Bsi bs en 04660 004 2011

13 Figure 4 — Module Connector Interface Definition and Identification connector inserts shown for example only .... The module shall have the following attributes: requirements identif

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BSI Standards Publication

Aerospace series — Modular and Open Avionics Architectures

Part 004: Packaging

This British Standard is the UK implementation of EN 4660-004:2011.The UK participation in its preparation was entrusted to TechnicalCommittee ACE/6, Aerospace avionic electrical and fibre optictechnology.

A list of organizations represented on this committee can beobtained on request to its secretary

This publication does not purport to include all the necessaryprovisions of a contract Users are responsible for its correctapplication

© BSI 2011ISBN 978 0 580 62444 5ICS 49.090

Compliance with a British Standard cannot confer immunity from legal obligations.

This British Standard was published under the authority of theStandards Policy and Strategy Committee on 31 March 2011

Amendments issued since publication

Série aérospatiale - Architectures Avioniques Modulaires et

Ouvertes - Partie 004: Packaging Luft- und Raumfahrt - Modulare und offene Avionikarchitekturen - Teil 004: Packaging

This European Standard was approved by CEN on 26 June 2010

CEN members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN member

This European Standard exists in three official versions (English, French, German) A version in any other language made by translation under the responsibility of a CEN member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions

CEN members are the national standards bodies of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom

EUROPEAN COMMITTEE FOR STANDARDIZATION

C O M I T É E U R O P É E N D E N O R M A L I S A T I O N

E U R O P Ä I S C H E S K O M I T E E FÜ R N O R M U N G

Management Centre: Avenue Marnix 17, B-1000 Brussels

Contents

Foreword 4

0 Introduction 5

0.1 Purpose 5

0.2 Document structure 6

1 Scope 6

2 Normative references 7

3 Terms, definitions and abbreviations 8

3.1 Terms and definitions 8

3.2 Abbreviations 8

3.3 Precedence 9

3.4 Definition of terms 9

4 Generic module specification 11

4.1 Introduction 11

4.2 Module description 12

4.3 Module Physical Specification 12

4.4 Module Physical Interface - Connector 16

4.5 Module Physical Interface - Cooling 20

4.6 Module Physical Interface – Insertion Extraction Device 23

5 Module Mechanical Tests 25

5.1 Master gauge test 25

5.2 Module insertion and extraction 25

6 Guidelines for a rack slot 27

6.1 Introduction 27

6.2 Interchangeability 27

6.3 Rack Slot Design Requirements 27

6.4 Connector interface 28

6.5 Conduction Cooled Interface 29

6.6 Air Flow Cooled Interface 30

6.7 Relationship between Cooling, Connector and IED Rack Interfaces 32

7 Typical modular avionics environment 33

7.1 Ambient pressure (altitude) 34

7.2 Humidity 34

7.3 High and low temperatures 34

7.4 Thermal shocks 35

7.5 Salt spray 36

7.6 Vibrations 36

7.7 Accelerations 37

7.8 Mechanical shocks 38

7.9 Contamination resistance 39

7.10 Flame resistance 39

7.11 Fungus resistance 39

7.12 Rain 39

7.13 Acoustic noise 40

7.14 Electromagnetic environment 40

7.15 Explosive atmosphere 40

7.16 Nuclear, Biological and Chemical (NBC) Hazards 40

7.17 Sand and dust 42

7.18 Single Event Upset / Multiple Bit Upset 42

7.19 Module Tempest 42

Figures

Figure 1 — ASAAC Standard Documentation Hierarchy 5

Figure 2 — Module definitions 10

Figure 3 — CFM dimensions 13

Figure 4 — Module Connector Interface Definition and Identification (connector inserts shown for example only) 16

Figure 5 — Preferred Contact Identification (viewed from outside module, lowest numbered contact is towards Side C of the cassette) 17

