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Bài 1.Linh kiện điện tử cơ bản 3 1.Điện trở 3 2.Biến trở 5 3.Tụ điện 5 3.1.Phân loại 6 3.2.Tụ hoá 7 4.Diode 7 4.1.Mô tả 5 4.2.Kí hiệu các loại diode 5 5.Transistor 8 5.1.Tác dụng 9 6.Led 7 thanh 9 7.Bộ cách ly quang 11 7.1.Ứng dụng 11 7.2.Nguyên lý cấu tạo chung của bộ cách ly 11 7.3.Phân loại 11 7.4.Hình vẽ nguyên lý 11 8.Relay 13 8.1.Phân loại 13 8.2.Điều khiển đóng mở relay 13 B Bài thực hành số 1 14 1.Công cụ 14 2.Hướng dẫn sử dụng panel 14 Bài 2:Các IC tích hợp chuyên dụng 16 2.1.Mạch nguồn 16 2.2.Các mạch số logic 19 2.3.IC lập trình được 19 Bài 3:Thiết kế mạch nguyên lý bằng PROTEL 24 3.1.Tổng quan 25

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Flexible Presentation of Key Topics

Revisions have given the text a level of fl exibility such that ideal op-amps (Chapter 9) can be

presented as the fi rst topic in electronics; either MOS or Bipolar transistors can be studied as the

fi rst transistor type; and digital electronics can be covered before analog electronics This fl exibility

allows instructors to present topics in whatever order makes the most sense for their students.

New Problems and Text Updates

The fourth edition features a substantial number of new problems This includes: over 45 percent

new exercise and Test Your Understanding problems; over 45 percent new end-of-chapter problems;

and over 70 percent new open-ended design problems and computer simulation problems In addition,

coverage of circuit voltage levels and device parameters was updated to more closely match real

world electronics.

Goal-Oriented Pedagogy

A Preview section introduces each chapter and correlates with learning objectives that head each

section Worked examples reinforce the theoretical concepts being developed; all examples are

followed by exercises to immediately test learning Test Your Understanding problems are integrated

at the end of each section to provide additional practice Problem solving techniques guide students

through analyzing and solving a problem

Focus on Design in the Real World

Students are taught good design by incorporating design exercises that help students get a feel for

how the design process works in the real world Each chapter includes a Design Application that

leads students through the design and development of an electronic thermometer The various

characteristics and properties of circuits are explained as the student moves through the analysis

Design Pointers appear in examples and throughout the text to help students with tricky design

issues, and Design Problems are featured in most problem sets.

Computer Tools

Because computer analysis and computer-aided design are signifi cant factors in professional

electronic design, the text contains a large number of new computer simulation problems

These appear both throughout the chapter and at the end of each chapter.

Learning and Teaching Technologies

The website for Microeletronics features tools for students and teachers Professors can benefi t

from McGraw-Hill’s COSMOS electronic solutions manual COSMOS enables instructors to generate

a limitless supply of problem material for assignment, as well as transfer and integrate their own

problems into the software In addition, the website boasts PowerPoint slides, an image library,

the complete Instructor’s Solution Manual (password protected), data sheets, laboratory manual,

and links to other important websites You can fi nd the site at www.mhhe.com/neamen

CIRCUIT ANALYSIS AND DESIGN

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Circuit Analysis and Design

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Circuit Analysis and Design

Fourth Edition

Donald A Neamen University of New Mexico

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MICROELECTRONICS: CIRCUIT ANALYSIS AND DESIGN, FOURTH EDITION Published by McGraw-Hill, a business unit of The McGraw-Hill Companies, Inc., 1221 Avenue

of the Americas, New York, NY 10020 Copyright © 2010 by The McGraw-Hill Companies, Inc All rights reserved Previous editions © 2007, 2001, and 1996 No part of this publication may be reproduced or distributed in any form or by any means, or stored in a database or retrieval system, without the prior written consent of The McGraw-Hill Companies, Inc., including, but not limited to,

in any network or other electronic storage or transmission, or broadcast for distance learning.

Some ancillaries, including electronic and print components, may not be available to customers outside the United States.

This book is printed on acid-free paper.

1 2 3 4 5 6 7 8 9 0 VNH/VNH 0 9 ISBN 978–0–07–338064–3 MHID 0–07–338064–4 Global Publisher:Raghothaman Srinivasan

Director of Development:Kristine Tibbetts

Developmental Editor:Lora Neyens

Senior Marketing Manager:Curt Reynolds

Project Manager:Melissa M Leick

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Cover Designer:Studio Montage, St Louis, Missouri

Compositor:Aptara®, Inc.

Typeface:10/12 Times Roman

Printer:R R Donnelley Jefferson City MO

All credits appearing on page or at the end of the book are considered to be an extension of the copyright page.

Library of Congress Cataloging-in-Publication Data

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Dedication

To the many students I’ve had the privilege of teaching over the years who havecontributed in many ways to the broad field of electrical engineering, and to futurestudents who will contribute in ways we cannot now imagine

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About the Author

Donald A Neamen is a professor emeritus in the Department of Electrical andComputer Engineering at the University of New Mexico where he taught for morethan 25 years He received his Ph.D degree from the University of New Mexico andthen became an electronics engineer at the Solid State Sciences Laboratory atHanscom Air Force Base In 1976, he joined the faculty in the ECE department at theUniversity of New Mexico, where he specialized in teaching semiconductor physicsand devices courses and electronic circuits courses He is still a part-time instructor

in the department He also just recently taught for a semester at the University ofMichigan–Shanghai Jiao Tong University (UM-SJTU) Joint Institute in Shanghai

In 1980, Professor Neamen received the Outstanding Teacher Award for theUniversity of New Mexico In 1990, and each year from 1994 through 2001, hereceived the Faculty Recognition Award, presented by graduating ECE students

He was also honored with the Teaching Excellence Award in the College ofEngineering in 1994

In addition to his teaching, Professor Neamen served as Associate Chair of theECE department for several years and has also worked in industry with MartinMarietta, Sandia National Laboratories, and Raytheon Company He has publishedmany papers and is the author of Semiconductor Physics and Devices: Basic Princi- ples, third edition and An Introduction to Semiconductor Devices.

vi

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Brief Table of Contents

PROLOGUE I PROLOGUE TO ELECTRONICS 1

PART 1 SEMICONDUCTOR DEVICES AND BASIC APPLICATIONS 7Chapter 1

Semiconductor Materials and Diodes 9

PART 2 ANALOG ELECTRONICS 619Chapter 9

Ideal Operational Amplifiers and Op-Amp Circuits 621

Chapter 10

Integrated Circuit Biasing and Active Loads 687

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PART 3 DIGITAL ELECTRONICS 1145Chapter 16

