Iec 60748 23 1 2002

IEC 60748-23-3:2002, Semiconductor devices – Integrated circuits – Part 23-3: Hybridintegrated circuits and film structures – Manufacturing line certification – Manufacturers’ self-audi

Circuit

The circuit marking must be detailed in the specification to ensure proper identification and traceability It should include terminal identification, such as the position of pin No 1, type designation, date code, and handling precautions, as space allows.

This document is licensed to MECON Limited for internal use in Ranchi and Bangalore, and it is supplied by the Book Supply Bureau It includes essential details such as the mark of conformity, the manufacturer's name or trademark, the serial number, and the product assessment level schedule (PALS) number.

Despatch primary pack

The marking of the dispatch primary pack must be detailed in the specification to ensure proper content identification and traceability It should include relevant information such as the certificate of conformity reference number, the order or contract number, and the quantity of circuits.

General

6.1.1 Eligibility for manufacturing line certification

Manufacturing line certification is available exclusively to manufacturers of film integrated circuits and hybrid film integrated circuits who have received manufacturer's approval per ISO 9000 standards, as outlined in IEC QC 001002-3, clause 2 To qualify for this certification, manufacturers must have direct supervision from a designated management representative (DMR) during the manufacturing process, particularly in the primary stage of production The DMR is responsible for ensuring effective coordination and control of the certified manufacturing line by establishing a senior management team.

Subcontracting shall be in accordance with the requirements of 4.2.2 of IEC QC 001002-3.

The subcontracted manufacturing processes may be either: a) film production; b) trimming of elements; c) mounting of components; d) packaging; e) others.

Not more than two of the four named processes shall be subcontracted.

6.1.3 Control of procurement sources and incoming material

Subclause 4.2.3 of IEC QC 001002-3 applies with the following details:

6.1.3.1 Added components, part finished components, materials and subcontracted processes covered by a IECQ specification

These shall be procured using the normal IECQ release procedures Under these conditions no other assessment is required.

LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU.

6.1.3.2 Added components, part finished components, materials and subcontracted processes not covered by a IECQ specification

The DMR is responsible for maintaining a procurement specification and conducting an evaluation program for each procured item or family from all manufacturing sources, in line with the applicable product assessment level schedules (PALS) for the finished circuit.

This evaluation programme may be carried out as part of the initial design evaluation.

Each variant must meet the minimum sample size and acceptance criteria outlined in the relevant PALS, utilizing principles of structural similarity Additionally, it is essential to establish a goods inward inspection and a continuous vendor rating system for all items Furthermore, necessary procedures should be implemented to ensure that procurement aligns with any applicable IECQ release standards.

6.1.4 Validity of release for delivery

Circuits can be released under manufacturing line certification if they meet specific conditions: they must be designed and manufactured within the manufacturer's approved capabilities, and an evaluation program must be conducted for each circuit or family according to the relevant Product Assurance Levels (PALS) outlined in annex A These PALS represent the minimum product release requirements as specified in IEC 60748-23-1 to IEC 60748-23-5.

Each level specifies the minimum assessment requirement and process requirements.

Customers can enhance testing requirements or establish periodic product sampling for design evaluations Structural similarity claims must be mutually agreed upon by the customer and manufacturer The product assessment release level should be clearly indicated in the product specification and certificate of conformity The mandatory device screening sequence in each PALS can be altered by mutual agreement between the customer and manufacturer, allowing for a reversal of the sealing and final electrical test sequence There is no specific testing sequence required for design evaluations, and different samples may be utilized for each test, although the manufacturer may choose to use the same samples at their own risk Devices for testing must have successfully completed device screening The allowable percent defective (PDA) is determined at the start of the burn-in test, with tests conducted before burn-in or after the subsequent electrical test not subject to PDA If the number of defectives allowed is not a whole number, it should be rounded up In cases of failure at PDA, if the defective percentage exceeds the PDA but remains within double the PDA, the passing devices may be resubmitted for burn-in and evaluated against a tightened PDA The tightened PDAs are 10% to 7%, 7% to 5%, and 5% to 3% Additionally, all circuits, components, and materials are traceable to the original manufacturer's lot numbers.

