Iec 61192 1 2003

Exigences relatives à la qualité d'exécutiondes assemblages électroniques brasés –  IEC 2003 Droits de reproduction réservés  Copyright - all rights reserved Aucune partie de cette pub

Ordre de priorité

Unless the user specifies compliance with all requirements (or specific elements) of this standard, such as in a supply contract, the mandatory and relevant articles and paragraphs defined therein may be interpreted as guidelines.

IEC 61191-1, Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

IEC 61191-2, Printed board assemblies – Part 2: Sectional specification – Requirements for surface mount soldered assemblies

IEC 61191-3, Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole soldered assemblies

IEC 61191-4, Printed board assemblies – Part 4: Sectional specification – Requirements for terminal soldered assemblies

IEC 61192-2, Workmanship requirements for soldered electronic assemblies – Part 2: Surface- mount assemblies

IEC 61192-3, Workmanship requirements for soldered electronic assemblies – Part 3: Through- hole mount assemblies

IEC 61192-4, Workmanship requirements for soldered electronic assemblies – Part 4: Terminal assemblies

IEC 61249-8 (all parts), Materials for interconnection structures – Part 8: Sectional specifi- cation set for non-conductive films and coatings

IEC 61340-5-1, Electrostatics – Part 5-1: Protection of electronic devices from electrostatic phenomena – General requirements

IEC 61340-5-2, Electrostatics – Part 5-2: Protection of electronic devices from electrostatic phenomena – User guide

IEC 61760-2, Surface mounting technology – Part 2: Transportation and storage conditions of surface mounting devices (SMD) – Application guide

ISO 9002, Quality systems – Model for quality assurance in production, installation and servicing

For the purposes of this part of IEC 61192, the definitions in IEC 60194 and the following apply.

3.1 new design design that has not previously been assembled by the manufacturer

Users must explicitly state their compliance with all requirements or specific items in this standard, such as in a supply contract; otherwise, the mandatory clauses and subclauses may be viewed as guidance.

Les schémas fournis dans la présente norme sont destinés à aider à l'interprétation des exigences écrites qui font foi.

When a user declares compliance with the mandatory requirements of this standard, they must refer to IEC 61191-1 for priority guidance in case of contradictions between this standard and the applicable referenced documents, as well as IEC 61191-2, IEC 61191-3, and IEC 61191-4 for technical requirements This standard does not replace applicable laws and regulations In instances where there is a conflict between this standard's requirements and the user's assembly drawings and specifications, the latter shall prevail Any unapproved drawings or specifications must be submitted for user approval, and acceptance or modifications must be documented accordingly Furthermore, if the user's documentation requirements are less stringent than the mandatory elements in IEC 61191-1, IEC 61191-2, IEC 61191-3, IEC 61191-4, or this standard, neither the supplier nor the user may claim compliance without clearly identifying the specific articles and corresponding reliefs in each request.

When a user declares compliance with the mandatory requirements of this standard, the term "mandatory" indicates that the requirement is compulsory unless stated otherwise by the user Any deviation from a mandatory requirement requires written acceptance from the user, such as through assembly drawings, specifications, or contractual clauses The terms "should" and "may" refer to recommendations and guidelines, respectively, and are used to express non-mandatory provisions.

L'introduction d'une classification des produits en fonction de l'application finale prévue permet à l'utilisateur de différencier les exigences de performance.

This standard acknowledges that electronic and electrical assemblies are classified based on their intended final use Paragraph 4.3 of IEC 61191-1 identifies three general levels related to the finished product, reflecting variations in productivity, complexity, performance requirements, and testing frequency It is important to recognize potential overlaps of materials across different levels.

La détermination du niveau auquel le produit appartient incombe à l'utilisateur des montages.

Le contrat doit spécifier le niveau prescrit et indiquer toute exception ou exigence supplémentaire concernant les paramètres, le cas échéant Les trois niveaux sont:

Line drawings in this standard are intended to assist in interpretation of the written requirements The written requirements take precedence.

When users choose to comply with certain mandatory requirements of this standard, they should refer to IEC 61191-1 for guidance on resolving any conflicts between this standard and the applicable documents mentioned Additionally, IEC 61191-2 and IEC 61191-3 provide further relevant information.

The IEC 61191-4 standard outlines technical requirements, but it does not override any applicable laws and regulations In cases of conflict between this standard and user assembly drawings or specifications, the latter takes precedence If there is a conflict with unapproved drawings or specifications, they must be submitted for user approval, and any accepted changes should be documented accordingly Additionally, if user documentation requirements are less stringent than the mandatory items in IEC 61191-1, IEC 61191-2, IEC 61191-3, or IEC 61191-4, neither the supplier nor the user can claim compliance without specifying the relevant clauses and relaxations.