MOSFET Digital Circuits 1147

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Contents

PROLOGUE I PROLOGUE TO ELECTRONICS 1

Brief History 1Passive and Active Devices 2Electronic Circuits 2

Discrete and Integrated Circuits 3Analog and Digital Signals 3Notation 4

Summary 5

PART 1 SEMICONDUCTOR DEVICES AND BASIC APPLICATIONS 7Chapter 1 Semiconductor Materials and Diodes 9

Preview 91.1 Semiconductor Materials and Properties 101.2 The pn Junction 23

1.3 Diode Circuits: DC Analysis and Models 341.4 Diode Circuits: AC Equivalent Circuit 431.5 Other Diode Types 48

1.6 Design Application: Diode Thermometer 541.7 Summary 56

Problems 57

Preview 672.1 Rectifier Circuits 682.2 Zener Diode Circuits 842.3 Clipper and Clamper Circuits 902.4 Multiple-Diode Circuits 972.5 Photodiode and LED Circuits 1062.6 Design Application: DC Power Supply 1082.7 Summary 110

Problems 111

Chapter 3 The Field-Effect Transistor 125

Preview 1253.1 MOS Field-Effect Transistor 1263.2 MOSFET DC Circuit Analysis 146

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3.3 Basic MOSFET Applications: Switch, Digital Logic Gate,and Amplifier 165

3.4 Constant-Current Biasing 1703.5 Multistage MOSFET Circuits 1753.6 Junction Field-Effect Transistor 1803.7 Design Application: Diode Thermometer with an MOSTransistor 190

3.8 Summary 192Problems 194

Chapter 4 Basic FET Amplifiers 205

Preview 2054.1 The MOSFET Amplifier 2064.2 Basic Transistor Amplifier Configurations 2164.3 The Common-Source Amplifier 216

4.4 The Common-Drain (Source-Follower) Amplifier 2274.5 The Common-Gate Configuration 234

4.6 The Three Basic Amplifier Configurations: Summaryand Comparison 237

4.7 Single-Stage Integrated Circuit MOSFET Amplifiers 238

4.8 Multistage Amplifiers 2544.9 Basic JFET Amplifiers 2584.10 Design Application: A Two-Stage Amplifier 2644.11 Summary 266

Problems 268

Chapter 5 The Bipolar Junction Transistor 285

Preview 2855.1 Basic Bipolar Junction Transistor 2865.2 DC Analysis of Transistor Circuits 3015.3 Basic Transistor Applications 3235.4 Bipolar Transistor Biasing 3305.5 Multistage Circuits 3445.6 Design Application: Diode Thermometer with a BipolarTransistor 348

5.7 Summary 350Problems 352

Chapter 6 Basic BJT Amplifiers 369

Preview 3696.1 Analog Signals and Linear Amplifiers 3706.2 The Bipolar Linear Amplifier 371

6.3 Basic Transistor Amplifier Configurations 3966.4 Common-Emitter Amplifiers 398

6.5 AC Load Line Analysis 413

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6.6 Common-Collector (Emitter-Follower) Amplifier 4206.7 Common-Base Amplifier 431

6.8 The Three Basic Amplifiers: Summary and Comparison 435

6.9 Multistage Amplifiers 4366.10 Power Considerations 4426.11 Design Application: Audio Amplifier 4456.12 Summary 449

Problems 451

Preview 4697.1 Amplifier Frequency Response 4707.2 System Transfer Functions 4727.3 Frequency Response: Transistor Amplifiers with CircuitCapacitors 485

7.4 Frequency Response: Bipolar Transistor 5027.5 Frequency Response: The FET 514

7.6 High-Frequency Response of Transistor Circuits 5207.7 Design Application: A Two-Stage Amplifier

with Coupling Capacitors 5377.8 Summary 539

Problems 540

Chapter 8 Output Stages and Power Amplifiers 559

Preview 5598.1 Power Amplifiers 5608.2 Power Transistors 5608.3 Classes of Amplifiers 5718.4 Class-A Power Amplifiers 5868.5 Class-AB Push–Pull Complementary Output Stages 5918.6 Design Application: An Output Stage Using

MOSFETs 6018.7 Summary 603Problems 604

PROLOGUE II PROLOGUE TO ELECTRONIC DESIGN 615

Preview 615Design Approach 615System Design 616Electronic Design 617Conclusion 618

Contents xi

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PART 2 ANALOG ELECTRONICS 619Chapter 9 Ideal Operational Amplifiers and Op-Amp Circuits 621

Preview 6219.1 The Operational Amplifier 6229.2 Inverting Amplifier 6279.3 Summing Amplifier 6369.4 Noninverting Amplifier 6389.5 Op-Amp Applications 6419.6 Operational Transconductance Amplifiers 6579.7 Op-Amp Circuit Design 658

9.8 Design Application: Electronic Thermometer with anInstrumentation Amplifier 665

9.9 Summary 668Problems 669

Chapter 10 Integrated Circuit Biasing and Active Loads 687

Preview 68710.1 Bipolar Transistor Current Sources 68810.2 FET Current Sources 707

10.3 Circuits with Active Loads 71910.4 Small-Signal Analysis: Active Load Circuits 72610.5 Design Application: An NMOS Current Source 73410.6 Summary 736

Problems 737

Chapter 11 Differential and Multistage Amplifiers 753

Preview 75311.1 The Differential Amplifier 75411.2 Basic BJT Differential Pair 75411.3 Basic FET Differential Pair 77911.4 Differential Amplifier with Active Load 79011.5 BiCMOS Circuits 801

11.6 Gain Stage and Simple Output Stage 80611.7 Simplified BJT Operational Amplifier Circuit 81111.8 Diff-Amp Frequency Response 815

11.9 Design Application: A CMOS Diff-Amp 82111.10 Summary 824

Problems 825

Chapter 12 Feedback and Stability 851

Preview 85112.1 Introduction to Feedback 85212.2 Basic Feedback Concepts 85312.3 Ideal Feedback Topologies 863

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Contents xiii

12.4 Voltage (Series–Shunt) Amplifiers 87312.5 Current (Shunt–Series) Amplifiers 87912.6 Transconductance (Series–Series) Amplifiers 88612.7 Transresistance (Shunt–Shunt) Amplifiers 89312.8 Loop Gain 901

