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23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide AMD Thermal, Mechanical, and Chassis Cooling Design Guide This document specifies performance requirements

Publication # 23794 Rev: H

Issue Date: November 2002

AMD

Thermal, Mechanical, and Chassis Cooling

Design Guide

AMD, the AMD Arrow logo, AMD Athlon, AMD Duron, and combinations thereof are trademarks of

Advanced Micro Devices, Inc.

Other product names used in this publication are for identification purposes only and may be trademarks of their respective companies.

© 2000–2002 Advanced Micro Devices, Inc All rights reserved.

The contents of this document are provided in connection with Advanced Micro Devices, Inc (“AMD”) products AMD makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice No license, whether express, implied, arising by estoppel or otherwise, to any intellectual property rights

is granted by this publication Except as set forth in AMD’s Standard Terms and Conditions of Sale, AMD assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right

AMD’s products are not designed, intended, authorized or warranted for use

as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or in any other applica- tion in which the failure of AMD’s product could create a situation where per- sonal injury, death, or severe property or environmental damage may occur.

AMD reserves the right to discontinue or make changes to its products at any time without notice.

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Table of Contents

List of Tables vii

Revision History ix

Summary of Requirements 1

PGA Socket A-Based Processor Thermal Requirements 2

Socket Description 2

Socket A-Based Processor Specifications 3

General Socketed Design Targets 5

Suggested Interface Materials 6

Sample Socket A Heatsink Drawings 7

Socket A Heatsink Design Considerations 7

Socketed Motherboard Restrictions 10

Thermocouple Installation for Temperature Testing 13

Chassis Cooling Guidelines 16

Chassis Airflow 16

Power Supply as Part of the Cooling Solution 17

Rules for Proper Cooling 19

Conclusion 20

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

List of Figures

Figure 1 Socket A 2

Figure 2 Dimensions of Socket A 3

Figure 3 Sample Drawing of Socket A Heatsink 7

Figure 4 Heatsink and Load Pads 8

Figure 5 Motherboard Keepout Area for a Socket A AMD Athlon™ Processor Heatsink 11

Figure 6 Motherboard Keepout Area for a Socket A AMD Duron™ Processor Heatsink 12

Figure 7 Measuring Thermocouple Position 13

Figure 8 Bottom View of Heatsink and Drill Depth 14

Figure 9 Injecting Thermal Grease into Drilled Hole 15

Figure 10 Installed Thermocouple 15

Figure 11 Airflow through the Chassis 16

Figure 12 Power Supply Venting 18

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

List of Tables vii

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

List of Tables

AMD Athlon™ Processor Model 6 3

AMD Athlon™ Processor Model 8 4

AMD Duron™ Processor Model 7 4

for the AMD Athlon™ Processor Model 6 5

for the AMD Athlon™ Processor Model 8 5

for the AMD Duron™ Processor 6

viii List of Tables AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

Revision History ix

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Revision History

November 2002 H Updated values in Tables 1, 2, 3, 4, 5, and 6, and updated dimensions throughout Added

Fan Considerations section Updated PS photos and updated airflow diagram.

March 2002 G Updated Table 1 and Table 3 for total die size, Acore, and pthermal max values

January 2002 F Updated Figure 5, “Motherboard Keepout Area for a Socket A AMD Athlon™ Processor

Heatsink,” on page 11, removing the four mounting holes.

November 2001 E Added Bergquist, Honeywell, Power Devices, and ShinEtsu to the list of Vendors in Table 7,

“Suggested Thermal Interface Materials,” on page 6.

March 2001 D Corrected Athlon™ and Duron™ processor die sizes in tables 1 and 2 on page 4.

February 2001 C Corrected Max Length for heatsink from blank to 60mm, and corrected Min Length for

heatsink from 60mm to blank in Table 4 and in Table 6.

October 2000 B

■ Added mention of AMD Duron processor in the text and added the following tables and figures with AMD Duron information: Table 3 on page 4, Table 6 on page 6, and Figure

6 on page 12.

■ Revised “Suggested Interface Materials” on page 6, and Table 7 on page 6.

■ Added Section, "Thermocouple Installation for Temperature Testing" on page 13, and added Figure 7 through Figure 10.