When users choose to comply with the mandatory requirements of this standard, the term "shall" indicates a mandatory requirement, and any deviation from it necessitates written acceptance from the user, such as through assembly drawings, specifications, or contract provisions In contrast, the terms "should" and "may" are used to convey recommendations and guidance, representing non-mandatory provisions.

The introduction of product classification permits the user to select performance requirements according to end-use application.

The IEC 61191-1 standard acknowledges that electronic and electrical assemblies are classified based on their intended end-item use Subclause 4.3 outlines three general end-product levels, which account for variations in producibility, complexity, functional performance requirements, and the frequency of verification through inspection and testing It is important to note that there may be overlaps in equipment across these levels.

The user of the assemblies must identify the appropriate product level, as specified in the contract, which should also outline any exceptions or additional requirements There are three distinct levels to consider.

Level A – general electronic products This category includes consumer goods, certain computers, and peripherals, as well as hardware suitable for applications where the primary requirement is the functionality of the complete system.

Level B – specialized electronic products This category includes communication equipment, advanced office machines, and instruments that require high performance and extended durability These products are designed to operate continuously, although uninterrupted operation is not strictly necessary, as the end-use environment typically does not lead to failures.

Level C – high-performance electronic products are essential for equipment that requires continuous or on-demand operation, with no tolerance for downtime These products are designed to function reliably in exceptionally challenging environments, such as life support systems and other emergency systems, where operational readiness is critical.

For each level, the status of products is divided into three quality execution states: a) Target – represents a level of practice and quality execution that should be the goal for all normal operations, categorized as satisfactory; b) Acceptable – denotes a minimal state that can be provided to a given user or the next manufacturing unit without correction, but requires special attention and corrective measures if deviations from the standard significantly impact production; c) Non-compliant – indicates an incident that necessitates correction through appropriate rework or disposal, formally recognized as a quality defect, and is likely to render the process unacceptable or the product notably unreliable.

(il s'agit d'une catégorie non satisfaisante).

La première occurrence de non-conformité implique que tous les autres états précédant la non- conformitộ sont acceptables Par exemple si un ộtat non conforme indique un ôdộmouillage de

10 % de la surface ou plusằ, ceci signifie que s'il y a dộmouillage de 9 % de la surface, ceci est acceptable pour ce défaut, au niveau applicable.

Une non-conformité au niveau A implique automatiquement une non-conformité au niveau B et au niveau C Une non-conformité au niveau B implique une non-conformité au niveau C.

Le fabricant doit disposer (retoucher, réparer, utiliser en l'état ou mettre au rebut) le produit non conforme sur la base des exigences de conception, d'entretien et d'utilisation.

For arbitration purposes, it is accepted to conduct a precise measurement of specific material quantities, the arrangement of components, the positioning of components, or the dimensions of the brazed joint.

Gestion de processus

4.2.1 Défauts et indicateurs de déviation de processus (PDI)

Le Tableau 2 de la CEI 61191-1, le Tableau 1 de la CEI 61191-2, le Tableau 2 de la

IEC 61191-3 and Table 3 of IEC 61191-4 outline unacceptable defects that require actions such as rework or repair The manufacturer is responsible for identifying additional risk points and treating them as supplementary considerations.

It is essential to document specific points on the assembly diagram Any issues that do not fall under unacceptable defects, anomalies, or deviations from acceptable limits are considered process deviation indicators, and their development must be monitored upon their occurrence No measures are required for process deviations identified by PDI.

4.2.2 Exigences relatives à l'amélioration de la gestion de processus et du processus proprement dit

The CEI 61191-1 standard mandates the use of process management methods for the implementation and evaluation of processes involved in the assembly of electrical and electronic components With the user's consent, manufacturers or assemblers may forgo specific quality compliance evaluations and controls outlined in the standard, provided they can demonstrate the existence of a comprehensive and ongoing improvement plan.

Les moyens de maợtrise de la conception, des matộriaux et de la qualitộ des composants, ainsi que le contrôle de fonctionnement de la machine doivent être démontrés.

Process improvement plans do not necessarily require statistical process management methods, provided that the available evidence demonstrates the existence of alternative procedures and methods for data collection and recovery, as well as corrective actions.

Manufacturers and suppliers must enforce the applicable requirements of this standard in all subcontracting contracts and relevant orders No variations from these requirements should be imposed or permitted by the manufacturer or supplier in subcontracting contracts or orders, except those approved by the user.

Unless otherwise specified, the requirements of this standard do not apply to the supply of readily available items (from a catalog) However, it is not excluded that manufacturers of these items may comply with these requirements in certain cases.

Se reporter à l'article 3 et au paragraphe 5.1.