12.9 Stability of the Feedback Circuit 90812.10 Frequency Compensation 91812.11 Design Application: A MOSFET Feedback Circuit 92412.12 Summary 927

Problems 928

Chapter 13 Operational Amplifier Circuits 947

Preview 94713.1 General Op-Amp Circuit Design 94813.2 A Bipolar Operational Amplifier Circuit 95013.3 CMOS Operational Amplifier Circuits 97013.4 BiCMOS Operational Amplifier Circuits 98113.5 JFET Operational Amplifier Circuits 98913.6 Design Application: A Two-Stage CMOS Op-Amp toMatch a Given Output Stage 992

13.7 Summary 995Problems 997

Chapter 14 Nonideal Effects in Operational Amplifier Circuits 1009

Preview 100914.1 Practical Op-Amp Parameters 101014.2 Finite Open-Loop Gain 101314.3 Frequency Response 102314.4 Offset Voltage 103014.5 Input Bias Current 104214.6 Additional Nonideal Effects 104514.7 Design Application: An Offset Voltage CompensationNetwork 1047

14.8 Summary 1049Problems 1050

Chapter 15 Applications and Design of Integrated Circuits 1061

Preview 106115.1 Active Filters 106215.2 Oscillators 107415.3 Schmitt Trigger Circuits 108415.4 Nonsinusoidal Oscillators and Timing Circuits 109615.5 Integrated Circuit Power Amplifiers 1107

15.6 Voltage Regulators 111415.7 Design Application: An Active Bandpass Filter 112215.8 Summary 1125

Problems 1126

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PROLOGUE III PROLOGUE TO DIGITAL ELECTRONICS 1141

Preview 1141Logic Functions and Logic Gates 1141Logic Levels 1143

Noise Margin 1143Propagation Delay Times and Switching Times 1144Summary 1144

PART 3 DIGITAL ELECTRONICS 1145Chapter 16 MOSFET Digital Circuits 1147

Preview 114716.1 NMOS Inverters 114816.2 NMOS Logic Circuits 116316.3 CMOS Inverter 116816.4 CMOS Logic Circuits 118316.5 Clocked CMOS Logic Circuits 119116.6 Transmission Gates 1194

16.7 Sequential Logic Circuits 120216.8 Memories: Classifications and Architectures 120816.9 RAM Memory Cells 1212

16.10 Read-Only Memory 122116.11 Data Converters 122616.12 Design Application: A Static CMOS Logic Gate 123216.13 Summary 1234

Problems 1236

Chapter 17 Bipolar Digital Circuits 1255

Preview 125517.1 Emitter-Coupled Logic (ECL) 125617.2 Modified ECL Circuit Configurations 126717.3 Transistor–Transistor Logic 1277

17.4 Schottky Transistor–Transistor Logic 128917.5 BiCMOS Digital Circuits 1296

17.6 Design Application: A Static ECL Gate 129817.7 Summary 1300

Problems 1301

Appendix A Physical Constants and Conversion Factors 1315Appendix B Selected Manufacturers’ Data Sheets 1317Appendix C Standard Resistor and Capacitor Values 1329Appendix D Reading List 1333

Appendix E Answers to Selected Problems 1337

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Preface

PHILOSOPHY AND GOALS

Microelectronics: Circuit Analysis and Design is intended as a core text in

electron-ics for undergraduate electrical and computer engineering students The purpose ofthe fourth edition of the book is to continue to provide a foundation for analyzing anddesigning both analog and digital electronic circuits A goal is to make this book veryreadable and student-friendly

Most electronic circuit design today involves integrated circuits (ICs), in whichthe entire circuit is fabricated on a single piece of semiconductor material The ICcan contain millions of semiconductor devices and other elements and can performcomplex functions The microprocessor is a classic example of such a circuit Theultimate goal of this text is to clearly present the operation, characteristics, andlimitations of the basic circuits that form these complex integrated circuits Althoughmost engineers will use existing ICs in specialized design applications, they must beaware of the fundamental circuit's characteristics in order to understand the operationand limitations of the IC

Initially, discrete transistor circuits are analyzed and designed The complexity

of circuits being studied increases throughout the text so that, eventually, the readershould be able to analyze and design the basic elements of integrated circuits, such

as linear amplifiers and digital logic gates

This text is an introduction to the complex subject of electronic circuits

Therefore, more advanced material is not included Specific technologies, such asgallium arsenide, which is used in special applications, are also not included,although reference may be made to a few specialized applications Finally, thelayout and fabrication of ICs are not covered, since these topics alone can warrantentire texts

DESIGN EMPHASIS

Design is the heart of engineering Good design evolves out of considerable ence with analysis In this text, we point out various characteristics and properties ofcircuits as we go through the analysis The objective is to develop an intuition thatcan be applied to the design process

experi-Many design examples, design exercise problems, and end-of-chapter designproblems are included in this text The end-of-chapter design problems are desig-nated with a “D” Many of these examples and problems have a set of specifica-tions that lead to a unique solution Although engineering design in its truest sensedoes not lead to a unique solution, these initial design examples and problems are

a first step, the author believes, in learning the design process A separate section,Design Problems, found in the end-of-chapter problems, contains open-ended designproblems

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COMPUTER-AIDED ANALYSIS AND DESIGN

Computer analysis and computer-aided-design (CAD) are significant factors in tronics One of the most prevalent electronic circuit simulation programs is Simula-tion Program with Integrated Circuit Emphasis (SPICE), developed at the University

elec-of California A version elec-of SPICE tailored for personal computers is PSpice, which

is used in this text

The text emphasizes hand analysis and design in order to concentrate on basiccircuit concepts However, in several places in the text, PSpice results are in-cluded and are correlated with the hand analysis results Obviously, at the instruc-tor's discretion, computer simulation may be incorporated at any point in the text

A separate section, Computer Simulation Problems, is found in the end-of-chapterproblems

