An Introduction to MEMs Engineering - Nadim Maluf and Kirt Williams Part 16 potx

TiNi Alloy Company valve, 122–23metals, 20 defined, 122 fabrication sequence, 123 illustrated, 122 performance, 123 See also Micromachined valves Titanium-nickel alloys, 24 Transition te

Polymerase chain reaction (continued)

on a chip, 174–76

defined, 174

Polymers, 21, 23

defined, 23

forms, 21

parylenes, 23

photoresist, 21

polyimide, 21, 23

Polysilicon, 14, 17–18

beam structures, 18

deposition of, 38

importance, 17

mechanical properties, 17

piezoresistive effect, 26

surface micromachining, 69–71

Population inversion, 143

Potassium hydroxide (KOH), 16

etch rate, 47

as KOH, 46

Pressure sensors, 89–93

fabrication process, 91

high-temperature, 93–94

schematic illustration, 90

silicon-fusion-bonded, 91

See also Sensors

Principle axes, 15

Protective coatings, 222–23

Psychological barrier, 8–9

Q

Quality control, 244–46

Quartz

crystals, 201

micromachining, 21

as piezoelectric material, 29

R

Reactive ion etching (RIE), 51–52

Redwood Microsystems valve, 120–22

defined, 120

fabrication steps, 121

illustrated, 120

operating mechanism, 121

See also Micromachined valves

Reliability, 243–56

accelerated life modeling, 248–49

bath-tub relationship, 248

case study, 254–56

defined, 246

GR-CORE series, 245

ISO 9000/QS 9000, 244

standards, 244–46 statistical methods in, 246–48 tests, 246

See also Failure(s); Quality control

Resonators, 200–211 beam, 203–6 comb-drive, 201–3 coupled-resonator bandpass filter, 206–8 film bulk acoustic, 208–11

microelectromechanical, 200–211

See also RF MEMS

RF MEMS, 189–214 devices, 189 losses, 190 low-resistivity metals, 190 microelectromechanical resonators, 200–211

microelectromechanical switches, 211–14 passive electrical components, 190–200 signal integrity, 189–90

Room-temperature vulcanizing (RTV) rubbers,

227, 252

S

Santur DFB tunable laser, 148–51 Screen printing, 65–66

defined, 65 illustrated, 65 process, 65–66 Seebeck effect, 29, 30 coefficients, 30 defined, 29 thermocouple structure using, 30 Self-assembled monolayers (SAM), 61 coating process, 61

electromagnetic, 82 precursors, 61 Sensing

capacitive, 82 methods, 81–82 objective, 81 piezoresistive, 81–82 Sensors, 89–116 acceleration, 96–114 angular rate, 104–7 carbon monoxide gas, 114–16 high-temperature pressure, 93–94 mass flow, 94–96

pressure, 89–93 protective coatings, 222–23 stress-sensitive, 222

Sensors and Actuators (A, B, C), 9

Sensors Magazine, 10

Shape-memory alloys, 23–24

actuation with, 85

critical temperature and, 23–24

Shocks, 251–52

Side-shooter nozzles, 87

Silicon, 13–19

amorphous, 14, 17–18

crystalline, 14–17

defined, 13

interactions, 18

mechanical integrity and, 18

micromachining, 33

microstructures, 14

optical reflectivity, 18

polysilicon, 14, 17–18

properties, 14

surface oxidation, 18

as thermal conductor, 18

Silicon carbide, 22

Silicon dioxide, 38–39

Silicon direct bonding, 56–57

defined, 56

performance, 56

process, 56–57

Silicon-fusion bonding, 94

Silicon fusion bonding with reactive ion

etching (SFB-DRIE), 71

defined, 71

high aspect ratio, 71

illustrated, 72

Silicon nitride, 19

deposition of, 39–40

LPCVD, 48

Silicon-on-sapphire (SOS) wafers, 35

Silicon oxide, 19

Silk screening See Screen printing

Single-crystal reactive etching and

metallization (SCREAM) process,

72–74

defined, 72

development, 74

illustrated, 74

Sliding plate microvalve, 124–26

defined, 124

designs, 126

fabrication, 126

schematic cross section, 125

See also Micromachined valves

Small Times Magazine, 10

Soft lithography, 66–67

Sol-gel process, 58

Spin-on methods, 40 Sputter deposition, 35–36 defined, 35

directional randomness, 36 planar/cylindrical magnetron, 36 Stiction, 253

Stress isolation, 221–22 SU-8 photosensitive epoxy, 61–62 defined, 61

structures, 62 use of, 62 Supercritical drying, 60–61 Surface-micromachined variable capacitors,

192–97 design, 194 etch holes, 195 fabrication, 192–93, 194 implementations, 193

in portable applications, 193 versions, 193

See also Capacitors

Surface micromachining polysilicon, 69–71 schematic illustration, 70 systems of materials for, 70 Surface mount technologies (SMT), 217 Switches, 211–14

cantilever, 212, 213–14 desirable parameters, 211 membrane, 212, 213 prototypes, 211

See also RF MEMS

T

Tape peel test, 253 TaqMan tagging, 175, 176 Tetramethyl ammonium hydroxide (TMAH),

48, 112 Thermal actuation, 84 Thermal failures, 254 Thermal inkjet heads, 116–19 concept, 117

fabrication, 117–18 fabrication illustration, 118 nozzles, 116

Thermal management, 220–21 Thermoelectric coolers (TECs), 29 Thermoelectricity, 29–30

Thermosonic gold bonding, 228 Thin metal films, 20–21 choice of, 20

etching, 44

TiNi Alloy Company valve, 122–23

metals, 20

defined, 122

fabrication sequence, 123

illustrated, 122

performance, 123

See also Micromachined valves

Titanium-nickel alloys, 24

Transition temperature, 23, 24

Transportation Recall Enhancement,

Accountability, and Documentation

(TREAD), 6

Tunable lasers, 142–51

as bench-top test instruments, 142

building blocks illustration, 143

DFB, 148–51

elements, 143

external cavity, 144–48

metal packaging, 238–39

specifications, 144

tuning operations, 144

U

Ultraprecision mechanical machining, 64

Ultrasonic machining, 68

V

Valves See Micromachined valves

Vanishing dipole, 28

Variable optical attenuators (VOAs), 142,

161–65 cross-sectional schematic, 164 defined, 161

diffraction operation, 163 fabrication, 165

key characteristics, 161 principle of operation, 162 Voltage-controlled oscillators (VCOs), 192 Volume manufacturing, 8

W

Wafers dicing concerns, 219–20 thickness, 219

Wavelength-division multiplexing (WDM),

142 Wavelength locker, 151–54 defined, 151

elements, 152 etalon, 153 schematic illustration, 153 Wire bonding, 227–29 aluminum, 228 gold, thermosonic, 228 limitations, 229

See also Electrical interconnects

Y

Yaw-rate sensor, 112

Microelectromechanical Systems (MEMS) Series

Fundamentals and Applications of Microfluidics, Nam-Trung Nguyen

and Steven T Wereley

Introduction to Microelectromechanical (MEM) Microwave Systems,

Héctor J De Los Santos

An Introduction to Microelectromechanical Systems Engineering, Second Edition,

Nadim Maluf and Kirt Williams

MEMS Mechanical Sensors, Stephen Beeby et al.

RF MEMS Circuit Design for Wireless Communications, Héctor J De Los Santos

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