Figure 6 — Contact Identification – MT Ferrule 18

Figure 7 — Polarisation Key identification 19

Figure 8 — Conduction Cooled Module – Cooling Interface Definition 20

Figure 9 — Air cooled module – Cooling interface definition 22

Figure 10 — IED Hook characteristics 24

Figure 11 — IED Implementation example 25

Figure 12 — Rack Connector Physical Interface 28

Figure 13 — Conduction Cooled rack guide rail 29

Figure 14 — Air Flow Through and Direct Air Flow cooled rack guide rail 30

Figure 15 — Air Flow Around cooled rack guide rail 31

Tables

Table 2 — Ambient pressure in relation to altitude 34

Table 3 — Temperature environmental conditions - Conditioned bay 35

Table 4 — Temperature environmental conditions - Unconditioned bay 35

Table 5 — Temperature environmental conditions - Storage 35

Table 6 — Thermal shocks 36

Table 7 — Sinusoidal vibrations 36

Table 8 — Rotational accelerations 37

Table 9 — Transversal accelerations 38

Table 10 — Functional Shocks 38

Table 11 — Summary of environment and bonding environmental Conditions 40

Table 12 — Initial Nuclear radiation conditions 41

Table 13 — Nuclear hardening conditions 41

This European Standard shall be given the status of a national standard, either by publication of an identical text

or by endorsement, at the latest by August 2011, and conflicting national standards shall be withdrawn at the latest by August 2011

Attention is drawn to the possibility that some of the elements of this document may be the subject of patent rights CEN [and/or CENELEC] shall not be held responsible for identifying any or all such patent rights

According to the CEN/CENELEC Internal Regulations, the national standards organizations of the following countries are bound to implement this European Standard: Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom

0 Introduction

0.1 Purpose

This document is produced under contract ASAAC Phase II Contract n°97/86.028

The purpose of the ASAAC Programme is to define and validate a set of open architecture standards, concepts and guidelines for Advanced Avionics Architectures (A3) in order to meet the three main ASAAC drivers The standards, concepts and guidelines produced by the Programme are to be applicable to both new aircraft and update programmes from 2005

The three main goals for the ASAAC Programme are:

1 Reduced life cycle costs

2 Improved mission performance

3 Improved operational performance

The ASAAC standards are organised as a set of documents including:

A set of agreed standards that describe, using a top down approach, the Architecture overview to all interfaces required to implement the core within avionics system

The guidelines for system implementation through application of the standards

The document hierarchy is given hereafter: (in this figure the document is highlighted)

Guidelines for System Issues

Standard for Architecture

Standard for Common Functional Modules

Standard for Communications and

Network

Standard for Packaging

Standard for Software

Figure 1 — ASAAC Standard Documentation Hierarchy

0.2 Document structure

The document contains the following clauses:

Clause 1, Scope

Clause 2, Normative references

Clause 3, Terms, definitions and abbreviation

Clause 4, Generic module specification

Clause 5, Module Mechanical Tests

Clause 6, Guidelines for a rack slot

Clause 7, Typical modular avionics environment

1 Scope

The purpose of this standard is to establish uniform requirements for Packaging for the Common Functional Modules (CFM) within an Integrated Modular Avionic (IMA) system, as defined per ASAAC It comprises the module physical properties and the Module Physical Interface (MPI) definitions together with guidelines for IMA rack and the operational environment

The characteristics addressed by the Packaging Standard are:

Interchangeability:

inserted into any rack slot conforming to the standard for the cooling method

interface will function correctly when inserted into any rack slot conforming to the same MPI definition Maintainability:

2 Normative references

The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies For undated references, the latest edition of the referenced document (including any amendments) applies

EN 2101, Aerospace series — Chromic acid anodizing of aluminium and wrought aluminium alloys

EN 2284, Aerospace series — Sulphuric acid anodizing of aluminium and wrought aluminium alloys

EN 2437, Aerospace series — Chromate conversion coatings (yellow) for aluminium and aluminium alloys

EN 4660-001, Aerospace series — Modular and Open Avionics Architectures — Part 001: Architecture

EN 4660-002, Aerospace series — Modular and Open Avionics Architectures — Part 002: Common Functional