In some chapters, particularly the chapters on frequency response and feedback,computer analysis is used more heavily Even in these situations, however, computeranalysis is considered only after the fundamental properties of the circuit have beencovered The computer is a tool that can aid in the analysis and design of electroniccircuits, but is not a substitute for a thorough understanding of the basic concepts

of circuit analysis

PREREQUISITES

This book is intended for junior undergraduates in electrical and computer ing The prerequisites for understanding the material include dc analysis and steady-state sinusoidal analysis of electric circuits and the transient analysis of RC circuits.Various network concepts, such as Thevenin’s and Norton’s theorems, are usedextensively Some background in Laplace transform techniques may also be useful.Prior knowledge of semiconductor device physics is not required

engineer-ORGANIZATION

The book is divided into three parts Part 1, consisting of the first eight chapters, ers semiconductor materials, the basic diode operation and diode circuits, and basictransistor operations and transistor circuits Part 2 addresses more advanced analogelectronics, such as operational amplifier circuits, biasing techniques used in inte-grated circuits, and other analog circuits applications Part 3 covers digital elec-tronics including CMOS integrated circuits Five appendices are included at the end

cov-of the text

Content

Part 1 Chapter 1 introduces the semiconductor material and pn junction, which

leads to diode circuits and applications given in Chapter 2 Chapter 3 covers the effect transistor, with strong emphasis on the metal-oxide-semiconductor FET(MOSFET), and Chapter 4 presents basic FET linear amplifiers Chapter 5 discussesthe bipolar junction transistor, with basic bipolar linear amplifier applications given inChapter 6

field-The frequency response of transistors and transistor circuits is covered in a arate Chapter 7 The emphasis in Chapters 3 through 6 was on the analysis and

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sep-Preface xvii

design techniques, so mixing the two transistor types within a given chapterwould introduce unnecessary confusion However, starting with Chapter 7, bothMOSFET circuits and bipolar circuits are discussed within the same chapter Fi-nally, Chapter 8, covering output stages and power amplifiers, completes Part 1 ofthe text

Part 2 Chapters 9 through 15 are included in Part 2, which addresses more

ad-vanced analog electronics In this portion of the text, the emphasis is placed on theoperational amplifier and on circuits that form the basic building blocks of integratedcircuits (ICs) The ideal operational amplifier and ideal op-amp circuits are covered

in Chapter 9 Chapter 10 presents constant-current source biasing circuits and duces the active load, both of which are used extensively in ICs The differentialamplifier, the heart of the op-amp, is discussed in Chapter 11, and feedback is con-sidered in Chapter 12 Chapter 13 presents the analysis and design of various circuitsthat form operational amplifiers Nonideal effects in analog ICs are addressed inChapter 14, and applications, such as active filters and oscillators, are covered inChapter 15

intro-Part 3 Chapters 16 and 17 form intro-Part 3 of the text, and cover the basics of

digi-tal electronics The analysis and design of MOS digidigi-tal electronics is discussed inChapter 16 The emphasis in this chapter is on CMOS circuits, which form the basis

of most present-day digital circuits Basic digital logic gate circuits are initially ered, then shift registers, flip-flops, and then basic A/D and D/A converters are pre-sented Chapter 17 introduces bipolar digital electronics, including emitter-coupledlogic and classical transistor-transistor logic circuits

cov-Appendices Five appendices are included at the end of the text Appendix A

contains physical constants and conversion factors Manufacturers' data sheets forseveral devices and circuits are included in Appendix B Standard resistor and ca-pacitor values are given in Appendix C, and references and other reading sources arelisted in Appendix D Finally, answers to selected end-of chapter problems are given

in Appendix E

Order of Presentation

The book is written with a certain degree of flexibility so that instructors can designtheir own order of presentation of topics

1 Op-Amp Circuits: For those instructors who wish to present ideal op-amp

cir-cuits as a first topic in electronics, Chapter 9 is written such that sections 9.1through 9.5.5 can be studied as a first chapter in electronics

Chapter Presentation

Ideal Op-Amp Circuits:

1 Chapter 9, Sections 9.1–9.5.5

2 Chapters 1, 2, etc

2 MOSFETs versus Bipolars: The chapters covering MOSFETs (3 and 4) and the

chapters covering bipolars (5 and 6) are written independently of each other structors, therefore, have the option of discussing MOSFETs before bipolars, as

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In-given in the text, or discussing bipolars before MOSFETs in the more traditionalmanner.

Chapter Presentation

1 pn Junctions 1 pn Junctions

2 Diode Circuits 2 Diode Circuits

3 MOS Transistors 5 Bipolar Transistors

4 MOSFET Circuits 6 Bipolar Circuits

5 Bipolar Transistors 3 MOS Transistors

6 Bipolar Circuits 4 MOSFET Circuits

NEW TO THE FOURTH EDITION

• Addition of over 250 new Exercise and Test Your Understanding Problems

• Addition of over 580 new end-of-chapter problems

• Addition of over 50 new open-ended Design Problems in the end-of-chapterproblems sections

• Addition of over 65 new Computer Simulation Problems in the end-of-chapterproblems sections

• Voltage levels in circuits were updated to more closely match modern day tronics

elec-• MOSFET device parameters were updated to more closely match modern dayelectronics

• Chapter 9 was rewritten such that ideal op-amp circuits can be studied as a firsttopic in electronics

• Maintained the mathematical rigor necessary to more clearly understand basiccircuit operation and characteristics

3 Digital versus Analog: For those instructors who wish to present digital

elec-tronics before analog elecelec-tronics, Part 3 is written to be independent of Part 2.Therefore, instructors may cover Chapters 1, 2, 3, and then jump to Chapter 16

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Preface xix

RETAINED FEATURES OF THE TEXT

• A short introduction at the beginning of each chapter links the new chapter to thematerial presented in previous chapters The objectives of the Chapter, i.e., whatthe reader should gain from the chapter, are presented in the Preview section andare listed in bullet form for easy reference

• Each major section of a chapter begins with a restatement of the objective forthis portion of the chapter

• An extensive number of worked examples are used throughout the text to force the theoretical concepts being developed These examples contain all the de-tails of the analysis or design, so the reader does not have to fill in missing steps

rein-• An Exercise Problem follows each example The exercise problem is very similar

to the worked example so that readers can immediately test their understanding ofthe material just covered Answers are given for each exercise problem so readers

do not have to search for an answer at the end of the book These exercise problemswill reinforce readers’ grasp of the material before they move on to the next section

• Test Your Understanding exercise problems are included at the end of mostmajor sections of the chapter These exercise problems are, in general, morecomprehensive that those presented at the end of an example These problemswill also reinforce readers’ grasp of the material before they move on to the nextsection Answers to these exercise problems are also given

• Problem Solving Techniques are given throughout each chapter to assist thereader in analyzing circuits Although there can be more than one method ofsolving a problem, these Problem Solving Techniques are intended to help thereader get started in the analysis of a circuit

• A Design Application is included as the last section of each chapter A specificelectronic design related to that chapter is presented Over the course of thebook, students will learn to build circuits for an electronic thermometer Thoughnot every Design Application deals with the thermometer, each applicationillustrates how students will use design in the real world