6.1.4.2 Release of circuits subjected to destructive or non-destructive tests

Circuits subjected to destructive (D) mechanical or environmental tests shall not be included in the lot for delivery.

Circuits subjected to non-destructive (ND) tests may be delivered, provided they meet the requirements of the detail specification.

Circuits that have been stored for more than two years after the lot's release must undergo retesting for electrical and solderability tests as specified, before delivery, unless the manufacturer can provide evidence for a longer storage period.

Rework shall only be permitted within the procedures declared in the manufacturer's declared procedures as defined in 4.7.1 of IEC QC 001002-3.

A customer may prohibit or restrict rework on circuits to be supplied to a particular contract.

In cases where circuits are embedded in hard plastic encapsulants, rework is strictly limited to the specifications outlined in section 6.1.5.8 It is essential to define the maximum time and temperature limits for any rework activities Additionally, thorough screening must be conducted post-rework to ensure compliance with the manufacturer's established testing procedures.

Film conductors can be modified by adding conducting links, as long as the quantity of links and attachment methods adhere to the manufacturer's specified guidelines.

Rebonding of semiconductor dies is limited to a single attempt and must not exceed 10% of the wire bonds in a circuit Additionally, rebonds should be made on at least 50% of the undisturbed metallization, excluding any probe marks.

Rebonding to header pins and film conductor tracks is not restricted except that each rebond is on at least 50 % undisturbed metallization.

Compound wire bonding is allowed, provided that one wire bond is placed on top of another, but this practice is not permitted on the semiconductor die The new bond must cover a minimum of 75% of the original bond and can only be attempted once.

Added components may be replaced up to two times except for a eutectic bonded semiconductor die which may be replaced only once, unless demonstrated otherwise by the manufacturer.

Assembled substrates may be removed and placed into new packages only once.

Package lids may only be replaced if the design lid/circuit clearance is maintained.

Reworked packages shall be submitted to the screening sequence of the relevant PALS.

The following processes are also permitted: a) cleaning; b) marking; c) lead straightening.

6.1.5.9 Use of reworked (removed) added components

Added components may be reused provided they conform with the requirements of the relevant visual, electrical, mechanical and environmental tests and the provisions of

Procedures for manufacturing line certification

6.2.1 Application for manufacturing line certification

Application shall be made to the National Authorized Institution (NAI) in accordance with

IEC QC 001002-3, 4.2.4 In addition, the manufacturer shall: a) conform with the eligibility requirements of 6.1.1; b) carry out an audit and conform with the requirements of the appraisal checklist in

IEC 60748-23-3; c) submit the completed appraisal checklist to the National Supervising Inspectorate (NSI); d) conform with the requirements of one or more of the product assessment level schedules

(PALS) in annex A The testing shall be performed on a circuit type or types representative of the manufacturer's claimed production capability (see 6.4.3).

6.2.2 Granting of manufacturing line certification

The manufacturer shall submit a report to the NSI covering the manufacturing line certification testing in accordance with the requirements of 6.4.4.3.

Manufacturing line certification shall be granted when the requirements of this specification have been satisfied.

Description of capability

The manufacturer shall describe his process capability to the NSI in a declared document.

The scope of process capability for each qualifying component shall be stated.

Qualifying components

A PTV may be either a specially designed test specimen or a standard product.

Specially designed PTVs will be documented within the manufacturer's control system, detailing circuit materials and components, outlining process and inspection stages along with quantities, specifying acceptance criteria, and including identification or marking requirements.

A list of PTVs, cross-referencing the process(es) monitored, shall be incorporated in the declared procedures This may be in tabular form.

The PTV quality standards, measurements, data collection and presentation shall be detailed in the process control documentation.

A circuit which is designated "qualification circuit" and used for process approval testing shall comply with the requirements of the detail specification.

More than one circuit may be needed as a qualifying circuit to approve all the permitted processes.

6.4.3 Circuit or circuits representative of the manufacturer's claimed production capability

The qualification circuit samples must undergo the most stringent PALS testing as specified by the manufacturer The quantity of samples needed is determined by the testing requirements, and the manufacturer assumes the risk for the sequence of tests A report detailing the results, in accordance with the requirements of 6.4.4.3, must be submitted to the NSI.