The requirements of this standard should not be the sole reason for altering an approved design However, if existing designs undergo changes that affect the hardware configuration, the design must be re-evaluated, and modifications approved by the user should be implemented to ensure maximum practical compliance.

4.2.1 Defects and process deviation indicators (PDIs)

Table 2 in IEC 61191-1, Table 1 in IEC 61191-2, Table 2 in IEC 61191-3 and Table 3 in

IEC 61191-4 outlines unacceptable defects that necessitate actions such as rework or repair, placing the onus on manufacturers to identify and address additional risks These concerns must be documented on the assembly drawing While anomalies within acceptable limits are classified as process deviation indicators and should be monitored, the disposition of these deviations is not mandatory.

4.2.2 Process control and process improvement requirements

IEC 61191-1 mandates the application of process control methodologies for the production and assessment of electrical and electronic assemblies Manufacturers or assemblers may be exempt from certain quality conformance evaluations and inspections outlined in this standard, contingent upon user agreement and the provision of objective evidence demonstrating a thorough and up-to-date process improvement plan.

The means of control of design, of materials and component quality, and of machine operation control shall be demonstrated.

Process improvement plans do not necessarily require statistical process control methods provided evidence demonstrating alternative data collection, feedback and corrective action procedures and methods is available.

Manufacturers and suppliers must enforce the requirements of this standard on all relevant subcontracts and purchase orders Any deviations from these requirements are only permitted if they have received prior approval from the user.

This document's requirements do not apply to the procurement of off-the-shelf (catalogue) items unless stated otherwise Nonetheless, manufacturers of these items may choose to comply as they see fit.

The requirements of this standard should not be the only reason for redesigning an approved design However, if changes to existing designs affect hardware configuration, a review is necessary, and user-approved modifications should be implemented to ensure maximum practical compliance.

The requirements are as follows: a) before commencing work, all instructors, operators, and control personnel must be competent in the tasks to be performed; b) objective evidence of this competence must be maintained and available for review, including training reports for applicable functions, compliance testing with the standard's requirements, and results from periodic competency assessments.

NOTE Pour plus d'information, se reporter aux normes ISO 9001 et ISO 9002 L'article 21 décrit de manière détaillée les catégories de formation correspondant.

Le programme de commande ESD doit être conforme à la CEI 61340-5-1 et à la CEI 61340-5-2.

The procedures and supporting documents for ordering electrostatic discharge (ESD) protection for sensitive electrical and electronic parts must be maintained throughout various phases, including: a) receipt and testing of received items; b) storage and assembly of boards, components, and parts; c) manufacturing and rework; d) inspection and testing cycles; e) storage, packaging, and shipping of the finished product; and f) transportation and installation.

Des procédures écrites ESD d'analyse des défaillances doivent être documentées et être disponibles pour réexamen.

Installations

4.3.1 Propreté des zones de travail

The work area must meet the following requirements: a) cleanliness and ambient conditions in all work zones should be maintained at levels that prevent contamination or deterioration of soldering tools, materials, and surfaces; b) eating, drinking, and the use of tobacco or drugs are strictly prohibited in the workplace.

Il convient de situer l'installation de brasage dans un espace clos, de contrôler la température et l'humidité et de maintenir une pression positive.

To ensure operator comfort and maintain solderability, it is recommended to keep the temperature between 18 °C and 30 °C, while not exceeding a relative humidity (RH) of 70% For process management, it may be necessary to impose stricter limits on temperature and humidity, particularly during the application of solder paste and adhesive.

When the relative humidity drops to 30% or lower, manufacturers must ensure that electrostatic discharge control is adequate and that humidity levels are sufficient to maintain the performance of flux and soldering cream applications.

All instructors, operators, and inspection personnel must demonstrate proficiency in their tasks before starting work Additionally, there must be objective evidence of this proficiency, including training records relevant to their job functions, testing results in accordance with established standards, and documentation of periodic proficiency reviews.

NOTE For further information, refer to ISO 9001 and ISO 9002 Details of relevant training categories are given in clause 21.

The ESD control programme shall be in accordance with IEC 61340-5-1 and IEC 61340-5-2.

To ensure the protection of ESD-sensitive electrical and electronic components, documented procedures for electrostatic discharge control must be upheld throughout various stages, including the receipt and testing of incoming items, storage and kitting of boards and components, manufacturing and rework processes, inspection and testing cycles, as well as the storage, packing, and shipping of finished products, and during transport and installation.

Failure analysis ESD procedures shall be documented and be available for review.

To ensure a safe and efficient workplace, it is essential to maintain cleanliness and proper ambient conditions in all work areas to prevent contamination of soldering tools and materials Additionally, the consumption of food, beverages, tobacco products, and drugs is strictly prohibited in these areas.

The soldering facility should be enclosed, temperature and humidity controlled and maintained at a positive pressure.