• A Summary section follows the text of each chapter This section summarizesthe overall results derived in the chapter and reviews the basic concepts devel-oped The summary section is written in bullet form for easy reference

• A Checkpoint section follows the Summary section This section states the goalsthat should have been met and states the abilities the reader should have gained

The Checkpoints will help assess progress before moving to the next chapter

• A list of review questions is included at the end of each chapter These questionsserve as a self-test to help the reader determine how well the concepts developed

in the chapter have been mastered

• A large number of problems are given at the end of each chapter, organizedaccording to the subject of each section Many new problems have been in-corporated into the fourth edition Design oriented problems are included as well

as problems with varying degrees of difficulty A “D” indicates design-typeproblems, and an asterisk (*) indicates more difficult problems Separate computersimulation problems and open-ended design problems are also included

• Answers to selected problems are given in Appendix E Knowing the answer to

a problem can aid and reinforce the problem solving ability

• Manufacturers’ data sheets for selected devices and circuits are given in dix B These data sheets should allow the reader to relate the basic concepts andcircuit characteristics studied to real circuit characteristics and limitations

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The website for Microeletronics features tools for students and teachers Professorscan benefit from McGraw-Hill’s COSMOS electronic solutions manual COSMOSenables instructors to generate a limitless supply of problem material for assignment,

as well as transfer and integrate their own problems into the software For students,there are profiles of electrical engineers that give students insight into the real world

of electrical engineering by presenting interviews with engineers working at a ber of businesses, from Fairchild Semiconductor to Apple In addition, the websiteboasts PowerPoint slides, an image library, the complete Instructor’s SolutionManual (password protected), data sheets, laboratory manual, and links to other

num-important websites You can find the site at www.mhhe.com/neamen.

ELECTRONIC TEXTBOOK OPTIONS

This text is offered through CourseSmart for both instructors and students Smart is an online resource where students can purchase the complete text online atalmost half the cost of a traditional text Purchasing the eTextbook allows students totake advantage of CourseSmart’s Web tools for learning, which include full textsearch, notes and highlighting, and email tools for sharing notes between classmates

Course-To learn more about CourseSmart options, contact your sales representative or visit

www.CourseSmart.com.

ACKNOWLEDGMENTS

I am indebted to the many students I have taught over the years who have helped

in the evolution of this text Their enthusiasm and constructive criticism have beeninvaluable, and their delight when they think they have found an error their pro-fessor may have made is priceless I also want to acknowledge Professor Hawkins,Professor Fleddermann, and Dr Ed Graham of the University of New Mexico whohave taught from the third edition and who have made excellent suggestions forimprovement

I want to thank the many people at McGraw-Hill for their tremendous support

To Raghu Srinivasan, publisher, and Lora Neyens, development editor, I am gratefulfor their encouragement and support I also want to thank Mr John Griffith for hismany constructive suggestions I also appreciate the efforts of project managers whoguided the work through its final phase toward publication This effort included gen-tly, but firmly, pushing me through proofreading

Let me express my continued appreciation to those reviewers who read the inal manuscript in its various phases, a focus group who spent an entire preciousweekend discussing and evaluating the original project, and the accuracy checkerswho worked through the original examples, exercises, and problems to minimize anyerrors I may have introduced My thanks also go out to those individuals who havecontinued to review the book prior to new editions being published Their contribu-tions and suggestions for continued improvement are incredibly valuable

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Prologue to Electronics

When most of us hear the word electronics, we think of televisions, laptop computers,

cell phones, or iPods Actually, these items are electronic systems composed of

sub-systems or electronic circuits, which include amplifiers, signal sources, power plies, and digital logic circuits

sup-Electronics is defined as the science of the motion of charges in a gas, vacuum,

or semiconductor (Note that the charge motion in a metal is excluded from thisdefinition.) This definition was used early in the 20th century to separate the field ofelectrical engineering, which dealt with motors, generators, and wire communica-tions, from the new field of electronic engineering, which at that time dealt withvacuum tubes Today, electronics generally involves transistors and transistor

circuits Microelectronics refers to integrated circuit (IC) technology, which can

produce a circuit with multimillions of components on a single piece of ductor material

semicon-A typical electrical engineer will perform many diverse functions, and is likely

to use, design, or build systems incorporating some form of electronics quently, the division between electrical and electronic engineering is no longer asclear as originally defined

Conse-BRIEF HISTORY

The development of the transistor and the integrated circuit has led to remarkableelectronic capabilities The IC permeates almost every facet of our daily lives, frominstant communications by cellular phone to the automobile One dramatic example

of IC technology is the small laptop computer, which today has more capability thanthe equipment that just a few years ago would have filled an entire room The cellphone has shown dramatic changes It not only provides for instant messaging, butalso includes a camera so that pictures can be instantly sent to virtually every point

on earth

A fundamental breakthrough in electronics came in December 1947, when thefirst transistor was demonstrated at Bell Telephone Laboratories by WilliamShockley, John Bardeen, and Walter Brattain From then until approximately 1959,the transistor was available only as a discrete device, so the fabrication of circuitsrequired that the transistor terminals be soldered directly to the terminals of othercomponents

In September 1958, Jack Kilby of Texas Instruments demonstrated the firstintegrated circuit fabricated in germanium At about the same time, Robert Noyce ofFairchild Semiconductor introduced the integrated circuit in silicon The develop-ment of the IC continued at a rapid rate through the 1960s, using primarily bipolartransistor technology Since then, the metal-oxide-semiconductor field-effect transis-tor (MOSFET) and MOS integrated circuit technology have emerged as a dominantforce, especially in digital integrated circuits

I

1

Trang 25

Figure PR1.1 Schematic of an electronic circuit with two input signals: the dc power supply input, and the signal input

Since the first IC, circuit design has become more sophisticated and the grated circuit more complex Device size continues to shrink and the number ofdevices fabricated on a single chip continues to increase at a rapid rate Today, an ICcan contain arithmatic, logic, and memory functions on a single semiconductor chip

inte-The primary example of this type of integrated circuit is the microprocessor

PASSIVE AND ACTIVE DEVICES

In a passive electrical device, the time average power delivered to the device over

an infinite time period is always greater than or equal to zero Resistors, capacitors,

and inductors, are examples of passive devices Inductors and capacitors can store

energy, but they cannot deliver an average power greater than zero over an infinitetime interval

Active devices, such as dc power supplies, batteries, and ac signal generators,are capable of supplying particular types of power Transistors are also considered to

be active devices in that they are capable of supplying more signal power to a load

than they receive This phenomenon is called amplification The additional power inthe output signal is a result of a redistribution of ac and dc power within the device

ELECTRONIC CIRCUITS

In most electronic circuits, there are two inputs (Figure PRl.1).One input is from apower supply that provides dc voltages and currents to establish the proper biasingfor transistors The second input is a signal Time-varying signals from a particular

source very often need to be amplified before the signal is capable of being “useful.”