The circuit must facilitate the evaluation of the largest area package within 20% for each generic package configuration and material type, as well as for each substrate material and various conductor, resistor, and dielectric generic material types It should exhibit representative density and incorporate the maximum number of layers, including metallization.

The article outlines essential requirements for design specifications, including a minimum declared design width of 20%, detailed temperature/time profiles for deposited materials, and various trimming techniques It emphasizes the need for representative samples of add-on components, assessing their maximum and minimum declared attach area and/or mass within 25% Additionally, it covers different attachment methods and materials, applicable bonding techniques such as ultrasonic and thermo-compression, and methods for package sealing or encapsulation.

6.4.4 Demonstration and verification of capability

Electrical, visual, mechanical, and environmental tests must adhere to the applicable qualifying circuit detail specifications outlined in one of the PALS in Annex A Additionally, the process and packaging should comply with the specifications detailed in the PALS.

Process controls and in-process inspections on process test vehicles as declared by the manufacturer shall be in accordance with the requirements of IEC 60748-23-3.

The test and inspection requirements for manufacturing line certification and maintenance of approval ensure that the design, materials, and processes can produce circuits that meet detailed specifications This is accomplished through a combination of approved materials, incoming inspections, tests, and in-process evaluations.

Manufacturers must ensure that any processing of completed circuits before dispatch does not significantly alter material performance All materials and validation tests must be thoroughly documented and referenced in the declared procedures.

5) damp heat. b) In-process inspections

In-process inspections, such as internal visual examinations, are essential for process control Manufacturers must provide comprehensive documentation demonstrating process capability in relation to design data, layout rules, and specific in-process inspection standards as outlined in their declared procedures The validation requirements for internal visual examinations are specified in IEC 60748-23-2.

Electrical, mechanical or environmental tests to be made on the assembled circuits to verify circuit performance prior to the packaging process shall be specified in the circuit control documentation.

Electrical, mechanical, or environmental tests performed on circuits or test vehicles essential to process control can substitute for quality conformance inspections, provided the manufacturer proves equivalence and thoroughly documents the requirements in the declared procedures.

1) constant acceleration (except for resin-moulded devices);

2) sealing, gross and fine leak (except for resin-moulded devices);

6.4.4.3 Manufacturing line certification test report

A test report must be created following the specifications outlined in this clause, validated by the DMR, and approved by the NSI after confirming compliance with the specified requirements.

A copy of the report shall be submitted to the NSI Any other reproduction and release of the report is the sole prerogative of the manufacturer.

The test report shall be dated and conform to the following requirements: a) Clause 1 – Front pages

The test report shall be prefaced with the following information:

1) Designation of report, i.e "Manufacturing line certification test report";

2) Name and address of the test laboratory;

3) When relevant, the position of the test laboratory within a larger organization shall be stated;

4) If it is an IECQ approved independent test laboratory, the scope of the approval shall be stated;

5) Name and address of the NSI responsible for the supervision of the manufacturing line certification tests;

6) Name and address of the manufacturer;

7) Detailed description of the tests with reference to the specifications to be applied including revision number and date of issue;

8) In case of subcontracting of tests the identification of the assigned test laboratory;

9) Accurate identification of the test sample specified by mark of origin, date code and fabrication flowchart (lot traveller);

10) Reference number of the test report;

11) A declaration as follows signed by the DMR:

I confirm that the System's requirements have been fulfilled, and all tested specimens are representative of the current production These specimens were produced using the latest intended methods and materials.

12) The signature of the representative of the NSI;

13) Date of receipt of test item(s) and period of testing. b) Clause 2 – Abstract of the test plan

The abstract should outline the test groups and subgroups within the entire testing program, specifying the required number of samples for each group and subgroup, as well as the potential number of defects identified in each category.

The use of a flow chart is recommended.

A timetable shall display the test program sequence and a summary of actual results achieved shall be given. c) Clause 3 – Details of the specimen

The article will detail the origin of the random sample, specifying the number of units selected from each inspection or production lot and their assignment to test groups or subgroups Additionally, it will provide the assigned numbers for each unit if the test plan necessitates the calculation of delta limits.

