IEC 60747 1 Edition 2 1 2010 08 INTERNATIONAL STANDARD NORME INTERNATIONALE Semiconductor devices – Part 1 General Dispositifs à semiconducteurs – Partie 1 Généralités IE C 6 07 47 1 2 00 6+ A 1 20 10[.]
Device structure
3.1.1 pad area on a chip (die) to which a connection to the chip (die) can be made
3.1.2 bonding wire wire that is bonded to a chip (die) bonding pad in order to connect the chip (die) to any other point within the device package
3.1.3 base (of a package) part of the package on which a chip (die) can be mounted
3.1.4 cap, can, lid, plug part of a cavity package that completes its enclosure
NOTE The particular term used depends on the package design
The anode terminal of a semiconductor diode, excluding current-regulator diodes, is connected to the P-type region of the PN junction In cases where multiple PN junctions are connected in series with the same polarity, the anode terminal is linked to the extreme P-type region.
NOTE For voltage-reference diodes; if temperature-compensating diodes are included, these are ignored in the determination of the anode terminal
The cathode terminal of a semiconductor diode, excluding current-regulator diodes, is connected to the N-type region of the PN junction In cases where multiple PN junctions are connected in series with the same polarity, the cathode terminal is linked to the extreme N-type region.
NOTE For voltage-reference diodes; if temperature-compensating diodes are included, these are ignored in the determination of the cathode terminal
3.1.7 anode terminal (of a current-regulator diode) terminal to which current flows from the external circuit when the diode is biased to operate as a current regulator
3.1.8 cathode terminal (of a current-regulator diode) terminal from which current flows into the external circuit when the diode is biased to operate as a current regulator
Elements and circuits
3.2.1 passive circuit element circuit element primarily contributing resistance, capacitance, inductance, ohmic inter- connection, wave-guiding, or a combination of these, to a circuit function
Passive components in electrical networks, such as resistors, capacitors, inductors, and passive filters, operate without requiring an external energy source beyond the input However, this definition excludes semiconductor diodes.
3.2.2 active circuit element circuit element that contributes other qualities to a circuit function than a passive circuit element, for example, rectification, switching, gain, conversion of energy from one form to another
NOTE 1 Examples for devices with active circuit elements are diodes, transistors, active integrated circuits, light- sensing or light-emitting devices
Active physical circuit elements can function as passive elements by contributing resistance and/or capacitance to a circuit's temperature function These elements are essential for an electrical network or device, as they require an external energy source beyond the input, which includes semiconductor diodes.
NOTE Active circuit elements can also be used to act as passive circuit elements only, for example, to contribute resistance and/or capacitance to a circuit
3.2.3 circuit element constituent part of a circuit that contributes directly to its operation and performs a definable function
NOTE The term may include the interconnection means to other circuit elements, or to the terminals.
Thermal characteristics properties
3.3.1 virtual (equivalent) junction temperature virtual temperature of the junction or channel of a semiconductor device
3.2.3 3.3.2 reference-point temperature temperature at a specified point on, near or within a device
3.2.4 3.3.3 case temperature temperature of a reference point, on or near the surface of the case
For smaller devices, if the reference point is located away from the case, such as on one of the terminals, the temperature at that location is referred to as the "reference-point temperature." Despite this distinction, devices that are rated based on this temperature are still classified as "case-rated devices."
3.2.5 3.3.4 storage temperature temperature at which the device may be stored without any voltage being applied
3.3.1 3.3.5 thermal derating factor factor by which the power dissipation rating must be reduced with increase of reference point temperature
The equivalent thermal network is a theoretical circuit that models the thermal resistances, thermal capacitances, and heat flow sources of a semiconductor device or integrated circuit This representation provides insights into the thermal conditions and temperature behavior under electrical load, facilitating accurate temperature calculations.
NOTE 1 It is assumed that the total heat flow, caused by the power dissipation, is flowing through this equivalent thermal network
When heat is generated at multiple points within a device, it is essential to incorporate each heat source into the equivalent thermal networks This ensures that the heat flow accurately reflects the total power dissipation occurring in the semiconductor device or integrated circuit.
Transient thermal impedance is defined as the ratio of the change in temperature difference between two specified points or regions at the end of a time interval to the step-function change in power dissipation that initiates this temperature difference change.
The term utilized in practice must clearly indicate the two specified points or regions, such as in "junction-case transient thermal impedance." The abbreviated term "transient thermal impedance" may only be used when there is no risk of ambiguity.
Thermal impedance under pulse conditions is defined as the ratio of the difference between the maximum virtual temperature induced by pulse power and a specified external reference temperature, to the amplitude of power dissipation in the device resulting from a defined sequence of rectangular pulses.
NOTE 1 The initial transient phenomena are ignored and zero continuous power dissipation is assumed
NOTE 2 The thermal impedance under pulse conditions is given as a function of the duration of the pulses with the duty factor as a parameter.
Noise
3.4.1 reference-noise temperature absolute temperature (in kelvins) to be assumed as a noise temperature at the input ports of a network when calculating certain noise parameters, and for normalizing purposes
NOTE It has not been possible to achieve a consensus on a single standard reference noise temperature, although no values below 290 K or above 300 K were found to be in use
3.4.2 overall average noise figure (of a mixer diode and an l.F amplifier) average noise figure of the cascaded combination of a mixer and an I.F amplifier
The standard overall average noise figure of a mixer diode and an I.F amplifier is determined when the average noise figure of the I.F amplifier is set to a standard value, typically 1.5 dB This condition is valid when the I.F amplifier's passband is significantly narrower than that of the mixer, ensuring that the mixer’s conversion loss and output noise temperature remain essentially constant across the I.F passband.
The output noise ratio is defined as the ratio of the noise temperature at an output port to a reference noise temperature This measurement is taken when the noise temperature of all input terminations is maintained at the reference noise temperature across all frequencies that influence the output noise.
The equivalent input noise voltage of a two-port device is defined as the voltage of an ideal voltage source with zero internal impedance, connected in series with the input terminals This voltage source effectively represents the portion of the internally generated noise that can be accurately modeled as a voltage source.
The definition overlooks the equivalent input noise current necessary for a comprehensive description of device noise When the external source impedance is zero, the noise voltage accounts for the total noise.
The equivalent input noise current of a two-port device is defined as the current of an ideal current source, which has an infinite internal impedance, connected in parallel with the device's input terminals This current source effectively represents the portion of the internally generated noise that can be accurately modeled as a current source.
In this definition, the equivalent input noise voltage necessary for a comprehensive description of the device noise is overlooked When the external source impedance is infinite, the noise current accounts for the total noise.
Conversion loss
The conversion loss of a mixer, mixer diode, or harmonic generator is defined as the ratio of the available input power at a specific single-signal frequency to the available output power at the same frequency This measurement excludes intrinsic mixer noise and any power converted from frequencies other than the signal input frequency.
The conversion insertion loss of a mixer, mixer diode, or harmonic generator is defined as the ratio of the available input power at a specific single-signal frequency to the output power delivered at that same frequency This measurement excludes any intrinsic mixer noise and power derived from frequencies other than the signal input frequency.