To ensure operator comfort and maintain solderability, it is essential to keep the temperature between 18 °C and 30 °C, while relative humidity should not exceed 70% For effective process control, stricter limits on temperature and humidity may be necessary, particularly during solder paste and adhesive deposition.

When relative humidity falls to 30% or below, manufacturers must ensure that electrostatic discharge control is sufficient and that there is enough moisture for effective flux performance and solder paste application.

L'éclairage du plan de travail des postes de brasage manuel et des postes de contrôle doit être de 1 000 lm/m 2 au minimum.

For field operations where it is not feasible to adhere to the prescribed controlled environment conditions, specific precautions must be implemented to enhance connection quality and reduce the impact of uncontrolled environmental factors on the equipment being operated.

The assembly of electronic components may require the use of clean parts to ensure compliance with the current standard during production If necessary, the cleanliness class of the parts must be agreed upon between the user and the manufacturer/assembler.

Machines used for assembly, soldering, and testing must be maintained to ensure power and efficiency align with the design specifications set by the manufacturers Maintenance procedures and schedules should be documented to facilitate the replication of the process.

Identification des processus

4.4.1 Formats de montage et séquences du processus

Les figures 1 à 5 illustrent cinq exemples de format de montage de base applicables à la présente spécification ainsi que les séquences types du processus correspondant.

Figure 1 – Montage en surface mono face (SM), refusion uniquement

Placement du composant Durcissement Renversement de l’adhésif Brasage à la vague

Figure 2 – Montage mono face (SM), immersion uniquement

When manual placement and soldering of output components are required after a simultaneous immersion soldering operation, it may be necessary to cover the corresponding metallized through-holes with a removable solder mask to prevent them from being filled with solder.

Illumination at the working surface of manual soldering and inspection surfaces shall be

In field operations where achieving the controlled environment conditions specified by this standard is not feasible, it is essential to implement special precautions These measures aim to enhance the quality of solder connections and reduce the impact of uncontrolled environmental factors on hardware operations.

The assembly of electronic products often requires clean rooms to meet production standards It is essential for the user and manufacturer or assembler to agree on the appropriate clean room class if needed.

To ensure optimal performance and efficiency, all machines involved in assembly, soldering, and testing must be properly maintained according to the manufacturers' design specifications It is essential to document maintenance procedures and schedules to facilitate consistent processing.

4.4.1 Construction formats and process sequences

Examples of five basic construction formats applicable to this specification are shown in figures 1 through 5, together with typical associated process sequences.

Figure 1 – SM single-sided surface-mount assembly, reflow soldering only

Adhesive deposition Component placement Cure adhesive Invert Wave solder

Figure 2 – SM single-sided assembly, immersion only

When manual insertion and soldering of leaded components are needed after mass immersion flow or wave soldering, it is essential to cover the associated plated through-holes with a peelable resist mask to avoid solder filling Please refer to clause 19 for more details.

Dépôt de la crème à braser

Figure 3 – Montage par technique combinée, double face: refusion et immersion, fusion ou soudure à la vague

Dépôt de la crème à braser

Dépôt de la crème à braser

Figure 4 – Montage par technique combinée, manuel et refusion double face

Brasage à la vague Durcissement de l’adhésif

Figure 5 – Montage par technique combinée, double face, immersion uniquement

At a minimum, individual assemblies must be labeled or marked to ensure compliance with the traceability requirements specified by both the manufacturer and the user For Class C products, all components of a set must be traceable with delivery notes provided to the buyer.

Component placement Reflow soldering Invert Adhesive deposition

Figure 3 – Mixed technology assembly, double-sided: reflow and immersion, flow or wave solder

Component placement Reflow soldering Invert Solder paste deposition

Figure 4 – Mixed technology assembly, double-sided reflow soldering and manual

Adhesive deposition Component placement Invert

Figure 5 – Mixed technology assembly, double-sided, immersion only

Individual assemblies must be clearly labelled to ensure traceability for both manufacturers and users For level C products, every component within an assembly should be traceable back to the specific goods inwards delivery notes.

To minimize the risk of errors in production, it is essential that the issue numbers of all drawings and related data on individual products, along with their modification orders, are controlled by a single authority within the assembler's factory for both products and associated machine management software.

4.4.4 Statut de travaux en cours

All sets, including those at every stage of production and those returned for rework or repair by the user, must display an identification mark indicating their status, such as awaiting visual inspection, failed the initial on-site test, or pending rework.

For level C products, it is essential to document each failure in controls and successive tests, as well as their successes It is preferable for indicators, such as color marks on the edge of the card or labeled tags, to be easily visible to the naked eye without the need for magnification.

The assembler must ensure that all relevant personal safety information regarding the operation of purchased equipment and the handling of acquired materials, components, and substrates is provided by suppliers and communicated to those who need it.