The report shall detail the rules applied in cases where the report concerns structural similarity claims.

LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU. d) Clause 4 – Contents

The following details shall be given on each page of the test report:

1) The test report reference number;

NOTE The front page of the report should indicate the page number and the total number of pages of the report.

The test and measurement equipment used for the performance the tests shall be uniquely identified, with its calibration status shown;

Each test method must be named according to the relevant standard If a non-standard test method is employed, it should be thoroughly detailed.

6) A description of all test conditions:

Standard conditions for testing (ambient temperature, relative humidity, etc.);

Type and level of the stress;

Where relevant, a description of any special preconditioning or recovery of the test samples;

Test results must be reported with accuracy, clarity, and completeness Each test sequence or sub-group result should be traceable to the individual who conducted the test or measurement, and all results must be dated.

If there is a large amount of test data, it is recommended that statistical methods are used so that a clear evaluation can be made;

8) The individual test requirement (specification limit) shall be stated and the measurement uncertainty associated with the test. e) Clause 5 – Failure identification and analysis

All failures which occur during the testing shall be identified with the results of the failure analysis carried out.

6.4.5 Procedures to be followed in the event of capability qualifying component

The requirements of 4.2.6.2 and 4.2.10 of IEC QC 001002-3 apply in the case of all failures, where applicable.

6.4.6 Abstract of description of capability

The manufacturer's description of his capability shall be provided to the NSI for inclusion in the certified manufacturing line listing.

The description shall be based on the following abstract of capability: a) company name; b) type of technology; c) approved processes; d) subcontracted processes; e) packaging methods;

Procedures following the granting of manufacturing line certification

6.5.1 Maintenance of manufacturing line certification

Manufacturing line certification is upheld through quality conformance inspections that assess detailed specifications and the manufacturer's quality management program This includes the annual submission of a self-audit checklist to the NSI, in compliance with IEC 60748-23-3 standards.

Manufacturing processes which have not been exercised within a two year period shall be automatically excluded from the manufacturing line certification and the manufacturer shall take action in accordance with 6.5.2.

6.5.2 Notification of changes likely to affect the validity of manufacturing line certification

A manufacturer who intends to extend his capability shall make formal application to the NSI, in accordance with 6.2.1 A manufacturer who intends to reduce his capability shall advise the

NSI of the modification and amend the 'abstract of capability' accordingly.

Such modifications shall be included in the manufacturer's change control system.

The manufacturer is required to notify the NSI of the following changes and provide a plan of implementation and/or re-verification which shall, as a minimum, include the following:

NOTE All re-verification programmes are to be agreed with the NSI. a) Change in place of manufacturer

1) breakdown of personnel transferring to the new site;

2) organization chart for the new site;

3) approvals held by the new site (if applicable);

4) details of equipment transfer and commissioning;

5) plan for re-establishing the environment;

6) re-verification of approval proposals. b) Change of key manufacturing process

1) details of equipment and commissioning;

2) re-verification of approvals proposal. c) Changes of materials from those declared in manufacturer's declared procedures

2) products and/or processes affected;

4) re-verification of approvals proposal.

NOTE Engineering data may be submitted as evidence of suitability of materials in lieu of a re-verification programme with the agreement of the NSI.

LICENSED TO MECON Limited - RANCHI/BANGALORE FOR INTERNAL USE AT THIS LOCATION ONLY, SUPPLIED BY BOOK SUPPLY BUREAU. d) Change of quality personnel/organization chart

- Any change of DMR. e) Change of test equipment or approved test house

NOTE Does not include electrical test.

2) details of equipment and commissioning;

3) change to scope of approval. f) Reclassification of clean room area

1) extent of reclassification and areas affected;

2) implementation data. g) Significant failures/returns

4) data relating to processes and/or other products affected. h) Significant adverse change of process monitoring limits

1) Nature and details of change;

2) Data relating to processes and/or other products affected.

Release for delivery

Circuits conforming to the requirements of 6.1.4 may be released.

The detailed specification will outline the quality conformance inspection requirements, which must include at least the tests specified in the relevant PALS (refer to sections 6.6.2.4 to 6.6.2.7) It is essential that these tests are conducted in the order presented in the PALS.