Stability of characteristics
3.6.1 drift difference between the final value of a characteristic at the end of a specified long period and the initial value, all other operating conditions being held constant
NOTE The use of the term "drift" to refer to the immediate change of a characteristic in direct response to changed operating conditions (for example, temperature) is deprecated
– drift of the characteristic, to
– initial value of the characteristic
3.6.3 instability range difference between the extreme values of the characteristic observed either continuously or repeatedly during a specified period, all other operating conditions being held constant
3.6.4 relative instability range quotient of
– the instability range of the characteristic, and
– the initial value of the characteristic
NOTE 1 The input and output signal measurement units should be specified, eg current, voltage
NOTE 2 Delay time, rise time, and fall time are defined in IEC 60050-521 (Terms IEC 60050-521-05-21, IEC
The turn-on time refers to the duration between a step function change in the input signal level and the moment the output signal magnitude reaches a specified upper limit, indicating the transition of a semiconductor device from a non-conducting to a conducting state.
The turn-off time refers to the duration between a change in the input signal level and the moment the output signal magnitude falls to a specified lower limit This occurs when a semiconductor device transitions from its conducting state to a non-conducting state.
3.7.3 carrier storage time synonym for delay time at turn-off
General
This clause establishes a system of letter symbols for properties relevant to discrete devices and integrated circuits Additional symbols for specific categories may be found in Clause 4 of other sections of IEC 60747 and IEC 60748 In case of any discrepancies, the symbols from the latter sections take precedence.
The general standards outlined in IEC 60027 are applicable unless specified otherwise in this clause, which should be adhered to in such cases Additionally, certain letter symbols and rules for creating complex letter symbols have been specifically authorized for use in IEC 60747.
NOTE Definitions of the terms used in this clause can be found in Clause 3 of this or the other parts of IEC 60747 and IEC 60748.
Letter symbols for currents, voltages and powers
4.2.1 Use of upper-case or lower-case letters and subscripts i D
–i d i d instantaneous value of alternating component i dm peak (maximum) value of alternating component
I DM peak (maximum) total value i D instantaneous total value
I D(AV) , I D(D) , or I D average total value; direct component
I d(r.m.s.) or i d R.M.S value of alternating component i dmin or –i dm peak (minimum) value of alternating component
I DMIN peak (minimum) total value
I D(PP) , [i d(pp) ] peak-to-peak of total value [of alternating component] t t
Figure 1 – Example of the application of the rules to a periodic current
In electrical notation, upper-case letters represent total values (large signal values) for currents, voltages, or powers, while lower-case letters denote values related to the alternating component (small signal values) When multiple subscripts are present, they should consistently use either all upper-case or all lower-case letters.
Exceptionally, cases are used in combination to save otherwise necessary parentheses, for example, V CEsat
Figure 1 gives an example It represents the drain current of an FET that consists of a direct component (the average value) and an alternating component
The basic letters to be used are:
IEC 60027 suggests using the letters V and v as reserve symbols for voltage; however, in semiconductor devices, these symbols are so commonly utilized that this publication prefers them over U and u.
M, m = peak (maximum) value with respect to time
MIN, min = peak (minimum) value with respect to time (see note 3) n noise
(PP), (pp) = peak-to-peak, value
NOTE 1 Where no ambiguity arises, subscripts may be omitted, for example:
I b or I b(rms) = instantaneous root-mean-square value base current
NOTE 2 For other recommended subscripts, see Clause 4 in the other relevant parts of these publications
NOTE 3 “MIN, min” should be used with caution, as it can be confused with the lower limit of a ranges of values
To specify the terminal associated with a current or to indicate the voltage at that terminal, a single subscript should be used.
The terminal relative to which the voltage is measured or, if required, out of which the current flows (the reference terminal) shall be indicated by a second subscript
A third subscript may be used to indicate the external connection between a third (input) terminal and the reference terminal, for example:
I CES collector current of a transistor with the base short-circuited to the emitter;
V (BR)CEO collector-emitter breakdown voltage of a transistor with base open-circuit
4.2.5 Subscripts for supply voltages or supply currents
Repeating the appropriate terminal subscript shall indicate supply voltages and supply currents, for example: V CC , I EE
If it is necessary to indicate a reference terminal, this should be done by a third subscript, for example: V CCE
4.2.6 Subscripts for devices having more than one terminal of the same kind
When a device features multiple terminals of the same type, the subscript is created using the corresponding letter for the terminal followed by a number To prevent confusion with multiple subscripts, hyphens may be used for clarity.
I B2 = continuous (d.c.) current flowing in the second base terminal;
V B2-E = continuous (d.c.) voltage between the second base terminal and the emitter terminal
For multiple devices, the subscripts are modified by a number preceding the letter subscript
In the case of multiple subscripts, hyphens may be necessary to avoid misunderstandings, for example:
I 2C = continuous (d.c.) current flowing into the collector terminal of the second transistor;
V 1C-2C = continuous (d.c.) voltage between the collector terminals of the first and the second transistors
4.2.8 Indication of the polarity of currents and voltages
When a letter symbol or value is not preceded by a minus sign, it indicates a voltage with a positive value relative to a reference terminal or a conventional current that flows positively from the external circuit into the device terminal.
VXY = voltage applied to terminal X is positive with respect to terminal Y;
IX = conventional current flowing into terminal X from an external source
The negation sign can be placed before either the letter symbol or the value, indicating opposite polarity, such as in the expressions −V XY and –I X, which represent values contrary to V XY and I X, respectively According to algebraic rules, the expression V XY = –5 V can also be rewritten as –V XY = 5 V.
Where the definition itself denotes a reversal of the polarity and there is no ambiguity, the negation may be omitted, for example, V F = 2 V, V R = 10 V.
Letter symbols for signal ratios expressed in dB
Decibels (dB) are calculated as ten times the logarithm to the base of ten of the ratio of two power levels For voltage measurements, the formula is dB(V) = 20 times the logarithm to the base of ten of the ratio of two voltages Similarly, for current, the formula is dB(I) = 20 times the logarithm to the base of ten of the ratio of two currents.
Examples: n = 10 log (P 1 /P 2 ) dB n = 20 log (V 1 /V 2 ) dB (V) n = 20 log (I 1 /I 2 ) dB (I)
When the resistances associated with V₁ and V₂ (or I₁ and I₂) are equal or have negligible differences, the numerical value of n will match that of the first case, allowing for the omission of the subscripts (V) and (I).
Letter symbols for other electrical properties
This clause applies to elements of electrical equivalent circuits, electrical impedances, admittances, inductances and capacitances
The real and imaginary components of the impedance and admittance parameters are denoted using specific letters as outlined in section 4.4.1 To differentiate between the real and imaginary parts of the hybrid or s-parameters, the notation Re( ) is employed.