Contrôles de conception

This function applies to each individual card design and includes essential control activities to ensure the proper operation and quality of manual execution of mechanized equipment The list of controls is not exhaustive and does not cover all aspects related to reliability.

Design controls for all types of assemblies must ensure that the layout of the board adheres to applicable regulations regarding component spacing and orientation for soldering and assembly processes This compliance is essential to meet the specified requirements outlined in the series.

CEI 61191 outlines the positional contour requirements for components and corresponding solder joints after assembly It is essential to ensure that when a board undergoes wave or drag soldering and supports components that require a maximum preheating of 100 °C (such as multilayer ceramic capacitors without leads), adequate space free of components is provided to prevent sagging Additionally, all landing pad placements and associated traces must be thermally isolated from large thermal masses to facilitate soldering and manual rework with minimal time-temperature combinations The printed circuit board, including its dimensions, flatness, coatings, and specified components, must be suitable for the intended manufacturing processes and equipment without compromising overall reliability; if there is any uncertainty, written confirmation from the supplier should be sought Lastly, the distribution of copper layers and ground plane design should be balanced to achieve optimal flatness after soldering, and where feasible, significant copper areas (such as ground and power planes) should be gridded to minimize the risk of inter-laminar delamination.

To minimize production errors, a single authority within the assembler's plant should manage the issue numbers for all product drawings and data, as well as any modification or change notes, ensuring consistency for both the products and their associated machine control software.

All assemblies, whether in the manufacturing stages or returned for rework or repair, must have a clear identification of their status, such as pending visual inspection, failing the initial in-circuit test, or awaiting rework.

For level C products, it is essential to document every failure and success in inspections and tests Ideally, indicators such as colored paint marks or labeled tags should be clearly visible to the naked eye, eliminating the need for magnification.

The assembler must obtain all essential personal safety information regarding the operation of purchased equipment and the handling of materials, components, and substrates from suppliers, ensuring it is communicated to the necessary personnel.

Each board design requires specific checks to ensure optimal performance of mechanized equipment and manual workmanship While the following list of checks is essential, it is not comprehensive and does not cover all aspects of reliability.

Design checks for all assembly types must ensure that the board design adheres to layout component clearance and orientation rules, allowing for compliance with IEC 61191 series requirements for post-assembly component positioning and solder joint contours It is essential to verify that adequate space is provided for supporting carriers when wave- or drag-soldering components that require preheating to within 100 °C of the solder bath temperature Additionally, land layouts and tracks should provide thermal isolation from large thermal masses to facilitate efficient manual soldering and rework The printed board, including its dimensions, flatness, coatings, and components, must be suitable for the intended processes without compromising assembly reliability, and confirmation from the supplier should be sought if there are any doubts Finally, the distribution of copper layers and earth-plane design should be balanced to optimize board flatness post-soldering, with large copper areas being utilized wherever feasible.

To minimize the risk of delamination, it is essential to cross-hatch earthplanes and power planes Ensure there is adequate clearance around each component to facilitate the use of the recommended repair tools and methods as specified by the manufacturer Confirm that all in-situ probes or test probes can contact the board without touching a solder joint, output, or component body, while adhering to the relevant intermediate specification requirements Additionally, verify that the available in-situ testing equipment includes a sufficient number of nodes to meet testing requirements for all necessary components, ideally in a single pass Lastly, ensure that, to the best of available knowledge, the proposed design complies with legal safety requirements and relevant national or international safety standards, guaranteeing its safety during intended use in the specified environment.

It is essential, and in some cases mandatory, to conduct a risk analysis and assess hazardous phenomena to evaluate the issue at hand When necessary, users should be appropriately informed.

Design controls for surface mount assemblies must ensure that the adhesive or solder paste application operates at acceptable speed and quality When simultaneous reflow soldering is planned, thermal mass compensation and surface tension effects must be addressed to prevent unwanted movement during soldering Adequate clearance for component placement and visual inspection before and after soldering is essential, along with sufficient distance between solder joints and interruption lines for separated circuits Test pads should be spaced to allow for reliable testing probes, ensuring compliance with specified requirements Testing circuits and associated benches must not damage the assembly's structure or function, and excessive forces from test probes should not deform the boards For multilayer ceramic capacitors without leads, the available landing length must meet IEC 61191-2 standards Additionally, optical alignment markers on printed circuit boards must be suitable for the automatic component placement machines in terms of size, shape, surface condition, and contrast.