The DMR is responsible for the formation of inspection lots from production batches/lots submitted for quality conformance inspection.

Each inspection lot shall be given an inspection lot number and records shall be kept of the production batches/lots forming the inspection lot together with the test results.

Each shipment of circuits to a customer must include a certificate of conformity, confirming that the circuits meet the specified detail specifications and is endorsed by an approved signatory.

A copy of the certificate of conformity shall be filed by the manufacturer.

The certificate of conformity must contain essential information, including the manufacturer's name, address, and certified manufacturing line registration number, as well as the customer's name, address, and contract/order number It should specify the circuit type number, inspection lot number, and detail specification number with its issue Additionally, it must include the number of PALS, the total circuits in the shipment, and a statement certifying traceability and compliance with the detail specification and customer's order Finally, it should be signed by an approved signatory and dated.

The signatories to the certificate of conformity shall be declared by the manufacturer to the

The tests specified in the PALS shall be carried out on all devices submitted for inspection.

Devices that fail testing must not be released The allowable percentage of defects (PDA) is determined from the start of the burn-in test, and any failed lots are prohibited from being released Tests conducted prior to burn-in or after the electrical test at ambient temperature following the burn-in do not fall under the PDA criteria.

In any lot, the PDA is rounded up to the nearest whole number If a failure occurs at the PDA and the percentage of defects exceeds the PDA but remains below double the PDA, the devices that passed can be re-submitted for burn-in once and then evaluated against a tightened PDA The tightened PDAs are adjusted from 10% to 7%.

Tests outlined in the PALS must be conducted on samples from each inspection lot Lots that fail destructive tests will be rejected, while those that fail non-destructive tests will undergo 100% testing for the parameters that failed.

Devices that share the same build standard but have varying electrical functions may be considered structurally similar, provided this is agreed upon by the customer However, this claim does not apply to tests that are specifically excluded in the PALS outlined in annex A.

Tests outlined in the PALS must be conducted on the initial delivery lot of each product, unless prior tests on structurally similar devices confirm their applicability As these tests are crucial for design validation, any failed lots are prohibited from shipping, necessitating an investigation into the failure's cause Re-submission is allowed only after the fault has been rectified and a new lot successfully passes inspection.

The requirements given in the PALS shall be applied.

The customer detail specification shall be in accordance with the requirements of

The PALS number shall be stated in the customer detail specification.

Customer and manufacturer ownership rights for a detail specification may be shared, with both parties treating the contents as confidential Additionally, a detail specification for standard catalogue circuits must be included in the qualified products list (QPL).

The detail specification shall conform to the requirements of IEC 60748-23-4.

General

Test and measurement procedures must adhere to the published standards of IEC and IECQ This clause outlines any qualifications or options available In cases where IEC and IECQ standards are not applicable, and specific test methods are not provided, the relevant tests and measurement conditions should be specified in the detail specification.

In addition to the tests outlined in the PALS, manufacturers may incorporate additional tests for process control, which can be documented in the process control documentation Customers may also request these tests to be included in their specific detail specifications.

Standard conditions for testing

Conditions for testing shall conform to those given in a) 5.3 of IEC 60068-1: standard atmospheric conditions for measurement and tests, b) 5.4 of IEC 60068-1: recovery conditions.

The specified limits in the detail specifications represent accurate values To account for measurement uncertainty during the required tests, the approved manufacturer must use an adequate inset from these specified limits.

A measurement uncertainty value shall be calculated for each performance requirement which relates to screening, lot-by-lot and design evaluation tests specified in the detail specification.

Each measurement uncertainty value shall be used to apply an inset of at least the uncertainty value to the values specified in the detail specification.

Where external test laboratories are utilized, measurement results are to include a stated measurement uncertainty.

The specified test and measurement methods are not the sole options available; however, the tester must ensure that any alternative methods yield results equivalent to those specified In the event of a dispute, only the specified methods will be referenced Detailed specifications will not include alternative test methods.

7.2.3 Definition of axes for mechanical and other tests

Methods that involve observation or the application of external forces must align with the orientations and directions illustrated in Figure 1 For alternative configurations, the definitions of the axes will be specified in detail.