Im( ) should be used, for example:
Re(h 11b ) = real part of a hybrid parameter;
Im(s 21e ) = imaginary part of an s-parameter
NOTE Alternatively, the numerical value may include either real and imaginary values or magnitude and angle values
4.4.3 Use of upper-case or lower-case letters
In sections 4.4.1 and 4.4.2, it is specified that upper-case letters should be utilized to represent a) elements of external circuits that the device may only partially comprise, and b) all inductances and capacitances.
Lower-case letters shall be used for the representation of circuit elements inherent in the device (with the exception of inductance and capacitance)
A subscript can be added to identify the circuit configuration, such as for the terminal or reference terminal (refer to section 4.2.4) This additional subscript can be omitted when there is no potential for confusion.
In circuit configurations, the initial letter suffixes for matrix parameters lack clarity without additional subscripts, and numeric suffixes do not indicate the circuit setup or whether the value pertains to small-signal or static conditions For instance, \( h_{21E} \) or \( h_{FE} \) represents the static value of the forward current transfer ratio in a common-emitter configuration, while \( h_{21e} \) or \( h_{fe} \) denotes the small-signal value of the short-circuit forward current transfer ratio in the same configuration.
Z e = R e + jX e = small-signal value of the external impedance; r B = d.c value of the internal base resistance
4.4.6 Use of upper-case and lower-case subscripts
In the representation of total and small signal values, upper-case subscripts denote the total value, while lower-case subscripts indicate the small signal value When multiple subscripts are present, they must consistently use either all upper-case or all lower-case letters This case rule also applies to terminal subscripts, such as h\(_{FE}\), y\(_{RE}\), and h\(_{fe}\), with the exception of C\(_{Te}\), as T does not have a lower-case variant This guideline is specifically applicable to matrix parameters.
Not applicable to matrix parameters
Letter symbols for other properties
4.5.1 Time-related properties t = time, duration f = frequency
For example: tr = rise time; fmax = maximum frequency of oscillation
4.5.2 Time subscripts d = delay f = fall on = turn on off = turn off p = pulse duration r = rise s = carrier storage w = average pulse duration
T = temperature, indicating either Celsius or Kelvin temperature, for example: Ta = 25 °C, To
NOTE 1 The use of the lower-case letter, t, is strongly deprecated
For distinguishing between Celsius and Kelvin temperatures, use the letter symbol T followed by the unit in brackets: T (°C) for Celsius and T (K) for Kelvin.
NOTE 3 Differences between two temperatures are expressed using the same unit as that used for the two temperatures This results from the pertinent magnitude equation, for example: T 2 (°C) – T 1 (°C) = Δ T (°C)
Z th(x-y) , Z th(X-Y) = transient thermal impedance;
Zthp(x-y), Zthp(X-Y) = transient thermal impedance under pulse conditions
In the provided letter symbols, the letters x, y, or X, Y represent subscripts indicating the points or regions over which thermal resistance or impedance is measured These subscripts must be selected from the list specified in section 4.5.4.
In the context of thermal properties, various subscripts are used for clarity: \( j \) and \( J \) denote junctions or channels, while \( vj \) and \( VJ \) refer to virtual junctions or internal equivalents The symbols \( c \) and \( C \) represent the case, and \( ch \) indicates the channel Reference points are denoted by \( r \) and \( R \), with \( a \) and \( A \) signifying ambient conditions The heat sink is represented by \( s \) and \( S \), while \( f \) and \( F \) refer to cooling fluids other than air Additionally, \( sb \) stands for substrate, \( stg \) for storage, \( sld \) for soldering, and \( op \) indicates operating conditions Lastly, \( th \) and \( \theta \) are used to denote thermal properties.
NOTE 1 The subscripts j (or J)and vj (or VJ) may be used instead of ch to indicate “channel”
NOTE 2 In data sheets, specifications always refer to the virtual junction (channel) temperature Therefore, the letter v in the subscript may be omitted
The longer subscripts "case," "ref," and "amb" are now considered outdated When referring to thermal resistances or impedances, it is important to use hyphens to separate the subscripts and enclose them in brackets, as demonstrated in the example: R th(j-amb).
In data sheets, the subscript "op" in the term T aop, which stands for "operating ambient temperature," is often omitted when there is no risk of confusion.
The following letter symbols are recommended:
Kt = thermal derating factor; or F AV
F = average noise figure, average noise factor;
F = spot noise figure, spot noise factor;
To/Tno = reference noise temperature.
Presentation of limit values
Limit values can be expressed using two conventions Typically, the absolute magnitude convention applies to discrete semiconductors, while the algebraic convention is specifically used for integrated circuits.
In this article, we define two important letter symbols: "max" represents the upper limit of a range, irrespective of its polarity, while "min" denotes the lower limit of a range, also regardless of polarity.
In scenarios where a range encompasses both positive and negative values, both limits are considered maximum, with a minimum limit of zero implied Notably, when the polarity is uncertain, the term 'min' can denote 'the more negative limit'; however, in such instances, the letter symbol must remain unnegated.
NOTE To avoid ambiguities, where a range of values includes both positive and negative values, the negation should be shown in the letter symbol (see examples in Table 1)
The following subscripts are added to the letter symbol:
The terms 'max' and 'min' in algebraic conventions are no longer recommended due to their conflicting meanings when used with negative values, which can create confusion with the absolute magnitude convention.
NOTE 2 To avoid ambiguities, negation, where present, should preferably be shown in the value (see example 3 in Table 1)
Table 1 – Presentation of limit values with the two conventions
NOTE 1 In example 2, the implied minimum is zero, not customarily shown
According to IEC 60747 and IEC 60748, when the values and polarities are unknown, the example 4 format should be utilized However, once these details are identified, such as in a data sheet, the correct format should revert to that of examples 1-3.
General
Manufacturers must adhere to the minimum ratings and characteristics outlined in IEC 60747 and IEC 60748 when describing their products for general use Additionally, all published data should comply with the guidelines specified in section 5.3.
Some products excel in particular circuits even if they lack specified ratings and characteristics Consequently, the data for these products may not encompass all the requirements outlined in this clause.
Relationship between conditions of use, ratings and characteristics
Semiconductor ratings are the limiting conditions of use that all conforming devices will withstand but beyond which damage to the device may occur
Operating conditions of use are the conditions at which the specified characteristics are valid but beyond which the characteristics may not remain within the specified limits
Measuring conditions are those in which a characteristic is measured when being tested
NOTE 1 Limiting conditions may be either maxima or minima and are known as maximum ratings and minimum ratings, respectively
NOTE 2 IEC 60134 explains the rating systems in general use and, in particular, the division of responsibility between the manufacturer of semiconductor devices and circuit designers
Many ratings and characteristics can be interchanged, but they must not be under the same conditions within the same data sheet For instance, the limiting point on a diode's reverse characteristic curve can be defined in multiple ways.
I Rmax (characteristic) at V R max (rating), or V BR min (characteristic) at I R max (rating), but not both
However, I R max (characteristic) at V R max (rating), and V BR min (characteristic) at I RM max (rating) is permissible, as
I RM is time restricted while V R is continuous
Other points below the limit on the same curve may be given independently, for example, I R2 max (characteristic) at specified V R (operating condition)
Before applying any conditions not specified in the manufacturer's data, such as using solvents or ultrasonics during equipment assembly, users should consult the device manufacturer.