Design controls for combined assembly techniques with automatic placement and insertion include the application of previously mentioned design checks It is essential to ensure adequate clearance around surface-mounted components to prevent damage during subsequent operations such as drilling and riveting Additionally, verify that there is sufficient space for the recommended rework tools and methods All test probes must be able to contact the board without touching any solder joints or component leads, adhering to the relevant specifications The in-circuit test equipment should have enough nodes to fulfill testing requirements efficiently, ideally in a single pass Lastly, the design must comply with legal safety requirements and relevant safety standards to ensure reasonable safety in its intended use and environment.

A hazard and risk analysis is helpful in assessing this issue and is mandatory in some applications Where necessary, appropriate warnings to users should be made available.

Design checks for surface-mounted assemblies must ensure that the layout supports efficient solder paste or adhesive deposition while maintaining quality It is crucial to verify that land patterns for small components have balanced thermal mass and surface tension to prevent movement during mass reflow soldering Adequate clearance should be provided for component placement, visual inspections, and electrical testing Solder joints must be spaced away from break lines in step and repeat array panels, and test probe pads should be at least 2.5 mm apart to accommodate reliable probes Additionally, the test circuitry and jigs must not compromise the assembly's function or structure, avoiding excessive voltages and mechanical distortion For leadless multilayer ceramic capacitors, sufficient land length must comply with IEC 61191-2 standards, and fiducial marks should be appropriate for optical alignment in printing or component placement machines.

Design checks for mixed technology assemblies that involve auto-placement and auto-insertion must adhere to the guidelines outlined in sections 5.1.1 and 5.1.2 It is essential to ensure that there is adequate clearance around surface-mounted components to prevent damage during the subsequent through-hole insertion and crop and clinch operations.

Spécification et fourniture des composants

Afin de contribuer à garantir que les composants fournis sont ôaptes à l'emploiằ et permettent une retouche minimale, il convient de mettre en œuvre l'exigence de qualité d'exécution suivante.

5.2.1 Applications et traitements des produits

Before signing the contract and making a purchase, the supplier's authority should inform the assembler about the product's scope and the relevant mechanical and environmental testing specifications The assembler must then relay this information to the suppliers and also inform them about the assembly process, appropriate time-temperature cycles, and cleaning methods for the components, including the rework of brazed joints and any subsequent brazing operations required for both sides.

5.2.2 Modốle de boợtier de composant

Il convient que l'assembleur s'assure que les composants sont spécifiés pour être placés dans le modốle de boợtier pour lequel l'implantation de la carte a ộtộ conỗue (voir exemples aux

Figures 6 and 7 will be presented in a packaging format that can be effectively handled by the appropriate placement or sequencing/insertion equipment, such as strips, reels, tubes, bins, or direct feed magazines.

To optimize the maintenance of solderability, it is essential to specify that the shipping packaging for solderable components ensures low relative humidity and protection against atmospheric contamination during shipping and any intermediate storage, such as at a distributor's facility Whenever possible, contact between the surfaces of terminations and soft plastic materials, such as polyethylene and adhesive films, should be avoided, as well as the transport or storage of reels, tubes, or magazines packed in open boxes made of hygroscopic materials like cardboard.

It is essential that packaging for ceramic components and other small parts prevents loose components from being shaken and damaged through friction with one another.

5.2.4 Date de fabrication et épaisseur de revêtement brasable

When necessary, the assembler must accurately identify the manufacturing date of the components, the guaranteed minimum thickness of the solderable coating, and the method of application This information is essential to assess their suitability for achieving high post-soldering performance.

The recommended minimum thickness for brazing coatings on any outlet is 6 micrometers for components intended for use within 12 months of manufacturing, and 8 micrometers for longer-term applications Other coatings may require different minimum thicknesses.

Spécification et fourniture des cartes imprimées

To ensure that the supplied printed substrates/boards are suitable for use and require minimal touch-up, it is essential to implement the following quality execution requirements.

5.2 Specification and procurement of components

To assist in assuring that components supplied are ‘fit for purpose’ and enable rework to be kept to a minimum, the following workmanship requirement should be implemented.

Before placing a contract and making a purchase, the procuring authority must inform the assembler about the product's application field and its associated environmental and mechanical test specifications The assembler is responsible for relaying this information to suppliers, as well as detailing the intended assembly process, including the relevant time-temperature cycles and cleaning methods for the components This includes considerations for reworking solder joints and any additional soldering operations needed for populating both sides of the assembly.

The assembler must verify that the components are delivered in the designated package style compatible with the board layout, as illustrated in Figures 6 and 7 Additionally, the packaging format should be suitable for the sequencing, insertion, or placement equipment, such as tapes, reels, tubes, trays, or bulk feed magazines.

To ensure optimal solderability maintenance, it is crucial to specify transit packaging for solderable components that maintains low relative humidity and protects against atmospheric contamination during transit and intermediary storage Avoid contact between termination materials and soft plastics like polyethylene, cling film, and unsealed hygroscopic packaging materials such as cardboard.