NOTE The Y 1 force application is such that it will tend to lift the die off the substrate or the wires off the die.

The term "equivalent" refers to the value of a characteristic determined by an alternative method, which is deemed acceptable within the defined limits of that method This value will also fall within the specified limits when assessed using the designated method.

2 Principal base substrate or mounting surface

Figure 1a – Dual in-line(DIL) package

Figure 1c – Flat package with radial lead

Figure 1d – Single in-line package

Figure 1 – Definition of axes for mechanical and other tests

Visual inspections and package dimensions

Internal visual inspection shall be carried out in accordance with IEC 60748-23-2.

Visual inspections must be conducted under approved factory lighting and standard viewing conditions, covering several key aspects: the correctness and legibility of markings, proper identification and alignment of terminations, and the overall appearance of embedded packages, including checks for chip-outs, cracks, voids, and pin holes, as well as the condition of packaging material beneath the seating plane Additionally, for cavity packages, both metal and ceramic, inspections should assess appearance, dents, burrs, metal stress, and any cracks in glass or metal seals.

The dimensions to be checked shall be specified in the detail specification and verified using methods and equipment compatible with the required tolerances.

Electrical measurement procedures

The requirements for measuring the electrical characteristics or the electrical function of the circuit shall be in accordance with the detail specification.

The requirements in 7.4.2 to 7.4.8 shall be complied with, unless stated otherwise in the detail specification.

The test conditions for all measurements shall be such that the maximum ratings of the device are not exceeded (see IEC 60134).

All electrical tests must be performed under stable conditions unless stated otherwise or if measurements are taken under pulsed conditions If test conditions lead to significant changes over time in the characteristics being measured, appropriate compensation methods must be outlined, such as the duration the device should be held at test conditions prior to measurement.

The ambient temperature must be recorded as the air temperature near the film and hybrid integrated circuit, within an environment that maintains a largely uniform temperature This measurement should be taken in conditions where cooling occurs solely through natural air convection, without significant influence from reflective or radiant surfaces.

To ensure safety, it is essential to set limits on maximum instantaneous currents and applied voltages Additionally, it is advised that devices should not be inserted or removed from a test circuit while it is energized.

Unless the detail specification declares the circuit not to be electrostatic discharge sensitive

(ESDS), circuits shall be considered to be ESDS, and precautions shall be taken in accordance with IEC 61340-5-1.

A current is deemed constant when a two-to-one increase in effective load impedance results in a change in the measured parameter that remains within the acceptable accuracy limits.

The effective admittance of a current measuring device shall be sufficiently high so that halving its value does not significantly affect the accuracy of the measurement.

A voltage is deemed constant when a reduction of the effective load impedance by half does not result in a change in the measured parameter that exceeds the specified accuracy requirements.

The effective impedance of a voltage measuring device shall be sufficiently high so that halving its value does not significantly affect the accuracy of measurement.

The load impedance signifies the equivalent input impedance of both the test circuit and the device being evaluated For acceptance testing, this input impedance can be substituted with a resistor that reflects the worst-case scenario.

Direct current and voltage sources must maintain a ripple content that is minimal enough to ensure accurate measurements Additionally, the test or supply voltages and currents should remain within ±1% of their specified values.

Any termination for which no conditions are specified shall be left unconnected.

Unless otherwise prescribed in the detail specification, a d.c voltage of 100 V ± 15 V, shall be applied for 1 min ± 5 s Where necessary, the polarity shall be specified in the detail specification.

7.4.8.1 Insulation between terminations (or groups of terminations)

The voltage shall be supplied between any and every combination of terminations which are electrically and functionally isolated.

7.4.8.2 Insulation between all the isolated terminations and the case

Voltage must be applied between a metal foil securely in contact with the case and all circuit terminations that are connected, excluding leads electrically linked to the case It is essential that the size and placement of the foil do not compromise the insulation paths.

Unless otherwise specified in the detail specification, a circuit fails the test if there is a) evidence of flashover or mechanical damage. b) any individual reading of insulation resistance less than 100 MΩ.