There is no tolerance on the limit values of ratings and characteristics given in published data
In bulk transactions, the acceptable percentage of devices that may not meet specified criteria, along with the verification methods, should be mutually agreed upon by the supplier and the purchaser These methods may allow for a certain number of failed devices to be included in the delivered lots.
For semiconductor devices marketed under the IECQ scheme, these methods and values are prescribed in the relevant parts of IEC 60747 and IEC 60748.
Standard format for the presentation of published data
Published data must include specific information, including the manufacturer's type number and the device category as defined in the relevant sections of IEC 60747 and IEC 60748 pertaining to the IECQ system Compliance with the requirements for devices supplied under the IECQ system is fully outlined in these standards.
The article discusses the essential specifications outlined in IEC 60748, focusing on semiconductor materials like silicon and their polarity, such as PNP or NPN It emphasizes the importance of providing detailed information on outlines, terminal identification, connections, and case materials, which may include glass, ceramic, metal, or plastic Additionally, it highlights the need for electrical and thermal ratings, including the positioning of reference points for temperature and high-current-low-voltage measurements The article also covers electrical and thermal characteristics, mechanical data, environmental data, and reliability information, along with graphical representations of these characteristics.
Type identification
If the manufacturer's type number is not clearly visible on the device, it is essential to specify the type identification method, such as employing color coding or utilizing a double-width band for the first digit.
Terminal and polarity identification
The function of each terminal should be identifiable, either from the outline drawing, or by means of terminal marking
Any electrical connection between an electrode and the case should be stated
If there is a possibility of the colour code at the cathode end of diodes in very small envelopes being confused with a type marking, then the latter may be omitted
5.5.2 Examples of terminal marking a) Colour coding
Anode Cathode Gate Collector Emitter Base
Blue or black Red (or white for diodes)
Yellow or white Red Blue Yellow b) The rectifier diode graphical symbol points towards the cathode terminal c) The type-number coloured bands are placed nearer to the cathode terminal.
Electrical ratings and characteristics
All electrical ratings and characteristics should be stated with reference to externally available connections.
Cooling conditions
Semiconductor devices can be classified into three categories: ambient-rated (mode A), case-rated (mode C), or both Additionally, there are forced-cooling rated (mode F) devices, which are distinguished by their cooling conditions.
IEC 60747 and IEC 60748 as ambient rated devices, or as heat-sink rated devices which are categorized in these publications as case-rated devices
The virtual junction temperature provided as a rating is intended for calculation purposes only, as it is only partially controllable by the user The actual junction temperature during power dissipation is influenced by the device's thermal capacity and resistivity characteristics.
Ambient-rated devices are designed to operate under natural air-cooling conditions, which refers to air cooled by natural convection, unless stated otherwise (refer to section 5.7.4).
Where devices are specified as case-rated devices, this signifies that the device character- istics apply under the conditions of conduction cooling through a defined area of the case
Thermal resistance or impedance values refer to an equivalent circuit model of the device's thermal properties, which assumes that all heat transfers through a designated reference point in the specified area.
To achieve optimal thermal contact between a device and a heat dissipator, it is essential to consider effective attachment methods and prepare contact surfaces to enhance both thermal and electrical conductivity Additionally, selecting appropriate thermally conductive compounds or washers is crucial for improving heat dissipation efficiency.
Where devices are specified as forced cooling devices, this signifies that the device characteristics apply under the conditions of forced fluid cooling
When providing information about a fluid system, it is essential to specify the type of fluid involved, such as air, freon, water, or oil Additionally, the position and orientation of the device in relation to the fluid flow must be detailed, along with the velocity and pressure of the fluid at the inlet.
Heat-sink rated devices are designed to operate under specific characteristics when mounted on an external heat sink, following the manufacturer's mounting guidelines The case temperature refers to a designated point that is thermally near the device's case surface, either directly on the surface or within the external heat sink.
NOTE The thermal characteristics of the interface between the device and the external heat-sink are included in the specified device thermal characteristics of heat-sink rated devices
Some ambient rated devices can be provided subsequently with a fin or with a fastening clip
The device primarily dissipates heat through conduction to the clip or fin, necessitating its classification as a case-rated device.
Recommended temperatures
It is recommended that ratings and characteristics be stated at 25 °C and at one (or more) other temperature(s).
Recommended voltages and currents
When electrical characteristics are required at reference voltages or currents, the values of the R10 series taken from ISO 3 are recommended In order of preference, these are:
These figures can be multiplied by 10 n , where n can be a positive or a negative integer
When electrical characteristics are required at reference voltages equal to, or higher than,
200 V values may be rounded off.
Mechanical ratings (limiting values)
In the following subclauses on mechanical ratings, the preferred method of stating the information required should be in accordance with the relevant section of IEC 60068
When detailing significant conditions and restrictions for devices, it is essential to specify the following: a) the required horizontal or vertical mounting position; b) the minimum distance for bending a flexible lead at right angles; c) the maximum and minimum torque for stud-mounted devices under specified conditions; d) the maximum and minimum pressing forces for press-pack devices; and e) the mounting requirements, interface material, and flatness of the external heat-sink for heat-sink rated devices.
5.10.3 Ratings for terminations a) Stress ratings
A statement of any restrictions on the stresses that may be applied should be given b) Temperature ratings
The maximum temperature at the terminations, measured at a specific distance from the body over a designated time, must be specified along with any relevant limiting conditions, tailored to the intended attachment methods such as soldering or welding.
When these ratings are significantly dependent on the initial temperature of the device, any information on derating should be given
Where appropriate, for certain applications, additional information may need to be given, for example, limiting values for acceleration, shock and vibration, environmental conditions, etc.
Mechanical characteristics
Either: refer to a standard IEC outline drawing and base drawing where appropriate (see
IEC 60191-2); or: give an outline drawing (and base drawing, where appropriate) showing dimensions with appropriate tolerances
The type of termination (for example, wire-ended, strip, stud, etc.) should be indicated
The function of each terminal and where appropriate, of the case (for example, anode, gate, collector) should be stated
Where appropriate, for certain applications, additional information may need to be given, for example, the weight of the device.
Multiple devices having a common encapsulation
The following applies to multiple devices having a common encapsulation, in which the individual devices can be measured and may be used separately
The individual devices should be identified and any common terminal stated
Electrical ratings must adhere to standards such as IEC 60747-2 and IEC 60747-3 for each device It is essential to specify the maximum isolation voltage between individual devices Additionally, the maximum total power dissipation for each device, as well as the combined power dissipation of multiple devices, should be determined under consistent case or ambient temperature conditions.