In particular, packaging for ceramic and other small components should not permit jostling and abrasion of loose components, one against another.

5.2.4 Date of manufacture and solderable coating thickness

The assembler must verify the manufacturing date of components and the minimum guaranteed solderable coating thickness, along with the application method This information is crucial for assessing the components' suitability for achieving a high post-soldering yield.

The minimum recommended solder coating thickness for leads is 6 µm for components intended for use within 12 months of manufacture, and 8 µm for those used beyond that period Different coatings may necessitate varying minimum thickness requirements.

5.3 Specification and procurement of printed boards

To assist in assuring that substrates/printed boards supplied are 'fit for purpose' and enable rework to be kept to a minimum, the following workmanship requirements should be implemented.

In addition to data on the dimensions and precision of the map size, it is essential for the specification to outline the required base materials, the thickness of the provided conductors, as well as details regarding the pads, landing zones, and holes.

When considering fine tracks, it is essential to evaluate the type of solder mask, thickness range, and the shapes, sizes, and positions of applicable optical recognition marks Additionally, attention must be given to the surface condition, type of savings, and the precision of thickness and alignment The applicable protective surface states, separation dimension requirements (such as the widths and positions of terminals, notches, and separation lines), as well as the required flatness of bare boards, are also critical Refer to IEC 61188-1-1 for further details.

5.3.2 Informations aux assembleurs et à leurs fournisseurs

Before delivery, the end user must inform the manufacturer about the product's classification level or application, along with the relevant mechanical and environmental testing specifications The manufacturer should relay this information to suppliers and also inform them about the planned assembly process, appropriate time-temperature cycles, and cleaning methods for the substrate or board, including the rework of solder joints and any subsequent soldering processes required for both sides.

5.3.3 Adéquation pour un rendement de montage élevé

To ensure that the condition of substrates and boards is satisfactory for high performance in placement and soldering operations, manufacturers must verify that the surface condition of the landing area and the solderability specifications applied by suppliers are suitable for the respective placement and soldering methods Additionally, relevant parameters include the method of applying the solderable coating, the flatness of the soldered coating, the range of thicknesses (if solder serves as a finish), and the optical characteristics of the surface for optical analysis It is also essential that the shelf life of antioxidant coatings and flux application does not exceed the recommended duration Furthermore, packaging materials for shipping and the maximum stacking quantity should be agreed upon with the supplier and specified as part of the contract.

It is advisable to ensure that hygroscopic materials or those with significant free ionic content of sodium, chloride, or sulfur (such as shrink film and adhesive film) do not come into contact with solderable surfaces.

Spécification et fourniture de matériaux de traitement

To ensure that the quality of materials is adequate for high-performance reflow soldering operations, it is essential for each individual container to require the supplier to specify the manufacturing date and location of the cream or adhesive Additionally, suppliers should be mandated to provide guidance on how to interpret this information.

To minimize air exposure of solder paste used in printing and reduce the risk of solder contamination, it is advisable to provide a container with a usable amount of paste within 36 hours of opening, equipped with a resealable lid.

Syringes for diffusion should be securely packaged in light-proof materials for shipping and storage They must be transparent to allow for the detection of any separation between the cream base and the solder particles.

The specification must include essential details such as base materials, conductor thickness, solder coating type and thickness, optical recognition mark specifications, resist type and thickness, protective surface finishes, break-out dimensional requirements, and the necessary flatness of the bare board, as outlined in IEC 61188-1-1.

5.3.2 Notifying assemblers and their suppliers

Before procurement, it is essential for the end-user to communicate the product's application or classification level, along with its environmental and mechanical test specifications, to the manufacturer The manufacturer must relay this information to suppliers, detailing the intended assembly process, relevant time-temperature cycles, and cleaning methods for the substrate or board This includes considerations for reworking solder joints and any additional soldering processes needed for populating both sides of the assembly.

5.3.3 Suitability for high assembly yield

To ensure that substrates and boards arrive in optimal condition for high-yield placement and soldering operations, manufacturers must verify that the land surface finish and solderability specifications from suppliers are appropriate for the intended methods Key factors include the application method of the solderable coating, the flatness and thickness range of the solder coating, and the optical characteristics of the surface for optical sensing Additionally, it is crucial to adhere to the useful storage life of anti-oxidant and pre-flux coatings to maintain their effectiveness.

The transit packaging materials and the maximum stack quantity must be agreed upon with the supplier and included in the contract It is essential to ensure that hygroscopic materials or those containing significant levels of free sodium, chlorine, or sulfur ions, such as shrink film and cling film, do not come into contact with solderable surfaces.

5.4 Specification and procurement of process materials

To ensure optimal performance in reflow soldering operations, it is essential that each container of paste or adhesive includes the date of manufacture and the country of origin Suppliers must also provide a clear key for interpreting this information.

