for production to avoid endless proliferation of BGA outlines

4 Terminal position numbering

When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA,

AB, etc., while terminal columns are numbered from left to right starting with 1 Terminal positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1, or AC34 The letters I, O, Q, S, X and Z are not used for naming the terminal rows

5 Nominal package dimension

A nominal package dimension is defined as “the package width (E) × length (D)”, which is expressed in the tenths place in millimetre

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

– 7 –

6 Symbols and drawings

BGA outline is shown in the Figure 1 and 2

The symbols in this figure are explained in IEC 60191-6

Figure 1 – Cavity down type

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

The symbols in this figure are explained in IEC 60191-6

Figure 2 – Cavity up type

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

– 9 – Notes relating to Figure 1 and Figure 2:

(1) Datum S is defined as the seating plane on which a package free stands by contact of the balls

(2) The distance between the centrelines of any two adjacent rows or columns of balls

(3) The hatched zone indicates the index-marking area where whole index mark will be contained (4) The profile tolerance that controls of package size and orientation is applied to all four sides of the package outline

(5) The tolerance of position that controls the relationship of the balls applies to all balls

(6) The terminal diameter “bp” is the maximum diameter of individual balls as measured in the plane parallel to the seating plane

(7) It shows the lid made of mould compound, glob top resin, metal cap, ceramics, etc It may be flat, convex, or concave shape

(8) The primary stand-off height is defined by the height from the seating plane to the package substrate

(9) The secondary stand-off height is defined by the height from the seating plane to the lid that is the lowest surface on the cavity-down configuration

(10) SD and SE are the dimensions that define the positions of balls next to the datum A and B

NOTE An array pattern of permissible terminal-existing zones including true position tolerance is shown in Figure

The symbols in this figure are explained in IEC 60191-6

Figure 3 – Pattern of terminal position areas

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

E × D (1) A nominal package dimension is defined as “the

package width (E) × length (D)”, which is expressed in the tenths place in millimetre

(2) Variations on nominal package dimensions are:

10,0 ×10,0 31,0 ×31,0 11,0 ×11,0 33,0 ×33,0 12,0 ×12,0 35,0 ×35,0 13,0 ×13,0 37,5 ×37,5 14,0 ×14,0 40,0 ×40,0 15,0 ×15,0 42,5 ×42,5 16,0 ×16,0 45,0 ×45,0 17,0 ×17,0 47,5 ×47,5 18,0 ×18,0 50,0 ×50,0 19,0 ×19,0 52,5 ×52,5 20,0 ×20,0 55,0 ×55,0 21,0 ×21,0 57,5 ×57,5 23,0 ×23,0 60,0 ×60,0

Refer to Table 4 through 9

Package length D (1) Package length D

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

– 11 –

Table 1 (continued)

Unit:mm

Term Symbol Specification Recommended value

Package width E (1) Package width E

Profile tolerance of package body

”A” includes heat slug thickness, package warpage and tilt errors

“A” does not include the height of external heat sink or chip capacitors

-

Primary off height A1

e A1 min A1 nom A1 max1,27

1,00

0,5 0,4

0,6 0,5

0,7 0,6

Terminal grid

1,27 1,00

−

Terminal diameter

bp

1,27 1,00

0,60 0,50

0,75 0,60

0,90 0,70

−

Positional tolerance with respect to the body datum

x1

1,27 1,00

0,30 0,25

−

terminal positional tolerance

Terminal-to-x2

1,27 1,00

0,15 0,10

1,27 1,00

0,20 0,20

−

Parallelism tolerance of the top surface

Center terminal(s) position in length

SD When MD is an odd number, SD = 0

When MD is an even number, SD = e /2

−

Center terminal(s) position in width

SE When ME is an odd number, SE = 0

When ME is even number, SE = e /2

position SD and SE Any terminal balls may be omitted from the terminal matrix

–

Number of terminals

through 9 Maximum

matrix size in length

MD

Maximum matrix size in width

Overhang dimension in width

– 15 –

Full grid 4 rows in perimeter

matrix

5 rows in perimeter matrix

6 rows in perimeter matrix

7 rows in perimeter

Index marking is in the left bottom corner

Figure 4 – Example of the terminal depopulations

BS EN 60191-6-18:2010

EN 60191-6-18:2010 (E)

– 16 –

8 Recommended BGA variations

Table 4 – P-BGA (cavity up) 1,27 mm pitch

Number of rows in centre matrix

Number of terminals

Number of rows in centre matrix

Number of terminals

Number of terminals

Number of terminals

– 20 –

Bibliography

IEC 60191-6-2, Mechanical standardization of semiconductor devices – Part 6-2: General

rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

IEC 60191-6-4, Mechanical standardization of semiconductor devices – Part 6-4: General

rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of ball grid array (BGA)

IEC 60191-6-5, Mechanical standardization of semiconductor devices – Part 6-5: General

rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA)

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