May 2000 A Initial release based on AMD Athlon Processor Family Thermal Cooling Requirements

Version 2.1.

x Revision History AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H — November 2002

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

AMD Thermal, Mechanical, and Chassis Cooling Design Guide

This document specifies performance requirements for thedesign of thermal, mechanical, and chassis cooling solutions forthe AMD Athlon™ and AMD Duron™ processors In addition toproviding design targets, drawings are provided from anAMD-designed solution meeting the requirements of theAMD Athlon and AMD Duron processors

Summary of Requirements

To a l l ow t he opt i m a l re l i ab il i t y fo r A M D A th l o n a ndAMD Duron processor-based systems, the thermal designsolution should dissipate heat from a theoretical processorrunning at a given maximum thermal power The followingsections specify recommended values for these optimal thermalparameters By setting a high-power target, the engineer mayavoid redesigning a point solution heatsink/fan sink, thusincreasing the life of the particular thermal solution

2 PGA Socket A-Based Processor Thermal Requirements

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

PGA Socket A-Based Processor Thermal Requirements

The first step to achieving proper thermal performance is todissipate the heat generated by the processor This, normally, isaccom plished by use of a heatsink of some design Thefollowing section includes the specifications required to have aproper heatsink design for Socket A processors

Socket Description

Socket A is a PGA socket designed for socketed AMD Athlon™and AMD Duron™ processors Figure 1 shows the socket layout

Note: The figure socket is labeled SOCKET 462, which is

synonymous with the Socket A.

Figure 1 Socket A

Socket A is very similar in form factor to previous sockets, such

as Socket 7 Socket A incorporates additional pins in the innerportion of the socket Thus, a thermal solution for Socket A canleverage preexisting design efforts

Figure 2 on page 3 details the physical dimensions of Socket A

PGA Socket A-Based Processor Thermal Requirements 3

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Figure 2 Dimensions of Socket A

Socket A-Based Processor Specifications

Table 1, Table 2 on page 4, and Table 3 on page 4 list thethermal specifications of the socketed AMD Athlon andAMD Duron processors

Table 1 Socketed Processor Specifications for the AMD Athlon™ Processor Model 6

Total die size Die size 129.26 mm2 Includes L2 cache

Acore Core area 105.72 mm2 Die size not including L2 cache

Form factor Heatsink form factor PGA PGA Socket A form factor

thermal power 72.0 W Required supported power

4 PGA Socket A-Based Processor Thermal Requirements

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

General Socketed Design Targets

To maintain the die temperature of the processor below the

considered Table 4 details additional specifications that must

be met for the AMD Athlon processor model 6 to reliablyoperate

Table 2 Socketed Processor Specifications for the AMD Athlon™ Processor Model 8

temperature

90°C For Model 2100+ and below 85°C For Model 2200+ and above

Total die size Die size

80.89 mm2 Includes L2 cache For CPUID = 680 only 84.66 mm2 Includes L2 cache For CPUID = 681 only.86.97 mm2 Includes L2 cache For CPUID = 682 only.

67.35 mm2 Die size not including L2 cache For CPUID = 680 only.

71.12 mm2 Die size not including L2 cache.For CPUID = 681 only.

73.43 mm2 Die size not including L2 cache.For CPUID = 682 only.

Form factor Heatsink form factor PGA PGA Socket A form factor

thermal power 68.4 W Required supported power

Table 3 Socketed Processor Specifications for the AMD Duron™ Processor Model 7

Total die size Die size 105.68 mm2 Includes L2 cache

Acore Core area 99.61 mm2 Die size not including L2 cache

Form factor Heatsink form factor PGA PGA Socket A form factor

thermal power 60.0 W Required supported power

Table 4 General Socketed Thermal Solution Design Target for the AMD Athlon™ Processor Model 6

PGA Socket A-Based Processor Thermal Requirements 5

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Table 5 details additional specifications that must be met forthe AMD Athlon processor model 8 to reliably operate

Table 4 General Socketed Thermal Solution Design Target for the AMD Athlon™ Processor Model 6

Table 5 General Socketed Thermal Solution Design Target for the AMD Athlon™ Processor Model 8

6 PGA Socket A-Based Processor Thermal Requirements

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

Table 6 shows the thermal solution design target for theAMD Duron processor

Suggested Interface Materials

AMD evaluates thermal interface materials for socketeddesigns A list of suggested materials tested by AMD isprovided in Table 7 If the heatsink needs to be removed, thephase change material must be replaced on the heatsink beforere-installing the heatsink Use a plastic scraper to gentlyremove the old phase change material from the heatsink

