Bsi bs en 60191 6 12 2011

BSI Standards PublicationMechanical standardization of semiconductor devices Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device pa

BSI Standards Publication

Mechanical standardization

of semiconductor devices

Part 6-12: General rules for the preparation

of outline drawings of surface mounted semiconductor device packages – Design guidelines for fine-pitch land grid array (FLGA)

National foreword

This British Standard is the UK implementation of EN 60191-6-12:2011 It isidentical to IEC 60191-6-12:2011 It supersedes BS EN 60191-6-12:2002which is withdrawn

The UK participation in its preparation was entrusted to Technical CommitteeEPL/47, Semiconductors

A list of organizations represented on this committee can be obtained onrequest to its secretary

This publication does not purport to include all the necessary provisions of acontract Users are responsible for its correct application

© BSI 2011ISBN 978 0 580 70310 2ICS 31.080.01

Compliance with a British Standard cannot confer immunity from legal obligations.

This British Standard was published under the authority of the StandardsPolicy and Strategy Committee on 31 August 2011

Amendments issued since publication

Amd No Date Text affected

Management Centre: Avenue Marnix 17, B - 1000 Brussels

© 2011 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members

Ref No EN 60191-6-12:2011 E

English version

Mechanical standardization of semiconductor devices -

Part 6-12: General rules for the preparation of outline drawings of surface

mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

(IEC 60191-6-12:2011)

Normalisation mécanique des dispositifs à

semiconducteurs -

Partie 6-12: Règles générales pour la

préparation des dessins d'encombrement

des boîtiers des dispositifs à

semiconducteurs à montage en surface -

Lignes directrices de conception pour les

boîtiers matriciels à plots et à pas fins

(FLGA)

(CEI 60191-6-12:2011)

Mechanische Normung von Halbleiterbauelementen - Teil 6-12: Allgemeine Regeln für die Erstellung von Gehäusezeichnungen von SMD-Halbleitergehäusen -

Konstruktionsleitfaden für Land-Grid-Array (FLGA)

Feinraster-(IEC 60191-6-12:2011)

This European Standard was approved by CENELEC on 2011-07-13 CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration

Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member

This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified

to the Central Secretariat has the same status as the official versions

CENELEC members are the national electrotechnical committees of Austria, Belgium, Bulgaria, Croatia, Cyprus, the Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom

Foreword

The text of document 47D/784/CDV, future edition 2 of IEC 60191-6-12, prepared by SC 47D, Mechanical standardization for semiconductor devices, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60191-6-12 on 2011-07-13

This European Standard supersedes EN 60191-6-12:2002

EN 60191-6-12:2011 includes the following significant changes with respect to EN 60191-6-12:2002: a) scope is expanded so that this standard include the square type FLGA The title of this standard has been changed accordingly: “Rectangular type” has been deleted from the title;

b) ball pitch of 0,3 mm has been added;

c) datum is changed from the body datum to the ball datum;

d) combination lists of D, E, MD, and ME have been revised

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CEN and CENELEC shall not be held responsible for identifying any or all such patent rights

The following dates were fixed:

– latest date by which the EN has to be implemented

at national level by publication of an identical

national standard or by endorsement (dop) 2012-04-13

– latest date by which the national standards conflicting

with the EN have to be withdrawn (dow) 2014-07-13

Annex ZA has been added by CENELEC

Annex ZA

(normative)

Normative references to international publications with their corresponding European publications

The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies

EN 60191-6 -

CONTENTS

1 Scope 5

2 Normative references 5

3 Terms and definitions 5

4 Terminal position numbering 6

5 Nominal package dimension 6

6 Outline drawings and principle dimensions 7

7 Dimensions 10

Figure 1 – Flange-type FLGA 6

Figure 2 – Rectangle-type FLGA 6

Figure 3 – Flange-type FLGA 7

Figure 4 – Rectangle-type FLGA 8

Figure 5 – Mechanical gauge drawing e 9

Figure 6 – Pattern of terminal position area f 9

Table 1 – Group 1: Dimensions appropriate to mounting and interchangeability 10

Table 2 – Group 2: Dimensions and tolerances 14

Table 3 – Combination list of D, E, MD, and ME – e = 0,80mm pitch 15

Table 4 – Combination list of D, E, MD, and ME – e = 0,65 mm pitch 16

Table 5 – Combination list of D, E, MD, and ME – e = 0,50 mm pitch 17

Table 6 – Combination list of D, E, MD, and ME – e = 0,40 mm pitch 18

Table 7 – Combination list of D, E, MD, and ME – e = 0,30 mm pitch 19

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES – Part 6-12: General rules for the preparation of outline drawings

of surface mounted semiconductor device packages –

Design guidelines for fine-pitch land grid array (FLGA)