For example, Figure PR1.l shows a signal source that is the output of a compact discsystem The output music signal from the compact disc system consists of a smalltime-varying voltage and current, which means that the signal power is relativelysmall The power required to drive the speakers is larger than the output signal fromthe compact disc, so the compact disc signal must be amplified before it is capable ofdriving the speakers in order that sound can be heard

Other examples of signals that must be amplified before they are capable ofdriving loads include the output of a microphone, voice signals received on earthfrom an orbiting manned shuttle, video signals from an orbiting weather satellite, andthe output of an electrocardiograph (EKG) Although the output signal can be largerthan the input signal, the output power can never exceed the dc input power There-fore, the magnitude of the dc power supply is one limitation to the output signalresponse

Signal source

dc voltage source

CD player signalLow

power

High signal power Speakers

dc power

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Prologue I Prologue to Electronics 3

DISCRETE AND INTEGRATED CIRCUITS

In this text, we will deal principally with discrete electronic circuits, that is, circuitsthat contain discrete components, such as resistors, capacitors, and transistors Wewill focus on the types of circuits that are the building blocks of the IC For example,

we will look at the various circuits that make up the operational amplifier, an tant IC in analog electronics We will also discuss various logic circuits used indigital ICs

impor-ANALOG AND DIGITAL SIGNALS

Analog signals

The voltage signal shown graphically in Figure PR1.2(a) is called an analog signal

The magnitude of an analog signal can take on any value within limits and may varycontinuously with time Electronic circuits that process analog signals are called

analog circuits One example of an analog circuit is a linear amplifier A linear amplifier magnifies an input signal and produces an output signal whose amplitude

is larger and directly proportional to the input signal

The vast majority of signals in the “real world” are analog Voice tions and music are just two examples The amplification of such signals is a largepart of electronics, and doing so with little or no distortion is a major consideration

communica-Therefore, in signal amplifiers, the output should be a linear function of the input Anexample is the power amplifier circuit in a stereo system This circuit provides suffi-cient power to “drive” the speaker system Yet, it must remain linear in order toreproduce the sound without distortion

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In many electronic systems, signals are processed, transmitted, and received indigital form Digital systems and signal processing are now a large part of electron-ics because of the tremendous advances made in the design and fabrication of digitalcircuits Digital processing allows a wide variety of functions to be performed thatwould be impractical using analog means In many cases, digital signals must beconverted from and to analog signals These signals need to be processed throughanalog-to-digital (A/D) converters and digital-to-analog (D/A) converters A signifi-cant part of electronics deals with these conversions.

NOTATION

The following notation, summarized in Table PR1.1, is used throughout this text

A lowercase letter with an uppercase subscript, such as i Band v B E , indicates a total

instantaneous value An uppercase letter with an uppercase subscript, such as I Band

V B E , indicates a dc quantity A lowercase letter with a lowercase subscript, such as

i b and v be , indicates an instantaneous value of a time-varying signal Finally, an uppercase letter with a lowercase subscript, such as I b and V be , indicates a phasor

quantity.

As an example, Figure PR1.3 shows a sinusoidal voltage superimposed on a dcvoltage Using our notation, we would write

v B E = V B E + v be = V B E + V Mcos(ωt + φ m )

The phasor concept is rooted in Euler’s identity and relates the exponential function

to the trigonometric function We can write the sinusoidal voltage as

Trang 28

where Re stands for “the real part of.” The coefficient of e jωtis a complex number

that represents the amplitude and phase angle of the sinusoidal voltage This complexnumber, then, is the phasor of that voltage, or

Prologue I Prologue to Electronics 5

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1

In the first part of the text, we introduce the physical and electrical characteristics

of the major semiconductor devices Various basic circuits in which these devices areused are analyzed This introduction will illustrate how the device characteristics areutilized in switching, digital, and amplification applications

Chapter 1 briefly discusses semiconductor material characteristics and thenintroduces the semiconductor diode Chapter 2 looks at various diode circuitsthat demonstrate how the nonlinear characteristics of the diode itself are used inswitching and waveshaping applications Chapter 3 introduces the metal-oxide-semiconductor field-effect transistor (MOSFET), presents the dc analysis of MOStransistor circuits, and discusses basic applications of this transistor In Chapter 4, weanalyze and design fundamental MOS transistor circuits, including amplifiers

Chapter 5 introduces the bipolar transistor, presents the dc analysis of bipolartransistor circuits, and discusses basic applications of this transistor Various bipolartransistor circuits, including amplifiers, are analyzed and designed in Chapter 6

Chapter 7 considers the frequency response of both MOS and bipolar transistor cuits Finally, Chapter 8 discusses the designs and applications of these basicelectronic circuits, including power amplifiers and various output stages

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Semiconductor

This text deals with the analysis and design of circuits containing electronic devices,such as diodes and transistors These electronic devices are fabricated using semi-conductor materials, so we begin Chapter 1 with a brief discussion of the propertiesand characteristics of semiconductors The intent of this brief discussion is to be-come familiar with some of the semiconductor material terminology, and to gain anunderstanding of the mechanisms that generate currents in a semiconductor

A basic electronic device is the pn junction diode The diode is a two-terminal

device, but the i– v relationship is nonlinear Since the diode is a nonlinear element,

the analysis of circuits containing diodes is not as straightforward as the analysis ofsimple linear resistor circuits A goal of the chapter is to become familiar with theanalysis of diode circuits

PREVIEW

In this chapter, we will:

• Gain a basic understanding of a few semiconductor material propertiesincluding the two types of charged carriers that exist in a semiconductor andthe two mechanisms that generate currents in a semiconductor

• Determine the properties of a pn junction including the ideal current–voltagecharacteristics of the pn junction diode

• Examine dc analysis techniques for diode circuits using various models todescribe the nonlinear diode characteristics

• Develop an equivalent circuit for a diode that is used when a small, varying signal is applied to a diode circuit

time-• Gain an understanding of the properties and characteristics of a few ized diodes

special-• As an application, design a simple electronic thermometer using the ature characteristics of a diode

temper-9

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1.1 SEMICONDUCTOR MATERIALS

AND PROPERTIES

Objective: • Gain a basic understanding of a few semiconductormaterial properties including the two types of charged carriers thatexist in a semiconductor and the two mechanisms that generatecurrents in a semiconductor