Environmental test procedures

The environmental tests are labelled (D) for "destructive" or (ND) for "non-destructive" according to their effect upon the circuit.

Most of the tests outlined here are based on IEC 60068, with certain tests providing additional guidance as indicated in their titles Further assistance can be found in the footnotes, and sections from IEC 60068-3 and IEC 60068-5 may also offer valuable insights.

The dry heat test shall be in accordance with:

The IEC 60068-2-2 Test Ba specifies that conditioning periods must be extended to 160 h, 320 h, and 640 h, each with a tolerance of ±0.8 h, or to 1,000 h with a tolerance of ±24 h During the conditioning phase, no electrical loading or measurements are permitted, and the recovery period is to be extended to a maximum of 24 h.

The detail specification shall prescribe:

1) the temperature of conditioning which shall be the maximum storage temperature of the circuit;

The cold test shall be in accordance with:

The Test Ab of IEC 60068-2-1 specifies that conditioning periods must be extended to 160 h, 320 h, and 640 h, each with a tolerance of ±0.8 h, or to 1000 h with a tolerance of ±24 h During the conditioning phase, no electrical loading or measurements are permitted Additionally, the recovery period is to be extended to a maximum of 24 h.

The detail specification shall prescribe:

1) the temperature of conditioning which shall be the minimum storage temperature of the circuit;

This damp heat, steady state test shall be in accordance with:

IEC 60068-2-3 with the following specific change:

Amend clause 1 of Test Ca to read:

"1 Object: To assess, using unsaturated damp heat, the external aspect (such as surface finish) of hybrid integrated circuits."

The detail specification shall prescribe: a) method; b) preconditioning procedure: none; c) initial measurements:

Prior to introducing the device into the chamber, it must be heated to a temperature higher than that of the chamber to prevent condensation, or alternatively, the chamber can be brought to ambient temperature The conditioning severities can be set for either 21 days or 56 days, with no electrical operation or checks required during this period Special care should be taken to remove any surface moisture if necessary After conditioning, the specimens must be allowed to recover under standard atmospheric conditions before final measurements are taken, as outlined in section 5.3 of the IEC standards.

60068-1) for no less than 1 h and no more than 2 h, unless otherwise stated in the detail specification; j) final measurements:

5 Guidance for damp heat tests is given in IEC 60068-3-4.

7.5.3.2 Method 2 – Damp heat, steady-state, accelerated

(based upon Amendment 1 to IEC 60749)

The steady-state damp heat test evaluates the accelerated resistance of non-cavity and epoxy-sealed cavity devices to degradation from damp heat exposure.

It is also used to assess the effect of damp heat when combined with bias This test is not intended to assess external effects of corrosion.

The test exposes specimens to elevated levels of unsaturated damp heat for durations ranging from 168 hours to 5,000 hours, based on the specified severity outlined in Table 1 Additionally, a bias voltage may be applied if required, as described in the following sections.

Degradation results from absorption of water vapour by the encapsulation materials and presence of moisture films or penetration of moisture along physical junctions.

The chamber must be designed to ensure that temperature and humidity are continuously monitored using sensing devices within the working area Additionally, it is essential that both the temperature and relative humidity remain consistent, with a tolerance of ±2 °C for temperature and ±5% for relative humidity from the specified levels.

The temperature tolerance of ± 2 °C accounts for absolute measurement errors, gradual temperature changes, and variations in the working environment To ensure the required humidity levels, short-term fluctuations must be limited to ± 0.5 °C Additionally, condensed water is continuously drained from the chamber and is not reused until it has been re-purified, and it is crucial that this condensed water does not come into contact with the specimens.

The supply water shall have a resistivity not less than 500 Ωm.

Table 1 – Severities for damp heat, steady-state – Method 2

Test conditions (see note) Duration (h)

% Severity 1 Severity 2 Severity 3 Severity 4 Severity 5

NOTE The resulting vapour pressure is of the order of 500 hPa.

7.5.3.2.4 Bias voltage a) When specified, the specimen shall have a voltage bias applied during exposure.

Guidelines for determining the appropriate circuit configuration for bias applications are listed below in descending order of importance (see note):

1) power as small as possible;

2) voltage as high as possible within the operating range;

3) voltage difference as high as possible between adjacent metallization lines on the die

(for example, in the case of digital devices, adjacent inputs for the same gate would be high and low, respectively).