1 Scope

This part of IEC 60191 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less

2 Normative references

The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition

of the referenced document (including any amendments) applies

IEC 60191(all parts), Mechanical standardization of semiconductor devices

IEC 60191-6, Mechanical standardization of semiconductor devices – Part 6: General rules for

the preparation of outline drawings of surface mounted semiconductor device packages

3 Terms and definitions

For the purposes of this document, the terms and definitions given IEC 60191 series and the following apply

NOTE Flange-type FLGA, shown in Figure 1, is generally cut by singulation press, thus resulting in larger dimensional errors than the singulation by dicing saw

Figure 1 – Flange-type FLGA

Figure 2 – Rectangle-type FLGA

4 Terminal position numbering

When a package is viewed from the terminal side with the index corner in the bottom left corner position, terminal rows are lettered from bottom to top starting with A, then B, C,,,, AA,

AB, etc,, whereas terminal columns are numbered from left to right starting with 1 Terminal

positions are designated by a row-column grid system and shown as alphanumeric identification, e.g., A1, B1

The letters I, O, Q, S, X and Z shall not be used for naming the terminal rows

5 Nominal package dimension

A nominal package dimension is defined as “the package width (E) × length (D)”, which is

expressed in the tenths place in millimeter

IEC 1163/11

IEC 1164/11

6 Outline drawings and principle dimensions

The FLGA outline is shown in Figures 3 and 4

NOTE For footnotes relating to this figure, see Figure 4

Figure 3 – Flange-type FLGA

NOTES relating to Figures 3 and 4:

a Datum S is defined as the seating plane on which a package free stands by contact of the balls

b The hatched zone is an index-marking area, where whole index mark will be basically contained in 1/16 of the body size, In case it is physically difficult, index mark can extend more than 1/16 but no more than a quarter of the body size

c True positional tolerances of terminals, x1 and x2, are applied to all terminals

d The terminal diameter b is the maximum diameter of individual balls as measured in the plane parallel to the seating plane

e An array of terminal-existence areas with regard to the datum S, A, and B is shown in the mechanical gauge drawing in Figure 5

f The array of terminal-existence areas with regard to the datum S is shown in Figure 6

Figure 4 – Rectangle-type FLGA

NOTE The symbols in this figure are explained in IEC 60191-6

E x D A package nominal dimension is defined as “the package width (E) x

length (D), which is expressed in the tenths place in millimeter -

Package length D

(1) Range of Dnom: from 1,5 to 21,0

(2) Interval of DnomFor square FLGA with Dnom ≥ 15,0, Dnom is an integer

For other FLGA, the number in the tenths place of Dnom is either 0 or

For square FLGA with Enom ≥ 15,0, Enom is an integer

For other FLGA, the number in the tenths place of Enom is either 0 or

-A = 0,30

0,40 0,50 0,65 0,80 1,00 1,20 1,70 2,00

For C-FLGA:

e min nom max

0,80 0,45 0,50 0,55 0,65 0,35 0,40 0,45 0,50 0,25 0,30 0,35 0,40 0,20 0,25 0,30

For P-FLGA and T-FLGA

e min nom max

0,80 0,35 0,40 0,45 0,65 0,30 0,35 0,40 0,50 0,20 0,25 0,30 0,40 0,15 0,20 0,25 0,30 0,12 0,15 0,18

ME x (MD -1) (ME -1) x (MD -1)

(ME +1) x MD

ME x (MD +1) (ME +1) x (MD +1)

MD ≤( Dnom - bmax – vD -X1 - x2 - 2u)/ e+1

ME ≤( Enom - bmax – vE - x1 - x2 - 2u)/ e+1

u = 0,11 Numbers of matrices in ME and MD are shown in Table 3

“u” denotes edge clearance

e y

0,80 0,10 0,65 0,10 0,50 0,08 0,40 0,08 0,30 0,05

Table 2 – Group 2: Dimensions and tolerances

Table 3 – Combination list of D, E, MD, and ME – e = 0,80mm pitch

Table 4 – Combination list of D, E, MD, and ME – e = 0,65 mm pitch

Table 5 – Combination list of D, E, MD, and ME – e = 0,50 mm pitch

Table 6 – Combination list of D, E, MD, and ME – e = 0,40 mm pitch

Table 7 – Combination list of D, E, MD, and ME – e = 0,30 mm pitch

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