Most electronic devices are fabricated by using semiconductor materials along withconductors and insulators To gain a better understanding of the behavior of the elec-tronic devices in circuits, we must first understand a few of the characteristics of thesemiconductor material Silicon is by far the most common semiconductor materialused for semiconductor devices and integrated circuits Other semiconductor mate-rials are used for specialized applications For example, gallium arsenide and relatedcompounds are used for very high speed devices and optical devices A list of somesemiconductor materials is given in Table 1.1

Intrinsic Semiconductors

An atom is composed of a nucleus, which contains positively charged protons andneutral neutrons, and negatively charged electrons that, in the classical sense, orbitthe nucleus The electrons are distributed in various “shells” at different distancesfrom the nucleus, and electron energy increases as shell radius increases Electrons

in the outermost shell are called valence electrons, and the chemical activity of a

material is determined primarily by the number of such electrons

Elements in the periodic table can be grouped according to the number ofvalence electrons Table 1.2 shows a portion of the periodic table in which the morecommon semiconductors are found Silicon (Si) and germanium (Ge) are in group IV

and are elemental semiconductors In contrast, gallium arsenide is a group III–V

compound semiconductor We will show that the elements in group III and group V are

also important in semiconductors

Figure 1.1(a) shows five noninteracting silicon atoms, with the four valenceelectrons of each atom shown as dashed lines emanating from the atom As silicon

1.1.1

Table 1.1 A list of some semiconductor materials

Elemental Compound

Si Silicon GaAs Gallium arsenide

Ge Germanium GaP Gallium phosphide

AlP Aluminum phosphideAlAs Aluminum arsenideInP Indium phosphide

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Chapter 1 Semiconductor Materials and Diodes 11

Figure 1.1 Silicon atoms in a crystal matrix: (a) five noninteracting silicon atoms, each with four valence electrons, (b) the tetrahedral configuration, (c) a two-dimensional representation showing the covalent bonding

atoms come into close proximity to each other, the valence electrons interact to form

a crystal The final crystal structure is a tetrahedral configuration in which eachsilicon atom has four nearest neighbors, as shown in Figure 1.1(b) The valence

electrons are shared between atoms, forming what are called covalent bonds.

Germanium, gallium arsenide, and many other semiconductor materials have thesame tetrahedral configuration

Figure 1.1(c) is a two-dimensional representation of the lattice formed by thefive silicon atoms in Figure 1.1(a) An important property of such a lattice is thatvalence electrons are always available on the outer edge of the silicon crystal so thatadditional atoms can be added to form very large single-crystal structures

Table 1.2 A portion of the

Trang 35

Conduction band

Forbidden bandgap

E g

E c

E v

Valence band

Conduction band

Electron generation

E c

E v

Valence band

A two-dimensional representation of a silicon single crystal is shown in Figure 1.2,

for T = 0 K, where T = temperature Each line between atoms represents a valence electron At T = 0 K, each electron is in its lowest possible energy state, so each cova-lent bonding position is filled If a small electric field is applied to this material, theelectrons will not move, because they will still be bound to their individual atoms

Therefore, at T = 0 K, silicon is an insulator; that is, no charge flows through it.

When silicon atoms come together to form a crystal, the electrons occupy

par-ticular allowed energy bands At T = 0 K, all valence electrons occupy the valenceenergy band If the temperature increases, the valence electrons may gain thermal en-ergy Any such electron may gain enough thermal energy to break the covalent bondand move away from its original position as schematically shown in Figure 1.3 Inorder to break the covalent bond, the valence electron must gain a minimum energy,

E g, called the bandgap energy The electrons that gain this minimum energy now

exist in the conduction band and are said to be free electrons These free electrons inthe conduction band can move throughout the crystal The net flow of electrons in theconduction band generates a current

An energy band diagram is shown in Figure 1.4(a) The energy E ν is the

maxi-mum energy of the valence energy band and the energy E cis the minimum energy of

the conduction energy band The bandgap energy E g is the difference between E cand

E ν, and the region between these two energies is called the forbidden bandgap.

Electrons cannot exist within the forbidden bandgap Figure 1.4(b) qualitativelyshows an electron from the valence band gaining enough energy and moving into theconduction band This process is called generation

Materials that have large bandgap energies, in the range of 3 to 6 electron–volts1(eV), are insulators because, at room temperature, essentially no free electrons exist

in the conduction band In contrast, materials that contain very large numbers of free

electrons at room temperature are conductors In a semiconductor, the bandgap

energy is on the order of 1 eV

The net charge in a semiconductor is zero; that is, the semiconductor is neutral

If a negatively charged electron breaks its covalent bond and moves away from itsoriginal position, a positively charged “empty” state is created at that position

1 An electron–volt is the energy of an electron that has been accelerated through a potential difference of

1 volt, and 1 eV= 1.6 × 10−19joules.

all valence electrons are

bound to the silicon atoms

by covalent bonding

e – +

Si Si Si Si

Figure 1.3 The breaking of a

covalent bond for T > 0 K

creating an electron in the

conduction band and a

positively charged “empty

state”

Trang 36

Chapter 1 Semiconductor Materials and Diodes 13

(Figure 1.3) As the temperature increases, more covalent bonds are broken, andmore free electrons and positive empty states are created

A valence electron that has a certain thermal energy and is adjacent to an emptystate may move into that position, as shown in Figure 1.5, making it appear as if

a positive charge is moving through the semiconductor This positively charged

“particle” is called a hole In semiconductors, then, two types of charged particles

contribute to the current: the negatively charged free electron, and the positivelycharged hole (This description of a hole is greatly oversimplified, and is meant only

to convey the concept of the moving positive charge.) We may note that the charge of

a hole has the same magnitude as the charge of an electron

The concentrations (#/cm3) of electrons and holes are important parameters inthe characteristics of a semiconductor material, because they directly influence the

magnitude of the current An intrinsic semiconductor is a single-crystal

semicon-ductor material with no other types of atoms within the crystal In an intrinsicsemiconductor, the densities of electrons and holes are equal, since the thermallygenerated electrons and holes are the only source of such particles Therefore, we usethe notation n ias the intrinsic carrier concentration for the concentration of the

free electrons, as well as that of the holes The equation for n iis as follows:

The values for B and E gfor several semiconductor materials are given in Table 1.3

The bandgap energy E gand coefficient B are not strong functions of temperature The

intrinsic concentration n iis a parameter that appears often in the current–voltageequations for semiconductor devices

EXAMPLE 1.1Objective: Calculate the intrinsic carrier concentration in silicon at T = 300 K

Solution: For silicon at T = 300 K, we can write

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Comment: An intrinsic electron concentration of 1.5 × 1010cm−3may appear to be

large, but it is relatively small compared to the concentration of silicon atoms, which

is 5× 1022cm−3.