5.12.3 Electrical characteristics a) Characteristics for each individual device in accordance with the relevant part of
When values are temperature-dependent, significant dissipation in unmeasured internal devices should be avoided unless specified It is important to note the maximum leakage current between individual devices and the necessary biasing magnitude and polarity for isolation Additionally, the nature and magnitude of any electrical cross-coupling effects, such as capacitance, must be considered under intended operating conditions For multiple devices provided to achieve matched characteristics, the degree of matching and applicable conditions of use should be clearly defined.
NOTE The degree of matching should be stated at 25 °C and at one higher temperature
The maximum thermal resistance of the shared heat path to the case or ambient, applicable to all devices, should be specified under the same conditions as for each individual device.
The thermal coupling resistance between devices is crucial, and it is important to specify the maximum thermal resistance for each device in relation to the hot end of the common heat path when applicable.
This represents the decoupled part of the thermal resistance of each device
General
The measuring methods outlined in IEC 60747 and IEC 60748 provide the fundamental principles used in measurement but do not include specific techniques for practical implementation These methods are recognized for delivering the most accurate results and are often referred to as reference methods.
For each characteristic, it is essential to utilize a single primary method of measurement While multiple measurement methods may be presented, it is understood that each is valid; however, one method may be more suitable than the others depending on specific conditions of use.
Alternative methods of measurement
Any alternative measurement method can be utilized, as long as adjustments for measurement accuracy are considered For instance, when measuring temperature-dependent characteristics prior to achieving temperature stability, it is essential to account for any anticipated changes in characteristics due to temperature fluctuations.
Under steady-state conditions, a characteristic can only be accurately measured before thermal equilibrium is achieved or through a pulse method, ensuring that any changes in the measured value, which would have occurred under steady-state conditions, are accounted for.
NOTE If a pulse method is chosen, it must be ensured that there are no electrical or thermal transient phenomena that may affect the accuracy of the measurement.
Measurement accuracy
Allowances for measuring accuracy tolerances must be considered in the actual measured values of characteristics Measurements conducted by the supplier should fall within the published limit values, accounting for this tolerance, while measurements taken by the purchaser must exceed the published values by at least the same tolerance.
To ensure accurate verification of device ratings, the values used by the supplier must significantly differ from the published values Conversely, the values applied by the purchaser should remain within the published range to maintain accuracy.
The measurement accuracy shall take into account both the electrical and the environmental conditions
Wherever possible, methods giving a direct answer are preferable, as calculated results are based on equivalent circuits that may not be valid under all conditions
NOTE 1 The specified conditions of measurement should align with those given in the essential ratings and characteristics clauses
NOTE 2 The manufacturer may, at his discretion, add additional tolerances (To allow, for example, for drift of the characteristics during the life of the device.)
Protection of devices and measuring equipment
This clause outlines precautions applicable to discrete devices and integrated circuits, with specific guidelines for different device categories provided alongside their respective measuring methods in the relevant sections of these publications.
NOTE Electrostatic sensitive devices should be handled as described in IEC 61340
All measurement conditions for device characteristics must ensure that the maximum ratings are not surpassed To achieve this, circuits can incorporate clamping diodes or resistors to restrict maximum instantaneous currents and voltages.
It is recommended that devices should not be inserted into or removed from a circuit while it is energized
6.4.3 Measuring instruments and power supplies
It is advisable to protect the meters and power supplies against overloads arising from faulty semiconductor devices or incorrect connection.
Thermal conditions for measuring methods
To effectively manage thermal conditions, it is essential to implement specific recommendations whenever necessary This level of control is typically required when the measured characteristic exhibits a strong dependence on temperature.
Thermal equilibrium is reached when extending the time between power application and measurement does not alter the indicated result within the expected error margin.
For accurate measurement, natural air-cooling conditions are utilized when the ambient temperature is recorded beneath a semiconductor device, which is held by its leads within an enclosure that maintains a relatively uniform air temperature.
The ambient temperature T a shall be measured below the case of the device at a distance from this case equal to about five times its diameter, but not less than 10 mm
The support points of the device must be at least 10 mm (3/8 in) away from the device body, unless the device has very short leads, in which case the support point locations should be clearly defined Additionally, the supports should maintain a temperature that is not lower than the ambient temperature.
Measurements must be conducted in a properly sized chamber with non-reflective walls, designed to prevent direct radiation heating in any area where devices are positioned, while also ensuring that natural air convection remains largely unaffected.
The chamber should be capable of maintaining, in any region where the devices may be placed, a temperature which is within a tolerance of ±2 °C, or less if required, of a specified temperature
Gently stirring the air within the chamber is allowed, as long as it does not lead to a decrease in device temperature and the same outcomes could be achieved in a larger chamber with only normal convection.
NOTE The reproducibility of measurements for ambient rated devices depends largely on the chamber design
For accurate measurement, conduction-cooling conditions are established when the case temperature is recorded at a designated point on or near the device's external surface, ensuring that heat is uniformly distributed across the entire defined cooling area.
Measurements shall be carried out under such conditions that the case-ambient thermal resistance is as small as possible, compared with the junction-case thermal resistance
To achieve this condition, the device can be installed within a large mass of thermostatically controlled metal or placed in a thermostatically controlled oil bath.
For measurement purposes, forced cooling applies when the temperature is measured at a specified point in front of the device in the path of the flow
Measurements shall be carried out in strict compliance with the data sheet specified conditions.
Accuracy of measuring circuits
Power-supply ripple should not affect the desired accuracy of the measurements
A current source is deemed constant when a two-to-one increase in load impedance results in a change in the measured value that remains within the allowable measurement error.
A voltage source is deemed constant when a reduction in load impedance by a factor of two does not result in a measurable change exceeding the allowable measurement error.
If low currents are measured, suitable precautions should be taken to ensure that parasitic circuit currents or external leakage currents are small compared with the current being measured
To achieve accurate measurement results, it is essential to manage stray capacitance and inductance effectively This can be done by either minimizing their impact on the measurements or by incorporating their effects into the final results.
Coupling or bypassing capacitors must act as effective short circuits at the measurement frequency For radio frequency (r.f.) decoupling, it is crucial to adhere to the specified components and mounting conditions of the device.
Care should be taken to minimize spurious oscillations or distortions likely to affect the accuracy of the measurement
An open circuit is defined as a condition where a two-to-one reduction in impedance does not result in a measurable change exceeding the allowable measurement error.
A circuit is deemed short-circuited when a two-to-one increase in its impedance does not result in a measurable change that exceeds the allowable measurement error.
When a characteristic is known to be light-sensitive, the effect of lighting conditions should be taken into account
For devices handling high currents, it is essential to utilize separate contacts for current-carrying and voltage-measuring functions If separation is not feasible, adjustments must be made to the measured inter-terminal voltages to ensure accuracy.
In addition, for high-current devices, residual inductance should be as low as possible
Distorted input and output waveforms in rectifying and converting circuits deviate from sinusoidal shapes As a result, traditional sinusoidal conversion factors, such as those used for calculating average to root mean square (r.m.s.) or peak values, are not suitable for these distorted waveforms.
When measuring electrical parameters, it is essential to account for the voltage drop in current-measuring circuits and the current consumed by voltage-measuring circuits, especially if these factors are significant.