Modules

EN 4660-003, Aerospace series — Modular and Open Avionics Architectures — Part 003: Communications/Network

EN 4660-005, Aerospace series — Modular and Open Avionics Architectures — Part 005: Software

— Volume 1 — System Management

— Volume 2 — Fault Management

— Volume 3 — Initialisation and Shutdown

— Volume 4 — Configuration / Reconfiguration

— Volume 5 — Time Management

— Volume 6 — Security

— Volume 7 — Safety

ARINC 600, Air transport avionics — Equipment interfaces

Def Stan 03-18, Chromate Conversion Coatings (Chromate Filming Treatments) Grades: Standard and Brushing

for Aluminium and Aluminium Alloys

Def Stan 03-24, Chromic Acid Anodizing of Aluminium and Aluminium Alloys

Def Stan 03-25, Sulphuric Acid Anodizing of Aluminium and Aluminium Alloys

1) In preparation at the date of publication of this standard

BS 5599, Specification for hard anodic oxidation coatings on aluminium and its alloys for engineering purposes

2)

MIL-C-26074E, Coatings, Electroless Nickel Requirements

MIL-A-8625E, Anodic Coatings for Aluminium and Aluminium Alloys

MIL-C-81706, Chemical Conversion Materials for Coating Aluminium and Aluminium Alloys

MIL-C-5541, Chemical Conversion Coatings on Aluminium and Aluminium Alloys

3 Terms, definitions and abbreviations

3.1 Terms and definitions

Use of “shall”, “should” and “may” within the standards observe the following rules:

of the standard It is expected that such recommendations or advice will be followed unless good reasons are stated for not doing so

the standard

3.2 Abbreviations

2) Replaces Def Stan 03-26

MPI Module Physical Interface

3.3 Precedence

Figures in this document have precedence over text

3.4 Definition of terms

3.4.1 General terms

Backplane A structure containing optical and electrical communication paths and

electrical power supply wiring between modules This shall be a removable structure or integrated into the rack

Cassette Mechanical frame enclosing the electrical components of the module

Connector A device to provide all of the electrical and optical connections between

the cassette and the backplane

The connector fixed to the module cassette plugs into the corresponding connector of the backplane

It comprises a shell, inserts contacts and ferrules

Contact A single signal connection, either an electrical pin/socket or a single fibre

In the case of fibre optic contacts this does not necessarily imply the mating parts are in mechanical contact

Cooling Interface Surface which contributes to the removal of heat from the module

Ferrule A housing and alignment device for one or more optical fibres

Insert A section of a connector containing a number of ferrules or contacts

Insertion Extraction Device

(IED) A device to aid the insertion and extraction of the module from the rack and give mechanical advantage over the mating forces associated with

the connector It also provides the retention system for the module within the rack such that the module connector remains mated under all conditions specified

Module The module is a grouping of electronic devices, assembled together to

perform a specific function, into a flight-line protected hardware assembly This is the Common Functional Module The CFM is replaceable at first line

Rack A mechanical arrangement for housing avionics equipment This provides

physical support, environmental protection and cooling for the modules

Shell The outer mating parts of the connector that provide the structure of the

connector, fixings to the module and backplane parts and the support for the Inserts

3.4.2 Module mechanical items

A Common Functional Module comprises:

The volume of the cassette is delimited by a cuboid The module is referenced against a Cartesian Reference System as represented on Figure 2

Volume for Insertion/

Extraction Device

Connector

Side BSide A

Module Header

Side D

Insertion DirectionZ

X

Y

Guide Edge

Reference PlaneSide C

Volume for Insertion/

Extraction Device

Connector

Side BSide A

Module Header

Side D

Insertion DirectionZ

X

Y

Guide Edge

Reference PlaneSide C

Figure 2 — Module definitions

Guide Edge Edge of the CFM running along the X axis It defines the location of the module

within the rack

Height The cassette dimension in the Z-axis It is measured from cassette Side C to

cassette Side D

Length The cassette dimension in the X-axis measured from the Reference Plane to the

module header (this excludes the Insertion Extraction Device and the connector)