EXERCISE PROBLEM

Ex 1.1: Calculate the intrinsic carrier concentration in gallium arsenide and

germanium at T = 300 K (Ans GaAs, n i = 1.80 × 106cm−3; Ge, n

rela-The most common group V elements used for this purpose are phosphorus andarsenic For example, when a phosphorus atom substitutes for a silicon atom, as shown

in Figure 1.6(a), four of its valence electrons are used to satisfy the covalent bondrequirements The fifth valence electron is more loosely bound to the phosphorus atom

At room temperature, this electron has enough thermal energy to break the bond, thusbeing free to move through the crystal and contribute to the electron current in thesemiconductor When the fifth phosphorus valence electron moves into the conductionband, a positively charged phosphorus ion is created as shown in Figure 1.6(b)

The phosphorus atom is called a donor impurity, since it donates an electron

that is free to move Although the remaining phosphorus atom has a net positivecharge, the atom is immobile in the crystal and cannot contribute to the current

Therefore, when a donor impurity is added to a semiconductor, free electrons are

created without generating holes This process is called doping, and it allows us to

control the concentration of free electrons in a semiconductor

A semiconductor that contains donor impurity atoms is called an n-type

semi-conductor (for the negatively charged electrons) and has a preponderance of

elec-trons compared to holes

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Chapter 1 Semiconductor Materials and Diodes 15

Figure 1.7 (a) Two-dimensional representation of a silicon lattice doped with a boron atom showing the vacant covalent bond position, (b) the resulting negatively charged boron ion after it has accepted an electron from the valence band A positively charged hole is created.

The most common group III element used for silicon doping is boron When aboron atom replaces a silicon atom, its three valence electrons are used to satisfythe covalent bond requirements for three of the four nearest silicon atoms (Fig-ure 1.7(a)) This leaves one bond position open At room temperature, adjacent siliconvalence electrons have sufficient thermal energy to move into this position, thereby cre-ating a hole This effect is shown in Figure 1.7(b) The boron atom then has a net neg-ative charge, but cannot move, and a hole is created that can contribute to a hole current

Because the boron atom has accepted a valence electron, the boron is therefore

called an acceptor impurity Acceptor atoms lead to the creation of holes without

electrons being generated This process, also called doping, can be used to control theconcentration of holes in a semiconductor

A semiconductor that contains acceptor impurity atoms is called a p-type

semi-conductor (for the positively charged holes created) and has a preponderance of

holes compared to electrons

The materials containing impurity atoms are called extrinsic semiconductors, or

doped semiconductors The doping process, which allows us to control the

concentra-tions of free electrons and holes, determines the conductivity and currents in the material

A fundamental relationship between the electron and hole concentrations in a

semiconductor in thermal equilibrium is given by

n o p o = n2

where n o is the thermal equilibrium concentration of free electrons, p ois the thermal

equilibrium concentration of holes, and n iis the intrinsic carrier concentration

At room temperature (T = 300 K), each donor atom donates a free electron to

the semiconductor If the donor concentration N dis much larger than the intrinsicconcentration, we can approximate

Similarly, at room temperature, each acceptor atom accepts a valence electron,

creat-ing a hole If the acceptor concentration N ais much larger than the intrinsic tration, we can approximate

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Then, from Equation (1.2), the electron concentration is

n o= n2i

N a

(1.6)

EXAMPLE 1.2Objective: Calculate the thermal equilibrium electron and hole concentrations

(a) Consider silicon at T = 300 K doped with phosphorus at a concentration of

N d = 1016cm−3 Recall from Example 1.1 that n

i = 1.5 × 1010cm−3.Solution: Since N d  n i, the electron concentration is

is also important to note that the difference in the concentrations between electronsand holes in a particular semiconductor is many orders of magnitude

EXERCISE PROBLEM

Ex 1.2: (a) Calculate the majority and minority carrier concentrations in silicon at

T = 300 K for (i) N d = 2 × 1016cm−3 and (ii) N

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Chapter 1 Semiconductor Materials and Diodes 17

Drift and Diffusion Currents

We’ve described the creation of negatively charged electrons and positively chargedholes in the semiconductor If these charged particles move, a current is generated

These charged electrons and holes are simply referred to as carriers.

The two basic processes which cause electrons and holes to move in a

semicon-ductor are: (a) drift, which is the movement caused by electric fields, and (b) diffusion,

which is the flow caused by variations in the concentration, that is, concentration dients Such gradients can be caused by a nonhomogeneous doping distribution, or

gra-by the injection of a quantity of electrons or holes into a region, using methods to bediscussed later in this chapter

Drift Current Density

To understand drift, assume an electric field is applied to a semiconductor The fieldproduces a force that acts on free electrons and holes, which then experience a net driftvelocity and net movement Consider an n-type semiconductor with a large number of

free electrons (Figure 1.8(a)) An electric field E applied in one direction produces a force on the electrons in the opposite direction, because of the electrons’ negative

charge The electrons acquire a drift velocity v dn(in cm/s) which can be written as

where μ n is a constant called the electron mobility and has units of cm2/V–s Forlow-doped silicon, the value of μ n is typically 1350 cm2/V–s The mobility can bethought of as a parameter indicating how well an electron can move in a semicon-ductor The negative sign in Equation (1.7) indicates that the electron drift velocity isopposite to that of the applied electric field as shown in Figure 1.8(a) The electron

drift produces a drift current density J n(A/cm2) given by

where n is the electron concentration (#/cm3) and e, in this context, is the magnitude

of the electronic charge The conventional drift current is in the opposite directionfrom the flow of negative charge, which means that the drift current in an n-typesemiconductor is in the same direction as the applied electric field

Next consider a p-type semiconductor with a large number of holes (Figure l.8(b))

An electric field E applied in one direction produces a force on the holes in the same

direction, because of the positive charge on the holes The holes acquire a driftvelocity v dp(in cm/s), which can be written as

h+ v dp

J p

E p-type

(b) (a)

Figure 1.8 Directions of applied electric field and resulting carrier drift velocity and drift current density in (a) an n-type semiconductor and (b) a p-type semiconductor

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