A signal is deemed small when a twofold increase in its magnitude does not result in a change in the measured value that exceeds the allowable measurement error.
When utilizing the pulse technique for measurements, it is essential to select the duty factor, pulse duration, and repetition frequency carefully These parameters should be chosen to ensure that the variation in the measured value remains within the allowable measurement error This consideration must hold true when independently adjusting the pulse duty factor to double its value, doubling the pulse duration, or halving the pulse repetition frequency.
7 Acceptance and reliability of discrete devices
General
Acceptance and reliability testing may be used where appropriate to augment, but not to replace, adequate manufacturing process control ISO 9000 details minimum quality requirements
For devices supplied under the IECQ system, this testing is prescribed in the relevant parts of these publications
NOTE 1 The endurance tests given in 7.2 and many of the mechanical and climatic test methods included in
IEC 60749 are suitable for use for acceptance and reliability purposes
NOTE 2 For the presentation of reliability information resulting from tests on semiconductor devices, see
Electrical endurance tests
Endurance tests, along with their failure-defining characteristics and criteria, are outlined in the relevant sections of these publications for each device category This clause establishes the general requirements that apply to all categories of devices.
When applied for more than 200 h, the tests are considered to be destructive
NOTE These tests should not be confused with "burn-in" which is sometimes applied 100 % as part of the device manufacturing process
The device must be operated under steady-state conditions, whether direct current (d.c.), alternating current (a.c.), or dynamic, according to the specified circuit configuration In certain instances, intermittent or alternative modes of operation may also be required.
For optimal performance, the free lead length between the case and electrical contacts or supports should ideally be at least 5 mm for both single-ended and double-ended devices If the lead lengths are shorter than 5 mm, it is essential to follow the manufacturer's mounting recommendations.
The support(s) shall be maintained at a temperature within the ambient operating temperature tolerance
The devices shall be mounted so that the specified case temperature is maintained
T br T T max T amb or T case °C
The operating temperature shall be specified at a point between T br and T (see Figure 2)
Temperature t T corresponds to the 20 % point as shown in Figure 2
The operating temperature for ambient-rated devices must be kept within ±5 °C For case-rated devices, the average case temperature should also remain within ±5 °C, while any individual case temperature must not exceed ±10 °C from the specified operating temperature.
NOTE This operating temperature may be reached partly by dissipation of the device and partly by the ambient temperature
The operating voltage should be that recommended in the relevant part of IEC 60747 and
IEC 60748 Initial tolerances and any variations during operation shall be within ±5 % for d.c voltages and ±10 % for a.c or pulse voltages
Devices under test must operate within the specified power dissipation or current limits as outlined in the derating curve, with the exception of high-temperature blocking or reverse bias tests Initial tolerances and operational variations should remain within ±5% for direct current (d.c.) power or current, and ±10% for alternating current (a.c.) or pulse power or current.
If an indication of the variation in failure rate with operating conditions is needed, the combinations of voltage and power dissipation or current shown in Table 2 are recommended
Table 2 – Failure rate operating conditions
Operating voltage Power dissipation or current
NOTE 1 The 100 % values refer to those recommended in the relevant publication part for the category of device
Certain stress combinations may not be safely applicable to specific device classes or types It is essential to select test conditions that remain within the safe operating area to prevent issues such as thermal runaway and second breakdown for the device category being tested.
The duration of the test should be selected from the following list:
Intermediate measurements must be conducted at the specified times, and the test conditions should be reinstated within 8 hours It is important to note that the time taken for these measurements should not be counted as part of the overall test duration.
Where the duration is defined by a number of cycles, the sequence 1, 2 or 5 × 10 n , where n is an integer (including zero) shall be used
Final measurements should be measured within 96 h of removal of the devices from the test
Measurements shall be made at an ambient or reference-point temperature of 25 ± 5 °C
The measurement of characteristics should follow the specified order, as alterations in these characteristics due to certain failure mechanisms may be completely or partially obscured by the effects of other measurements.
For attributes testing, data may be taken by making measurements on a go/no-go basis
Measured values are evaluated against failure criteria to determine if each device has passed or failed For variable testing, each device must be uniquely identified, and the specified characteristics of each device should be accurately measured.
A device that fails to meet the specified limits for one or more characteristics of its category is classified as a failure When reporting data, it is essential to include the counts of both short-circuited and open-circuited devices alongside the total number of failures.
A short-circuited device is a device that no longer performs its required function and exhibits a quasi-resistive low-impedance characteristic
NOTE The particular limit value which defines a short-circuit failure should be given in the data sheet
Manufacturers have the discretion to establish specific test limits prior to conducting acceptance tests, ensuring that devices conform to the specifications outlined in their published data sheets after the acceptance tests are completed.
7.2.11.1 Loss or removal of bias during test
Bias voltages and currents must be applied to devices for the specified test duration, adhering to the allowed tolerance It is recommended to maintain the voltage bias until the devices cool to room temperature, unless it is determined that removing the bias during cooling does not significantly affect the device's characteristics under the specific test conditions.
7.2.11.2 Over-temperature of ovens or other heat sources
To prevent damage or destruction of devices during testing, it is essential to implement redundant over-temperature controls on heat sources, ensuring that the maximum temperature is effectively limited in case of temperature control failures.
7.2.11.3 Static-electricity discharges and electromagnetic fields
Precautions should be taken regarding apparatus and personnel to avoid devices being destroyed or damaged by high electrostatic voltages and large electromagnetic fields
7.2.11.4 Oscillation suppression and current limiting
Oscillations in the circuit during testing can lead to the destruction or damage of devices A wideband oscilloscope can effectively detect these oscillations To mitigate their effects, shunt capacitors, series inductors, and resistors can be added to the test circuits.
Thermal runaway during testing can lead to the destruction or damage of devices To prevent this, it is essential to use fixed resistors that limit device dissipation during runaway Each device should have its own resistor instead of sharing among groups, ensuring that bias remains intact even if one device shorts Additionally, placing these resistors near the device terminals can help suppress oscillations.
Label and symbol
A unique symbol for electrostatic sensitive devices requiring special handling is illustrated in Figure 4a This symbol should be placed on the innermost level of packaging and, if space allows, directly on the device Additionally, it can be included on device data sheets, storage bins, and protective wrapping materials The symbol is designed for situations where space constraints prevent the use of a label.
In cases where space is limited, a simplified version of the symbol, as illustrated in Figure 4b, may be utilized for device marking Additionally, when marking devices, a monochromatic reproduction in any contrasting color against the background is acceptable.
Wherever possible, the colour red for the symbol should be avoided as red suggests a personnel hazard If used elsewhere, the symbol should be black on a yellow background
The label comprises the symbol with the words: “ATTENTION – Observe precautions for handling – ELECTROSTATIC SENSITIVE DEVICES” The symbol and lettering should be black on a yellow background
Figure 3b – Simplified version for extreme reduction
Figure 3 – Symbol to be used for the electrostatic sensitive devices that require special handling
Test methods for semiconductor devices sensitive to voltage pulses of short duration
A number of types of semiconductor device are sensitive to voltage pulses of short duration such as those caused by electrostatic discharge occurring during normal handling
The IEC 60749-26 test method assesses the sensitivity of devices, indicating whether they necessitate special handling precautions and the application of specific labels and symbols.