Module header The surface of the cassette parallel to the Reference Plane, and opposite to the

cassette surface contained within the Reference Plane The IED shall be mounted on this surface

Side A Surface of the cassette contained within the X, Z plane Viewing the module in

the direction of insertion, with the cassette Side C at the top, Side A is to the left

Side B Surface of the cassette parallel to and furthest from the X, Z plane Viewing the

module in the direction of insertion, with the cassette Side C at the top, Side B is

to the right

Side C Surface of the cassette parallel to and furthest from the X, Y plane

It contains one of the two cassette cooling interfaces, the other being within Side D

Side D Surface of the cassette contained within the X, Y plane It contains one of the

two cassette cooling interfaces, the other being within Side C

Reference Plane Plane defined by the Y and Z axis It is perpendicular to the direction of insertion

of the module and passes through the mating surface between the cassette and the connector

Width The cassette dimension in the Y-axis of the module, measured from Side A to

Side B

3.4.3 Tolerances

4 Generic module specification

4.1 Introduction

This clause specifies the physical properties and the principle physical interfaces for ASAAC Common Functional Modules, i.e the Module Physical Interface (MPI) The MPI comprises:

The ASAAC Common Functional Module supports four cooling techniques detailed in 4.5 These being:

This clause specifies those parameters that shall apply to all module types

In addition, Guidelines for the Module guide to rack slot interfaces compatible with the MPI is provided in Clause 6

It is assumed that a System Design Specification will be raised for each specific project implementation It will define the CFM characteristics which are not imposed by the standard

4.2 Module description

A module consists of an enclosed component mounting area, a connector and an insertion extraction device The module shall have the following attributes:

requirements identified in the Clause 7, both during use and during handling, storage and transportation,

the rest of the avionics system,

that an incorrectly fitted CFM shall be prevented from making any electrical connection,

conditions specified herein and yet allows for easy insertion and removal of the module,

4.3 Module Physical Specification

4.3.1 Module envelope: height, length, width

The module envelope comprises the IED, the cassette and the connector The principle dimensions for the cassette are as shown in Figure 3 These dimensions shall be:

 Height: 160 mm +0.0 / -0.2 mm

Detailed dimensions of the connector, IED and mating structure parts are given in 4.4 and 4.6

The modules shall be capable of being mounted on a pitch of 26 mm (modular)

Figure 3 — CFM dimensions 4.3.2 Module Distortion

All warp, twist and surface contour tolerance shall not violate the module envelope defined in 4.3.1

4.3.3 Module mass

NOTE It is an objective of the IMA concept to reduce the overall weight of the packaging associated with the avionics The module construction should aim to minimise the total weight of the module

4.3.4 Module insertion and extraction

The modules shall be able to be installed and removed from the rack without the need for special tools nor for manual adjustment of the module once installed in order for it to function

It shall also be possible to perform maintenance in the flight line environment (temperature, humidity etc.) Maintenance shall be possible whilst wearing Nuclear, Biological and Chemical (NBC) protective clothing

Module insertion and extraction shall also be compliant with the tests specified in Clause 5

4.3.5 Electrical safety

Modules containing hazardous voltage shall have exposed surfaces connected to the safety ground

4.3.6 Materials

4.3.6.1 Use of flammable materials

The equipment shall be designed/constructed from materials that do not support combustion

No material used in the construction of the module shall constitute a fire hazard

Under condition of overheating and when exposed to fire no harmful concentrations of noxious products or explosive gases shall emanate

4.3.6.2 Finishes and protective treatments

There shall be no sharp edges or other imperfections which could cause injuries during transport or maintenance

Equipment metal parts including spares shall be either inherently resistant to or adequately protected against the corrosive actions to which the equipment may be subjected when in storage or during normal service life, as detailed in the appropriate environmental standard

All materials used in the construction of the module shall be fungus inert or protected against fungal growth

No device containing mercury or its compounds shall be used, in any state, in the construction of the module The module shall not be exposed to any such material during testing