To reduce the risk of solder balling and minimize air exposure to solder paste during printing, it is advisable to choose a container size that can be consumed within 36 hours of opening and features a re-sealable lid.

Dispensing syringes should ideally be transparent, even when sealed in light-proof material for transport and storage, to allow for easy detection of any separation between the paste carrier and solder particles.

5.4.2 Lingots de brasure pour brasage par immersion

Cleaning materials are typically specified according to the manufacturer's reference data It is important to choose container sizes that allow available personnel or local transport and lifting equipment, such as carts, to handle them safely Containers holding flammable, toxic, or other hazardous substances must be clearly labeled with appropriate standard hazard warnings.

Used cleaning materials should be disposed of in clearly marked safety containers that are easily distinguishable from those containing new materials It is important to arrange for their disposal at the same time as the purchase of new supplies.

Les exigences légales locales en matière de sécurité et d'environnement pour la gestion des matériaux nuisibles à l'environnement, toxiques et inflammables doivent être respectées.

Ceux-ci sont très sensibles aux dommages mécaniques et il convient que la spécification de fourniture identifie la méthode d'emballage appropriée et les matériaux utilisés à cet effet.

Packaging materials in contact with the stencil or screen should not release particles that could obstruct openings It is also essential to specify the measured parameters and the methods employed for incoming goods inspections.

Il convient que les flux soient spécifiés comme respectant les exigences appropriées, par exemple celles fournies dans la CEI 61190-1-1 ou dans la spécification destinée à l'utilisateur.

Temporary solder masks should be selected based on their ability to adhere to the board materials, as well as the integrity, adhesion, and flexibility of the adhesive according to the expected time-temperature profile of soldering Any contaminants remaining after removal must be specified as harmless and should not compromise the solderability of surfaces requiring further soldering or interfere with cleaning processes if applicable.

Plan de contrôle, installations de contrôle et manipulation

Sample sizes and confidence levels should be tailored to the supplier's quality history, assembly process requirements, and product classification level A documented control plan in accordance with ISO 9002 must be available for review.

5.5.2 Installations de contrụle des marchandises reỗues

The manufacturer or assembler must demonstrate appropriate handling capabilities to effectively control received goods, thereby minimizing the risk of mechanical, chemical, or electrostatic damage, as well as contamination of the inspected items essential for subsequent production.

5.4.2 Solder ingots for immersion soldering

Cleaning materials should be identified using the manufacturer's reference data, and containers must be sized for safe handling by personnel or local lifting equipment, such as trolleys Additionally, containers that hold flammable, toxic, or harmful substances must display the appropriate standard hazard labels.

Used cleaning materials must be stored in clearly labeled containers that are distinct from those containing unused supplies Their disposal should be coordinated with the purchasing process.

Local legal environmental and safety requirements for the management of flammable, toxic and environmentally harmful materials shall be complied with.

Proper packaging is crucial for sensitive items to prevent mechanical damage, and the procurement specification must detail the packaging methods and materials It is essential that packaging materials in contact with stencils or screens do not release particles that could obstruct small apertures Additionally, the specifications should outline the parameters and methods for conducting goods inward checks.

Fluxes should be specified as meeting the relevant requirements, for example, those given in

IEC 61190-1-1 or the user specification.

Temporary solder masks must be compatible with board materials and ensure the integrity, adhesion, and flexibility of the adhesive during the specified soldering time-temperature profile Any residues remaining after removal should be deemed harmless and should not affect the solderability of surfaces that require further soldering or hinder cleaning processes Refer to section 19.3 for more details.

5.5 Inspection plan, inspection facilities and handling

Sampling and confidence levels must align with the supplier's quality history, assembly process requirements, and product classification Additionally, a documented inspection plan compliant with ISO 9002 should be accessible for review.

The manufacturer or assembler must ensure effective handling procedures during goods inwards inspection to reduce the risk of mechanical damage, chemical contamination, and electrostatic damage to items needed for future production.

Control installations for received items must include sufficient lighting for visual inspection, exceeding 1,000 lm/m² at the table level, appropriate visual magnification, and electrical testing devices for boards and components that meet the requirements of the received goods testing strategy.

– des appareils de mesure mécaniques et des gabarits suffisamment précis pour assurer que les dimensions et la forme des articles reỗus satisfont aux exigences spộcifiộes;

Access to testing devices for the solderability of components and boards is essential for evaluating the products' ability to maintain high performance after soldering, while requiring minimal rework during production.

Stockage et assemblage des composants, des cartes et des matériaux

All components, boards, and processing materials must be stored according to the manufacturer's recommended conditions, adhering to the specified shelf life (IEC 61760-2) In the absence of such data, assemblers should maintain a low humidity level (relative humidity