Sample Socket A Heatsink Drawings

Figure 3 provides a reference drawing of a heatsink AMD hasdesigned to work with Socket A processors

Table 6 General Socketed Thermal Solution Design Target for the AMD Duron™ Processor

Table 7 Suggested Thermal Interface Materials

PGA Socket A-Based Processor Thermal Requirements 7

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Figure 3 Sample Drawing of Socket A Heatsink

Socket A Heatsink Design Considerations

Heatsink design considerations include the characteristics ofthe heatsink itself, the clip used to hold the heatsink to theprocessor, the thermal interface material between the heatsinkand the processor, and the length of the fan wire for activeheatsinks

Heatsink Considerations

The important design parameters of the socket A heatsinkinclude the dimensions of the flat base, the maximum basefootprint, and the clearance over the socket cam

Flat base to contact support pads The PGA processor is housed in a

50 x 50 mm ceramic package The heatsink makes direct contact

w i t h t h e f l i p -c h i p d i e W h i l e t h e d i e d i m e n s i o n s a r econsiderably less than the 50 mm x 50 mm package footprint,the heatsink base must maintain a minimum flat surface of

46 mm x 46 mm centered on the package and 48 mm x 48 mm at

a maximum This positioning is required for the heatsink tomake contact with compliant load support pads The padsprotect the die from mechanical damage during heatsinkMeasurements are in millimeters

8 PGA Socket A-Based Processor Thermal Requirements

AMD Thermal, Mechanical, and Chassis Cooling Design Guide 23794H—November 2002

installation, as well from shock and vibration Figure 4 detailsthe ceramic package and compliant load support pads

Figure 4 Heatsink and Load Pads

Maximum base footprint of 63 mm x 80 mm T h e m a x i m u m b a s e

footprint for socket heatsinks is 63 mm x 80 mm (as detailed inFigure 3 on page 7) Not all processor speeds require the full

63 mm x 80 mm footprint Heatsinks with approximately 60 mm

x 60 mm footprints have proven to be adequate for low tomoderate clock frequencies

Clearance in heatsink base for socket cam box The heatsink base must

have enough clearance so that it does not contact the cam box

on the socket The clearance zone is defined in the exampleshown in the Figure 3 on page 7 and Figure 4

Clip Considerations

The important design parameters of the socket A heatsink clipinclude the load applied to the heatsink, where the load isapplied, how the clip ensures the location of the heatsink inrelation to the processor package and socket, and ease ofinstallation

TM

PGA Socket A-Based Processor Thermal Requirements 9

23794H—November 2002 AMD Thermal, Mechanical, and Chassis Cooling Design Guide

Load target of 16 lb with range of 12–24 lb The clip load is greater

than that allowed for previous pro cess ors with sim ilarmechanical form factors Table 4 on page 4 details the clip forcerequirements

Load applied directly over center of die (asymmetric design) To e n s u re

adequate thermal interface performance between the flip-chipdie and the heatsink, the clip must apply its load to the heatsinkalong a single contact axis The load should be applied 26.8 mmfrom the front (non-cam side) socket tab load point (seeFigure 4 on page 8) The acceptable tolerance for off-center clipload is ± 1.5 mm

Feature to lock relative position of heatsink, clip, and socket A l o c k i n g

feature is needed to avoid incorrect placement of the heatsink

on the package Such a lock can be constructed with small tabsthat project from the sides of the clip and fit into a heatsinkchannel

Installation features designed to minimize operator fatigue The clip load

requirements of the socketed processor are significantly higherthan past models Emphasis should be focused on providing aclip design that is easily installed While clips that do notrequire tools for installation offer some advantages, designsthat accept a flat-head screwdriver (or nutdriver) near the cliphook have certain advantages Such advantages include theability to pry the clip hook over the socket tab dur inginstallation and the ability to install the clips onto the tabs inareas that are tightly confined by motherboard componentssurrounding the socket

Thermal Interface Considerations

Many customers have indicated a preference for pre-appliedthermal interface materials A heatsink vendor that chooses tooffer pre-applied interface materials should apply a 25 x 25 mmpad centered 25 mm from the front edge of the heatsink