4.3.6.2.1 Use of compatible materials

Dissimilar metals shall not be used in intimate contact unless suitably protected against electrolytic corrosion

4.3.6.2.2 Anodic treatment and plating

Copper and copper composite frames may be electroless nickel plated in accordance with MIL-C-26074, class 1, grade A

Aluminium, aluminium alloy and aluminium composite parts shall receive protective treatments in accordance with the following Table 1:

Table 1 — Allowed aluminium protective treatments

Sulphuric acid

Close tolerance parts which cannot be painted Sulphuric acid

Sulphuric acid

Normal thickness 50-75um Other thickness to be specified, reduces fatigue strength

4.3.7 Module Identification

The module shall be identified and marked with appropriate identifiers as specified herein

4.3.7.1 Module Key Code

A symbol key code, assigned to each module type, shall be marked on the module header The marking shall be located at the header end closest to Side C of the cassette The standardisation body is responsible for the generation of an approved code

The key code shall also be printed on the component area of the module such that when the cover, insertion extraction device and connector are removed the module type is still identifiable The key code shall also be

marked on each module cover

4.3.7.2 Module Part Number

The module part number shall be marked as specified, on a visible part of the connector shell

All standard module part numbers will be assigned by the standardisation body, the module part number shall be

made up of:

Specification

Type Specification Number

Detail Specification Number

Environmental Class

Detail Specification Revision Letter

Detail Specification Amendment Number

For the original CFM, the detail specification revision letter and amendment number shall be left blank

4.3.7.3 Module Certification Mark

All CFMs which meet the requirements of a detailed specification, shall carry the appropriate certification mark

on the module header

4.3.7.4 Module Name and Type

Each module shall have its name and type marked as specified, on the connector shell or frame The name marked on the module shall agree with the name in the title of the detail specification, however abbreviations in accordance with that specification are permissible The standardisation body is responsible for the generation of

an approved name

4.3.7.5 Vendor's Module Identification

Each module shall be marked on the module header with either the vendor's identification code or vendor's name The vendor's code, if utilised, shall be a numerical code determined by the standardisation body The vendor's code shall be marked on each module as specified No other module vendor's part number shall be marked on the module

4.3.7.6 Module Serial number

Each module shall have a serial number including the vendor's designation as specified The serial number shall

be located on the top surface of the header used for marking the key code The serial number shall consist of a number of digits with significant digits prefixed with zeros, as required The serial number shall be affixed to the module prior to electrical acceptance tests

4.3.7.7 Module Date Code

Each module shall be marked as specified, with a six digit date code on the module header, designating the week and year of manufacture The first four digits of the code shall indicate the year of manufacture and the remaining two digits shall indicate the calendar week When the number of the week is a single digit, it shall

4.4 Module Physical Interface - Connector

This subclause defines the part of the Module Physical Interface (MPI) Specification associated to the module connector It defines the interface that will mate to the IMA rack and the backplane connector part defined in Clause 6 The module connector shall provide the following features:

4.4.1 Connector shell dimensions

The connector shell outline shall be as defined in Figure 4

Top polarising key Bottom polarising key

Figure 4 — Module Connector Interface Definition and Identification

(connector inserts shown for example only)

4.4.2 Module connector shell location

The connector shell shall be rigidly mounted on the module as shown in Figure 4 such that no part of the connector protrudes beyond the Side A and Side B surfaces of the module

Any "float" required between the modules and the backplane at the connector shells shall be provided in the backplane part

4.4.3 Connector Cavities, Inserts, Ferrules and Contacts

The connector shall incorporate three identical cavities with dimensions compatible with ARINC 600 shell size 1 Each cavity shall be capable of containing any one of the following, but not limited to, insert types:

“Electrical - Power” This insert will provide 8 size 16 electrical power contacts

The Electrical Power contact arrangement shall allow “make last/break first” operation when the module is respectively removed from or inserted into the rack

Figure 5 — Preferred Contact Identification

(viewed from outside module, lowest numbered contact is towards Side C of the cassette)