NOTE The highest stress conditions correspond to zero power combined with maximum allowed voltage to the device within the operating range and maximum allowed voltage between adjacent metallization lines.

Where the dissipation of the devices cannot be reduced below 100 mW the bias voltage shall be applied intermittently The on-off periods shall be specified, preferably

1 h on and 3 h off. b) Bias voltage shall be applied to the specimens for a total time equal to the specified test duration.

The total test duration for intermittent bias must match the specified duration for non-intermittent tests, including both on and off periods Additionally, voltage biases should remain applied to specimens until they reach room temperature, unless it is proven that removing the bias during cooling does not significantly affect the device's characteristics under the specific test conditions.

Prior to exposure, the specified measurements shall be made at standard atmospheric conditions for testing or as specified.

The specimens under test are placed at a minimum distance of 30 mm from the chamber internal surfaces and shall not be submitted to radiant heat from the heaters.

After conditioning, the specimens must be tested under standard conditions as outlined in section 5.3 of IEC 60068-1, maintaining normal atmospheric pressure for a duration of at least 1 hour and no more than 2 hours, unless specified otherwise in the detail specification.

The specimen shall be visually inspected and electrically and mechanically checked as required in the detail specification.

Measurements may be initiated any time upon completion of the recovery period, but all measurements shall be completed within 8 h after the recovery period.

The detail specification shall prescribe: a) method; b) severity; c) bias voltage (when specified); d) on-off periods, if applicable; e) initial measurements; f) final measurements.

7.5.3.3 Method 3 – Damp heat, steady-state, highly accelerated

(based upon Amendment 1 to IEC 60749)

The steady-state damp heat test evaluates the resistance of non-cavity devices to degradation caused by damp heat, using unsaturated and pressurized vapor for accelerated results It also examines the impact of damp heat in conjunction with bias, but does not measure external corrosion effects.

The test exposes specimens to high levels of unsaturated damp heat for brief durations, with bias voltage applied if required The severity of the test, as outlined in Table 2, is based on temperature, relative humidity, and duration It is crucial to avoid exceeding the glass transition temperature of the encapsulating material.

Degradation results from absorption of water vapour by the encapsulation materials and presence of moisture films or penetration of moisture along physical junctions.

The chamber is designed as a humidity and pressure vessel (autoclave) capable of generating vapor pressures exceeding 1,000 hPa, adhering to specified values in table 2 It features strategically placed sensing devices to monitor temperature and humidity, ensuring uniform conditions within the working space that comply with the tolerances outlined in table 2 Additionally, it prevents condensed water from dripping onto specimens, and the water used must have a resistivity of at least 500 Ωm.

Table 2 – Severities for damp heat, steady-state – Method 3

NOTE The vapour pressures are approximately 1 200 hPa, 1 700 hPa or 2 300 hPa for variants A, B and C, respectively.

When specified, a voltage bias must be applied to the specimen during exposure, ensuring it remains within the operating range and adheres to safety requirements Guidelines for selecting the appropriate circuit configuration for bias application are provided, prioritized by importance.

1) power as small as possible;

2) voltage as high as possible;

3) voltage difference as high as possible between adjacent metallization lines on the die

(for example, in the case of digital devices, adjacent inputs for the same gate would be high and low, respectively).

Under the highest stress conditions, the device experiences zero power while operating at the maximum allowed voltage and the maximum voltage between adjacent metallization lines In cases where the specimens cannot dissipate below 100 mW, it is recommended to apply the bias voltage intermittently, with specified on-off periods for optimal performance.

1 h on and 3 h off. c) Bias voltage shall be applied to the specimens for a total time equal to the specified test duration.

Tiêu đề	Part 23-1: Hybrid Integrated Circuits and Film Structures – Manufacturing Line Certification – Generic Specification
Trường học	International Electrotechnical Commission
Chuyên ngành	Semiconductor Devices – Integrated Circuits
Thể loại	Standard
Năm xuất bản	2002
Thành phố	Geneva

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