The test is regarded as destructive
Definitions
A type of semiconductor (for example, packaged semiconductor, wafer, die, etc.)
To cancel the supply of a product
A customer who has ordered a product from a supplier within the last two years, intends to use the product in a specific application as formally communicated within the past year, or has an agreement with the supplier to receive all notifications regarding product discontinuation, is considered a relevant stakeholder in the discontinuation process.
General aspects for discontinuation
The affected customers should receive notification that requires acknowledgement (active information) and can place a last purchase order, to assure a stock for future use of the product
Distributors receive notification as affected customers and can purchase a stock for continued supply or can give discontinuance notification to their customers
Contract manufacturers receive notification as affected customers and shall inform their customer to decide on replacement or on a last purchase order
Last purchase orders are different from normal orders: a last purchase order is irrevocable, and, in case of quality problems, there is no guarantee of replacement products.
Information for the discontinuance notification
To ensure a smooth transition during product discontinuance, the following key details are essential: the date when the supply will cease, the deadline for the last purchase order (which must be at least 6 months after notification), and the possibility of a maximum 6-month delayed delivery upon customer request Additionally, it is important to specify the type number of the product being discontinued and the reason for its discontinuance, whether it is due to the end of manufacturing or a decision to stop marketing in a specific region Lastly, the contact person for the supplier should be provided for any inquiries regarding the discontinuation process.
Additional information may include the type number of the replacement product along with its supplier, as well as the option for affected customers to purchase the rights for manufacturing and design.
Notification
The supplier will directly notify the designated contact person of each affected customer regarding the discontinuance Each notification will include the relevant customer part number, if applicable.
The manufacturer should provide the product discontinuance notifications on the Internet
This should include downloadable lists of discontinued products.
Retention
Product information (including discontinuance notifications) shall be kept for at least three years after the last sales date
Presentation of IEC 60747 and IEC 60748
IEC 60747 focuses on semiconductor devices, primarily discrete types, while also addressing aspects relevant to integrated circuits, which are covered in IEC 60748 Each standard is divided into multiple parts, such as IEC 60747-1 and IEC 60748-1, with each part detailing standards for specific categories of semiconductor devices or mandatory specifications for the IECQ quality assessment system.
A.1 Scope of the parts of IEC 60747
(For details, refer to Clause 1.)
A.1.2 The majority of the subsequent parts (IEC 60747-2, IEC 60747-3, etc)
The standards for discrete semiconductor devices, such as diodes and transistors, outline specific information and requirements pertinent to each category, alongside general requirements These standards ensure a necessary minimum for the effective use and interchangeability of the devices.
Occasionally, a part is divided into separately published subparts identified with a second suffix, for example, IEC 60747-2-1
A.1.3 The remaining parts of IEC 60747
These are dedicated to the IECQ quality assessment system They include the Generic
The specifications for all semiconductor devices, including the Sectional and Blank Detail Specifications for discrete semiconductors, establish mandatory minimum requirements within the IECQ system Unlike the presentation rules outlined in Clause A.3, these specifications are essential for compliance, as detailed in QC 001002.
NOTE These standards can be recognized by the use of the word "specification" in the title
A.2 Scope of the parts of IEC 60748
This provides information and requirements that are valid for all integrated circuits in addition to the general requirements given herein
A.2.2 The majority of the subsequent parts of IEC 60748
The standards for different categories of integrated circuits, such as digital and interface, outline specific information and requirements relevant to each category, in addition to the general requirements provided.
A.2.3 The remaining parts of IEC 60748
These are dedicated to the IECQ quality assessment system They include the Generic
Specification for hybrid integrated circuits and the Sectional, Family and Blank Detail
Specifications for all integrated circuits
NOTE These standards can be recognized by the use of the word "specification" in the title
A.3 Presentation of the non-IECQ parts of IEC 60747 and IEC 60748
The presentation requirements given below are for guidance and may not always apply The clauses shown below will usually contain subclauses
Each of the publication parts described in A.1.2 and A.2.1, is subdivided into clauses as follows:
The device category in a publication is often divided into several subcategories, particularly in Clauses 5 and 7, which have corresponding sections Other clauses typically do not feature this device-oriented subdivision, although there are rare instances where subcategories may be published as independent subparts.
A.3.3 Purpose of the clauses in each publication part
Provides general information that describes the device types(s) covered by the publication part and the applicability or purpose or usage of the device
Lists all references to other publications which are called up in the body of the part and which are necessary for the use of the part
This article offers definitions for specialized terms essential for understanding this section, which are not included in the International Electrotechnical Vocabulary (IEC 60050) or Clause 3 of IEC 60747-1 Additionally, it provides clarifications or modifications to existing definitions to better align with the unique characteristics of specific device categories.
The definitions outlined in Clause 3 apply to all devices within the relevant category, though additional restrictions may be required for specific subcategories, and the terms will be appropriately qualified in such instances.
NOTE Any terms which are subsequently added to the IEV should then be omitted in later revisions of the part
This section offers additional special letter symbols not included in Clause 4, which are essential for comprehending this part It also presents alternative symbols that may be more suitable for the unique characteristics of specific device categories.
The letter symbols should be composed according to the general rules for letter symbols, given in Clause 4 of this publication part
A.3.3.5 Clause 5 – Essential ratings and characteristics
Provides general ratings and characteristics information
Provides a list of the limiting conditions of use which will not damage the device
The limits of the conditions of use under which it will operate correctly may also be given
Provides a list of the characteristics of the device that describe the product for general use together with details of the operating conditions under which each given characteristic applies
When typical values are required in these standards, it should be understood that they are intended for engineering guidance and are not guaranteed values
Provides the principles of the measuring methods which are needed for the accurate measurement of device characteristics: primarily those characteristics given as essential in
Alternatively, where test methods for the verification of ratings (limiting values) are required,
Clause 6 may contain two subclauses:
Methods that apply a rating Each method is succeeded by the measurement of one or more device characteristics to verify that the device is still correctly functioning
Methods for measuring the device characteristics as described in A.3.3.8.1
Each measuring method should incorporate the following subclauses as appropriate:
The article outlines the purpose of the method, indicating whether it is intended for verification or measurement It also highlights any limitations associated with the method, such as conditions under which it is preferable to alternative methods for measuring the same characteristic.