4.4.3.2 Insert Allocation

The mix of connector inserts in the connector shell shall be defined by the System Design Specification

Examples (Informative) include the following:

High density optical:

Cavity A: Up to 48 guided optical contacts,

Cavity B: Up to 48 guided optical contacts,

Cavity C: Electrical power insert

Cavity A: Up to 48 guided optical contacts,

Cavity B: Electrical power insert,

Cavity C: Electrical power insert

4.4.3.3 “Guided Optical” inserts and ferrules

Each guided optical insert type shall accommodate four “MT” optical fibre contacts

The optical insert may have a "module" and a "back-plane" variant

Each fibre optic ferrule may provide 4, 8 or 12 optical fibre contacts (see Figure 6) The MT alignment pins shall

be retained in the module half of the connector The module half of the MT connector shall be fixed in position relative to the insert

The MT ferrule shall support and interface all fibre types with a nominal external diameter of 125 µm (cladding diameter) The internal geometry of the fibre, i.e multimode or single mode, will depend on specific implementations and shall be specified in the System Design Specification

If not all contact locations are to be used, dummy contacts or similar items shall be provided to maintain the environmental performance specified

Guide pins Ø0.127 +0.001/-0 4,8 or 12 Fibre holes 0.250 spacing about

guide pin centreline

Normal safety precautions regarding pins supplying high voltages shall be observed

4.4.3.5 Electrical - Power Contacts

This insert shall provide up to 8 size 16 electrical power contacts

 Electrical and optical contacts

4.4.5 Guide pins and sockets

The guide pins of the connector shall be the first part of the module to make contact during mating

The electrical earth shall be provided by a dedicated earth contact integral to the connector design

4.4.6 Keying

The connector interface shall include two polarisation keys, positioned on either side of the electrical and optical cavities, to provide module physical identification The two key positions shall provide 36 unique combinations The identification of the key positions is shown in Figure 7 The allocation of polarisation settings may be related

to the module type and shall be defined by the System Design Specification The key ways shall be positioned asymmetrically to prevent the module being inserted upside down

Dark portion Indicates the

solid part of the key.

Code BF is shown in the

example.

Top polarising key

B F

Bottom polarising key

Dark portion Indicates the

solid part of the key.

Code BF is shown in the

example.

Top polarising key

B F

Bottom polarising key

Figure 7 — Polarisation Key identification 4.4.7 Environmental Protection and Cleaning

The module connector shall provide environmental protection of optical termini at all times when disconnected to ensure termini cleanliness This may be in the form of a removable cover or an integral shutter The module connector shall also allow the optical termini to be easily cleaned when required

4.5 Module Physical Interface - Cooling

4.5.1 Conduction Cooled Module Interface

This subclause specifies the cooling interface for a conduction cooled module, where the heat from the components within the module is conducted through the module structure to the guide rib within the rack and then onto an appropriate cooling medium There is no other cooling path

4.5.1.1 Module outline drawing

The cooling interface for a conduction cooled module is shown on Figure 8

Notes:

1 Dimensions marked are Critical Interface Dimensions

Max Area for Insert Extract Device

Includes any Locking Provision on Rack

Max Area for Insert Extract Device

Includes any Locking Provision on Rack

4.5.1.3 Cooling requirements

Modules implementing conduction cooling shall be designed to be conduction cooled through the guide ribs with

no other cooling path

The module supplier shall provide graphs of rack coolant temperature against the thermal resistance between the module guide rib surface and the rack coolant, on which he shall indicate the region within which the module meets its specified performance They may also be used to indicate the regions within which a certain reliability level is achieved

The graphs shall cover the full altitude range for the module specified in the appropriate environmental standard

4.5.2 Air Cooled Module Interface

This subclause defines the cooling interfaces associated with the three air cooled designs: Air Flow Through (AFT), Air Flow Around (AFA) and Direct Air Flow (DAF)

4.5.2.1 Module outline drawings

The critical cooling parameters of the module are shown on Figure 9