Gives any necessary precautions not given in 6.4 of this part (IEC 60747-1)
Symbols used in circuit diagrams should be in accordance with IEC 60617 However, if the symbol for the device under test has not yet been standardized, a symbol described in
Clause 1 of the part may be used
Describes the function of the components in the test circuit
Describes the complete measuring procedure step by step
These conditions should be the same as those given in the essential characteristics clause of the document for the characteristic being measured
Provides those acceptance and/or reliability tests that are applicable
NOTE Includes endurance test methods, conditions and durations, and the failure-defining characteristics for acceptance after applying the endurance test
Clause cross-references from first edition of IEC 60747-1 (1983)
Old heading (in first edition 1983)
Chapter I Scope and presentation of IEC publications 747 and 748
Chapter II Purpose and presentation of publication 747-1
A.3 Chapter III Purpose, presentation and requirements on the contents of publications 747-2, 747-3, etc
Purpose of each part Presentation of each part Subdivision into chapters Subdivision into device sub-categories Requirements on the different chapters of each part Requirements on Chapter I, General
Purpose Requirements on Chapter II, Terminology and letter symbols Purpose
Validity of terms, definitions and letter symbols Letter symbols
Requirements on Chapter III, Essential ratings and characteristics Purpose
Requirements on Chapter IV, Measuring methods Purpose
Requirements on Chapter V, Acceptance and reliability Purpose
This article covers essential terminology in the field of electronics, including general terms, structural terminology, and process-related terms It discusses the roles of anode and cathode terminals, as well as concepts pertaining to elements and circuits Additionally, it explores the distinctions between active and passive elements, components, and devices, along with relevant concepts related to various components in electronic systems.
Old heading (in first edition 1983)
Terms relating to ratings and characteristics Currents and voltages
Terms characterising the constant value or periodic waveforms of currents and voltages
IEC 60469-1 6 Pulse terms and definitions
IEC 60050-521 7 Input-to-output pulse switching times, general terms
Introduction Letter symbols for currents, voltages and powers Basic letters
Subscripts Summary chart for current, voltage and power letter symbols Example of the application of the rules to a periodic quantity Indication of the polarity of currents and voltages
Letter symbols for electrical parameters Definition
Basic letters Subscripts Distinction between real and imaginary parts Letter symbols for other quantities
General Times, durations Thermal characteristics and related temperatures Frequencies
Sundry quantities Letter symbols for logarithmic scale units for signal ratios expressed in dB Power ratio
Voltage ratio (or current ratio)
Old heading (in first edition 1983)
Chapter VI Essential ratings and characteristics, general
Introduction Standard format for the presentation of published data Definitions
Definition of maximum limit and minimum limit Algebraic convention
Absolute magnitude convention Basic "rating" definitions Definitions for rating systems Definitions of cooling conditions List of recommended temperatures List of recommended voltages and currents Recommended voltages
Preferred nominal values and limits of voltages in the E24 series for voltage- reference diodes
Preferred nominal values and limits of voltages in the E12 series for voltage- reference diodes
Mechanical ratings, characteristics and other data Introduction
Mechanical ratings (limiting values) Mechanical characteristics
5.11.1 8 Standardization of the position of terminals on bases of semiconductor devices Omitted 8.1 Position of the base, emitter and collector terminals of bipolar transistors
Omitted 8.2 Position of the terminals of high frequency bipolar transistors with four terminals 5.5
Colour coding of terminals for semiconductor devices Colour coding of rectifier and signal diode terminals Colour coding of thyristor terminals
Colour coding of transistor leads
General information applicable to multiple devices having a common encapsulation
General Electrical ratings Electrical characteristics Thermal characteristics Mechanical data Production spread and compliance Printed wiring and printed circuits
Old heading (in first edition 1983)
Chapter VII General and reference measuring methods, general
Introduction General precautions Protection of devices and measuring equipment Accuracy of measurement
Definitions Small signal Pulse measurements
Guide for reference measuring methods Guiding principles in selecting reference methods Thermal conditions for electrical reference measuring methods Introduction
Conditions in case of negligible power dissipation in the device Conditions in case of significant power dissipation in the device
Chapter VIII Acceptance and reliability of discrete devices
Section 1 General Section 2 General principles (under consideration) Section 3 Electrical endurance tests
Purpose and presentation General requirements Conditions for endurance tests Duration of test
Failure-defining characteristics and measurements Failure criteria
Specific requirements General List of endurance tests Conditions for endurance tests
Failure-defining characteristics and failure criteria for acceptance after endurance tests
(See other relevant publication parts) 3.4 Failure-defining characteristics and failure criteria for reliability tests
Procedure in case of a testing error Information to be given in Tables I and Il:
Old heading (in first edition 1983)
(referred out to other publications)
Chapter IX Electrostatic-sensitive devices
Label and symbol Introduction Purpose Symbol Label Device marking Test methods for electronic devices sensitive to voltage pulses of short duration
IEC 60050-131, International Electrotechnical Vocabulary (IEV) – Part 131: Circuit theory
IEC 60134, Rating systems for electronic tubes and valves and analogous semiconductor devices
IEC 60319, Presentation and specification of reliability data for electronic components
IEC 60469-1, Pulse techniques and apparatus – Part 1: Pulse terms and definitions
IEC 60617-DB 1 , Graphical symbols for diagrams
1 “DB” refers to the IEC on-line data base
4.2 Symboles littéraux pour les courants, les tensions et les puissances 56
4.3 Symboles littéraux pour les rapports de signaux exprimés en dB 59
4.4 Symboles littéraux pour les autres propriétés électriques 59
4.5 Symboles littéraux pour d’autres propriétés 61
5 Valeurs limites et caractéristiques essentielles 64
5.2 Relation entre les conditions d’utilisation, les valeurs limites et les caractéristiques 64
5.3 Feuille cadre pour la présentation des données publiées 65
5.5 Identification des bornes et de la polarité 66
5.6 Valeurs limites et caractéristiques électriques 66
5.12 Dispositifs multiples ayant une encapsulation commune 69
6.4 Protection des dispositifs et de l’appareillage de mesure 71
6.5 Conditions thermiques des méthodes de mesure 71
6.6 Précision des circuits de mesure 72
7 Réception et fiabilité des dispositifs discrets 74
8 Dispositifs sensibles aux charges électrostatiques 78
8.2 Méthodes d'essai pour les dispositifs à semiconducteurs sensibles à des impulsions de tension de courte durée 79
9 Notification de suppression d’un produit 79
9.2 Aspects généraux de la suppression 80
9.3 Informations pour la notification de suppression 80
Annexe A (informative) Présentation de la CEI 60747 et de la CEI 60748 82
Annexe B (informative) Références croisées des articles de la première édition de la
Figure 1 – Exemple d’application des règles à un courant périodique 56
Figure 3 – Symbole à utiliser pour les dispositifs sensibles aux charges électrostatiques nécessitant une manipulation spéciale 79
Tableau 1 – Représentation graphique des valeurs limites dans les deux conventions 64
Tableau 2 – Taux de défaillance en fonction des conditions de fonctionnement 76
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Official decisions or agreements of the IEC on technical matters aim to establish an international consensus on the topics under consideration, as each study committee includes representatives from the relevant national IEC committees.
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To promote international consistency, the national committees of the IEC commit to transparently applying IEC publications in their national and regional documents as much as possible Any discrepancies between IEC publications and corresponding national or regional publications must be clearly indicated in the latter.
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